Post on 31-Dec-2015
• MEMS
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Microelectromechanical systems - Materials for MEMS manufacturing
1 The fabrication of MEMS evolved from the process technology in
semiconductor device fabrication, i.e. the basic techniques are deposition
of material layers, patterning by photolithography and etching to
produce the required shapes.
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Mechanical engineering - Micro electro-mechanical systems (MEMS)
1 Micron-scale mechanical components such as springs, gears, fluidic and heat transfer
devices are fabricated from a variety of substrate materials such as silicon, glass
and polymers like SU8. Examples of MEMS components are the accelerometers that are used as car airbag sensors, modern
cell phones, gyroscopes for precise positioning and microfluidic devices used
in biomedical applications.
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Microphone - MEMS microphone
1 Major manufacturers producing MEMS silicon microphones are
Wolfson Microelectronics (WM7xxx), Analog Devices, Akustica (AKU200x), Infineon (SMM310 product), Knowles Electronics, Memstech (MSMx), NXP Semiconductors, Sonion MEMS, AAC Acoustic Technologies, and Omron.
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Frequency multiplier - Microelectromechanical (MEMS) frequency doubler
1 The inherent square-law nonlinearity of the voltage-to-force transfer function of a cantilever resonator’s capacitive transducer can be employed for the
realization of frequency doubling effect.[http://arxiv.org/abs/1210.3491
Microelectromechanical system cantilever-based frequency doublers] Due to the low-loss attribute (or
equivalently, a high Q) offered by MEMS devices, improved circuit performance can be expected from a
micromechanical frequency doubler than semiconductor devices utilized for the same
task.[http://ieeexplore.ieee.org/stamp/stamp.jsp?tp=arnumber=1386679isnumber=30188 1.156-GHz
self-aligned vibrating micromechanical disk resonator]
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MEMS
1 'Microelectromechanical systems' ('MEMS') (also written as micro-electro-mechanical, MicroElectroMechanical or
microelectronic and microelectromechanical systems) is the technology of very small devices; it merges at the nano-scale into
nanoelectromechanical systems (NEMS) and nanotechnology. MEMS are also referred to
as Micromachinery|micromachines (in Japan), or micro systems technology – MST
(in Europe).https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
MEMS
1 Because of the large surface area to volume ratio of MEMS, surface
effects such as electrostatics and wetting dominate over volume
effects such as inertia or thermal mass.
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MEMS
1 An early example of a MEMS device is the resonistor – an
electromechanical monolithic resonator.Electromechanical
monolithic resonator, [http://www.google.com/patents/abou
t?id=hpcBAAAAEBAJdq=ELECTROMECHANICAL+MONOLITHIC+RESONATOR US patent 3614677], Filed April 29,
1966; Issued October 1971https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
MEMS - Silicon
1 Silicon is the material used to create most integrated circuits used in
consumer electronics in the modern industry. The economies of scale, ready availability of cheap high-quality materials and ability to
incorporate electronic functionality make silicon attractive for a wide
variety of MEMS applications.
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MEMS - Silicon
1 Silicon also has significant advantages engendered through its material properties
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MEMS - Polymers
1 MEMS devices can be made from polymers by processes such as injection molding, Embossing (manufacturing)|embossing or
stereolithography and are especially well suited to microfluidic
applications such as disposable blood testing cartridges.
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MEMS - Metals
1 Metals can also be used to create MEMS elements. While metals do not have some of the advantages displayed by silicon in
terms of mechanical properties, when used within their limitations, metals can exhibit very high degrees of reliability. Metals can
be deposited by electroplating, evaporation, and sputtering processes. Commonly used
metals include gold, nickel, aluminium, copper, chromium, titanium, tungsten,
platinum, and silver.https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
MEMS - Ceramics
1 titanium nitride|TiN, on the other hand, exhibits a high electrical conductivity and large elastic modulus allowing to realize
electrostatic MEMS actuation schemes with ultrathin membranes
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MEMS - Deposition processes
1 One of the basic building blocks in MEMS processing is the ability to
deposit thin films of material with a thickness anywhere between a few
nanometres to about 100 micrometres. There are two types of
deposition processes, as follows.
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MEMS - Physical deposition
1 Physical vapor deposition (PVD) consists of a process in which a
material is removed from a target, and deposited on a surface
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MEMS - Chemical deposition
1 Chemical deposition techniques include chemical vapor deposition (CVD), in
which a stream of source gas reacts on the substrate to grow the material
desired. This can be further divided into categories depending on the details of
the technique, for example, LPCVD (Low Pressure chemical vapor deposition) and
PECVD (Plasma Enhanced chemical vapor deposition).
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MEMS - Chemical deposition
1 Oxide films can also be grown by the technique of thermal oxidation, in
which the (typically silicon) wafer is exposed to oxygen and/or steam, to grow a thin surface layer of silicon
dioxide.
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MEMS - Lithography
1 Lithography in MEMS context is typically the transfer of a pattern into
a photosensitive material by selective exposure to a radiation
source such as light
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MEMS - Lithography
1 This exposed region can then be removed or treated providing a mask
for the underlying substrate. Photolithography is typically used
with metal or other thin film deposition, wet and dry etching.
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MEMS - Photolithography
1 Photolithography is the process of transferring geometric shapes on a
mask to the surface of a silicon wafer. The steps involved in the
photolithographic process are wafer cleaning; barrier layer formation;
photoresist application; soft baking; mask alignment; exposure and development; and hard-baking.
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MEMS - Photolithography
1 In the first step, the wafers are chemically cleaned to remove
particulate matter on the surface as well as any traces of organic, ionic,
and metallic impurities
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MEMS - Photolithography
1 There are two types of photoresist: positive and
negative
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MEMS - Photolithography
1 Negative resists behave in just the opposite manner
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MEMS - Electron beam lithography
1 Electron beam lithography (often abbreviated as e-beam lithography) is the practice of scanning a beam of
electrons in a patterned fashion across a surface covered with a film
(called the resist), (exposing the resist) and of selectively removing
either exposed or non-exposed regions of the resist (developing)
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MEMS - Electron beam lithography
1 The primary advantage of electron beam lithography is that it is one of the ways to beat the diffraction limit
of light and make features in the nanometer regime. This form of
maskless lithography has found wide usage in photomask-making used in
photolithography, low-volume production of semiconductor components, and research
development.https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
MEMS - Electron beam lithography
1 The key limitation of electron beam lithography is throughput, i.e., the very long time it takes to expose an entire silicon wafer or glass substrate. A long
exposure time leaves the user vulnerable to beam drift or instability which may
occur during the exposure. Also, the turn-around time for reworking or re-design is lengthened unnecessarily if the pattern is
not being changed the second time.
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MEMS - Ion beam lithography
1 It is known that focused-ion-beam lithography has the capability of writing
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MEMS - Ion beam lithography
1 extremely fine lines (less than 50nm line and space has been achieved) without
proximity
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MEMS - Ion beam lithography
1 effect. However, because the writing field in ion-beam
lithography is quite small, large area patterns must be created by stitching together the small fields.
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MEMS - Ion track technology
1 Ion track technology is a deep cutting tool with a resolution limit
around 8nm applicable to radiation resistant minerals, glasses and
polymers
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MEMS - X-ray lithography
1 X-ray lithography, is a process used in electronic industry to selectively
remove parts of a thin film. It uses X-rays to transfer a geometric pattern
from a mask to a light-sensitive chemical photoresist, or simply
resist, on the substrate. A series of chemical treatments then engraves
the produced pattern into the material underneath the photoresist.
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MEMS - Etching processes
1 In the former, the material is dissolved when immersed in a chemical solution.
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MEMS - Etching processes
1 In the latter, the material is sputtered or dissolved using reactive ions or a vapor phase etchant. for a somewhat dated overview of MEMS
etching technologies.
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MEMS - Wet etching
1 Wet chemical etching consists in selective removal of material by
dipping a substrate into a solution that dissolves it. The chemical nature
of this etching process provides a good selectivity, which means the
etching rate of the target material is considerably higher than the mask
material if selected carefully.
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MEMS - Isotropic etching
1 Etching progresses at the same speed in all directions. Long and
narrow holes in a mask will produce v-shaped grooves in the silicon. The
surface of these grooves can be atomically smooth if the etch is
carried out correctly, with dimensions and angles being extremely
accurate.
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MEMS - Anisotropic etching
1 Some single crystal materials, such as silicon, will have different etching
rates depending on the crystallographic orientation of the
substrate
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MEMS - HF etching
1 Hydrofluoric acid is commonly used as an aqueous etchant for silicon
dioxide (, also known as BOX for SOI), usually in 49% concentrated form,
5:1, 10:1 or 20:1 BOE (buffered oxide etchant) or BHF (Buffered HF). They were first used in medieval times for
glass etching. It was used in IC fabrication for patterning the gate oxide until the process step was
replaced by RIE.https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
MEMS - HF etching
1 Hydrofluoric acid is considered one of the more dangerous acids in the cleanroom. It penetrates the skin
upon contact and it diffuses straight to the bone. Therefore the damage is
not felt until it is too late.
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MEMS - Electrochemical etching
1 Electrochemical etching (ECE) for dopant-selective removal of silicon is a common method to automate and
to selectively control etching
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MEMS - Xenon difluoride etching
1 Xenon difluoride () is a dry vapor phase isotropic etch for silicon
originally applied for MEMS in 1995 at University of California, Los
Angeles
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MEMS - Reactive ion etching (RIE)
1 In reactive ion etching (RIE), the substrate is placed inside a reactor, and several gases are introduced
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MEMS - Reactive ion etching (RIE)
1 Deep RIE (DRIE) is a special subclass of RIE
that is growing in popularity
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MEMS - Reactive ion etching (RIE)
1 The creates a polymer on the surface of the substrate, and the second gas composition ( and )
etches the substrate
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MEMS - Die preparation
1 After preparing a large number of MEMS devices on a wafer (electronics)|silicon wafer, individual die (integrated circuit)|dies have to be separated, which is called die preparation
in semiconductor technology. For some applications, the separation is preceded by wafer backgrinding in order to reduce the wafer thickness. Wafer dicing may then be performed either by sawing using a cooling
liquid or a dry laser process called wafer_dicing#Stealth_dicing|stealth dicing.
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MEMS - Bulk micromachining
1 Bulk micromachining is the oldest paradigm of silicon
based MEMS
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MEMS - Surface micromachining
1 Analog Devices have pioneered the industrialization of surface
micromachining and have realized the co-integration of MEMS and
integrated circuits.
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MEMS - High aspect ratio (HAR) silicon micromachining
1 Bonding a second wafer by glass frit bonding, anodic bonding or alloy
bonding is used to protect the MEMS structures
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MEMS - Applications
1 In one viewpoint MEMS application is categorized by
type of use.
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MEMS - Applications
1 In another view point MEMS applications are categorized by the
field of application (commercial applications include):
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MEMS - Applications
1 *Inkjet printers, which use piezoelectrics or thermal bubble ejection to deposit ink on
paper.
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MEMS - Applications
1 *Accelerometers in modern cars for a large number of purposes including
airbag deployment in collisions.
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MEMS - Applications
1 [ http://www.eetimes.com/showArticle.j
html?articleID=200900669 There's more to MEMS than meets the
iPhone], EE Times, (2007-07-09) and a number of Digital Cameras (various
Canon Digital IXUS models)
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MEMS - Applications
1 *MEMS gyroscopes used in modern cars and other applications to detect
yaw, pitch, and roll|yaw; e.g., to deploy a roll over bar or trigger
dynamic stability control
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MEMS - Applications
1 *Silicon pressure sensors e.g., car tire pressure sensors, and disposable blood
pressure sensors
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MEMS - Applications
1 *Display device|Displays e.g., the Digital micromirror device|DMD chip in a projector based on Digital Light Processing|DLP technology, which has a surface with several hundred
thousand micromirrors or single micro-scanning-mirrors also called
microscanners
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MEMS - Applications
1 *Optical switching technology, which is used for switching technology and alignment for data communications
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MEMS - Applications
1 *Bio-MEMS applications in medical and health related technologies from Lab-On-Chip to
MicroTotalAnalysis (biosensor, chemosensor), or embedded in medical devices e.g. stents.
[ http://ves.sagepub.com/content/46/8/605 Microelectromechanical Systems and
Nanotechnology. A Platform for the Next Stent Technological Era ,Louizos-Alexandros Louizos,
Panagiotis G. Athanasopoulos, Kevin Varty,VASC ENDOVASCULAR SURG November 2012 vol. 46
no. 8 605-609, doi: 10.1177/1538574412462637]
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MEMS - Applications
1 *Interferometric modulator display (IMOD) applications in consumer electronics (primarily displays for mobile devices), used to create interferometric modulation −
reflective display technology as found in mirasol displays
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MEMS - Applications
1 *electrostatic fluid accelerator|Fluid acceleration such as for micro-cooling
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MEMS - Applications
1 *Micro-scale Energy harvesting including piezoelectric, electrostatic
and electromagentic micro harvesters.
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MEMS - Applications
1 *Micromachined Ultrasound Transducer including Piezoelectric
Micromachined Ultrasonic Transducers and Capacitive Micromachined Ultrasonic
Transducers.
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MEMS - Applications
1 Companies with strong MEMS programs come in many sizes. The larger firms specialize in
manufacturing high volume inexpensive components or packaged solutions for end markets such as automobiles, biomedical,
and electronics. The successful small firms provide value in innovative solutions and absorb the expense of custom fabrication with high sales margins. In addition, both large and small companies work in RD to
explore MEMS technology.
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MEMS - Industry structure
1 The global market for micro-electromechanical systems, which includes products such as
automobile airbag systems, display systems and inkjet cartridges totaled $40 billion in 2006
according to Global MEMS/Microsystems Markets and Opportunities, a research report from SEMI and Yole Developpement and is forecasted to
reach $72 billion by 2011.[http://www.azonano.com/news.asp?
newsID=4479 Worldwide MEMS Systems Market Forecasted to Reach $72 Billion by 2011]
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MEMS - Industry structure
1 While MEMS manufacturing continues to be dominated by used
semiconductor equipment, there is a migration to 200mm lines and select
new tools, including etch and bonding for certain MEMS
applications.
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Wavelength selective switching - Microelectromechanical Mirrors (MEMS)
1 The incoming light is broken into a spectrum by a diffraction grating
(shown at RHS of Figure) and each wavelength channel then focuses on
a separate MEMS mirror
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Wavelength selective switching - Microelectromechanical Mirrors (MEMS)
1 This technology has the advantage of a single steering surface, not
necessarily requiring polarization diversity optics. It works well in the
presence of a continuous signal, allowing the mirror tracking circuits to dither the mirror and maximise
coupling.
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Wavelength selective switching - Microelectromechanical Mirrors (MEMS)
1 MEMS based WSS typically produce good extinction ratios, but poor open loop performance for setting a given
attenuation level
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Wavelength selective switching - MEMS Arrays
1 In this case, the angle of the MEMs mirrors is changed to
deflect the beam
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MEMS magnetometer - Introduction
1 Magnetic field sensors|Magnetic field sensing can be categorized into four general typesLenz, J., Edelstein, A.S.,
Magnetic sensors and their applications
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MEMS magnetometer - Introduction
1 Integration of MEMS sensor and microelectronics can further reduce the size of the entire magnetic field
sensing system.
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MEMS magnetometer - Lorentz-force-based MEMS sensor
1 This type sensor relies on the mechanical motion of the MEMS
structure due to the Lorentz force acting on the current-carrying
conductor in the magnetic field
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MEMS magnetometer - Voltage sensing
1 Beroulle et al.Beroulle, V.; Bertrand, Y.; Latorre, L.; Nouet,
P
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MEMS magnetometer - Voltage sensing
1 Herrera-May et al.Herrera-May, A.L.; García-Ramírez, P.J.; Aguilera-Cortés, L.A.; Martínez-Castillo, J.; Sauceda-Carvajal, A.; García-González, L.;
Figueras-Costa, E
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MEMS magnetometer - Voltage sensing
1 Kádár et al.Kádár, Z.; Bossche, A.; Sarro, P.M.;
Mollinger, J.R
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MEMS magnetometer - Voltage sensing
1 Emmerich et al.Emmerich, H.; Schöfthaler, M. Magnetic field
measurements with a novel surface micromachined magnetic-field sensor. IEEE Tans. Electron Dev.
2000, 47, 972-977. fabricated the variable capacitor array on a single silicon substrate with comb-figure
structure. The reported sensitivity is 820 Vrms/T with a resolution 200 nT
at the pressure level of 1mbar.https://store.theartofservice.com/itil-2011-foundation-complete-certification-kit-fourth-edition-study-guide-ebook-and-online-course.html
MEMS magnetometer - Frequency shift sensing
1 Another type of Lorentz force based MEMS magnetic field sensor utilize the shift of mechanical resonance
due to the Lorentz force applying to certain mechanical structures.
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MEMS magnetometer - Frequency shift sensing
1 Sunier et al.Sunier, R.; Vancura, T.; Li, Y.; Kay-Uwe, K.; Baltes, H.; Brand, O
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MEMS magnetometer - Frequency shift sensing
1 Bahreyni et al.Bahreyni, B.;
Shafai, C
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MEMS magnetometer - Optical sensing
1 The optical sensing is to directly measure the mechanical
displacement of the MEMS structure to find the external magnetic field.
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MEMS magnetometer - Optical sensing
1 Zanetti et al.Zanetti, L.J.; Potemra, T.A.; Oursler, D.A.; Lohr, D.A.; Anderson, B.J.; Givens, R.B.;
Wickenden, D.K.; Osiander, R.; Kistenmacher, T.J.; Jenkins, R.E
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MEMS magnetometer - Optical sensing
1 Keplinger et al.Keplinger, F.; Kvasnica, S.; Hauser, H.;
Grössinger, R
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MEMS magnetometer -
1 When the temperature increases, the Young’s modulus of the material used
to fabricate the moving structure decreases
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IBM Monochrome Display Adapter - Clone boardshttp://www.vgamuseum.info/index.php/component/content/arti
cle/59-vlasks-articles/index.php?optioncom_custompropertiesviewshowtaskshowcp_madecp_buscp_memsizecp_yearcp_memorycp_familycp_cardtypemdacp_ownercp_directxcp_openglcp_pipelinescp_manufacturercp_processcp_text_search
1 Other boards offered MDA compatibility, although with
differences on how attributes are displayed or the font used.
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IBM Monochrome Display Adapter - Clone boardshttp://www.vgamuseum.info/index.php/component/content/arti
cle/59-vlasks-articles/index.php?optioncom_custompropertiesviewshowtaskshowcp_madecp_buscp_memsizecp_yearcp_memorycp_familycp_cardtypemdacp_ownercp_directxcp_openglcp_pipelinescp_manufacturercp_processcp_text_search
1 *United Microelectronics
Corporation UM6845
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Hercules Graphics Card - Clone boards[http://www.vgamuseum.info/index.php/component/content/art
icle/59-vlasks-articles/index.php?optioncom_custompropertiesviewshowtaskshowcp_madecp_buscp_memsizecp_yearcp_memorycp_familycp_cardtypeherculescp_ownercp_directxcp_openglcp_pipelinescp_manufacturercp_processcp_text_sear
ch VGA Legacy]
1 Other boards offered Hercules
compatibility.
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Hercules Graphics Card - Clone boards[http://www.vgamuseum.info/index.php/component/content/art
icle/59-vlasks-articles/index.php?optioncom_custompropertiesviewshowtaskshowcp_madecp_buscp_memsizecp_yearcp_memorycp_familycp_cardtypeherculescp_ownercp_directxcp_openglcp_pipelinescp_manufacturercp_processcp_text_sear
ch VGA Legacy]
1 *ATi Small Wonder Graphics Solution, 18700, Graphics
Solution Plus
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Barometric - Mems Barometers
1 Microelectromechanical systems (or Mems) barometers are extremely small devices between 1 to 100 micrometres in size (i.e. 0.001 to
0.1mm). They are created via lithography or etching. Typical
applications include miniaturized weather stations, electronic barometers and altimeters.
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COMSOL Multiphysics - MEMS Module
1 For coupled physical processes in microelectromechanical systems and piezoelectric devices. Incorporates specific multiphysics couplings for
applications such as thin-film damping, piezoelectricity, and fluid-structure interaction. A specialized user interface for electromechanics interactions is included that allows
for MEMS cantilever beam simulations.
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List of Freescale products - MEMS Sensors
1 * MMA Series (Multi-G/ Multi-Axis
Accelerometers)
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Jaypee Institute of Information Technology - MEMS Design Centre
1 The Centre has undertaken in-house development of Quartz Micro-balance
for Bio-sensors, MEMS Inductor Design for RF wireless application, Microcantilever for communication filter and lead free piezo ceramics
through master level projects.
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