Please send your resume to ressources.humaines@ino.ca with the subject ’Silicon photonics packaging master application’’

MASTER’S THESIS PROPOSAL

THE OBJECTIVES OF THIS PROJECT ARE:

We are calling for applications from highly motivated individuals enrolled in a master’s program to conduct research in silicon photonics packaging. The candidate will work with a multidisciplinary research team as part of the leading optics and photonics R&D center in Canada.

In silicon photonics packaging, several devices require high frequency electrical signals. In standard CMOS packaging, ball grid arrays and the flip chip bonding technologies are used for RF packaging. However, these technologies require high temperature processes that may not be compatible with optoelectronic packages.

The goal of this research is to develop an optoelectronic package for photonic chips with RF electrical I/Os.

1) Identify the appropriate technologies to package Si photonics chips with RF electrical signals requirements.

2) Perform simulations to predict the performances of the selected technologies

3) Develop these technologies on INO packaging capabilities

4) Design a package using these technologies

5) Assemble a package or selected components to verify predicted performances

6) Compare the performances with the prediction

WHAT: Master thesis

WHERE: INO, Québec city, Québec Canada

WHEN: From September 2014 to April 2016

Identification of the technologies

to develop

Simulation ofthe performancesof the identified

technologies

Selection of thetechnologies to test

experimentally

Assembly of an RFpackage

Preliminary tests onindividual components

Design of an RFpackage

Characterization of theperformances of an RF

package

Final Report(Master Thesis)

INO2740 Einstein Street, Québec City, Québec G1P 4S4 Canada

418.657.7006 / 1.866.657.7406www.ino.ca / info@ino.ca