Gopal Rao

Technology & Manufacturing Consulting

email:greatpickles@gmail.com

Tel: (505) 504 2620

Enabling the Supply Chain Accelerate R&D and

Stay in Sync with the IC Scaling Cadence and Consumer Demand

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Device Makers

Customers

Develop New Capabilities

And Mitigate Risk

Time Money/Market

Technology Cadence

Reduce Cost of Technology

And Manufacturing

Reduce Cost of Sales

Reduce Cost of Manufacturing

Supply

Chain

Consumer

Demand

Supply Chain Integration: Push/Pull Roadmaps

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Powered By Moore’s LawPowered By

Imagination

Source: Intel

Example: End Result – Integrated Performance of Supply Chain

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ITRS Roadmap – Helped Industry Stay On Moore’s Law

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Evolution of ITRS: From More of Moore to More Than More

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Imagination Inspired Products: Dramatic Impact on HVM

Source: Intel

Cost of Technology

Cost of Manufacturing

Time to Market

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Leveraging Digital Revolution In HVM

Source: GE

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Research

Development

Manufacturing

Source: ITRS

Sequential Flow to Integrated R-D-M: Faster Cycles of Learning

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Buildings

Sub Fab, Systems, Facilities

Roadmap

Standards

Fab (Clean Room)

Roadmaps

Standards

Equipment/Materials

RoadmapsStandards

FactoryOperations

ProductionEquipment AMHS

Factory Information& Control Systems Facilities

UI

Sub Systems

Components

Supply

Chain

Case For Integrated Roadmap & Standards Development

FYI : SEMI has 870 Standards (Source SEMI.org)Roadmaps & Standards6/25/2014

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Some Attributes of a Fab

SECS Control Line

Equipment Data Acquisition (EDA) Standards to get Rich Equipment Data

Manufacturing Execution Systems

Predictive Factory Scheduler

And Material Control

Full Wafer Level Tracking &

Recipe/Parameter Changes

100% Direct Tool

Delivery AMHS

Ubiquitous APC; Rapid Process Matching &

New Product Qualification

Standard, Detailed Equipment

Performance Tracking (EPT) Data

Systems Scaled for

> 50k wspm

Data standards and

Systems for Rapid

Mask Set Creation

Aggressive NPW Reduction &

Efficient Spares Mgmt

Very Fast Cycle time

Fabs for Hot &

Normal lots

Wafer Data Standard

For Packaging

Offline tools to test

schedule rules and rapidly

put in Mfg.

Predictive Maint. and PM

scheduling.

Pervasive

E-Diagnostics

SPCR2R FDC

Yield VM EPT

Equipment Engineering Capabilities

Recipes

E-Diag

EquipmentControl Systems

Partner, Customer

Or Supplier

Equipment & Systems

designed for High Mix

operation & “Mega Fabs”

Equipment &

Process Data

Source: Gopal Rao, International Technology Roadmap for Semiconductors

PPM

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Product Reliability

Form, FIT, Function

Process

Transistor & Interconnect

Metrics

Equipment

Input & Output

Parameters

Materials

Quality, Purity,

Defectivity

Facilities

Integrated Metrics

Symptom

Low Deposition Rate

Condition 1

Contamination

Condition 2

Gas

Condition 3

Pressure

Condition 4

Temperature

Condition 1.1

Chamber

Contamination

Condition 1.2

Load Lock

Contamination

Condition 2.1

Gas lines

Condition 2.2

Flow Control

Condition 2.3

Cylinder

Condition 3.1

Vacuum pump

Condition 3.2

Chamber Leak

Condition 3.3

Pump Lines

Condition 3.4

Pressure control

Condition 4.1

Heating coils

Condition 4.2

T.C.

Condition 4.3

Temp controler

Condition 2.2.1

MFC calibration

Condition 2.2.2

MFC functionalityCondition 2.2.3

Controller functionality

Cause & Effect – Problem Solving CapabilityComponent Impact on Yield, Output, Cost

Example of Problem TraceabilityInteraction & Interdependency of Metrics6/25/2014

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Source: Intel

Need For Faster Integration of

Supply Chain in R&D and HVM

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So What Does This All Mean?

Culture Challenges Opportunities for

The ConFab

AccelerateFocus on

Entire Supply Chain

Interception of the Imagination Inspired,

Consumer Driven Products

The Fabs Make it Happen: Expand Discussions Beyond

the SEMI Industry

Collaborate Faster Time To Market

Effective Supply Chain Integration into R&D and

HVM

Build on your success – What is the vision for the next 10

years?

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