CMOS Transistors

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CMOS Transistors. Outline. Qualitative Description of CMOS Transistor g m /I D Design Biasing a transistor Using g m /I D Approach Design Using Cadence. A Crude Metal Oxide Semiconductor (MOS) Device. V2 causes movement of negative charges, thus current. V1 can control the - PowerPoint PPT Presentation

Transcript of CMOS Transistors

CMOS Transistors

Outline

• Qualitative Description of CMOS Transistor

• gm/ID Design

• Biasing a transistor Using gm/ID Approach

• Design Using Cadence

A Crude Metal Oxide Semiconductor (MOS) Device

P-Type Silicon is slightly conductive.

Positive charge attractnegative chargesto interface between insulator and silicon.

A conductive path is createdIf the density of electrons is sufficiently high.Q=CV.

V2 causes movement of negative charges,thus current.

V1 can control the resistivity of the channel.The gate

draws no current!

An Improved MOS Transistor

n+ diffusion allowselectrons movethrough silicon.

(provide electrons) (drain electrons)

Typical Dimensions of MOSFETs

These diode mustbe reversed biased.tox is made really thin

to increase C, therefore, create a strong control of Q by V.

A Closer Look at the Channel Formulation

Need to tie substrate to GNDto avoid current through PN diode.

Positive charges repel the holescreating a depletion region, a region free of holes.

Free electrons appear at VG=VTH.

VTH=300mV to 500 mV(OFF) (ON)

Channel Resistance

As VG increases, the density of electrons increases, the value ofchannel resistance changes with gate voltage.

Drain Current as a function of Drain Voltage

Resistance determined by VG.

Drain Current as a function of Gate Voltage

Higher VG leads to a lower channel resistance, therefore larger slope.

Length Dependence

The resistance of a conductor is proportional to the length.

Dependence on Oxide Thickness

Q=CVC is inversely proportional to 1/tox.

Lower Q implies higher channel resitsance.

Width Dependence

The resistance of a conductor is inversely proportional to the crosssection area.

A larger device also has a larger capacitance!

Channel Pinch Off• Q=CV– V=VG-VOXIDE-Silicon

• VOXIDE-Silicon can change along the channel! Low VOXIDE-Silicon implies less Q.

VG-VD is sufficiently largeto produce a channel

VG-VD is NOT sufficiently largeto produce a channel

No channel

Electronsare sweptby E to drain.

Drain can no longer affect the drain current!

Regions

No channel

(No Dependence on VDS)

Determination of Region

• How do you know whether a transistor is in the linear region or saturation region?– If VDS>(VGS-VTH) and VGS>VTH, then

the device is in the saturation region.– If VDS<(VGS-VTH) and VGS>VTH, then

the device is in the linear region.

Graphical Illustration

Limited VDS Dependence During Saturation

As VDS increase, effective L decreases, therefore, ID increases.

Pronounced Channel Length Modulation in small L

Transconductance• As a voltage-controlled current source, a MOS transistor

can be characterized by its transconductance:

• It is important to know that

What Happens to gm/ID when W and ID are doubled?

Body Effect

The threshold voltage will change when VSB=0!

Experimental Data of Body Effect

The threshold voltage will increase when VSB increases.

Small Signal Model for NMOS Transistor

PMOS Transistor

IV Characteristics of a PMOS

Small Signal Model of PMOS

Small Signal Model of NMOS

gm/ID Design Approach

gm/ID Design Flow

Specs

Design Equations(Analytical

)

gm/Id Data Set

(Emprical)

gm/ID Design Optimization

W/L Ratios

(F. Silveira, JSSC, 1996.)

Intuition

gm

gds

gm/IDgm/gds

2gm

2gds

gm/IDgm/gds

2gm

2gds

gm/IDgm/gds

gm/ID Data Set

• gm/gds

• gm/gmbs

• ID/W

• Cgd/Cgg

• Cgs/Cgg

• ….more

(F. Silveira, JSSC, 1996.)

Design Example

Calculation

(gm is determined)

Initially assume that gmro is large!

gm/gds

(50)

Current Density

Biasing an MOS Transistor Using gm/ID technique

Section 7.1

J.OuSonoma State Univeristy

Basic Analysis

Use 1.2 V

(Modified Ex 7.1)

Design Equations

Assumption: VDD=1.2 V

Transistor Information:Type: 120 nm Specify VDSNote var1_1 is ‘vsd’ if pmos is usedNote var2_1 is ‘vns’ if nmos is used.

In this example, is initially unknown, so we will assume that it is 0.0

Interpolation

Since the database basecan not be so large as to keep all possible values of vds/vsb, we have to interpolate based on existing values, which are availableOn 0.1 V interval.

Current release: need to enterinBias <= the minVar1 and maxVar1.

minVar=maxVar-0.1

Browse Database

dBrowse2D(25, 'pfet', '15.0u', 'vsd', 0.3, 0.4, 0.353, 'vns', 0.5, 0.6, 0.577, 'vth')

Variable name=dBrowse2D(gmoverid, type, length, var1, minVar1, maxVar1,inBias1,var2, minVar2, maxVar2,inBias2,‘parameter’)

Valid parameters:gmovergds, gmovergmbs, vth, ft, gmoveridft, idoverw, vod, region, fndbderivcgdovercgg,cddovercgg, cgsovercgg, csbovercgg, cdbovercgg, ron, vdsat, rseff, rdeff

type: nfet, pfetlength: {'120n' '180n' '250n' '350n' '600n' '800n' '1.0u' '2.0u' '3.0u' '4.0u' '5.0u' '6.0u' '7.0u' '8.0u' '9.0u' '10.0u' '15.0u' '20.0u'} (text string)

Iteration• Start with

– length=‘120nm’– gmoverid=20– VDS=VDD/2, VSB=0

• Calculate– vod_1– vth_– vgs_1– vx (gate voltage)– vs (source voltage)– ID– Idoverw– W– RD– Vd– Vds=Vd-Vs

Iteration Example

Design Iterations

Iteration

VS IDS W RD Vds

0 0.1 V 392uA 53.06 um

1.529Kohms

0.207 V

1 0.321 322 uA 45.16 um

1.89 Kohms

0.278 V

2 0.340 340.4 uA

46.86 um

1.762 Kohms

0.259

3 0.335 335 uA 46.44 1.788 Kohms

0.265

Matlab & Simulation

Parameters Matlab Cadence

W 46.56 um 46 um

Vx 0.857 V 0.857 V

ids 336.8 uA 339 uA

gm 6.7 mS 6.80 mS

gm/ids 19.94 20.05

Vs 0.336 V 0.339 V

Vd 0.6 V 0.593 V

Vds 0.263 V 0.257V

Vth 0.5 V 0.497 V

Circuit Design Using Cadence

J.Ou

Start Cadence

Start Cadence

Create New Cellview

Add Instance

Add a Resistor

Add Ground

Add Power

Add Wire

Done!

Start ADE L

Start DC Analysis

Netlist and Run

Annotate DC Node Voltages

Model Library Setup

DC Voltage Annotated

Component Display

Display DC Operating Point

Click on the device to displayvalues!

Save State