Chapter 6 Thermal Oxidation _ I Bo Cui
Books
Chapter 2 Modern CMOS technology 1.Introduction. 2.CMOS process flow. 1 NE 343: Microfabrication and thin film technology Instructor: Bo Cui, ECE, University.
1.Introduction and application. 2.Dopant solid solubility and sheet resistance. 3.Microscopic view point: diffusion equations. 4.Physical basis for diffusion.
Chapter 9 Thin film deposition 1.Introduction to thin film deposition. 2.Introduction to chemical vapor deposition (CVD). 3.Atmospheric Pressure Chemical.
1.Introduction and application. 2.Ion implantation tools. 3.Dopant distribution. 4.Mask thickness and lateral distribution. 5.Effect of channeling. 6.Damage.
1.SiO 2 properties and applications. 2.Thermal oxidation basics. 3.Manufacturing methods and equipment. 4.Measurement methods. 5.Deal-grove model (linear.
Chapter 9 Thin Film Deposition _ I
Lecture 1 2013
Chapter 5 Lithography _ III
1.Introduction to etching. 2.Wet chemical etching: isotropic. 3.Anisotropic etching of crystalline Si. 4.Dry etching overview. 5.Plasma etching mechanism.
