1 Fingerprint Sensing Techniques, Devices and Applications Rahul Singh [email protected] 30 th April 2003.
Daniel S Levin UM/TAU/IS/ORNL meeting with GE Sept 27, 2012 University of Michigan
Wire Bonding and Analogue Readout ● Cold bump bonding is not easy ● Pixel chip is not reusable ● FE-I3 is not available at the moment ● FE-I4 is coming.
