Polyglot Messaging with Apache ActiveMQ
ActiveMQ 5.9.x new features
Work in Progress --- Not for Publication 1 PIDS 7/11/00 PIDS ITWG Meeting PIDS ITWG Emerging Research Devices Working Group Face-to-Face Meeting Jim Hutchby.
December 3, 2010 Public Conference MAKUHARI MESSE International Conference Hall Assembly and Packaging.
The Emerging Electronic Design Automation Design Technology Needs for Supporting Emerging Reaches of Silicon Rajesh Gupta, UC San Diego [email protected].
Heterogeneous Technology Alliance Photonic on Silicon : Electro-optical links for massively parallel multiprocessors systems- in-package.
Three-Dimensional Microelectronics Integration: Design, Analysis and Characterization Zeynep Dilli Ph.D. Program Dissertation Proposal.
3D-INTEGRATED CIRCUITS
StorageIQ™ Daniel Greenberg New Product Manager. 9/5/20152 Making Storage Smarter Fujifilm is the premier provider of quality tape media and storage intelligence.
Project / subject name: Industrial Realization of CMOS- integrated Nanosensors Contact person and organization: Anton Köck, AIT Austrian Institute of Technology.
Nano Technology for Microelectronics Packaging Karl-Friedrich Becker, Rolf Aschenbrenner BECAP - TU Berlin / Fraunhofer IZM Gustav-Meyer-Allee 25 / 13355.
Dependable Web Service Compositions usng a Semantic Replication Scheme LABORATÓRIO DE SISTEMAS DISTRIBUÍDOS – LASID DEPARTAMENTO DE CIÊNCIA DA COMPUTAÇÃO.
