SM_LCT27HA36_CMO(11-16-06)
Ic fab
Visit To Botswana 2008
EEE-287 Tony Osladil EEE-287 California State University Sacramento VLSI Design - IC Manufacturing and Test Instructor: Tony Osladil.
2007013265 Moon – jun young. Index Introduce product Semiconductor product manufacturing process Wafer backgrinding Wafer saw Die attach Mold Mark.
M.Nuzaihan DMT 243 – Chapter 3 Wafer Backgrinding, Die Preparation, Die Attach, Wire Bonding, Die Overcoat, Molding, Sealing, Marking, DTFS, Lead Finish,
