The top documents tagged [d layerbonding]

MonolithIC 3D Inc. Patents Pending 1 THE MONOLITHIC 3D-IC: Logic + eDRAM on top.

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MonolithIC 3D Inc. Patents Pending 1 Monolithic 3D Integrated Circuits Deepak C. Sekar, Paul Lim, Brian Cronquist, Israel Beinglass and Zvi Or-Bach MonolithIC.

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THE MONOLITHIC 3D-IC: Logic + eDRAM on top

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