Report - Experience with bump bonding ATLAS Particle physics€¦ · • Readout wafer size 200 mm x 725 μm • Bumping with eutectic solder: –TiW/Cu/Ni(3 μm)/eut. Sn-Pb(13 μm) • Bump

Select PornographicDefamatoryIllegal/UnlawfulSpamOther Terms Of Service ViolationFile a copyright complaint

Please pass captcha verification before submit form