Introduction
One of the most important parts of any analysis, thermal or not, is proper setup and definition. Without clear and precise setup, an analysis can be off by orders of magnitude, with meaningless results. This document will guide you through a step by step process to define the thermal model and associated boundary conditions to ensure accurate results.
Throughout this document, there will be places to add text, makes selections, and add pictures. These places will be indicated in YELLOW highlighting or shapes. Please add information as required in the indicated yellow areas by using your mouse to click (or double click) until the text cursor appears, then type in the requested information. When done typing, use the mouse to click elsewhere on the page to finish text entry. Additionally, areas of RED show important notes, reminders, or cautions.
Customer Information:
Company Name – Company Name Here
Requester Name – Requester Name Here
Luminaire Name – Luminaire Name Here
Date – Date Here
Company Name –
Requester Name –
Luminaire Name –
Date –
__________________________
__________________________
__________________________
__________________________
Company Name Here To edit text fields, move your mouse cursor over the yellow box and click (or double click) until the text cursor flashes in the yellow box. Delete the existing text then type the necessary information. Finally, use your mouse to click outside of the box to disable text entry
Requester Name Here
Luminaire Name Here
Date Here
Material Definition
# MaterialConductivity
(W/m·K)
1 ABS Plastic / Acrylic 0.17
2 Aluminum 6061 180
3 Aluminum 6063 218
4 Aluminum ADC6 130
5 Aluminum Cast A360 113
6 Aluminum Cast A380 116
7 Brass 120
8 Copper (99% pure) 390
9 Fiberglass (FR4) 0.25
10 Glass 1.0
11 Nylon / Polycarb / PVC / Teflon 0.20
12 Steel, Low Alloy 50
13 Steel, Stainless 16
14 Zinc 116
Other (Specify)
O1 - - - - - - - -
O2 - - - - - - - -
O3 - - - - - - - -
O# - - - - - - - -
#
Make sure all components have been defined
Interface Definition
*Air gap (1 mil) is equivalent to standard part to part contact, with no thermal interface material in between.
**DO NOT specify thermal interface between the module and the heat sink. All XSM, XLM, & XPM ship with eGRAF HT-1205 thermal pad attached and will be used in the analysis.
#
# Interface***Contact Resistance
(ºC·m2/W)
A Air Gap (1 mil)* 9.37 x 10-4
B eGRAF HT-1205** 1.27 x 10-5
C Bergquist Q-pad3 2.26 x 10-4
D Wakefield Grease 3.46 x 10-5
Other (Specify)
O1 - - - - - - - -
O2 - - - - - - - -
O3 - - - - - - - -
O# - - - - - - - -
Make sure all interfaces have been defined
System Definitions – Product SelectionFamily Series Performance
Current (mA)
350 500 700 1050
XSM
80
400 lm NA
700 lm
1000 lm
1300 lm
2000 lm
3000 lm
Artist
700 lm NA
1000 lm
1300 lm
XPM 80 5 cd/mm2
XLM80
3000 lm
4000 lm
Artist 3000 lm
Please only select highest drive current required. Multiple selections will delay results.
Maximum Thermal Class – ______ *See following slide for corresponding Thermal Class
Goal of Analysis – ______________________________________
Maximum Operating Ambient Air Temperature – _______ºC
Color of Heat Sink or Primary Thermal Dissipator – ______________
Will the fixture be in-ground or in a sealed cavity? – ______________(if Yes, please fill out details on next page
Determine Maximum XSM Tc Temperature
40
Black
?
Y/N
In-Ground or Sealed Cavity Definition• Please leave as “N/A” if this doesn’t apply, otherwise delete “N/A” and define cavity size,
materials and orientation.# Material
Conductivity(W/m·K)
1 ABS Plastic / Acrylic 0.17
2 Glass 1.0
3 Nylon / Polycarb / PVC / Teflon 0.20
4 Air 0.025
5 Plywood 0.13
6 Concrete-Light 0.1
7 Brick 1.31
8 Drywall 2.2
9 Soil- Unkown Type 0.06-0.25
10 Soil- Clay 0.25
11 Soil- Sand 0.20
12 Soil- Peat 0.06
13 Soil- Chalk 0.09
Other (Specify)
O1 - - - - - - - -
O2 - - - - - - - -
O3 - - - - - - - -
O# - - - - - - - -
N/A
#
#
#
Thermal Classes (–C XSM)
Family Series PerformanceCurrent (mA)
350 500 700 1050
XSM
80
400 lm A A B NA
700 lm A A B D
1000 lm A B C E
1300 lm B C D F
2000 lm C E F K
3000 lm E G J P
Artist
700 lm C D F NA
1000 lm C D F H
1300 lm C E G K
XPM 80 5 cd/mm2 C D F J
XLM80
3000 lm D F J N
4000 lm F J M T
Artist 3000 lm G J N U
Thermal Classes also listed in module Data Sheets
Simulation Orientations
jj
Legend
Gravity9.81m/s²
(1.64m/s² if luminaire installed on moon)
180°
0°
270°90°
Orientation 1 ____ ° Orientation 2 ____ ° Orientation 3 ____ °0 ### ###
Additional Notes
• Submit completed forms to [email protected] along with exported CAD files.
• Simulation results should always be verified by making prototypes and comparing measured temperature values.
• Simulation does not qualify under the Xicato Luminaire Validation Program – see program requirements for details.
• Simulation results do not guarantee performance or lifetime: results should be used as design guidance only.
• Drivers and electronics can be simulated for power dissipation, but due to complexities and accuracy issues with individual temperature (i.e. capacitors, ICs, etc.), temperatures of drivers and electronics will not be accurate and therefore not reported. Electronics temperature gradients shown in thermal plots should be disregarded.
• For additional help or information, please contact your Xicato technical representative, or email [email protected].
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