Preface, Contents
Product Overview1
Getting Started with Commissioning
2
Configuration Options3
Installation4
Wiring5
Commissioning and Diagnostics6
Maintenance7
General Technical Data8
Terminal Modules9
Power Supply PS10
Interface Module11
Digital Electronic Modules12
Analog Electronic Modules13
Reserve Module14
Appendices
Glossary, Index
Edition 02/2005A5E00247483-04
Distributed I/O DeviceET 200iSP
Manual
SIMATIC
This documentation is available under order number 6ES7152-1AA00-8BA0
!Danger
indicates that death or severe personal injury will result if proper precautions are not taken.
!Warning
indicates that death or severe personal injury may result if proper precautions are not taken.
!Caution
with a safety alert symbol indicates that minor personal injury can result if proper precautions are nottaken.
Caution
without a safety alert symbol indicates that property damage can result if proper precautions are not taken.
Attention
indicates that an unintended result or situation can occur if the corresponding notice is not taken intoaccount.
If more than one degree of danger is present, the warning notice representing the highest degree ofdanger will be used. A notice warning of injury to persons with a safety alert symbol may also include awarning relating to property damage.
Qualified PersonnelThe device/system may only be set up and used in conjunction with this documentation. Commissioningand operation of a device/system may only be performed by qualified personnel. Within the context of thesafety notices in this documentation qualified persons are defined as persons who are authorized tocommission, ground and label devices, systems and circuits in accordance with established safetypractices and standards.
Prescribed UsageNote the following:
!Warning
This device and its components may only be used for the applications described in the catalog or thetechnical description, and only in connection with devices or components from other manufacturers whichhave been approved or recommended by Siemens.
Correct, reliable operation of the product requires proper transport, storage, positioning and assembly aswell as careful operation and maintenance.
TrademarksAll names identified by are registered trademarks of the Siemens AG. The remaining trademarks in this publication may be trademarks whose use by third parties for their ownpurposes could violate the rights of the owner.
Safety GuidelinesThis manual contains notices you have to observe in order to ensure your personal safety, as well as toprevent damage to property. The notices referring to your personal safety are highlighted in the manual bya safety alert symbol, notices referring to property damage only have no safety alert symbol. The noticesshown below are graded according to the degree of danger.
We have reviewed the contents of this publication to ensureconsistency with the hardware and software described. Sincevariance cannot be precluded entirely, we cannot guarantee fullconsistency. However, the information in this publication isreviewed regularly and any necessary corrections are includedin subsequent editions.
Disclaim of LiabilityCopyright Siemens AG 2004 All rights reserved
The distribution and duplication of this document or theutilization and transmission of its contents are not permittedwithout express written permission. Offenders will be liable fordamages. All rights, including rights created by patent grant orregistration of a utility model or design, are reserved
Siemens AGAutomation and DrivesPostfach 4848, D- 90327 Nuernberg
Siemens AG 2005Technical data subject to change.
Siemens Aktiengesellschaft A5E00247483-02
iiiDistributed I/O device ET 200iSPA5E00247483-02
Preface
Purpose of this manual
The information in this manual enables you to operate the ET 200iSP distributed I/O device as a DP slave via an RS 485 IS coupler on the PROFIBUS-DP RS 485 IS.
Basic knowledge required
To understand the manual, you require general experience in the field ofautomation engineering.
In particular when operating a PLC in safety-relevant areas, observe theinformation on the safety of electronic control systems in the S7-300, CPU 31xC,and CPU 31x operating instructions: Installation.
The following qualifications are also required:
Table 1-1 Qualified Personnel
Activities Qualifications
Installation of ET 200iSP • Basic technical training
• Knowledge of safety regulations regarding theworkplace
Wiring the ET 200iSP • Basic practical training in electrical engineering
• Knowledge of the relevant safety regulations forelectrical engineering
• Knowledge of methods of installing explosion-proofelectrical equipment
• Knowledge of safety regulations regarding theworkplace
Commissioning the ET 200iSP • Knowledge of all electrical and functionalparameters and properties of ET 200iSP
• Knowledge of the functions and commissioning ofPROFIBUS-DP
• Knowledge of the connected encoders, actuators,and HART field devices
• Knowledge of the safety regulations regarding theworkplace, and in particular of procedures inpotentially explosive areas
Preface
ivDistributed I/O device ET 200iSP
A5E00247483-02
Scope of the manual
This manual applies to the distributed I/O station ET 200iSP.
Approbation
for information on standards and certifications, refer to chapter 8-2.
CE certification
for information on standards and certifications, refer to chapter 8-2.
Identification for Australia (C tick mark)
for information on standards and certifications, refer to chapter 8-2.
Standards
for information on standards and certifications, refer to chapter 8-2.
Where this documentation fits in
In addition to this manual, you also need the manuals supplied with the DP masterand RS 485 IS coupler you are using (see the Order numbers in the appendix).
The Order numbers appendix provides a list of further sources of information onSIMATIC S7 and on the ET 200 distributed I/O system.
A description of the parameter assignment and configuration frame is not includedin this manual. The description is available on the Internet URL
http://www4.ad.siemens.de/WW/view/de/4000024
Guide to the manual
This manual describes the hardware of the ET 200iSP distributed I/O station. Itconsists of introductory chapters and reference chapters (technical data).
• Installing and wiring the ET 200iSP distributed I/O station
• Commissioning and diagnostics of the ET 200iSP distributed I/O station
• Components of the ET 200iSP distributed I/O station
• Order numbers
Recycling and disposal
The ET 200iSP distributed I/O station can be recycled due to its low-pollutantequipment. For environment-friendly recycling and disposal of your electronicwaste, please contact a company certified for the disposal of electronic waste.
Preface
vDistributed I/O device ET 200iSPA5E00247483-02
Further Support
If you have any technical questions, please get in touch with your Siemensrepresentative or agent responsible.
You will find your contact person at:
http://www.siemens.com/automation/partner
You will find a guide to the technical documentation offered for the individualSIMATIC Products and Systems here at:
http://www.siemens.com/simatic-tech-doku-portal
The online catalog and order system is found under:
http://mall.automation.siemens.com
Training Centers
Siemens offers a number of training courses to familiarize you with the SIMATICS7 automation system. Please contact your regional training center or our centraltraining center in D 90327 Nuremberg, Germany for details:
Telephone: +49 (911) 895-3200.
Internet: http://www.sitrain.com
Preface
viDistributed I/O device ET 200iSP
A5E00247483-02
Technical Support
You can reach the Technical Suport for all A&D products
• Via the Web formula for the Support Request http://www.siemens.com/automation/support-request
• Phone: + 49 180 5050 222
• Fax:+ 49 180 5050 223
Additional information about our Technical Support can be found on the Internetpages: http://www.siemens.com/automation/service.
Service & Support on the Internet
In addition to our documentation, we offer our Know-how online on the internet at:
http://www.siemens.com/automation/service&support
where you will find the following:
• The newsletter, which constantly provides you with up-to-date information onyour products.
• The right documents via our Search function in Service & Support.
• A forum, where users and experts from all over the world exchange theirexperiences.
• Your local representative for Automation & Drives.
• Information on field service, repairs, spare parts and more under “Services”.
viiDistributed I/O device ET 200iSPA5E00247483-02
Contents
1 Product Overview 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.1 What are Distributed I/O Stations? 1-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
1.2 What is the ET 200iSP Distributed I/O Station? 1-3. . . . . . . . . . . . . . . . . . . . . .
1.3 ET 200iSP in Potentially Explosive Environments 1-9. . . . . . . . . . . . . . . . . . . .
1.4 Integration into the Control System 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2 Getting Started with Commissioning 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.1 Introduction 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.2 Requirements 2-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.3 Materials and Tools Required for the Sample Configuration 2-2. . . . . . . . . . .
2.4 Configuration Overview 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.5 Installation of the Sample Configuration 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5.1 Installation of the ET 200iSP 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5.2 Mounting the S7-300 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.5.3 Installing the RS 485-IS Coupler 2-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.6 Wiring the Sample Configuration 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.7 Insert the Interface Module and the Electronic Modules 2-8. . . . . . . . . . . . . . .
2.8 Setting the PROFIBUS Address 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.9 Configuring the Example 2-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.9.1 Configuring the S7-300 2-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2.9.2 Configuring and Assigning Parameters to ET 200iSP 2-11. . . . . . . . . . . . . . . . .
2.10 Programming the Example 2-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.11 Putting the Example into Operation 2-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.12 Analysis of Diagnostics Data 2-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.13 Removing and Inserting Modules 2-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
2.14 Wire Break of the NAMUR Encoder Connected to the Digital Input Module 2-16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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3 Configuration Options 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.1 Modular System 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.2 Electronics Modules to Suit Your Application 3-2. . . . . . . . . . . . . . . . . . . . . . . .
3.3 Electronic Modules Matching the Terminal Modules 3-3. . . . . . . . . . . . . . . . . .
3.4 Power Supply of ET 200iSP 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.5 Configuration Options in Zones 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.6 Limitation of the Number of Connectable Electronic Modules 3-9. . . . . . . . . .
3.7 Maximum Configuration of ET 200iSP 3-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.8 Direct Data Exchange 3-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.9 Time Stamping 3-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.9.1 Time Stamping at an Accuracy of 20 ms 3-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.9.2 Time Synchronization with Flexible Time Interval 3-16. . . . . . . . . . . . . . . . . . . .
3.10 Counting 3-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.10.1 Features 3-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.10.2 Function Principle 3-18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.10.3 Configuring Counters 3-20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.10.4 Configuring Counters 3-22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.11 Frequency Measurement 3-23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.11.1 Features 3-23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.11.2 Function Principle 3-24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.11.3 Configuring Frequency Counters 3-24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.11.4 Assigning Frequency Counter Parameters 3-26. . . . . . . . . . . . . . . . . . . . . . . . . .
3.12 Identification Data I&M 3-27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.13 Redundancy with IM 152 3-29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.13.1 Redundancy with S7 DP Masters 3-29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3.13.2 Software redundancy 3-32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.14 Redundancy of the Power Supply 3-33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.15 Configuration Changes in RUN 3-34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
3.16 Operating the ET200iSP with Older CPUs 3-35. . . . . . . . . . . . . . . . . . . . . . . . . .
3.17 Date of Production of the Module 3-36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4 Installation 4-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.1 Rules for Installation 4-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.2 Installing the Mounting Rail 4-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.3 Installing the Terminal Module for Power Supply PS 4-8. . . . . . . . . . . . . . . . . .
4.4 Installing Terminal Modules for the Interface Module and Electronic Modules 4-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
4.5 Installing the Bus Termination Module and the Slot Cover 4-13. . . . . . . . . . . . .
4.6 Installing the Slot Number Labels 4-16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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ixDistributed I/O device ET 200iSPA5E00247483-02
5 Wiring 5-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.1 General Rules and Regulations for Wiring 5-1. . . . . . . . . . . . . . . . . . . . . . . . . .
5.2 ET 200iSP Operation with Equipotential Bonding PA 5-3. . . . . . . . . . . . . . . . .
5.3 Electrical Installation of the ET 200iSP 5-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.4 Lightning and Overvoltage Protection 5-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4.1 Overview 5-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4.2 The Lightning Protection Zone Concept 5-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4.3 Rules for the Interface Between Lightning Protection Zones
0 to 1 5-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4.4 Rules for the Interfaces between Lightning Protection Zones 1...2
and higher 5-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.4.5 Example of Protection from Overvoltage
for Networked ET 200iSP Stations 5-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.5 Wiring the ET 200iSP 5-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.1 Rules for Wiring the ET 200iSP 5-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.2 Wiring a Terminal Module with Screw Terminals 5-16. . . . . . . . . . . . . . . . . . . . . 5.5.3 Wiring a Terminal Module with Spring Terminals 5-17. . . . . . . . . . . . . . . . . . . . . 5.5.4 Grounding the Mounting Rail 5-18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.5 Wiring Terminal Module TM-PS-A 5-19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.6 Wiring Terminal Modules TM-IM/EM and TM-IM/IM 5-21. . . . . . . . . . . . . . . . . . 5.5.7 Wiring Terminal Modules TM-EM/EM 5-24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.8 Terminating the Cable Shielding 5-25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5.5.9 Connecting a TC Sensor Module 5-26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.6 Inserting and Labeling the Power Supply, Interface Module, and Electronic Modules 5-27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.7 Setting the PROFIBUS address 5-32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
5.8 Inserting and Changing the SIMATIC Micro Memory Card (MMC) 5-34. . . . . .
6 Commissioning and Diagnostics 6-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.1 Configuring in STEP 7 6-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.2 Configuring with GSD File and SIMATIC PDM 6-6. . . . . . . . . . . . . . . . . . . . . . .
6.3 Commissioning and Startup of ET 200iSP 6-9. . . . . . . . . . . . . . . . . . . . . . . . . . 6.3.1 Requirements for Commissioning 6-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3.2 Commissioning the ET 200iSP 6-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3.3 Startup of ET 200iSP 6-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.3.4 Startup of ET 200iSP with IM 152 redundancy 6-12. . . . . . . . . . . . . . . . . . . . . . . 6.3.5 Start up for time synchronization / time stamping of signal changes 6-14. . . .
6.4 Assigning Parameters for the ET 200iSP during Operation using SIMATIC PDM 6-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
6.5 Diagnostics by Means of the Process Input Image 6-16. . . . . . . . . . . . . . . . . . .
6.6 Status and Error LEDs on the ET 200iSP 6-17. . . . . . . . . . . . . . . . . . . . . . . . . . .
6.7 Diagnostics in STEP 7 6-21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.7.1 Introduction 6-21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.7.2 Reading Diagnostics Data 6-22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.7.3 Diagnostic Messages of the Electronics Modules 6-23. . . . . . . . . . . . . . . . . . . . 6.7.4 Evaluating Interrupts of the ET 200iSP (S7 DP Slave/ DPV1 Slave) 6-25. . . . 6.7.5 Structure of the Slave Diagnostics 6-27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.7.6 Station Status 1 to 3 6-27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.7.7 Master PROFIBUS address 6-29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
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6.7.8 Manufacturer’s ID 6-30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.7.9 ID-related Diagnostics 6-31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.7.10 Module Status 6-33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.7.11 Channel-Specific Diagnostics 6-34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.7.12 H-Status (Only with the S7-400H and Standard Redundancy) 6-38. . . . . . . . . 6.7.13 Interrupts 6-39. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6.7.14 Diagnostics for Incorrect Module Configuration States of the ET 200iSP 6-50
7 Maintenance 7-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.1 Actions in Run 7-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.2 Removing and Inserting Electronic Modules During Operation (Hot Swapping) 7-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.3 Exchanging the Interface Module 7-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.4 Maintenance during Operation 7-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.5 Cleaning 7-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
7.6 IM 152 Firmware Update 7-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8 General Technical Data 8-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.1 General Technical Data 8-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.2 Standards and Certifications 8-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
8.3 Electromagnetic Compatibility and Shipping and Storage Conditions 8-3. . .
8.4 Mechanical and Climatic Ambient Conditions 8-5. . . . . . . . . . . . . . . . . . . . . . . .
8.5 Information on Dielectric Tests, Class of Protection, Degree of Protection, and Rated Voltage of the ET 200iSP 8-6. . . . . . . . . . . .
9 Terminal Modules 9-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.1 Overview of Contents 9-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.2 Terminal Modules TM-PS-A and TM-PS-B 9-2. . . . . . . . . . . . . . . . . . . . . . . . . .
9.3 Terminal modules TM-IM/EM 60S and TM-IM/EM 60C 9-4. . . . . . . . . . . . . . .
9.4 Terminal module TM-IM/IM 9-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
9.5 Terminal modules TM-EM/EM 60S and TM-EM/EM 60C 9-9. . . . . . . . . . . . . .
10 Power Supply PS 10-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11 Interface Module 11-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.1 Interface module IM 152 11-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.2 Parameters for IM 152 11-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
11.3 Description of the Parameters for IM 152 11-5. . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3.1 Operation if Preset-<> Actual configuration 11-5. . . . . . . . . . . . . . . . . . . . . . . . . 11.3.2 Self-diagnostics 11-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3.3 Redundant Power Supply diagnostics 11-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3.4 Diagnostics Interrupts 11-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3.5 Process Alarms 11-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3.6 Time Stamping / Edge Evaluation 11-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3.7 Data Format 11-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3.8 Interference Frequency Suppression 11-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3.9 Unit of temperature 11-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11.3.10 Slot Reference Junction / Reference Junction Input 11-7. . . . . . . . . . . . . . . . . .
11.4 Identification and Message Functions (I&M) 11-7. . . . . . . . . . . . . . . . . . . . . . . . .
Contents
xiDistributed I/O device ET 200iSPA5E00247483-02
12 Digital Electronic Modules 12-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.1 Digital Electronic Module 8 DI NAMUR 12-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.2 Digital Electronic Module 4 DO 12-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.3 Parameters of the Digital Electronics Modules 12-19. . . . . . . . . . . . . . . . . . . . . . . 12.3.1 Digital Electronic Module 8 DI NAMUR 12-19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.3.2 Digital electronic module 4 DO 12-22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.4 Parameters of the Digital Electronics Modules 12-22. . . . . . . . . . . . . . . . . . . . . . . 12.4.1 Time Stamping 12-22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.4.2 Pulse Stretching 12-23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.4.3 Flutter Monitoring 12-24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.4.4 Counting Parameters 12-25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12.4.5 Frequency Counting Parameters 12-25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
12.5 Identification and Message Functions (I&M) 12-25. . . . . . . . . . . . . . . . . . . . . . . . .
13 Analog Electronic Modules 13-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.1 Analog Value Visualization 13-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.1.1 Analog Value Representation for Measuring Ranges with SIMATIC S7 13-2. . 13.1.2 Measuring Ranges of the Analog Input Modules in S7 Format 13-4. . . . . . . . . 13.1.3 Output Ranges of the Analog Output Modules in S7 Format 13-13. . . . . . . . . . .
13.2 Basics of Analog Value Processing 13-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.2.1 Connecting Thermocouples 13-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.3 Basics of HART 13-18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.3.1 HART Features 13-18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.3.2 Function Principle of HART 13-18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.3.3 Integration of HART Field Devices with ET 200iSP 13-21. . . . . . . . . . . . . . . . . . . 13.3.4 Use of HART 13-22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.3.5 IEEE Tags 13-25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.3.6 HART Data Records 13-27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.4 Response of the Analog Modules during Operation and if Faults Occur 13-29.
13.5 Analog Electronic Module 4 AI I 2WIRE HART 13-31. . . . . . . . . . . . . . . . . . . . . .
13.6 Analog Electronic Module 4 AI I 2WIRE HART 13-34. . . . . . . . . . . . . . . . . . . . . .
13.7 Analog Electronic Module 4 AI RTD 13-37. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.8 Analog Electronic Module 4 AI TC 13-41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.9 Analog Electronic Module 4AO I HART 13-45. . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.10 Parameters of the Analog Electronic Modules 13-48. . . . . . . . . . . . . . . . . . . . . . . 13.10.1 Parameters of the Analog Electronic Modules 4 AI I 2WIRE HART,
4 AI I 4WIRE HART 13-48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.10.2 Parameters of the Analog Electronic Modules 4 AI RTD and 4 AI TC 13-50. . . 13.10.3 Parameters of the Analog Electronic Module 4AO I HART 13-52. . . . . . . . . . . .
13.11 Description of the Parameters of the Analog Electronic Modules 13-54. . . . . . . 13.11.1 Reference Junction / Reference Junction Number 13-54. . . . . . . . . . . . . . . . . . . 13.11.2 Smoothing 13-54. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.11.3 Channel and IEEE Tag 13-56. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.11.4 HART Warning 13-58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13.11.5 HART Diagnostics 13-58. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
13.12 Identification and Message Functions (I&M) 13-59. . . . . . . . . . . . . . . . . . . . . . . . .
Contents
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14 Reserve Module 14-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
A Order Numbers A-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A.1 Order numbers A-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
B Dimensional Drawings B-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
C Reaction Times C-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
C.1 Response times at the DP master C-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
C.2 Reaction Times on the ET 200iSP C-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
C.3 Reaction Times with Digital Input Modules C-2. . . . . . . . . . . . . . . . . . . . . . . . . .
C.4 Reaction Times with Digital Output Modules C-2. . . . . . . . . . . . . . . . . . . . . . . .
C.5 Reaction Times of Analog Input Modules C-2. . . . . . . . . . . . . . . . . . . . . . . . . . .
C.6 Reaction Times of Analog Output Modules C-4. . . . . . . . . . . . . . . . . . . . . . . . . .
D Address Space of the Inputs and Outputs D-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
D.1 Digital Input Module D-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
D.2 Digital Output Module D-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
D.3 Analog Input Modules D-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
D.4 Analog Output Modules D-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
D.5 Analog Input Modules with HART (4 AI I 2WIRE HART, 4 AI I 4WIRE HART) D-5. . . . . . . . . . . . . . . . . . . . . . . . . .
D.6 Analog Output Module with HART (4 AO I HART) D-6. . . . . . . . . . . . . . . . . . . .
E Certifications E-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
E.1 EC Prototype Certificates E-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
E.2 EC Declarations of Conformity E-51. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Glossary Glossary-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Index Index-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents
xiiiDistributed I/O device ET 200iSPA5E00247483-02
Figures
1-1 Typical PROFIBUS DP network structure 1-2. . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 View of the ET 200iSP Distributed I/O Station 1-4. . . . . . . . . . . . . . . . . . . . . . . 1-3 Identifiers of ET 200iSP 1-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4 Integration into the Control System 1-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Overview of the Sample Configuration 2-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Wiring TM-PS-A 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Wiring the RS 485-IS Coupler 2-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-4 Wiring the ET 200iSP Module 2-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-5 Setting the PROFIBUS-address 3 2-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-6 Configuring the S7-300 2-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-7 Configuring and Assigning Parameters to ET 200iSP 2-11. . . . . . . . . . . . . . . . . 2-8 Deactivating ET 200iSP Channels 2-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Example of an ET 200iSP Configuration 3-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-2 Power Supply PS 3-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Configuration Options for the ET 200iSP in Zone 1 3-6. . . . . . . . . . . . . . . . . . . 3-4 Example of Direct Data Exchange 3-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Example of Time Stamping and Edge Evaluation 3-15. . . . . . . . . . . . . . . . . . . . 3-6 Example configuration with 2 IM 152s for redundancy in an H-system 3-16. . 3-7 Principle of Operation of the 16-bit Up Counter 3-18. . . . . . . . . . . . . . . . . . . . . . 3-8 Principle of Operation of the 16-bit Down Counter 3-19. . . . . . . . . . . . . . . . . . . . 3-9 PIO with “2 Count/ 6 DI NAMUR” Configuration 3-21. . . . . . . . . . . . . . . . . . . . . . 3-10 PIO with “2 Count/ 6 DI NAMUR” Configuration 3-21. . . . . . . . . . . . . . . . . . . . . . 3-11 PII with “2 Trace/ 6 DI NAMUR” Configuration 3-25. . . . . . . . . . . . . . . . . . . . . . . 3-12 Redundancy with 2 x IM 152 in an H-system 3-31. . . . . . . . . . . . . . . . . . . . . . . . 3-13 Redundancy of the Power Supply 3-33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14 Year of production 3-36. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 Enclosure for ET200iSP in Zone 1 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 Enclosure for ET200iSP in Zone 21 4-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Enclosure for ET 200iSP in Zone 2 4-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-4 Enclosure for ET200iSP in Zone 22 4-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-5 Minimum Clearances to the Enclosure 4-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-6 Mounting Terminal Module TM-PS-A 4-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-7 Mounting Terminal Module TM-PS-B 4-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-8 Installing Terminal Modules TM-IM/EM and TM-EM/EM 4-11. . . . . . . . . . . . . . . 4-9 Removing Terminal Module TM-EM/EM, Starting from the Right Side 4-12. . . 4-10 Installing the bus termination module 4-14. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-11 Installing the Slot Cover 4-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-12 Installing the Slot Cover 4-16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-13 Installing the Slot Number Labels 4-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 ET 200iSP Operation with Equipotential Bonding PA 5-4. . . . . . . . . . . . . . . . . 5-2 Potentials in the ET 200iSP System 5-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 Lightning Protection Zones of a Building 5-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4 Example of the Wiring of Networked ET 200iSP Stations 5-13. . . . . . . . . . . . . 5-5 Wiring with Spring Terminals 5-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6 Grounding the Mounting Rail 5-18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7 Connecting the Power Supply and Grounding Conductor PA
to the TM-PS-A. 5-20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-8 Wiring Terminal Module TM-IM/EM (PROFIBUS RS 485-IS) 5-22. . . . . . . . . . 5-9 Wiring Terminal Module TM-IM/IM (PROFIBUS RS 485-IS) 5-23. . . . . . . . . . . 5-10 Wiring the Terminal module TM-EM/EM 5-24. . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-11 Terminating the Cable Shielding 5-26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-12 TC-Sensor Module 5-27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-13 Installing the Power Supply PS 5-28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-14 Installing and Labeling Interface Modules and Electronic Modules 5-29. . . . . .
Contents
xivDistributed I/O device ET 200iSP
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5-15 Removing Interface and Electronic Modules 5-30. . . . . . . . . . . . . . . . . . . . . . . . . 5-16 Changing the Type of an Electronic Module 5-31. . . . . . . . . . . . . . . . . . . . . . . . . 5-17 Setting the PROFIBUS DP Address 5-33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-18 Position of the MMC Slot on the IM 152 5-35. . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1 Function Principle of Configuring 6-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2 Startup of ET 200iSP 6-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3 Startup of the ET 200iSP with IM 152 redundancy 6-13. . . . . . . . . . . . . . . . . . . 6-4 Starting Up Time Synchronization / Time Stamping 6-14. . . . . . . . . . . . . . . . . . 6-5 LED Display on IM 152 Interface Module 6-17. . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6 LED Displays on the Digital Electronic Modules 6-20. . . . . . . . . . . . . . . . . . . . . . 6-7 LED Displays on the Analog Electronic Modules 6-21. . . . . . . . . . . . . . . . . . . . . 6-8 Interrupts from Analog Input Modules 6-26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9 Structure of Slave Diagnostics 6-27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10 Evaluation of the Slave Diagnostics 6-31. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-11 Structure of the ID-Related Diagnostic Information for ET 200iSP 6-32. . . . . . 6-12 Module Status 6-33. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-13 Structure of Channel-Specific D iagnostics 6-35. . . . . . . . . . . . . . . . . . . . . . . . . . 6-14 Structure of the H-Status of the IM 152 (for S7-400H only) 6-38. . . . . . . . . . . . 6-15 Structure of the Interrupt Status of the Interrupt Section 6-40. . . . . . . . . . . . . . 6-16 Structure of bytes x+4 to x+7 for Diagnostic Interrupts 6-41. . . . . . . . . . . . . . . . 6-17 Structure Starting at Byte x+8 for Diagnostics Interrupt
from Interface Module 6-42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18 Structure Starting at Byte x+8 for Diagnostic Interrupt
(Input / Output Modules without HART) 6-43. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-19 Structure Starting at Byte x+8 for Diagnostic Interrupt
(Input or Output Module with HART) 6-44. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-20 Example of a Diagnostic Interrupt 6-45. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-21 Example of a Diagnostic Interrupt (Continued) 6-46. . . . . . . . . . . . . . . . . . . . . . . 6-22 Structure Starting at Byte x+4 for Hardware Interrupts (Analog Input) 6-47. . . 6-23 Structure Starting at Byte x+4 for Process Alarms (Time Stamping) 6-47. . . . 6-24 Structure Starting at Byte x+4 for Remove/Insert Interrupts 6-48. . . . . . . . . . . 6-25 Structure Starting at Byte x+4 for Update Interrupt 6-49. . . . . . . . . . . . . . . . . . 7-1 Automatic Parameter Assignment after Replacing a Module 7-3. . . . . . . . . . . 9-1 Block Diagram of Terminal Modules TM-P-A and TM-PS-B 9-3. . . . . . . . . . . . 9-2 Block diagram of Terminal Module TM-IM/EM 9-6. . . . . . . . . . . . . . . . . . . . . . . 9-3 Block diagram of Terminal Module TM-IM/IM 9-8. . . . . . . . . . . . . . . . . . . . . . . . 9-4 Block Diagram of Terminal Module TM-EM/EM 9-10. . . . . . . . . . . . . . . . . . . . . . 10-1 Block Diagram of the Power Supply PS 10-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1 Block Diagram Interface Module IM 152 11-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-1 Block Diagram of 8 DI NAMUR 12-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-2 Block Diagram 4 DO 12-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-3 Output Characteristics 4 DO DC23.1V/20mA 12-16. . . . . . . . . . . . . . . . . . . . . . . . 12-4 Output Characteristics 4 DO DC17.4V/27mA 12-16. . . . . . . . . . . . . . . . . . . . . . . 12-5 Output Characteristics 4 DO DC17.4V/40mA 12-17. . . . . . . . . . . . . . . . . . . . . . . 12-6 Actuator Shutdown by Means of Intrinsically Safe Switching Signal
(Safety Barrier) 12-18. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-7 Principle of Pulse Stretching 12-23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-8 Principle of Flutter Monitoring 12-25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . .
Contents
xvDistributed I/O device ET 200iSPA5E00247483-02
13-1 Compensation by 4 AI RTD 13-15. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-2 Example of the Configuration of Reference Junctions 13-16. . . . . . . . . . . . . . . . 13-3 The HART Signal 13-19. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-4 Location of the HART Analog Modules in the Distributed System 13-21. . . . . . 13-5 System Environment for HART Applications 13-23. . . . . . . . . . . . . . . . . . . . . . . . 13-6 IEEE Tag 13-25. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-7 IEEE754 Format 13-26. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-8 Status Byte 13-27. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-9 Block Diagram of 4 AI I 2WIRE HART 13-32. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-10 Block Diagram of 4 AI I 4WIRE HART 13-35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-11 Block Diagram of 4 AI RTD 13-38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-12 Block Diagram of 4 AI TC 13-42. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-13 Block Diagram of 4AO I HART 13-46. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-14 Example of the Influence of Smoothing on the Step Response 13-55. . . . . . . . . 13-15 Assigning the IEEE Tags 13-57. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-1 Terminal Module TM-PS-A with Inserted Power Supply PS B-1. . . . . . . . . . . . B-2 Terminal Module TM-IM/EM with Inserted Interface Module and Electronic
Module B-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . B-3 Terminal Module TM-EM/EM with Inserted Electronic Modules B-2. . . . . . . . . B-4 Terminating module B-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . C-1 Response times between the DP master and the ET 200iSP C-1. . . . . . . . . . C-2 Cycle Time of the Analog Input Module C-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . C-3 Cycle Time of the Analog Output Module C-4. . . . . . . . . . . . . . . . . . . . . . . . . . . C-4 Response Time of an Analog Output Channel C-5. . . . . . . . . . . . . . . . . . . . . . . D-1 PII with ”8 DI NAMUR” Configuration D-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-2 PII with ”2 Counter/ 6 DI NAMUR” Configuration D-2. . . . . . . . . . . . . . . . . . . . . D-3 PII with ”2 Counter/ 6 DI NAMUR” Configuration D-2. . . . . . . . . . . . . . . . . . . . . D-4 PII with ”2 Trace/ 6 DI NAMUR” Configuration D-3. . . . . . . . . . . . . . . . . . . . . . . D-5 PIO with Digital Output Module D-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-6 PII with Analog Input Modules D-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-7 PIO with Analog Output Modules D-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . D-8 PIO with Analog Input Modules with HART D-5. . . . . . . . . . . . . . . . . . . . . . . . . . D-9 PIO/PII with Analog Output Module with HART D-6. . . . . . . . . . . . . . . . . . . . . .
Contents
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Tables
1-1 ET 200iSP Components 1-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-2 Features and Benefits 1-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-3 Zone Classes 1-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1-4 Intrinsic Safety of the Types of Protection 1-10. . . . . . . . . . . . . . . . . . . . . . . . . . . 2-1 Required Material and Tools 2-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-2 Changes 2-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2-3 Sample program 2-13. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-1 Electronics Modules to Suit Your Application 3-2. . . . . . . . . . . . . . . . . . . . . . . . 3-2 Modules and Terminal Modules 3-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-3 Rules for Configuration 3-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-4 Current Consumption Calculation Table 3-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-5 Current consumption calculation table 3-11. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-6 Assignment of Digital Inputs of 2 Count / 6 DI NAMUR 3-20. . . . . . . . . . . . . . . 3-7 Assignment of Digital Inputs of 2 Count / 6 Control 3-22. . . . . . . . . . . . . . . . . . . 3-8 Parameters for the Counters 3-23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-9 Assignment of digital inputs of 2 Trace / 6 DI NAMUR 3-24. . . . . . . . . . . . . . . 3-10 Parameters for the Frequency Counters 3-26. . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-11 Identification data I&M 3-28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-12 Parameters for Redundancy of the Power Supply PS 3-34. . . . . . . . . . . . . . . . 3-13 Reaction of the I/O 3-35. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3-14 Operating the ET200iSP with Older CPUs 3-35. . . . . . . . . . . . . . . . . . . . . . . . . . 4-1 Installation Dimensions 4-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-2 Rail Mounting Diagram 4-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4-3 Fixing Screws 4-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-1 System Startup after Certain Events 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-2 Mains Power in the Safe Area 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-3 24 VDC Supply in the Safe Area 5-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-4 Protection from External Electrical Influences 5-3. . . . . . . . . . . . . . . . . . . . . . . 5-5 24 V DC Supply in the Safe Area 5-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-6 Lightning Protection Zones 5-8. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-7 Protection of Cables with Overvoltage Protection Components 5-11. . . . . . . . 5-8 Example of a Lightning-Protected Configuration 5-14. . . . . . . . . . . . . . . . . . . . . 5-9 Rules for Wiring the ET 200iSP 5-16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5-10 Available MMCs 5-34. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-1 Comparison of DPV1, S7 DP and DPV0 6-3. . . . . . . . . . . . . . . . . . . . . . . . . . . 6-2 Software requirements 6-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-3 Requirements for Commissioning 6-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-4 Commissioning the ET 200iSP 6-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-5 Status and Error LEDs on the IM 152 6-17. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-6 Status and Error LEDs on the Digital Electronic Modules 6-20. . . . . . . . . . . . . 6-7 Status and Error LEDs on the Analog Electronic Modules 6-21. . . . . . . . . . . . 6-8 Reading Diagnostics Data Using STEP 7 6-22. . . . . . . . . . . . . . . . . . . . . . . . . . . 6-9 Digital Input Modules 6-23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-10 Digital Output Modules 6-23. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-11 Analog Input Modules 6-24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-12 Analog Output Modules 6-24. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-13 Structure of Station Status 1 (byte 0) 6-28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-14 Structure of Station Status 2 (byte 1) 6-29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-15 Structure of Station Status 3 (byte 2) 6-29. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-16 Structure of the Vendor ID 6-30. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-17 Types of error of the electronic modules 6-36. . . . . . . . . . . . . . . . . . . . . . . . . . . 6-18 SKF Identifiers (STEP 7) 6-48. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6-19 Diagnostics of Faulty Configuration of the ET 200iSP 6-50. . . . . . . . . . . . . . . .
Contents
xviiDistributed I/O device ET 200iSPA5E00247483-02
7-1 Permitted actions / tasks in the potentially explosive areas 7-1. . . . . . . . . . . . 7-2 Requirements 7-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-1 Modules and Terminal Modules 9-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-2 Pinout on Terminal Modules TM-PS-A and TM-PS-B 9-2. . . . . . . . . . . . . . . . . 9-3 Pinout on the TM-IM/EM 9-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-4 Pinout on the TM-IM/IM 9-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9-5 Pinout of Terminal Module TM-EM/EM 9-9. . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11-1 Parameters for Interface Module IM 152-2 11-4. . . . . . . . . . . . . . . . . . . . . . . . . 12-1 Pinout for NAMUR Encoders or Encoders According to DIN 19234 12-2. . . . 12-2 Pinout for NAMUR Changeover Contacts or Encoders According
to DIN 19234 Changeover Contacts 12-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-3 Terminal Assignment of Single Contact with 10 k Load Resistance
(Mechanical NO Contact) 12-4. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-4 Terminal Assignment of Changeover Contact with 10 k Load Resistance
(Mechanical Changeover Contact) 12-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-5 Terminal Assignment of a Single Contact without Load Resistance
(Mechanical NO Contact with Single Contact ) 12-6. . . . . . . . . . . . . . . . . . . . . . 12-6 Terminal Assignment of a Changeover Contact without Load Resistance
(Mechanical Changeover Contact) 12-7. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-7 Changeover Contact Diagnostics 12-10. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-8 4 DO Terminal Assignment 12-12. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-9 ”8 DI NAMUR” parameters 12-20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-10 Parameters for ”2 Count/ 6 DI NAMUR” and ”2 Count/ 6 Control” 12-21. . . . . . 12-11 ”2 Count/ 6 Control” Parameters 12-21. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-12 Parameters for ”2 Trace/ 6 DI NAMUR” 12-21. . . . . . . . . . . . . . . . . . . . . . . . . . . . 12-13 Parameters for 4 DO 12-22. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-1 Measured Values in the Event of Wire Break Dependent on Enabled
Diagnostics (Format S7) 13-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-2 Analog Value Representation (SIMATIC S7 Format) 13-2. . . . . . . . . . . . . . . . . . 13-3 Examples 13-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-4 Measured Value Resolution of the Analog Values (SIMATIC S7 Format) 13-313-5 SIMATIC S7 Format: Measuring Range 80 mV 13-4. . . . . . . . . . . . . . . . . . . . 13-6 SIMATIC S7 Format: Measuring Ranges 0 to 20 mA, 4 to 20 mA 13-5. . . . . . 13-7 SIMATIC S7 Format: Measuring Ranges 600 Absolute 13-5. . . . . . . . . . . . . . 13-8 SIMATIC S7 Format: Measuring Ranges Pt 100 Standard in °C and °F 13-6. 13-9 SIMATIC S7 Format: Measuring Ranges Pt 100 Climatic in in °C and °F 13-613-10 SIMATIC S7 Format: Measuring Ranges Ni 100 Standard in °C and °F 13-7. 13-11 SIMATIC S7 Format: Measuring Ranges Ni 100 Climate in °C and °F 13-7. . 13-12 SIMATIC S7 Format: Measuring Range Type B in °C and °F 13-8. . . . . . . . . . 13-13 SIMATIC S7 Format: Measuring Range Type E in °C and °F 13-8. . . . . . . . . . 13-14 SIMATIC S7 Format: Measuring Range Type J in °C and °F 13-9. . . . . . . . . . 13-15 SIMATIC S7 Format: Measuring range Type K in °C and °F 13-9. . . . . . . . . . . 13-16 SIMATIC S7 Format: Measuring Range Type L in °C and °F 13-10. . . . . . . . . . 13-17 SIMATIC S7 Format: Measuring Range Type N in °C and °F 13-10. . . . . . . . . . 13-18 SIMATIC S7 Format: Measuring Range Type R, S in °C and °F 13-11. . . . . . . . 13-19 SIMATIC S7 Format: Measuring Range Type T in °C and °F 13-11. . . . . . . . . . 13-20 SIMATIC S7 Format: Measuring Range Type U in °C and °F 13-12. . . . . . . . . . 13-21 SIMATIC S7 Format: Output Ranges 0 to 20 mA, 4 to 20 mA 13-13. . . . . . . . . 13-22 Compensation of the Reference Junction Temperature 13-14. . . . . . . . . . . . . . . 13-23 Reference Junction Parameters 13-16. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-24 Examples of HART Parameters 13-20. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-25 Properties of the ET 200iSP HART Analog Modules 13-24. . . . . . . . . . . . . . . . . . 13-26 HART Data Records 13-28. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-27 Dependencies of the Input and Output Values on the Operating State
of the PLC (CPU of the DP Master) and the Supply Voltage L + 13-29. . . . . . .
Contents
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13-28 Response of the Analog Modules, Depending on the Location of the Analog Input Value in the Range of Values 13-30. . . . . . . . . . . . . . . . . . . . . . . . .
13-29 Response of the Analog Modules, Depending on the Location of the Analog Output Value in the Range of Values 13-30. . . . . . . . . . . . . . . . . . . . . . . .
13-30 Terminal Assignment of 4 AI I 2WIRE HART 13-31. . . . . . . . . . . . . . . . . . . . . . . . 13-31 Terminal Assignment of 4 AI I 4WIRE HART 13-35. . . . . . . . . . . . . . . . . . . . . . . . 13-32 Terminal Assignment of 4 AI RTD 13-38. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-33 Terminal Assignment of 4 AI TC 13-41. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-34 Parameters of the ”4 AI I 2WIRE HART” and ”4 AI I 4WIRE HART”
Configurations 13-49. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-35 Parameters of the ”...W+x” Configuration 13-50. . . . . . . . . . . . . . . . . . . . . . . . . . . 13-36 4 AI RTD and 4 AI TC Parameters 13-50. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13-37 Parameters of the ”4AO I HART” Configuration 13-53. . . . . . . . . . . . . . . . . . . . . . 13-38 Parameters of the ”...I +x” Configuration 13-54. . . . . . . . . . . . . . . . . . . . . . . . . . . . A-1 Interface module A-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-2 Terminal Modules A-1. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-3 Power Supply A-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-4 Digital Electronic Modules A-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-5 Analog electronic modules A-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-6 Reserve module A-2. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-7 ET 200iSP Accessories A-3. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-8 Network Components for ET 200iSP A-5. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-9 STEP 7 and SIMATIC S7 Manuals A-6. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . A-10 Reference for PROFIBUS DP with SIMATIC S7 and STEP 7 A-8. . . . . . . . .
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Product Overview
1.1 What are Distributed I/O Stations?
Distributed I/O stations – Fields of Application
When a system is set up, the inputs and outputs from and to the process are oftenlocated centrally in the programmable logic controller.
If there are inputs and outputs at considerable distances from the programmablelogic controller, there may be long runs of cabling which are not immediatelycomprehensible, and electromagnetic interference may impair reliability.
In such systems, it is often advisable to use distributed I/O stations:
• The control CPU is located centrally.
• The I/O devices (inputs and outputs) operate locally on a distributed basis.
• the high-performance PROFIBUS DP system provides high-speed datatransmission rates for reliable communication between the control CPU and theI/O devices.
• low installation effort by reduced wiring.
What is PROFIBUS DP?
PROFIBUS DP is an open bus system based on IEC 61784-1:2002 Ed1 CP 3/1with the ”DP” transmission protocol (DP stands for distributed I/O).
PROFIBUS DP is implemented either as an electrical network based on shieldedtwisted-pair cables, or as an optical network based on fiber optic cable.
The ”DP” transmission protocol allows a rapid, cyclic exchange of data betweenthe control CPU and the distributed I/O devices.
What is PROFIBUS RS 485-IS
In contrast to PROFIBUS DP, PROFIBUS DP RS 485-IS is intrinsically safe(intrinsically safe i type of protection). The RS 485-IS coupler ensures intrinsicsafety and acts as a safety barrier. For further information onPROFIBUS RS 485-IS, refer to the PROFIBUS RS 485-IS User and Installation Guideline (http://www.profibus.com).
1
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What are DP-masters and DP-slaves?
The DP master links the control CPU with the distributed I/O devices. It exchangesdata with the distributed I/O devices via PROFIBUS DP and monitorsPROFIBUS DP.
The distributed I/O devices (= DP slaves) prepare the data of the sensors andactuators locally so that they can be transmitted to the control CPU byPROFIBUS DP.
Which devices can be connected to the PROFIBUS-DP?
An extremely wide range of devices can be connected to the PROFIBUS DP asDP-masters or DP-slaves, provided their behavior complies with IEC 61784-1:2002 Ed1 CP 3/1. These include devices of the following productfamilies:
• SIMATIC S7/M7/C7
• SIMATIC PG/PC
• SIMATIC human-machine interface, or HMI (operator panel, OP; operatorstation, OS; and text display, TD)
• Distributed I/O devices
• Devices from other vendors
Structure of a PROFIBUS DP network
The figure below illustrates the typical layout of a PROFIBUS DP network. The DP master is integrated in the relevant device. For example, the S7-400 isequipped with a PROFIBUS DP interface. The ET 200iSP distributed I/O devicesare interconnected with the DP masters via PROFIBUS DP and PROFIBUS RS 485-IS.
Potentially explosive area: Zone 1 Potentially explosive area: Zone 2
ET 200iSP ET 200iSP
PROFIBUS RS 485-IS
S7-400 ET 200M PG/PC
PROFIBUS DP
RS 485-IS coupler
Figure 1-1 Typical PROFIBUS DP network structure
Product Overview
1-3Distributed I/O device ET 200iSPA5E00247483-02
1.2 What is the ET 200iSP Distributed I/O Station?
Definition
The ET 200iSP distributed I/O device is a highly modular and intrinsically safe DPslave with degree of protection IP 30.
Fields of application
The ET 200iSP distributed I/O device can be operated in potentially explosiveenvironments characterized by gas and dust atmospheres:
Certification ET 200iSP Station* Inputs and outputs
CENELEC Zone 1 and Zone 21 up to Zone 0, Zone 20
Zone 2 and Zone 22 up to Zone 0, Zone 20
* with installation in a corresponding enclosure
The ET 200iSP distributed I/O device is also suitable for operation in safety areas,of course.
You can insert almost any combination of ET 200iSP I/O modules directly next tothe interface module that transfers the data to the DP master. This allows you totailor the system to meet local requirements.
Each ET 200iSP consists of a power supply module, an interface module, and upto 32 electronic modules (for example, digital electronic modules.) Note themaximum current consumption (see the chapter 3.6.)
Terminal and Electronic Modules
An ET 200iSP distributed I/O station basically consists of various passive terminalmodules you can use to connect the power supply and electronic modules.
The ET 200iSP is connected to PROFIBUS RS 485-IS by means of a connectoron terminal module TM-IM/EM. Each ET 200iSP represents a DP slave onPROFIBUS RS 485-IS.
Product Overview
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View
The figure below shows an example of an ET 200iSP configuration.
Power Supply PS
Interfacemodule IM 152 Electronic module
Terminal moduleTM-PS-A Terminal
moduleTM-IM/EM
Terminal modulesTM-EM/EM
Bus terminationmodule
Figure 1-2 View of the ET 200iSP Distributed I/O Station
ET 200iSP Components
The table below provides an overview of the most important components of theET 200iSP.
Table 1-1 ET 200iSP Components
Component Function View
Enclosure ...is an additional measure toincrease safety, in order to avoidthe development of hightemperatures, sparks and electricarcs.
DIN rail ...rack of the ET 200iSP. Installthe ET 200iSP on this DIN rail.
Product Overview
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Table 1-1 ET 200iSP Components, continued
Component ViewFunction
Terminal module ...carries the wiring andaccommodates the power supplymodule, interface module, andthe electronic modules. Terminalmodules versions available:
• for power supply TM-PS-A
• for redundant power supplyTM-PS-B
• for interface module TM-IM/EM
• for redundant interfacemodule TM-IM/IM
• for electronic modules TM-EM/EM
TM-PS-A
TM-IM/EM
TM-EM/EM
TM-IM/IM
TM-PS-B
Power Supply PS ...is plugged into terminal moduleTM-PS-A or TM-PS-B. The powersupply module supplies power tothe electronic circuits andencoders.
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Table 1-1 ET 200iSP Components, continued
Component ViewFunction
Interface module ...is plugged into the terminalmodule. The interface moduleinterconnects the ET 200iSP withthe DP master and prepares thedata for the inserted electronicmodules.
Electronic module ...is plugged onto the terminalmodule and decides the function:
• Digital electronic modules forNAMUR sensors, digitaloutput
• Analog electronic moduleswith current and resistancemeasurement circuit,thermoresistor andthermocouples, analog output
• Reserve module
Bus terminatingmodule
...completes the ET 200iSP
RS 485-IS coupler ...couples PROFIBUS DP toPROFIBUS RS 485-IS.
Label sheet (DINA4, perforated, foil)
...for machine labeling or printing
80 strips per label sheet
Slot number labels ...used to identify the slots of theterminal module. 1 2 62 63
PROFIBUS- cablewith bus connector
...interconnects the PROFIBUSRS 485-IS nodes or the RS485-IS Coupler with ET 200iSP.
PROFIBUS connector RS485-IS, including switchedterminating resistor
Product Overview
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Features of ET 200iSP and its benefits
Table 1-2 Features and Benefits
Features Benefits
Regarding design
Modular structure based on 4- or 8-channelelectronic modules
• Cost-effective station design
• Reduced engineering anddocumentation costs
• Space-saving with user-specific in-lineinstallation of the modules
Wide range of electronic modules Wide field of application
Permanent wiring by separating mechanicaland electronic components
• Prewiring possible
• Hot swapping of modules while theET 200iSP is in operation, if at least twoelectronic modules are present.
Integrated Powerbus Reduced wiring effort
Regarding terminating technique
Screw terminals or spring terminals Use of most suitable terminating technique
I/Os intrinsically safe to EEx ia IIC Intrinsically safe encoders, actuators andHART field devices up to Zone 0/20 can beconnected
Automatic coding of the I/O modules Fast and safe module replacement
Large label Adequate space for clear labeling
Shutdown of the digital outputs of a moduleby means of intrinsically safe control signal
Control of outputs independent of processimage
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Table 1-2 Features and Benefits, continued
Regarding functionality
Reconfiguration and expansion in runtime No restart of the ET 200iSP necessary
Time stamp, flutter monitoring, pulse stretching
Efficient monitoring of the inputs
Counting and frequency measurements Technological fields of application
Identification data I&M Unique identification / assignment ofmodules (for example, for validation, qualityassurance)
Analog value display in S7-format
IEEE tags Analog modules with HART support up tofour IEEE tags in IEEE754 format
Redundancy of IM 152 (V2.0 and higher) • on S7-DP masters (e.g. S7-400H)
• with software redundancy
Redundancy of the Power Supply PS with TM-PS-B
DP master
All ET 200iSP modules support communication with DP masters that are compliantwith IEC 61784-1:2002 Ed1 CP 3/1 and operate with ”DP” transmission protocol(DP = Distributed I/O).
Product Overview
1-9Distributed I/O device ET 200iSPA5E00247483-02
1.3 ET 200iSP in Potentially Explosive Environments
Properties of the zones
Potentially explosive areas are divided into zones. The zones are distinguishedbased on the probability of the existence of an explosive atmosphere.
The ET 200iSP can be operated in the potentially explosive areas Zone 1/21 andZone 2/22, and in the safe area.
ET 200iSP supports the connection of intrinsically safe sensors, actuators andHART field devices located in Zone 0/20 and in the safe area. The sensors,actuators, and HART field devices must be certified for operation in the relevantpotentially explosive areas.
The table below shows the zone classes:
Table 1-3 Zone Classes
Potentiallyexplosive areas
Risk of explosion Example
Zone 0/20 Long-term, frequent orpermanent presence of explosivegas or dust atmosphere
Within containers.
Zone 1/21 Infrequent presence of potentiallyexplosive gas or dustatmosphere
In the region of openings forfilling and draining.
Zone 2/22 Rare or short-term presence ofpotentially explosive gas or dustatmosphere
Areas bordering on zone 1/21
For further information, refer to the Principles of Intrinsically-Safe Design manual.
Types of protection of ET 200iSP
The types of protection include design and electrical measures relating to theequipment in order to achieve Ex protection in potentially explosive areas.
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Table 1-4 Intrinsic Safety of the Types of Protection
Type ofprotection
Meaning View
Intrinsic safety i All voltage, current, inductive andcapacitive loads are limited byelectrical measures (intrinsicallysafe). Sparking or thermal effectscapable of causing ignition arethus excluded.
Pressure-proofencapsulation d
The power supply module isinstalled in a stable(pressure-proof) enclosure. If theexplosive atmosphere within theenclosure ignites, the enclosurewill withstand the explosion andcontain the explosion within thepower supply module.
Increased safety e In zone 1 of the hazardous area,the ET 200iSP must be installedin an additional enclosure. Theenclosure must have theincreased safety e type ofprotection.
This type of protection is anadditional measure to avoid thedevelopment of hightemperatures, sparking andelectrical arcs by increasing thedegree of safety
This type of protection is notrequired in the potentiallyexplosive zone 2. Here, theET 200iSP must simply beinstalled in an enclosure suitablefor zone 2 with at least degree ofprotection IP 54.
Product Overview
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Identification of the ET 200iSP
Equipment for operation in potentially explosive areas is marked with an identifierindicating the Ex environments in which the equipment can be used. Identifiers ofET 200iSP:
IM 152 and EMs: EEx ib IIC T4
Inputs and outputs: EEx ia IIC T4
Enclosure: EEx e
PROFIBUS RS 485-IS
Potentially explosive
area: Zone 1
Meaning:
EEx: Identifier of explosion protection
ia : Type of protection intrinsic safety (up to Zone 0)
ib : Type of protection intrinsic safety (up to Zone 1)
d : Type of protection pressure-proof encapsulation
e : Type of protection increased safety
IIC : Explosion group for hydrogen
T4 : Temperature class: Highest permitted surface temperature 135 C
mA
Power
Supply
EEx de [ib] IIC T4
Basic ET 200iSP structure: EEx d e ia/ib IIC T4
Figure 1-3 Identifiers of ET 200iSP
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1.4 Integration into the Control System
PCS7
PCS 7 is a high-performance process control system. PCS 7 integrates ET 200iSPdirectly into the process control system.
Operating and monitoringwith WinCC
Potentially explosivearea: Zone 1
Zone 0
S7-400
ET 200iSP in enclosure
PCS 7 components
higher-rankinglayer
lowest layer:
Actuators,encoders, fielddevices
PC/
PCS 7-OS
Industrial Ethernet
Configuring andparameterassignment usingSTEP 7
RS 485-IS Coupler
PROFIBUS RS 485-IS
PROFIBUS DP
PC/
PCS 7-ES
mA
Configuringusing GSD file
Configuring withSIMATIC PDM
Figure 1-4 Integration into the Control System
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Getting Started with Commissioning
2.1 Introduction
Introduction
This manual guides you step-by-step through a practical example until you havecreated a functioning application. You will become familiar with the basic hardwareand software functions of your ET 200iSP.
2.2 Requirements
The following requirements must be met:
• You must be familiar with the basics of electrical and electronic engineering andthe procedures relating to Ex areas as well as experience of working withcomputers and Microsoft(R) Windows(TM) 2000/XP.
• STEP 7 (version 5.3, Service pack 1 or higher and the current HW update) orPCS 7 (version 6.1 or higher) is installed on your PG and you have a basicknowledge of STEP 7. You may also use older STEP 7 versions. See 6Commissioning and Diagnostics.
• If you implement this example in a potentially explosive area, you must adhereto all the rules and regulations explained and listed in this manual.
Note
When checking the functions, always observe the guidelines to EN 60 079-17.This standard also contains the directives of the International StandardIEC 60 079-17.
!Danger
When laying cables and wiring in potentially explosive areas, make sure that youadhere to the installation regulations in EN 60 079-14 and local regulations.
When operating the ET 200iSP in combustible atmospheres developing as a resultof dust, you need to observe EN 50281-1-2 as well.
2
Getting Started with Commissioning
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!Warning
When used in systems, the ET 200iSP is subject to special rules and regulationsdepending on the area of application.
Please note and adhere to the valid safety and accident prevention regulations, forexample IEC 204 (EMERGENCY STOP devices).
If you do not adhere to these regulations, this can result in serious injury anddamage to machines and facilities.
2.3 Materials and Tools Required for theSample Configuration
Table 2-1 Required Material and Tools
Number Article Order number (Siemens)
1 SIMATIC S7-300, DIN rail L=160 mm 6ES7 390-1AB60-0AA0
2 SIMATIC S7-300, DIN rail L=480 mm 6ES7 390-1AE80-0AA0
1 Enclosure for ET 200iSP, type of protection EEx e (forusing ET 200iSP in the potentially explosive area Zone 1)
Contact your Siemensrepresentative
1 Terminal module TM-PS-A 6ES7 193-7DA00-0AA0
1 Terminal module TM-IM/EM with bus termination module 6ES7 193-7AA00-0AA0
2 Terminal module TM-EM/EM 6ES7 193-7CA00-0AA0
1 Interface module IM 152 6ES7 152-1AA00-0AB0
1 Power Supply PS 6ES7 138-7EA00-0AA0
2 8 DI NAMUR 6ES7 131-7RF00-0AB0
3 4 DO DC17.4/27mA 6ES7 132-7RD10-0AB0
1 RS 485-IS Coupler 6ES7 972-0AC80-0XA0
2 PROFIBUS connector (for master and RS 485-IS coupler) 6ES7 972-0BB50-0XA0
1 PROFIBUS connector RS 485-IS, up to 1.5 Mbps, incl. terminating resistor
6ES7 972-0DA60-0XA0
1 PROFIBUS-DP cable e.g. 6XV1 830-0EH10
2 NAMUR sensor e.g. BERO 3RG 4612-1NA00
1 Single-pole make action pushbutton commonly available
3 LEDs with series resistor commonly available
1 Power supply module PS S7-300 6ES7 307-1EA00-0AA0
1 Central processing unit CPU S7-315-2 DP 6ES7 315-2AG10-0AB0
1 Programming device (PG) with PROFIBUS DP interface,installed STEP 7 software (Version 5.3, Service pack 1 orhigher and the current HW update), communicationsprocessor CP 5611 and PG cable
various
1 Screwdrivers with 3 mm blade commonly available
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2-3Distributed I/O device ET 200iSPA5E00247483-02
Table 2-1 Required Material and Tools, continued
Number Order number (Siemens)Article
1 Screwdrivers with 4.5 mm blade commonly available
1 Cutting tool for the DIN rails commonly available
1 Side cutters and wire stripping tools commonly available
1 Tool for crimping wire-end ferrules commonly available
1 Cable for grounding DIN rails, 10 mm cross-section withM6 cable lug, length to suit local situation
commonly available
1 M6 cable lug commonly available
1 Flexible lead, 1 mm2 cross-section, with suitable wire-endferrules, design A, length 6 mm
commonly available
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2.4 Configuration Overview
Overview of the sample configuration (wiring and power sources not shown)
PG with CP 5611
8 DI NAMUR
S7-300
RS 485-IS Coupler
Equipotential busbar PA
4 DO
Figure 2-1 Overview of the Sample Configuration
2.5 Installation of the Sample Configuration
2.5.1 Installation of the ET 200iSP
1. Install the DIN rail (480 mm) in the EEx e enclosure which is mounted on a firmbase. See chapter 4 Installation.
2. Mount the various modules onto the rail, starting from the left. Begin withterminal module TM-PS-A (suspend – swivel in). Continue with the remainingmodules (suspend – swivel on – slide to left.) Note the following sequence:
– Terminal Module TM-PS-A
– Terminal module TM-IM/EM
– 2 x terminal module TM-EM/EM
– Bus terminating module
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2.5.2 Mounting the S7-300
1. Install the rack on a stable base. See the S7-300, CPU 31xC and CPU 31xoperating instructions: Installation.
2. Install the various modules in the rack, starting from the left (fit to the rail – pushin – secure the screws.) Observe the sequence shown below:
– Power supply PS
– Central processing unit CPU 315-2 DP
2.5.3 Installing the RS 485-IS Coupler
1. Install the DIN rail (160 mm) on a stable base.
2. Hang the RS 485-IS coupler onto the rail and then swivel it in.
Note
Install the RS 485-IS coupler in an enclosure outside of the Ex area.
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2.6 Wiring the Sample Configuration
L+MPA
Figure 2-2 Wiring TM-PS-A
AC
DC
PROFIBUS-DP
24 V powersupply
Strain reliefand shielding terminal
PROFIBUS RS 485-ISconnection
PROFIBUS-DPconnection (X1 DP)
DC 24 V
PROFIBUS RS 485-IS bus termination switch
PROFIBUS RS 485-IS
LEDs
from CPU 315-2 DP
to ET 200iSP
Figure 2-3 Wiring the RS 485-IS Coupler
Getting Started with Commissioning
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Connect the following:
1. The programming device (PG) and the CPU 315-2 DP (interface: X1 MPI) witha PG cable.
2. The DIN rail of the S7-300, including the grounding conductor
3. The DIN rail of ET 200iSP, the Power Supply PS and the equipotential busbarPA. Use the grounding bolt to fasten the components onto the DIN rail.
4. The CPU 315-2 DP (interface: X2 DP) with the RS 485-IS Coupler, as shown inFigure 2-3. Use a PROFIBUS DP cable (PROFIBUS connector6ES7 972-0BB50-0XA0.)
5. The interface IM 152 with the RS-485-IS coupler, as shown earlier. Use aPROFIBUS DP cable (PROFIBUS connector 6ES7 972-0BB50-0XA0.)
6. The TM PS-A, the RS 485-IS Coupler and the power supply module PS S7-300to the power supply.
Wire the ET 200iSP as shown below:
2 x 8 DI NAMUR 3 x 4 DO DC 17.4/27 mA
Terminals
NAMUR sensor LEDs
21 2 3 4 3 4 3 411 2
Figure 2-4 Wiring the ET 200iSP Module
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2.7 Insert the Interface Module and the Electronic Modules
Insert the modules For further information, refer to chapter 4.4 Installing the Terminal Module for the interface and electronic modules.
Observe the sequence shown below:
– Power Supply PS
– Interface module IM 152
– 2 x 8 DI NAMUR
– 3 x 4 DO DC17.4V/27mA
2.8 Setting the PROFIBUS Address
Set PROFIBUS address 3 on the interface module IM 152. See also 5.7.
64
32
16
8
4
21
ON
Interface module
OFF Example:
DP address =
+ 2
+ 1
= 3
_______*
* reserved
Figure 2-5 Setting the PROFIBUS-address 3
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2.9 Configuring the Example
2.9.1 Configuring the S7-300
Step 1
Open STEP 7.
Step 2
If the New Project Wizard opens, close it with Cancel.
Step 3
In SIMATIC Manager, select File > New. A dialog box opens in which you enter”ET 200iSP” as the name and then close the dialog with OK.
Step 4
Select Insert > Station, then click SIMATIC 300 station on the list. An icon withthe name SIMATIC 300(1) is created in the right-hand pane of the project window.
Step 5
Double-click the icon of the SIMATIC 300 station in SIMATIC Manager. An iconlabeled ”Hardware” now appears in the right-hand pane of the window. Double-clickthis icon. HW Config opens.
Step 6
If the component catalog is not shown in the right section of the window, you canactivate it by selecting View > Catalog.
Expand the SIMATIC 300 folder and RACK-300 folder until you can see UR.Double-click this entry.
Step 7
Select slot 1 (appears on blue background), return to the catalog and open thefolders SIMATIC 300, PS 300 and Standard PS 300 until you can see PS 407 5A.Double-click this icon. The power supply module now occupies slots 1 and 2.
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Step 8
Next, select slot 3, then go to SIMATIC 300, CPU 300, CPU 315-2 DP and6ES7 315-2AG10-0AB0. A double-click opens a window titled”Properties-PROFIBUS interface DP)”. Acknowledge this with OK. The CPU is assigned to slot 2.
Step 9
In the lower left-hand window, locate the row labeled DP and select it. Right-clickon the row and select Object Properties. The ”Properties DP” dialog opens.Click the Properties button, and in the next dialog, click New. The system nowcreates a new DP subnet operating at 1.5 Mbps. Now confirm by clicking OK threetimes in succession.
Step 10
From the main menu, select Station > Save and Compile to save your changes.
Figure 2-6 Configuring the S7-300
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2.9.2 Configuring and Assigning Parameters to ET 200iSP
Step 1
In the upper left-hand window of HW Config, click the stylized PROFIBUS to selectit. Next, go to the catalog and open PROFIBUS DP and ET 200iSP so that you cansee IM 152. Double-click this icon to insert an ET 200iSP station. In the dialog boxthat opens, change the address to 3 and confirm with OK. At the bottom left, youcan now see the new slots with an IM 152 in slot 2.
Step 2
Since slot 3 must remain free, select slot 4 and starting from there insert threeNAMUR 4DI modules and three 4 DO DC17.4V27mA modules.
Figure 2-7 Configuring and Assigning Parameters to ET 200iSP
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Step 3
Double-click the first module in the configuration table (slot 4: 8 DI NAMUR).Select the ”Parameters” tab.
At channels 0 and 1 change the encoder type to ”NAMUR encoder.” ”Deactivate”all other channels.
Figure 2-8 Deactivating ET 200iSP Channels
Step 4
Follow the same procedure as described in item 3 for each of the ET 200iSPmodules, and make the changes as outlined in the table below.
Table 2-2 Changes
Module Slot Type Channel 0 Channel 1 Channels 2 - 7
1 4 8 x DI NAMUR NAMUR sensor NAMUR sensor Encoder type: disabled
2 5 8 x DI NAMUR NAMUR sensor Encoder type: Channel disabled
Encoder type: disabled
3 6 4 x DO No change No change ---
4 7 4 x DO No change No change ---
5 8 4 x DO No change No change ---
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Step 5
Select File > Save to save your configuration, then select PLC > Download todownload it to the PLC.
2.10 Programming the Example
Function principle
The state of the encoders connected to inputs I512.0 , I513.0 and I514.0 is queriedand evaluated. I512.0 increments an internal counter and I513.0 decrements it.Input I514.0 resets the counter to zero.
Depending on the counter value, outputs Q512.0, Q513.0 and Q514.0 are set ordeleted. Q512.0 is set when the counter value is 0. Q514.0 is set at a countervalue of < 3, and Q513.0 is set at 3.
Programming
Select View > Component view to change to the component view.
Open the following in succession: SIMATIC 300(1), CPU 315-2 DP, S7 Program(1)and Blocks until you can see OB1. Double-click OB1, and confirm the dialog withOK.
Enter the following STL program:
Table 2-3 Sample program
STL Explanation
A I 514.0R C 0
A I 512.0CU C 0
A I 513.0CD C 0
AN C 0= Q 512.0
L C 0L 3>=I= Q 513.0<I= Q 514.0
If button 514.0 is active,set counter to 0
If BERO 512.0 is active,increment by 1
If BERO 513.0 is active,decrement by 1
Is counter = 0 ?YES, then output 512.0 is active
Load counter in ACCULoad 3 in ACCUIs counter => 3 ?YES, then output 513.0 is activeIs counter < 3 ?YES, then output 514.0 is active
Select File > Save to save your configuration, then select PLC > Download todownload it to the PLC.
Getting Started with Commissioning
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2.11 Putting the Example into Operation
Turn on the power supply of the ET 200iSP.
Watch the status LEDs on the S7-300 and the ET 200iSP:
• CPU 315-2 DP is lit
DC 5V: lit
SF DP: off
BUSF: off
• ET 200iSP
SF: off
BF: off
ON: lit
PS ON: lit
2.12 Analysis of Diagnostics Data
If an error occurs, OB82 is started. Evaluate the startup information in OB82.
Tip: Call SFC13 in OB82 and evaluate the diagnostic datagram. See chapter 6Commissioning and Diagnostics
Getting Started with Commissioning
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2.13 Removing and Inserting Modules
Removing and Inserting Digital Electronics Module 8 DI NAMUR
1. Remove the first of the three electronics modules 8 DI NAMUR from theterminal module during operation.
2. Monitor the status LEDs on the IM 152-2:
– SF: lit --> diagnostic message is present.
– BF: off
– ON: lit
– PS ON: litResult: The ET 200iSP continues to operate problem-free.
3. Evaluate the diagnostic information.
Result:
– Station status 1 (byte 0): Bit 3 is set –> External diagnostics
– ID-related diagnostics: Bit 3 in byte 7 is set –> slot 4
– Module status: Byte 16.7 / 16.6: 11B –> no module
4. Reinsert the removed electronic module into the terminal module.
Result:
– Status LED IM152:SF: offBF: offON: litPS ON: lit
– The diagnostic message is deleted.
Getting Started with Commissioning
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2.14 Wire Break of the NAMUR Encoder Connected to theDigital Input Module
1. Remove the wire from terminal 1 of the first electronic modules 8 DI NAMUR.
2. Watch the status LEDs.
– Status LED IM152:SF: On –> A diagnostics message is queued
– Status LEDs electronic module 8 DI NAMUR:SF: On –> A diagnostics message is queued3: off/on
3. Evaluate the diagnostic information.
Result:
– Station status 1 (byte 0): Bit 3 is set –> External diagnostics
– ID-related diagnostics: Byte 7.3 is set –> slot 4
– Channel-specific diagnostics:Byte 25: 10000011B –> Slot 4Byte 26: 01000000B –> Channel 0Byte 27: 00110B –> Wire break
4. Reconnect the BERO wire to terminal 1, then evaluate the diagnostics dataagain:
– Status LED IM152:SF: off
– Status LEDs electronic module 8 DI NAMUR:SF: off3: off/on
– The diagnostic message is deleted.
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Configuration Options
3.1 Modular System
Modular system
Modular in the context of ET 200iSP means: You can adapt the configuration toyour application with 4- and 8-channel electronic modules.
Example
The following schematic shows an example of a possible configuration of theET 200iSP distributed I/O station:
Switches, sensors
NAMUR sensor
Counting pulse, frequency
Valves, relays
mA2-/4-wire measuring transducer
Resistance thermometer
Thermocouples:
Loads on the current output
HART field devices
Figure 3-1 Example of an ET 200iSP Configuration
3
Configuration Options
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3.2 Electronics Modules to Suit Your Application
Which Electronics Module Does What
In the following table, you will find a guide to the applications of the electronicsmodules of the distributed I/O station ET 200iSP.
Table 3-1 Electronics Modules to Suit Your Application
Application Electronic module
Evaluating NAMUR sensors
Evaluation of mechanical contacts with and without Rcircuit
Recording counting pulses
Measuring frequencies
8 input channels 8 DI NAMUR
Switching solenoid valves, d.c. relays, indicator lamps, actuators
4 output channels 4 DO DC23.1V/20mA
4 DO DC17.4V/27mA
4 DO DC17.4V/40mA
Measuring currents with 2-wire transducers (standardapplications)
Measuring currents with HART field devices (2-wire measuring transducers)
HART communication
4 input channels
Input range
• 4 to 20 mA
• HART
4 AI I 2WIRE HART
Measuring currents with 4-wire transducers (standardapplications)
Measuring currents with HART field devices (4-wire measuring transducers)
HART communication
4 input channels
Input ranges:
• 0 to 20 mA
• 4 to 20 mA
• HART
4 AI I 4WIRE HART
Measuring temperatures with resistance thermometers
Measuring resistance
4 input channels
Input ranges:
• Pt 100, Ni 100
• 600 ohms
4 AI RTD
Measuring temperatures with thermocouples
Measuring thermal e.m.f.
4 input channels
Input ranges:
• 80 mV
• Type J, K, T, U, E,L, N, R, S, B
4 AI TC
Output of currents with HART field devices
HART communication
Output of currents
4 output channels
Output ranges:
• 0 to 20 mA
• 4 to 20 mA
• HART
4 AO I HART
Configuration Options
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3.3 Electronic Modules Matching the Terminal Modules
Selecting the Terminal Modules
In the following table, you will find information to help you select the terminalmodules you require.
Table 3-2 Modules and Terminal Modules
Modules Terminal Modules
TM-PS-A
TM-PS-B
TM-IM/IM TM-IM/EM 60S
TM-IM/EM 60C
TM-EM/EM 60S
TM-EM/EM 60C
Order number 6ES7 193- 7DA00-0AA0
7DB00-0AA0
7AB00-0AA0 7AA00-0AA0
7AA10-0AA0
7CA00-0AA0
7CA10-0AA0
Power Supply PS
Interface Module IM 152
8 DI NAMUR
4 DO 23.1 VDC/20mA
4 DO 17.4 VDC/27mA
4 DO 17.4 VDC/40mA
4 AI I 2WIRE HART
4 AI I 4WIRE HART
4 AI RTD
4 AI TC
4 AO I HART
Reserve module
Configuration Options
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3.4 Power Supply of ET 200iSP
Power Supply PS
Connect the power supply of ET 200iSP to the TM-PS-A terminal module of thepower supply module PS. The power supply module PS provides the requiredoutput voltages for the ET 200iSP. The output voltages are electrically isolatedfrom the supply voltage.
DC 24 V supply voltage
Grounding busbar PA
Output voltages:
IM 152
Backplane bus
Powerbus
Figure 3-2 Power Supply PS
Note
Fuse the power supply module with a 6 A over-current release, trippingcharacteristic C (one per ET 200iSP station.)
3.5 Configuration Options in Zones
General Rules
To operation of ET 200iSP in potentially explosive locations or in the safe area,irrespective of its configuration:
The ET 200iSP distributed IO device may only be operated on theintrinsically safe PROFIBUS RS 485-IS:
1. An RS 485-IS coupler (field bus isolating transformer) is always required
2. Identification of PROFIBUS DP as EEx i (not only for Ex areas)
3. Marking of the cables/wires to the actuators and sensors as EEx i (for example,using the color light blue).
Configuration Options
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!Warning
All devices connected to PROFIBUS RS 485-IS must be intrinsically safe.
It is not allowed to connect voltage measuring devices, oscillographs and bustesters to PROFIBUS RS 485-IS.
Rules relating to ET 200iSP configuration for operation in Zone 1:
If you use the ET 200iSP in zone 1, you must adhere to the following rules:
1. Install ET 200iSP in a metal enclosure with degree of protection EEx e(extended safety.) Order numbers are found in the appendix A.1.
2. Isolation of PROFIBUS DP by means of RS 485-IS Coupler (order number isfound in appendix A). The RS 485-IS Coupler ensures protection class EEx i ofPROFIBUS DP in potentially explosive areas. You can install the RS 485-ISCoupler in the potentially explosive Zone 2, or in the safe area.
3. In the potentially explosive area, you can use standard PROFIBUS DP cables(order numbers are found in appendix A.) You must, however, mark these as”EEx i bus cable” (for example with a blue band/blue heat-shrink sleeve at theends, or mark the cable with a blue color).
4. Connecting the PROFIBUS RS 485-IS bus cable to IM 152 via PROFIBUSconnector RS 485-IS (order numbers are found in appendix A.)
5. Terminating PROFIBUS RS 485-IS by means of PROFIBUS bus connectorRS 485-IS: Order numbers are found in appendix A. The transmission ratedetermines the maximum length of PROFIBUS RS 485-IS (cf. RS 485-IS Coupler product information.)
Configuration Options
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Safe areaRS 485-IS coupler
PROFIBUS DPbus cable
Enclosure type of protection EEx e Enclosure type of protection EEx e
ET 200iSP ET 200iSPBus connector 1.5 Mbps Bus connector with integrated
terminating resistor
PROFIBUSRS 485-IS
Potentially explosivelocations: Zone 1
Figure 3-3 Configuration Options for the ET 200iSP in Zone 1
Rules relating to ET 200iSP configuration for operation in Zone 21
If you use the ET 200iSP in zone 21, you must adhere to the following rules:
1. Install ET 200iSP in a metallic, dust-proof and certified enclosure with minimumdegree of protection IP 6x in accordance with directive 94/9/EC for category2D.) Further requirements (surface temperatures, for example) are found in thecertification document of the relevant enclosure.
Order numbers are found in the appendix A.1.
2. See items 2 to 5: Rules relating to ET 200iSP configuration for operation inZone 1
Rules relating to ET 200iSP configuration for operation in Zone 2:
If you use the ET 200iSP in zone 2, you must adhere to the following rules:
1. The ET 200iSP must be installed in an enclosure, minimum degree ofprotection IP 54. The enclosure must have a manufacturer’s declaration foroperation in zone 2 in accordance with EN 50021: Protection from mechanicaldamage; degree of protection IP 54; avoidance of ignition due to electrostaticcharge).
Order numbers are found in the appendix A.1.
2. See items 2 to 5: Rules relating to ET 200iSP configuration for operation inZone 1
Configuration Options
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Rules relating to ET 200iSP configuration for operation in Zone 22:
If you use the ET 200iSP in zone 22, you must adhere to the following rules:
1. Install ET 200iSP in a metallic, dust-proof enclosure with minimum degree ofprotection IP 5x in accordance with directive 94/9/EC for category 3D. Furtherrequirements (surface temperatures, for example) are found in the certificationdocument of the relevant enclosure.
Order numbers are found in the appendix A.1.
2. See items 2 to 5: Rules relating to ET 200iSP configuration for operation inZone 1
!Danger
If conductive dust develops in the potentially explosive Zone 22 (metal particles,for example), the Zone 21 rules apply.
Rules for Configuring the ET 200iSP in the Safe Area:
If you use the ET 200iSP in the safe area, you must adhere to the following rules:
1. Install the ET 200iSP in a metallic enclosure, degree of protection IP 20.
2. See items 2, 4 and 5: Rules relating to ET 200iSP configuration for operation inZone 1
Rules for the configuration of sensors, actuators, and HART field devices in thepotentially explosive area.
The verification of intrinsic safety for each field circuit must be made according tothe regulations stipulated by the relevant standards for configuration, selection andinstallation.
A simple, intrinsically safe circuit results from attaching a sensor, actuator or HARTfield device to an input or output of an electronic module.
The following table describes the conditions for checking the maximum safe valuesfor a simple, intrinsically safe circuit:
Configuration Options
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Table 3-3 Rules for Configuration
Relevant Standard / Conditions forElectrical Parameters
Usable Encoders and Actuators
Standard: EN 60 079-14
Rules for electrical parameters:
• U0 Ui
• I0II• P0Pi
• C0Ci+Ccable
• L0Li+Ccable
The maximum safety values of theencoders and actuators must be adaptedaccordingly to the maximum values of theelectronics modules. You will find thesemaximum values
• in the Ex certification of the senors andactuators
• in the technical specifications of theelectronic modules of the ET 200iSP
Modules
ET 200iSP
Encoders
Actuators
HART field devices
U0 max. output voltage
I0 max. output current
P0 max. output power
C0 max. external C
L0 max. external L
Ccable max. line/cable capacitance
Lcable max. line/cable inductance
Ui max. input voltage
Ii max. input current
Pi max. input power
Ci max. internal capacitance
L0 max. internal L
Safety information
Note
Always configure the system in accordance with EN 60 079-14 directives. Seetable 3-14.
Configuration Options
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!Warning
The interconnection of an intrinsically safe sensor, actuator, or HART field devicewith the input/output of an electronic module must produce an intrinsically safecircuit! Always check for resultant safety values when you select the sensors,actuators and HART field devices for an electronic module.
3.6 Limitation of the Number of Connectable ElectronicModules
Number of electronic modules at an ambient temperature of–20C to +60C in horizontal mounting position, and–20C to +40C in all other mounting positions.
Each ET 200iSP station consists of up to 32 electronic modules. This includesdigital and analog electronic modules.
The actual number of electronic modules may be limited by the current output bythe Power Supply PS (limit value: < 5000 mA). This current value limit may not beexceeded.
Unrestricted use and combination of modules in ET 200iSP are possible in thefollowing scenario:
ET 200iSP with up to 16 electronic modules
Verify any configuration containing a higher number of electronic modules (up to32), or an EM 4 DO 17.4 VDC/40mA, with the help of the calculation table (seetable 3-4.)
Note
At ambient temperatures between +60C and +70C (horizontal mountingposition), the output current of Power Supply PS is reduced to max. 3.5 A. For thisscenario, always calculate the number of electronic modules based on this currentvalue (limit value: < 3500 mA).
Calculation table
Verify the operational current consumption of ET 200iSP based on this calculationtable.
Configuration Options
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Note
ET 200iSP always conforms with safety-relevant current consumption limits (limitvalue < 15 A, see EC Prototype Test Certification KEMA 04ATEX2242.) Thenumber of modules available for any configuration scenario is limited only by theoperational current consumption (limit value < 5 A) or by the maximum number(32.)
Procedure
Check the operational current consumption of your ET 200iSP configuration.The limit value defined in table column = operational current consumption in mAmay not be exceeded.
1. Multiply the operational current per module by the number of modules, thenenter the values in the column = operational current consumption in mA.
2. Add all modules and enter the value in the Total Modules box (maximum of 32electronics modules).
3. Add the operational current consumption, and enter the value in the TotalCurrent Consumption box.
4. Compare the calculated totals with the specified limit values.
Table 3-4 Current Consumption Calculation Table
Electronic modules x Numberof
Modules
Operationalcurrent per
module in mA
= Operationalcurrent
consumptionin mA
Power Supply PS x 15 mA =
IM 152 x 30 mA =
8 DI NAMUR x 80 mA =
4 DO 23.1 VDC/20mA x 290 mA =
4 DO 17.4 VDC/27mA x 260 mA =
4 DO 17.4 VDC/40mA x 380 mA =
4 AI I 2WIRE HART x 280 mA =
4 AI I 4WIRE HART x 27 mA =
4 AI RTD x 19 mA =
4 AI TC x 17 mA =
4 AO I HART x 295 mA =
Reserve x ––– –––
TotalModules
=
Total CurrentConsumption
=
max. 32* < 5000 mA
* without Power Supply PS and IM 152
Configuration Options
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Example
An ET 200iSP consists of the following electronic modules, for example:
• 5 x 8 DI NAMUR
• 5 x 4 DO DC17.4V/27mA
• 2 x 4 DO DC23.1V/20mA
• 3 x 4 DI I 2 WIRE HART
• 5 x 4 DI I 4WIRE HART
• 5 x 4 DI RTD
• 4 x 4 DI TC
• 3 x 4 AO I HART
When operating with 32 electronic modules, check the current consumption(< 5000 mA):
Table 3-5 Current consumption calculation table
Electronic modules x Numberof
Modules
Operationalcurrent per
module in mA
= Operationalcurrent
consumptionin mA
Power Supply PS x 1 15 mA = 15 mA
IM 152 x 1 30 mA = 30 mA
8 DI NAMUR x 5 80 mA = 400 mA
4 DO 23.1 VDC/20mA x 2 290 mA = 580 mA
4 DO 17.4 VDC/27mA x 5 260 mA = 1300 mA
4 DO 17.4 VDC/40mA x ––– 380 mA = –––
4 AI I 2WIRE HART x 3 280 mA = 840 mA
4 AI I 4WIRE HART x 5 27 mA = 135 mA
4 AI RTD x 5 19 mA = 95 mA
4 AI TC x 4 17 mA = 68 mA
4 AO I HART x 3 295 mA = 885 mA
Reserve x ––– ––– –––
TotalModules
= 32
Total CurrentConsumption
= 4348 mA
max. 32* < 5000 mA
* without Power Supply PS and IM 152
Note
The limit values are not exceeded in the example.
Result: ET 200iSP can be operated with this configuration.
Configuration Options
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3.7 Maximum Configuration of ET 200iSP
Number of ET 200iSP Stations
You may operate up to 31 ET 200iSP stations on one segment of PROFIBUS RS 485-IS (via RS 485-IS Coupler).
Current consumption of ET 200iSP in maximum configuration
See Technical Specifications of the Power Supply Module PS.
Width of ET 200iSP
Maximum mounting width of ET 200iSP (power supply + interface module + 32electronic modules + bus termination module):
• 1.095 m (with a power supply and an IM 152)
• 1.185 m (with two power supplies and two IM 152 interface modules)
Address space
The interface module supports up to 244 input bytes and 244 output bytes. SomeDP masters do not support the entire address space.
3.8 Direct Data Exchange
Requirements
The ET 200iSP can be used as transmitter (publisher) for direct data exchange(cross traffic). This requires no configuration.
The DP master being used must, of course, also support direct communication.You will find information on this in the description of the DP master.
Principle of Operation
Direct data exchange is characterized by PROFIBUS DP nodes which “listen” onthe bus and know which data a DP slave returns to its DP master. This mechanismallows the “listening node” (recipient) direct access to deltas of input data of remoteDP slaves.
In your STEP 7 configuration, define the address area of the recipient in which therequired data of the publisher will be read, based on the peripheral inputaddresses.
Configuration Options
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Example
The diagram below shows which direct data exchange “relationships” can beconfigured with an ET 200iSP as publisher and which nodes can “listen in” aspotential recipients.
CPU 31x-2 DP master system 1
CPU 31x-2 asDP master 1
DP master system 2
ET 200iSP
DP slave
ET 200iSP
ET 200iSP
CPU 31x-2 asDP slave
PROFIBUS RS 485-IS
CPU 31x-2 asDP master 2
Figure 3-4 Example of Direct Data Exchange
3.9 Time Stamping
Features
IM 152 supports time stamping
• in customer applications using FB 62 (FB TIMESTMP)(see also the STEP 7 Online Help).
• in a PCS 7 system solution at an accuracy of 20 ms
For detailed information on time stamping and time-of-day synchronization,refer to the PCS 7 function manual “10 ms Time Stamps.”
Function principle
A modified input signal is assigned a time stamp and saved to a buffer (datarecord). When time-stamped signals are input, or the data record overflows, thesystem generates a process alarm output to the DP master. The buffer isevaluated with “read data record.” The system generates special messages uponevents influencing the time stamping function (communication with DP master isdown, time master message frame failure, etc).
Configuration Options
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Parameter assignment
in this configuration, define the user data of IM 152 to be monitored. With respectto the time stamping function, these are digital inputs monitored for signal changes.
Parameter Setting Description
Time stamping • disabled
• enabled
Enable time stamping for thechannels of electronic module 8DI NAMUR.
Edge evaluationevent entering state
• positive edge
• negative edge
Define which signal changesrequire a time stamp.
3.9.1 Time Stamping at an Accuracy of 20 ms
The time stamping of binary signal changes is supported in the PCS 7 system byall hardware and software components: from the ET 200iSP over the S7-400 rightto the OS.
Requirements
• Set a synchronization interval of 20 ms for the master and ET 200iSP.
• To enable the time stamping function, you need the electronic module 8 DINAMUR with the “8DI NAMUR” configuration. All other configurations of the 8DINAMUR electronic module do not support time stamping.
Function principle of time stamping
You can configure the monitoring of digital inputs for signal changes in HW Config.The following can be monitored: “Signal entering/leaving state” (as “positive ornegative edge”). ET 200iSP adds the current time-of-day stamp to these changedinput signals and saves them as message lists. Such a message list is a datarecord with a maximum of 20 messages about time-stamped signal changes. TheIM 152 can store up to 15 data records.
After a certain time and if messages exist or when a data record is full, the IM 152triggers a hardware interrupt on the DP master (S7-400). The CPU then reads thedata record and passes on the message lists to WinCC on an OS using the driverblock FB90 “IM_DRV”.
Configuration Options
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Example of time stamping
S7-400automation system
Industrial Ethernet
WinCCOperator Station (OS)(system visualization)
PROFIBUS
Real-timetransmitter
(SICLOCK)
CP 443-1
CP 443-5(DP master)
RS 485-IS Coupler ET 200iSP
Digital inputs
Figure 3-5 Example of Time Stamping and Edge Evaluation
Time Stamping: Principle of Operation in a Redundant System
Both IM 152s store the messages of the time-stamped signals. In this way, after aload transfer from the active to the passive IM 152, the “new” active IM 152 canforward the current messages to WinCC.
Signal changes are not time-stamped during the changeover between the twoIM 152 interface modules. The period during which no time stamping occurred canbe seen in WinCC.
Configuration Options
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Time Stamping: Example in a Redundant System
ET 200ISPdistributed I/O with 2 x IM 152
S7-400Hautomation
system
Redundant DP mastersystems
Industrial Ethernet
WinCCOperator Station (OS)(system visualization)
Real-timetransmitter
(SICLOCK)
RS 485-IS Coupler
ET 200iSP
Digital inputs
Figure 3-6 Example configuration with 2IM 152s for redundancy in an H-system
3.9.2 Time Synchronization with Flexible Time Interval
You can set the synchronization interval in the engineering tool.
Longer synchronization intervals reduce time stamping accuracy.
Configuration Options
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3.10 Counting
3.10.1 Features
The 8 DI NAMUR electronic module is equipped with a counter function.
• 2 16-bit up counters (standard counting function), or
• 2 16-bit down counters (periodic counting function), or
• 1 32-bit down counter (cascading counter function)
• Setpoint preset by the PIO
• GATE function
• Counter control signals you can configure:
– ”2 Count/ 6 6DI NAMUR” configuration: Two counters are configured. Thecontrol signals are stored in the PIO ( process image of outputs.)
– ”2 Count/ 6 Control” configuration: Two counters are configured. The countercontrol signals are stored in the PIO. The counters are also controlled by thedigital inputs of 8 DI NAMUR.
• You configure the counters of the 8 DI NAMUR electronic module and assign the parameters in the engineeringsoftware, for example, HW Config.
Configuration Options
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3.10.2 Function Principle
16-bit up counters (standard counting function)
The counting range is always 0 to 65535.
Each counting pulse at the digital input increments the counter value by the countof 1. When the counting limit is reached, the function resets the counter to 0 andresumes counting.
When the system detects a counter overflow, it sets the corresponding output inthe PII.
A positive edge of the control signal reset output resets the output in the PII. Thisdoes not influence the current counter value.
In 16-bit up counting operations, the system does not set any PIO outputs. Theseare always reset.
A positive edge of the control signal Reset counter sets the counter value 0 andthe set counter output.
The GATE control signal stops the count at a positive edge. Counter pulses areprocessed at the digital input again at a negative edge. The Reset counter controlsignal remains effective when the GATE function is enabled.
Actual counter value
Counting limit
Control signal GATE
Pulses on the digitalinput
Time
Control signal reset counter
Time
Time
Time
Control signal reset output
Counter output inthe PII
Time
Time
Figure 3-7 Principle of Operation of the 16-bit Up Counter
Configuration Options
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16-bit down counters (periodic counting function)
Maximum counter range: 65535 to 0.
The actual value is overwritten with the setpoint value when the counter starts.Each counting pulse decrements the actual value by the count of 1. When zero isreached, the system sets the corresponding output in the PII, and then resets theactual value to the setpoint value. The down count resumes at this value.
A positive edge at the Reset counter control signal resets the actual value to thesetpoint value, and resets the corresponding PII output.
A positive edge of the control signal reset output resets the output in the PII. Thisdoes not influence the current counter value.
The GATE control signal stops the count at a positive edge. The corresponding PIIoutput is reset at the same time. Counter pulses are processed at the digital inputagain at a negative edge. The Reset output and Reset counter control signals alsoremain active when the GATE function is enabled.
The counter setpoint is defined and modified by the PIO. A positive edge at theReset counter control signal, or a zero transition of the counter, applies thesetpoint.
Actual countervalue
Setpoint
Control signal GATE
Pulses on the digitalinput
Time
Control signal reset counter
Time
Time
Time
Control signal reset output
Counter output inthe PII
Time
Time
Figure 3-8 Principle of Operation of the 16-bit Down Counter
32-bit down counter (cascading counter function)
Maximum counter range: 4294967295 to 0.
The principle of operation is identical to that of the 16-bit down counter. Channel 1does not have any function.
Configuration Options
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3.10.3 Configuring Counters
Procedure in HW Config
Drag-and-drop the relevant “2 Count/ 6 DI NAMUR” or “2 Count/ 6 Control”configuration from the HW catalog to the configuration table, or set the relevantconfiguration parameters.
”2 Count/ 6 DI NAMUR” configuration
• Assignment of Digital Inputs at 8 DI NAMUR
For further information on input assignments, refer to the technical data of the 8DI NAMUR electronic module.
Table 3-6 Assignment of Digital Inputs of 2 Count / 6 DI NAMUR
Digital input Terminal Assignment
Channel 0 1, 2 Counter 1
Channel 1 5, 6 Counter 2 (irrelevant for 32-bit down counters)
Channel 2 9, 10 Digital input 2
Channel 3 13, 14 Digital input 3
Channel 4 3, 4 Digital input 4
Channel 5 7, 8 Digital input 5
Channel 6 11, 12 Digital input 6
Channel 7 15, 16 Digital input 7
Configuration Options
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• Assignments of the PII
EB x+5EB x+6
EB x
7 136 5 4 2 0
6 25 4 37
S7 format
Unassigned
Value status channels 2 to 7:
1B: Valid input signal0B: Input signal is invalid
EB x+1EB x+2EB x+3
Actual value counter 1
Actual value counter 2
7 6 5 4 13 2 0EB x+4
Counter output 1Counter output 2
Digital input 2Digital input 3
Digital input 4Digital input 5
Digital input 6Digital input 7
Actual valuecounter 1 (32-bit downcounter)
Bits 15 to 8Bits 7 to 0Bits 15 to 8Bits 7 to 0
Bits 31 to 24Bits 23 to 16Bits 15 to 8Bits 7 to 0
Figure 3-9 PIO with “2 Count/ 6 DI NAMUR” Configuration
• Assignments of the PIO
AB xAB x+1AB x+2AB x+3
7 6 5 4 13 2 0AB x+4
UnassignedUnassigned
Control signal GATE 1Control signal GATE 2
Control signal reset counter 1Control signal reset counter 2
Control signal reset counter output 1Control signal reset counter output 2
Setpoint counter 1
Setpoint counter 2
Setpoint counter 1 (32-bit downcounter)
Bits 15 to 8Bits 7 to 0Bits 15 to 8Bits 7 to 0
Bits 31 to 24Bits 23 to 16Bits 15 to 8Bits 7 to 0
Figure 3-10 PIO with “2 Count/ 6 DI NAMUR” Configuration
Configuration Options
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”2 Count/ 6 Control” configuration
This configuration also allows you to control the counters by means of digitalinputs.
• Assignment of digital inputs at 8 DI NAMUR
For further information on input assignments, refer to the technical data of the 8DI NAMUR electronic module.
Table 3-7 Assignment of Digital Inputs of 2 Count / 6 Control
Digital input Terminal Assignment
Channel 0 1, 2 Counter 1
Channel 1 5, 6 Counter 2 (irrelevant for 32-bit down counters)
Channel 2 9, 10 Control signal GATE 1
Channel 3 13, 14 Control signal GATE 2
Channel 4 3, 4 Control signal reset counter 1
Channel 5 7, 8 Control signal reset counter 2
Channel 6 11, 12 Control signal reset counter output 1
Channel 7 15, 16 Control signal reset counter output 2
• Assignments of the PII
The assignment is identical to that of the “2 Count/ 6 DI NAMUR” configuration(see Fig. 3-9).
• Assignments of the PIO
The assignment is identical to that of the “2 Count/ 6 DI NAMUR” configuration(see Fig. 3-10).
3.10.4 Configuring Counters
Procedure in HW Config
Double-click 8 DI NAMUR in the configuration table to start your configuration.
Parameters
This section describes only the parameters which are relevant for the counter.These form part of the parameters of 8 DI NAMUR and are based on the selectedconfiguration:
Configuration Options
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Table 3-8 Parameters for the Counters
Parameter Setting Description
Encoder typecounter inputs
• Channel disabled
• NAMUR sensor
• Single contact, no loadresistance
Select the encoder for therelevant counter for channel 0 or 1.
Counter 1 mode • Standard counting function
• Periodic counting function
• Cascaded counting function
Select the counter 1 mode.
Counter 2 mode • Standard counting function
• Periodic counting function
• Cascaded counting function
Select counter 2 mode. Thisparameter is irrelevant if you setthe “Counter 1 mode” parameterto “Cascading countingfunction.”
3.11 Frequency Measurement
3.11.1 Features
8 DI NAMUR supports frequency measurements at channels 0 and 1:
• 2 x frequency counters 1 Hz to 5 kHz
• Configurable measuring window (GATE)
• The frequency counting signals are input to the electronic module at its digitalinputs.
• You configure the frequency counters of the 8 DI NAMUR electronic moduleand assign the parameters in the engineering software, for example, HWConfig.
• ”2 Trace/ 6 6DI NAMUR” configuration: This configuration provides twofrequency counters.
Configuration Options
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3.11.2 Function Principle
Frequency countingThe signal frequencies are determined based on the input signals at channel 0 or 1of the electronic module. To calculate the frequency, the signals are measuredwithin a configurable gate time.
The frequency is visualized as 16-bit value in fixed-point format, and is transferredto the PII.
The frequency counters calculate the frequency based on the following formula:
Frequency [Hz] =Number of negative edges at the digital input
GATE [s]
Violation of input frequency limits
If the input frequency exceeds 5 kHz, 7FFFH is returned as actual value. It is nolonger possible to output any correct actual values if the input frequency exceedsan approx. value of 8 kHz.
3.11.3 Configuring Frequency Counters
Procedure in HW ConfigDrag-and-drop the relevant “2 Trace/ 6 DI NAMUR” configuration from the HWcatalog to the configuration table, or set the relevant configuration parameters.
”2 Trace/ 6 DI NAMUR” configuration• Assignment of digital inputs at 8 DI NAMUR
For further information on input assignments, refer to the technical data of the 8DI NAMUR electronic module.
Table 3-9 Assignment of digital inputs of 2 Trace / 6 DI NAMUR
Digital input Terminal Assignment
Channel 0 1, 2 Frequency counter 1
Channel 1 5, 6 Frequency counter 2
Channel 2 9, 10 Digital input 2
Channel 3 13, 14 Digital input 3
Channel 4 3, 4 Digital input 4
Channel 5 7, 8 Digital input 5
Channel 6 11, 12 Digital input 6
Channel 7 15, 16 Digital input 7
Configuration Options
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• Assignments of the PII
EB x+5EB x+6
EB x
7 136 5 4 2 0
6 25 4 37
S7 format
Unassigned
Value status channels 2 to 7:
1B: Valid input signal0B: Input signal is invalid
EB x+1EB x+2EB x+3
Frequency counter 1
Frequency counter 2
7 6 5 4 13 2 0EB x+4
UnassignedUnassigned
Digital input 2Digital input 3
Digital input 4Digital input 5
Digital input 6Digital input 7
Bits 15 to 8Bits 7 to 0Bits 15 to 8Bits 7 to 0
Figure 3-11 PII with “2 Trace/ 6 DI NAMUR” Configuration
• Assignments of the PIO
The PIO is not used.
Configuration Options
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3.11.4 Assigning Frequency Counter Parameters
Procedure in HW Config
Double-click 8 DI NAMUR in the configuration table to start your configuration.
Parameters
This section describes only the parameters which are relevant for the frequencycounters. These for part of the 8 DI NAMUR parameters:
Table 3-10 Parameters for the Frequency Counters
Parameter Setting Description
Encoder type frequency inputs
• Channel disabled
• NAMUR sensor
• Single contact, noload resistance
Select the encoder for the relevantfrequency counter for channel 0 or 1.
Measuring window(GATE)
• 50 ms
• 200 ms
• 1 s
Select the relevant GATE for channel0 or 1.
Observe the rules shown below inorder to achieve maximum accuracy offrequency counting:
• high frequencies (>4 kHz): set ashort gate time (50 ms)
• variable/ medium frequency range:medium gate times (200 ms)
• low frequencies (<1 kHz): high gatetimes (1 s)
Configuration Options
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3.12 Identification Data I&M
Features
I data: Module information, usually available on a the label of the moduleenclosure. I data are read-only.
M data: System-specific information such as the installation location and date.M data are generated during configuration and written to the module.
I&M data are stored on the module and support you in
• system troubleshooting
• verification of the system configuration
• Detection of HW changes in a system
Reading and writing I&M data in STEP 7
HW Config shows the I&M in the “Module status - IM 152” and“Properties - DP Slave” tabs. For information, refer to the STEP 7 Online Help.
Reading and writing the I&M in SIMATIC PDM
In SIMATIC PDM, select File > Upload all to PG/PC to read, and Device >Download all to device to write the parameters and the I&M. See chapter 6.2.
Reading the I&M with SFB 52
The standard function block SFB 52 can be used to read the data records of aDP slave. In order to read the I&M, download the data records 231 to 234(see table 2-1.)
Note
At present, the I&M data record objects cannot be read or written to by means ofdata record DS 255.
Configuration Options
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Identification data I&M
Table 3-11 Identification data I&M
I&M Access Default Explanation
I data 0: Index 1 (data record 231)
MANUFACTOR_ID read (2 bytes) 2A hex (=42 dec) The name of the manufacturer isstored here. (42 dec = SIEMENS AG)
ORDER_ID read (20 bytes) depends on themodule
Order number of the module
SERIAL_NUMBER read (16 bytes) depends on theproduct version
The serial number of the moduleis stored here. This makesunique identification of themodule possible.
HW_REVISION read (2 bytes) depends on theproduct version
This provides information on theproduct version of the module.This is incremented when theproduct version and/or thefirmware of the modulechanges.
SW_REVISION read (4 bytes) depends on theproduct version
This indicates the firmwareversion of the module. If thefirmware version is incremented,then the product version(HW_REVISION) of the moduleis incremented as well.
REVISIONS_COUNTER read (2 bytes) ––– Provides information on theparameter changes on themodule. REVISION_ COUNTERincrements with each change.
PROFILE_ID1) read (2 bytes) Not applicable
PROFILE_SPECIFIC_TYPE1)
read (2 bytes) Not applicable
IM_VERSION1) read (2 bytes) 10 hex Provides information on the I&Mversion (10 hex = version 1.0)
IM_SUPPORTED1) read (2 bytes) 3E hex Provides information onavailable I&M data (index 1 to 4)
M data 1: Index 2 (data record 232)
TAG_FUNCTION read / write (32bytes)
––– Enter a unique tag for themodule here.
TAG_LOCATION read / write (32bytes)
––– Enter the installation location ofthe module here.
M data 2: Index 3 (data record 233)
DEVICE_INSTALL_ DATE read / write (16bytes)
––– Enter the installation date of themodule here.
M data 4: Index 4 (data record 234)
DESCRIPTOR read / write (54bytes)
––– Enter a comment describing themodule here.
1) The indication of this I&M depends on the engineering software.
Configuration Options
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3.13 Redundancy with IM 152
Properties
The ET200iSP is capable of redundant operation
• on S7-DP masters (e. g. S7-400H)
• with software redundancy
Power Supply of the ET 200iSP
To ensure consistently high availability during redundant operation with 2IM152interface modules, it is also recommended that you configure the ET 200iSP with aredundant power supply PS (see section 3.14).
3.13.1 Redundancy with S7 DP Masters
Principle of Operation
Redundancy on an H-system provides the highest availability. If an interfacemodule fails, the system switches over to the redundant interface module withoutinterruption.
Requirements
• H-system (e.g. S7-400H)
• Terminal module TM-IM/IM
• 2 x IM 152 (V2.0 and higher)
• 2 x RS 485-IS coupler
• STEP 7 software package and SIMATIC S7 H systems
• In a redundant system, IM 152s can only be implemented on DP masters thatsupport the “Fail-Safe” parameter. On DP masters that do not support thisparameter, the IM 152 does not start up, and the BF LED flashes.Tip: The GSD file of the DP master indicates whether it supports the “Fail-Safe”parameter.
!Warning
The SYNC/FREEZE function must not be activated during redundant operation.Violation of this condition can result in invalid process values.
Cross-segment synchronization of SYNC/FREEZE commands does not take placeduring redundant operation.
Configuration Options
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Installation and Wiring
The H-system is completely set up, configured, and parameterized.
1. Install the ET 200iSP with the terminal module TM-IM/IM.
2. Connect a PROFIBUS RS 485-IS to each bus connector. Each PROFIBUS RS 485-IS requires a separate RS 485-IS coupler.
3. Fit the TM-IM/IM with two IM 152 interface modules (V2.0 or higher).
Configuration and Parameter Assignment
1. In the “Hardware Catalog” of HW Config, select a suitable DP master interfaceand place it in both module racks. In the properties dialog that appearsautomatically, create PROFIBUS DP networks with the same parameters forboth DP master interfaces.
2. For each DP master system, insert a DP master system. Result: STEP 7 willautomatically produce a redundant system.
3. Drag one IM 152 (V2.0 and higher) from the “Hardware Catalog” to aPROFIBUS DP in the station window. Result: STEP 7 will automatically createthe connection to both PROFIBUS DPs.
4. Open the properties window of the IM 152 and activate both PROFIBUS DPconnections in the “Redundancy” tab. “PROFIBUS” and “PROFIBUS-Red”.
5. Save the configuration and download it to the CPU.
Configuration Options
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Example-Configuration of a Redundant DP-Master System and IM 152
Figure 3-12 shows an example configuration on an S7-400H. For a detaileddescription of H-systems, refer to the manual S7-400H Automation System,Introduction to the system.
S7-400Hautomation system
RedundantDP mastersystems
ET 200iSP
Digital inputs
RS 485-IS Coupler
TM-IM/IM
Figure 3-12 Redundancy with 2 x IM 152 in an H-system
S7-400H as DP master
You need STEP 7 V 5.0 or higher and the SIMATIC S7 H-Systems softwarepackage to configure the S7-400H system.DP master 1 and DP master 2:
• Execute the same user program
• Have the same parameter assignment and configuration for the IM 152
Configuration Options
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3.13.2 Software redundancy
Principle of Operation
Software redundancy can be used anywhere central and particularly importantsystem devices require increased availability, and a temporary failure (failure of thesystem’s own execution cycles) during switchover from one station to another(master-standby switchover) is tolerated by the process.
Requirements
• Two S7-300 or S7-400 stations (with CPU and DP master)
• Terminal module TM-IM/IM
• 2 x IM 152 (V2.0 and higher)
• 2 x RS 485-IS coupler
• STEP 7 software package and software redundancy
Installation and Wiring
Perform the installation and wiring as described for redundancy on S7 DP masterin section 3.13.1.
Configuration and Parameter Assignment
If you implement the IM 152 with software redundancy, you must configure twoDP master systems in HW Config. For more information, refer to the Description ofSoftware-Redundancy for S7-300 and S7-400.
Configuration Options
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3.14 Redundancy of the Power Supply
Properties
With the ET 200iSP, you can configure a redundant power supply PS. When onePower Supply PS fails, the system switches over to the second Power Supply PSwithout interruption.
Requirements
• Terminal module TM-PS-A
• Terminal module TM-PS-B
• 2 x Power Supply PS
• IM 152 (V2.0 and higher)
Installation and Wiring
1. Begin the installation with the TM-PS-A.
2. Install the TM-PS-B to the right of the TM-PS-A.
3. Now complete the ET 200iSP configuration.
4. Connect a separate power supply to each TM.
5. Finally, fit the TMs with Power Supply PS 1 and PS 2.
TM-PS-ATM-PS-B
PS2
PS1
PS2
AC
DC
AC
DC
Figure 3-13 Redundancy of the Power Supply
Configuration Options
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Parameter Assignment
Only those parameters that are relevant for redundancy of the Power Supply areexplained below. These are part of the parameters of the IM 152 interface module.
Table 3-12 Parameters for Redundancy of the Power Supply PS
Parameter Setting Description
Self-diagnosis enabled –––
Redundant PowerSupply diagnostics
Redundant Power Supply Diagnostics for failure of PowerSupply PS 1 or PS 2
3.15 Configuration Changes in RUN
Features
Certain systems may not be shut down while they are in RUN. The reason for thismay be found in the complexity of automated processes or in high system restartcosts. A modification or removal of system components may nonetheless benecessary.
Certain system configurations and parameters can be modified in RUN by meansof the CiR function. The process is here halted for a brief time. Within this period,the process inputs retain their last value
You can modify the ET 200iSP configuration in RUN using the CiR function.
Reference
A detailed description of this function and its configuration is found in the functionsmanual Modifying the System during Operation via CiR.
You can download this function manual from the Internet. URL:
http://www.siemens.com/automation/service&support
Configuration changes in RUN
Note the information in the Modifying the System during Operation via CiRfunctions manual showing the steps in reconfiguring the system.
Reaction of the I/O to Configuration Changes in RUN
When reconfiguring certain modules (see the table), make sure that no diagnosticevents are pending for this module (wire break message, for example), becauseotherwise it may happen that outgoing diagnostic events are no longer reported.The effect is that the LEDs on the CPU, IM, or module stay lit even though thereconfigured module is operating properly. If this situation comes up, the onlyremedy is to remove and reinsert the module.
Configuration Options
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Table 3-13 Reaction of the I/O
Electronic module Reaction of the I/O- Special features inreconfiguring
8 DI NAMUR Return the last processvalue which was valid priorto the reconfiguration. Inputsnot affected return the lastvalid value and the valuestatus,
SF LED is lit.
if a diagnostic event wasreported before you startedto reassign parameters, theSF LEDs (on the CPU, IM ormodule) may be lit although
4 DO DC23.1V/20mA
4 DO DC17.4V/27mA
4 DO DC17.4V/40mA
Output the last processvalue which was valid priorto your configuration.Outputs not affected returntheir last valid value.
module) may be lit althoughthe module is operatingproperly and the diagnosticevent has been cleared.
• Reconfigure the systemonly if the module doesnot report a diagnostic
4 AI I 2WIRE HART Return the last processvalue which was valid prior
not report a diagnosticevent, or
4 AI I 2WIRE HART
4 AI I 4WIRE HART
4 AI RTD
Return the last processvalue which was valid priorto the reconfiguration. Inputs
event, or
• Remove and reinsert the4 AI RTD
4 AI TC
to the reconfiguration. Inputsnot affected return the lastvalid value.
• Remove and reinsert themodule.
4 AI TCnot affected return the lastvalid value.
4 AO I HART Output the last processvalue which was valid priorto your configuration.Outputs not affected returntheir last valid value.
3.16 Operating the ET200iSP with Older CPUs
The following CPUs cannot be operated in DPV1 mode. The ET 200iSP must beintegrated via the GSD file for projects with these CPUs. Parameters are to beassigned with SIMATIC PDM.
Table 3-14 Operating the ET200iSP with Older CPUs
CPU Order No. HWVersion
FWVersion
CPU 412-1 6ES7 412-1XF03-0AB0 8 V3.1.3
CPU 412-2 6ES7 412-2XG00-0AB0 8 V3.1.3
CPU 413-1 6ES7 413 1XG02-0AB0 9
CPU 413-2 6ES7 413 2XG02-0AB0 9
CPU 414-1 6ES7 414-1XG02-0AB0 9
CPU 414-2 with 128 kB 6ES7 414-2XG03-0AB0 8 V3.1.3
CPU 414-2 with 384 kB 6ES7 414-2XJ01-0AB0 9
CPU 414-3 6ES7 414-3XJ00-0AB0 8 V3.1.3
CPU 414-4H 6ES7 414-4HJ00-0AB0 1 V3.1.3
CPU 416-1 6ES7 416-1XJ02-0AB0 9
CPU 416-2 with 800 kB 6ES7 416-2XK02-0AB0 8 V3.1.3
Configuration Options
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Table 3-14 Operating the ET200iSP with Older CPUs, continued
CPU FWVersion
HWVersion
Order No.
CPU 416F-2 6ES7 416-2FK02-0AB0 2 V3.1.3
CPU 416-2 with 1.6 MB 6ES7 416-2XL01-0AB0 9
CPU 416-3 6ES7 416-3XL00-0AB0 8 V3.1.3
CPU 417-4 6ES7 417-4XL00-0AB0 6 V3.1.3
CPU 417-4H 6ES7 417-4HL01-0AB0 1 V3.1.3
Sync module 6ES7 960-1AA00-0XA0 3
CPU 416-2 DP ISA Lite 6ES7 616-2PG01-0AB4 1
CPU 416-2 DP ISA 6ES7 616-2PK01-0AB4 2
CPU 412-2 DP PCI 6ES7 612-2QH00-0AB4 1 V3.1.0
CPU 416-2 DP PCI 6ES7 616-2QL00-0AB4 1 V3.1.0
3.17 Date of Production of the Module
The year of production is contained in the serial number of the module (4th digit)The serial number is found on the rating plate,
Example of a serial number:
Digit
S VPS91234561 2 3 4 5 6 7 8 91011
Serial number
S 2004T 2005U 2006V 2007W 2008
Year of production
Figure 3-14 Year of production
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Installation
4.1 Rules for Installation
Safety information
!Danger
During installation, be sure to observe the stipulations in EN 60079-14. Theconditions for the electrical parameters in the standard apply to simple electricalcircuits. See 3.5.
When operating the ET 200iSP in combustible atmospheres developing as a resultof dust (Zone 21, Zone 22), you need to observe EN 50281-1-2 as well.
!Danger
Under certain circumstances, sparks or unacceptable surface temperatures capable of ignition can occur duringinstallation.
Never install the system when an explosive atmosphere is present!
The following activities/jobs are forbidden when the ET 200iSP is operating andthe 24 VDC power supply is applied to the terminal module TM-PS-A:
• Disconnecting the 24 VDC power supply at the terminal module TM-PS-A.
• Removing the safety screw from the terminating module.
• Uninstalling the bus termination module and any other modifications that affectthe configuration of the terminal modules.
4
Installation
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Installation Dimensions
Table 4-1 Installation Dimensions
Dimensions
Width Terminal module with power supply module 60 mm
Terminal module with interface module / electronicmodule
60 mm
Terminal modules with electronics modules 60 mm
Bus terminating module 20 mm
Height Terminal module with power supply module 190 mm
Terminal module with interface module / electronicmodule
190 mm
Terminal modules with electronic modules 190 mm
Bus termination module 155 mm
Depth ET 200iSP on S7-300 mounting rail 167 mm
Enclosure for ET 200iSP in Zone 1
The ET 200iSp must be installed in an enclosure with type of protection EEx e(increased safety). Order numbers are found in the appendix A.1.
Use the following cable glands:
• Power supply: type of protection EEx e
• PROFIBUS RS 485-IS and EEx i I/O: type of protection EEx i
Enclosure
EEx eZone 1
Powersupply
EEx e cable gland
PROFIBUSRS 485-IS
EEx i cable gland
EEx i inputs and outputs
Figure 4-1 Enclosure for ET200iSP in Zone 1
Installation
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Enclosure for ET 200iSP in Zone 21
Install ET 200iSP in a metallic, dust-proof and certified enclosure with minimumdegree of protection IP 6x in accordance with directive 94/9/EC for category 2D.)Further requirements (surface temperatures, for example) are found in thecertification document of the relevant enclosure. Order numbers are found in theappendix A.1.
Remove dust deposits from the enclosure and its immediate environment atregular intervals (see chapter 7.5), i.e. always install the enclosure in a locationwith easy access for cleaning.
Use the following cable glands::
• Power supply: Cable gland with manufacturer’s certification for Zone 21
• PROFIBUS RS 485-IS and EEx i I/O: Cable gland with manufacturer’scertification for Zone 21
Enclosure
IP 6x
Powersupply
Cable gland*
PROFIBUSRS 485-IS
Cable gland*
EEx i inputs and outputs
*Requires a manufacturer’s declaration for Zone 21
Figure 4-2 Enclosure for ET200iSP in Zone 21
Installation
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Enclosure for ET 200iSP in Zone 2
The ET 200iSP must be installed in a metallic enclosure with at least degree ofprotection IP 54. The enclosure must have a manufacturer’s certification for zone 2(complying with EN 50021). Order numbers are found in the appendix A.1.
Use the following cable glands:
• Power supply and PROFIBUS RS 485-IS: Cable gland with manufacturer’scertification for Zone 2
• Ex i inputs and outputs: type of protection EEx i
Enclosure
IP 54Zone 2
Powersupply
Cablegland*
PROFIBUSDP EEx i
EEx i cable gland
EEx i inputs and outputs
*Requires a manufacturer’s declaration for Zone 2
Figure 4-3 Enclosure for ET 200iSP in Zone 2
Installation
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Enclosure for ET 200iSP in Zone 22
Install ET 200iSP in a metallic, dust–proof and certified enclosure with minimumdegree of protection IP 5x in accordance with directive 94/9/EC for category 2D).Further requirements (surface temperatures, for example) are found in thecertification document of the relevant enclosure. Order numbers are found in theappendix A.1.
Remove dust deposits from the enclosure and its immediate environment atregular intervals (see chapter 7.5), i.e. always install the enclosure in a locationwith easy access for cleaning.
Use the following cable glands:
• Power supply and PROFIBUS RS 485-IS: Cable gland with manufacturer’scertification for Zone 22
• EEx i inputs and outputs: Cable gland with manufacturer’s certification forZone 22
Enclosure
IP 5xZone 22
Powersupply
Cablegland*
PROFIBUSDP EEx i
Cable gland*
EEx i inputs and outputs
*Requires a manufacturer’s declaration for Zone 22
Figure 4-4 Enclosure for ET200iSP in Zone 22
ET 200iSP enclosure for the safe area
The ET 200iSP must be installed in a metallic enclosure with at least degree ofprotection IP 20.
Mounting position
The preferred mounting position is horizontal on a vertical surface. All otherpositions are possible, although there are certain restrictions regarding the ambienttemperature.
Installation
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Minimum Clearances to the Enclosure for Installation, Wiring, and Ventilation
40 mm*
40 mm
Minimum clearance to theenclosure lid: 3 mm
* the cable shielding terminalis not taken into account
20 mm 25 mm
Figure 4-5 Minimum Clearances to the Enclosure
Rules for Installation
During installation, make sure that you keep to the following rules:
• The mechanical installation of ET 200iSP begins with terminal module TM-PS-A. Start this approx. 10 mm on the right side next to the grounding boltin order to optimize installation space on the rail.
• The terminal module TM-PS-A is followed by the terminal module TM-IM/EM.
• These are followed by the terminal modules TM-EM/EM.
• The ET 200iSP is completed by the bus termination module. The bustermination module accompanies the terminal module TM-IM/EM. If yourET 200iSP configuration leaves you with a gap in the last slot, you must protectthis slot with a slot cover or install a reserve module. The slot cover isintegrated into the terminating module.
• The maximum configuration of the distributed I/O station ET 200iSP contains1 power supply module, 1 interface module and 32 electronics modules. Notethe maximum current consumption (see the chapter 3.6.)
Note
The terminal modules can only be installed in the order described due to anintegrated coding.
Installation
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4.2 Installing the Mounting Rail
Features
The ET 200iSP distributed I/O device is mounted on a rail for S7 installationtechnology (order numbers are found in appendix A.) The mounting rails are readyfor installation with four bore holes and one grounding bolt.
The following configuration is recommended for optimal use of the rail whenmounting the terminal modules.
Fastening hole dimensions
The table below shows the dimensions of the fastening bores for the mounting rail.
Table 4-2 Rail Mounting Diagram
”Standard” Mounting Rail
32.5 mm
57.2 mm
a b
Mark for additional bore holefor applications with increasedvibration and shock stress.
b/2
Length of the mountingrail
Distance a Distance b Maximum number of terminalmodules1) within distance b
482.6 mm 8.3 mm 466 mm 6
530 mm 15 mm 500 mm 7
585 mm 8.5 mm 568 mm 8
830 mm 15 mm 800 mm 12
885 mm 8.5 mm 868 mm 13
1) Width of terminal modules: 60 mm
Required Tools
Wrench or screwdriver to match the selected fixing screws.
Installation
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Accessories required
You can use the following screw types for mounting the rail:
Table 4-3 Fixing Screws
For You can use... Explanation
outer fixing screws Cylindrical head screw M6 toISO 1207/ ISO 1580(DIN 84/DIN 85)
Select the screw length tomatch your installation.You also need 6.4 mm washersto ISO 7092 (DIN 433)Hexagonal head screw, M6, to
ISO 4017 (DIN 4017)
You also need 6.4 mm washersto ISO 7092 (DIN 433)
Installing the mounting rail
1. Mount the rail in the cabinet so that you have sufficient space for installationand development of heat at the modules, see Fig. 4-5).
2. If necessary, mark the bore holes on the base of the cubicle, then drill holeswith diameter of 6.5 mm 0.2.
3. Screw the mounting rail onto the base of the enclosure (M6 screws).
Note
You should always maintain a low impedance contact between the rail and thebase of the enclosure.
If the ET 200iSP is subject to increased vibration or shock, it is advisable to boltdown the mounting rail with an additional screw, at the center position between thetwo outer bores (with b/2.) To mount the fixing screws (see table 4-3), provide anadditional M6 bore hole at b/2 on the mounting rail (see table 4-2).
4.3 Installing the Terminal Module for Power Supply PS
Features
• The terminal module TM-PS-A is used to accommodate the Power Supply PS.
• The terminal module TM-PS-B is used to accommodate the redundant PowerSupply PS of the ET 200iSP.
• The terminal modules TM-PS-A and TM-PS-B must be prewired (without PowerSupply PS).
• All other terminal modules are mounted to the right, next to terminal module TM-PS-A or TM-PS-B.
Requirements
The mounting rail is installed.
Installation
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Required Tools
Screwdriver with 4.5 mm blade (cylindrical)
Mounting Terminal Module TM-PS-A
1. Fit the terminal module onto the rail.
2. Push in the terminal module at the bottom until you can hear the catch lock.
3. Screw fasten the terminal module onto the mounting rail (2 screws, tighteningtorque 0.8 N/m to 1.1 N/m). Use a screwdriver with 4.5 mm blade.
Note: Prevent the ET 200iSP from slipping sideways by fixing the terminalmodule mechanically (see item 3). The corresponding two screws are locatedon the bottom front of the terminal module.
Slider
3 3
1
2
Figure 4-6 Mounting Terminal Module TM-PS-A
Installation
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Mounting Terminal Module TM-PS-B (Redundant Power Supply PS)
1. Hang terminal module TM-PS-B to the right of the TM-PS-A on the mountingrail.
2. Swivel the TM-PS-B back until you can hear the catch lock.
3. Push the TM-PS-B to the left until you hear it engage on the first terminalmodule TM-PS-A.
4. Bolt the terminal module to the mounting rail. See Mounting Terminal ModuleTM-PS-A.
1
3
2
TM-PS-ATM-PS-B
Figure 4-7 Mounting Terminal Module TM-PS-B
Removing Terminal Modules TM-PS-A and TM-PS-B
The terminal module is wired and there are further terminal modules to the right ofit.
1. Turn off the power supply to terminal module TM-PS-A and, if present, terminalmodule TM-PS-B.
2. Disconnect the cables from terminal module TM-PS-A using a screwdriver.
3. Unscrew the retaining screws of the terminal module.
4. Using the screwdriver as a lever, force the slider on terminal module TM-PS-A to its bottom end stop, then shift the terminal module to the left.
Note: The slider is located below the terminal module (see the figure above).
5. Hold the slider while taking the terminal module off the mounting rail.
6. Repeat steps 2 to 5 for terminal module TM-PS-B, if present.
Installation
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4.4 Installing Terminal Modules for the Interface Moduleand Electronic Modules
Properties
• The terminal modules are used to accommodate the interface module and theelectronics modules
– TM-IM/EM: The terminal module for the interface module and electronicmodule is located directly next to the right of terminal module TM-PS-A.
– TM-IM/IM: Terminal module for 2 interface modules (IM 152 redundancy),located to the right of TM-PS-A or TM-PS-B.
– TM-EM/EM: The terminal modules for the electronic modules are located tothe right of terminal module TM-IM/EM or TM-IM/IM.
• The terminal modules can be prewired (without electronics modules).
Requirements
The mounting rail is installed.
Required Tools
Screwdriver with 4.5 mm blade
Mounting Terminal Modules TM-IM/EM, TM-IM/IM, and TM-EM/EM
1. Fit the terminal module onto the rail.
2. Push in the terminal module at the bottom until you can hear the catch lock.
3. Push the terminal module to the left until you hear the click of the mechanismlatching it to the previous terminal module.
1
2
3
Figure 4-8 Installing Terminal Modules TM-IM/EM and TM-EM/EM
Installation
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Removing Terminal Modules TM-IM/EM, TM-IM/IM and TM-EM/EM
The terminal module is wired and there are further terminal modules to the right ofit.
The description below explains how to remove the module, starting from the right:
1. Shut down power to Power Supply PS, or remove it.
2. Strip the terminal module wiring using a 3.5 mm screwdriver.
3. Loosen the retaining screws of the terminating module using a 4.5 mmscrewdriver.
4. Using the screwdriver, lever the slider on the previous (left) terminal moduledown to its mechanical stop.
5. At the same time, slide the terminating module to the right.
6. Maintain pressure on the slider when taking the terminating module off themounting rail.
7. Repeat steps 4 to 6 for further terminal modules.
Note
You can also remove the distributed I/O station starting from the left.
4
5
Slider 6
Figure 4-9 Removing Terminal Module TM-EM/EM, Starting from the Right Side
Installation
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4.5 Installing the Bus Termination Module and theSlot Cover
Features
• The ET 200iSP distributed I/O device is terminated with the bus terminationmodule at its right-hand end. If you do not insert a bus termination module, theET 200iSP cannot be operated.
• To retain the ET 200iSP mechanically, screw fasten the terminating moduleonto the mounting rail.
• If your ET 200iSP configuration leaves you with a gap in the last slot, you mustprotect this slot with a slot cover or install a reserve module. The slot cover isintegrated into the terminating module.
• The bus termination module accompanies with terminal modules TM-IM/EMand TM-IM/IM.
Requirements
The last terminal module of the ET 200iSP has been installed.
Required Tools
Screwdriver with 4.5 mm blade.
Installation
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Installing the bus termination module
1. Fit the bus termination module onto the rail to the right of the last terminalmodule.
2. Push in the bus termination module onto the DIN rail.
3. Push the bus termination module to the left until you hear it lock into the lastterminal module.
4. Screw fasten the terminating module onto the mounting rail (one screw,tightening torque 0.8 N/m to 1.1 N/m). Use a screwdriver with 4.5 mm blade.
Note: Prevent the ET 200iSP from slipping sideways by fixing the terminatingmodule mechanically (see item 4). The retaining screw is located at the bottomfront of the bus termination module.
2
3
1
4
Figure 4-10 Installing the bus termination module
Removing the Bus Termination Module
1. Shut down power to Power Supply PS, or remove it.
2. Unscrew the retaining screws of the terminal module.
3. Using the screwdriver, press down the slider on the last terminal module as faras it will go and shift the bus termination module to the right.
4. Pull the bottom of the bus termination module away from the DIN rail.
Installation
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Installing the Slot Cover
1. Lever the slot cover out of the terminating module using the screwdriver. Theslot cover is mounted on a bracket on the right side of the terminating module.
2. Take this off and insert it into the last slot of the ET 200iSP.
1
2
Figure 4-11 Installing the Slot Cover
Installation
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Removing the slot cover
1. To remove the slot cover from the terminal module, insert the screwdriver intothe bottom opening an lever it out.
2. Press the slot cover into the bracket on the terminating module.
1
Figure 4-12 Installing the Slot Cover
4.6 Installing the Slot Number Labels
Properties
The slot number labels identify the various I/O modules by their slot assignment(1 to 34).
Requirements
• The terminal modules are installed.
• You can only fit the slot number labels when no electronics modules areinstalled.
• Position of terminal module TM-PS-A: One label on top left.
Position of terminal modules TM-IM/EM and TM-EM/EM: Each with one labelon the left, and one on the top right.
Installation
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Required Tools
Screwdriver with 3.5 mm blade (only for removal)
Installing the Slot Labels
1. Break the slot number label (1 to 34) out of the strip.
2. Push the color identification label into the terminal module.
1 2 3 4 5
Slot numberlabels
Figure 4-13 Installing the Slot Number Labels
Removing the slot labels
1. Remove the electronic module from the terminal module.
2. Lever the slot number label out of the holder using a screwdriver.
Installation
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Wiring
5.1 General Rules and Regulations for Wiring
Introduction
The distributed I/O station ET 200iSP represents a component in plants orsystems, and is thus subject to special rules and regulations based on itsapplication. This chapter provides an overview of the most important rules whenintegrating the ET 200iSP distributed I/O system into a plant or system.
Specific application
Observe the accident prevention guidelines for specific applications, such asmachine protection guidelines. When laying cables and lines, observe theinstallation regulations in EN 60 079-14, as well as country-specific regulations.When operating the ET 200iSP in combustible atmospheres developing as a resultof dust (Zone 21, Zone 22), you need to observe EN 50281-1-2 as well.
EMERGENCY-OFF equipment in the safe area
All EMERGENCY-OFF equipment according to IEC 204 (corresponds toDIN VDE 113) must remain operative in all states of the plant or system.
5
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System Startup after Certain Events
The following table describes points to remember when your plant starts upfollowing certain events:
Table 5-1 System Startup after Certain Events
If... then...
Startup after power dips or failure,Startup of ET 200iSP after buscommunication interrupts,
the system may not assume any dangerousstates. If necessary, force anEMERGENCY-OFF!
Startup follows unlocking of theemergency-stop device
must always be controlled and defined.
Mains Power in the Safe Area
The table below shows points to observe when handling mains.
Table 5-2 Mains Power in the Safe Area
For... Then...
stationary plants or systems without all-polepower disconnect switch
the building installation must be equippedwith a power disconnect switch or a fuse.
load power supplies, power supply modules the set rated voltage range must match thelocal power supply.
all power circuits of the distributed I/Ostation ET 200iSP
the fluctuation/deviation of the power supplyfrom the nominal value must be within thepermitted tolerance (see chapter 8.)
24 VDC Supply in the Safe Area
The following table describes points to remember relating to the 24 VDC supply:
Table 5-3 24 VDC Supply in the Safe Area
For... Make sure of...
buildings external lightning protection (for example, lightning protectionelements)
24 VDC supply lines,signal lines
internal lightning protectionelements)
24 VDC supply Reliable Electrical Isolation
Wiring
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Protection from External Electrical Influences
The following table describes points to remember relating to the protection fromelectrical influences or faults:
Table 5-4 Protection from External Electrical Influences
For... make sure that...
all plants or systems in which the ET 200iSPis installed
the plant or system is connected to agrounding conductor to divertelectromagnetic interference.
Supply, signal, and bus lines the cables are installed and routed correctly.
Signal and bus lines Any break of a line or conductor does notresult in undefined states of the plant orsystem.
5.2 ET 200iSP Operation with Equipotential Bonding PA
Components and Protective Measures
When setting up a system, various components and protective devices aremandatory. The type of component and the necessity of protective measuresdepends on the DIN VDE regulations that apply to your system configuration. Thetable below relates to the schematic that follows.
Table 5-5 24 V DC Supply in the Safe Area
Compare... Relates to figure DIN VDE 0100 DIN VDE 0113
Shutdown device forcontrollers,encoders and finalcontrol elements
(1) ...Part 460: mainswitch
...Part 1: mainsdisconnect switch
Short-circuit andoverload protection
(2) ...Part 725:Single-pole fusing ofcircuits
...Part 1: single-polefusing of groundedsecondary circuit
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Safe electrical isolation
Modules supplied with ≤ DC 60 V or ≤ AC 250 V voltages must be safely isolated,i.e. the ET 200iSP power supply must be electrically isolated.
ET 200iSP with floating reference potential
The ET 200iSP is installed without connecting the reference potential M of thepower supply to protective ground.
ET 200iSP within the overall system
The following schematic shows the ET 200iSP distributed I/O station within theentire system in zone 1 (power supply and grounding concept) when powered froma TN-S system.
Equipotential busbar PA
L1L2L3N
Low-voltage distribution – TN-Ssystem, for example (3 400 V)
PE
ET 200iSP
FE: FE: FE:Mountingrail
FE: Functional ground for direct discharge of interferenceto the mounting rail by means of spring-loaded contact.
Power SupplyPS
FE:FE:
Enclosure EEx e
L+ M PA
AC
DC
(2)
(1)
rail for terminating cable shielding
Potentially explosive locations: Zone 1Safe area
Bus cable
Figure 5-1 ET 200iSP Operation with Equipotential Bonding PA
Wiring
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Equipotential bonding PA
The following must be connected to the equipotential bonding system
• the mounting rail of the ET 200iSP system (grounding bolt EEx e)
• terminal module TM-PS-A at the PA terminal
• Rail for terminating cable shielding (with one EEx e terminal)
!Danger
It is not permitted to connect the equipotential bonding system to the groundconductor of the mains system.
The equipotential bonding system PA is compliant with EN 50 079-14 directives forpotentially explosive areas.
Wiring
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5.3 Electrical Installation of the ET 200iSP
Electrical isolation between...
• the load circuits/process and all other circuitry of the ET 200iSP
• the PROFIBUS-DP interface in the interface module and all other circuits
• power supply (auxiliary power) and all output voltages
The following schematic shows the various potentials in the ET 200iSP system.The figure shows only the most important components:
Auxiliary power
Processelectroniccomponents
RS 485-ISinterface
L+ M PA
Power Supply PS IM 152 Electronic module Bus termination module
BackplanebusET 200iSP
Mountingrail
Potential of auxiliary power
I/O potentials
ET 200iSP potentials
Potential DP interface
Processelectroniccomponents
Processelectroniccomponents
Figure 5-2 Potentials in the ET 200iSP System
Wiring
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5.4 Lightning and Overvoltage Protection
5.4.1 Overview
Introduction
One of the most common causes of failure are overvoltages caused by:
• atmospheric discharge, or
• electrostatic discharge
First, will show the basis of the theory of overvoltage protection: the lightningprotection zone concept.
Next, we are going to outline the rules for the transitions between the variouslightning protection zones.
Note
This section can only provide you with the general guide on protecting theET 200iSP from overvoltage.
Full protection from overvoltage is only guaranteed if the design of the entiresystem includes an overvoltage protection. This applies in particular to structuralmeasures to be included in the planning of the building.
We therefore recommend that you contact your Siemens representative or acompany specialized in lightning protection if you require more detailed informationabout overvoltage.
Further references
The solutions presented in these manuals are based on the lightning protectionzone concept described in IEC IEC 61312-1 ”Protection against LEMP.”
Wiring
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5.4.2 The Lightning Protection Zone Concept
Principal of the Lightning Protection Zone Concept complying with IEC 61312-1/DIN V VDE V 0185 T4
The principle of a lightning protection zone requires that facilities to be protectedfrom overvoltage, for example a control room, should be divided into lightningprotection zones based on EMC considerations (see figure below).
The various lightning protection zones (LPZ: Lightning Protection Zone) are formedby:
Table 5-6 Lightning Protection Zones
Lightning Protection Zones (LPZ: Lightning Protection Zone)
the external lightning protection of thebuilding
peripheral parts of the system in which nogalvanic coupling of lightning current peakscan occur (field side)
Lightning protection zone 0A
Lightning protection zone 0B
the shielding of
• buildings
• rooms and/or
• devices
Lightning protection zones 1
Lightning protection zones 2
Lightning protection zones 3
Effects of lightning stroke
Direct lightning strikes occur in lightning protection zone 0A The effects of thelightning stroke are high-energy, electromagnetic fields that must be reduced orweakened from one lightning protection zone to the next through suitable lightningprotection elements/measures.
As described in EN 1127-1, direct lightning strikes ignite explosive atmospheres.For this reason, our advice is to prevent the effects of direct lightning strokes(galvanic coupling) reaching hazardous areas by taking suitable building measures.
Lightning protection measures can, for example, prevent direct lightning strikes inEx zones or to cables leading into these zones. A closely meshed equipotentialbonding system involving all parts of the plant with a minimum of 16 mm2 Cuprevents the flow of lightning currents within the plant. If these measures are takenin the building, lightning protection zone 0B results for installation in the outer area.Indirect lighting effects (inductive, capacitive) can be reduced to a harmless levelwith suitable shielding measures and surge arresters.
Overvoltages
In lightning protection zone 0B, lightning currents can no longer occur. However,peak pulse voltages of 10 kV and more are to be expected. In lightning protectionzone 1 and higher, in addition to the effects of a lightning strike, overvoltage maybe induced by switching actions and couplings, etc.
Wiring
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Lightning Protection Zone Scheme
The following schematic illustrates the lightning protection zone concept for afree-standing building.
Lightning protection zone 0 (field side)
Lightning protection
LightningProtective
Zone 3
Device
power systemline
Lightning protection zones 1
BuildingexternalLightning
shielding(steel reinforced)
Room shielding
(steel reinforced)
Device shielding(metal enclosure)
metal part
notelectricalline
IT cableLightning protectionEquipotential bondinglocalEquipotential bonding
internalline
(metallic)
protection
zones 2
Figure 5-3 Lightning Protection Zones of a Building
Principle of the Interfaces between Lightning Protection Zones
At the junctions between lightning protection zones, you must implement measuresto prevent the transfer of overvoltages.
The principle of a lightning protection zone also requires that at the interfacesbetween the lightning protection zones, all metal cables must be included in theequipotential bonding system.
Metallic lines include:
• the piping (for example, of water, gas and heat),
• active cables
– power cables (for example, system power supply, 24 V power supply)
– signal cables (for example, a bus cable).
Wiring
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5.4.3 Rules for the Interface Between Lightning Protection Zones 0 to 1
Rule for the Interface 0A <–> 1 (Lightning Protection Equipotential Bonding)
The following measures are suitable for lightning protection equipotential bondingat the interface lightning protection zone 0 <–> 1:
• Keep lightning stroke currents away from Ex areas and cables that lead intothese areas.
• Define the zone transition 0A <–> 1 in the non-Ex area.
Since this zone transition is not relevant for the typical applications of theET 200iSP, this will be discussed in no further detail in this manual.
Rule for the interface 0B <–> 1 (high-energy electromagnetic interference)
The following measures are suitable for overvoltage protection at the interfacelightning protection zone 0B <–> 1:
• Use conductive spiral metal bands or metal braids, grounded at both ends asthe cable shields, for example, NYCY or A2Y(K)Y
• and run the cables
– through metal pipes without breaks and grounded at both ends, or
– in conduits of reinforces concrete with interconnected armor, or
– on closed metal cable racks which are grounded at both ends, or
• you may also use fiber-optic cable instead of metal cables.
Additional Measures
If you are not able to take the measures outlined above, provide protection at theinterface 0B <–> 1 with a surge voltage protector. The following table lists thecomponents you can use to provide coarse protection for your system.
Lightning protection zone 1 can, for example, be defined as the interior of abuilding with a shielded outer skin or as the interior of a metal distributor. If theshielding effect of the building outer skin is uncertain, the metal distributor ispreferable. We recommend that you install overvoltage protection devices for thesignal lines in the metal distributor. The protective devices for the 24 V supply mustbe integrated in an explosion-proof enclosure and should also be installed in themetal distributor.
!Danger
To increase the availability of a cable connection with overvoltage protection, bothends of the cable should be connected to protective devices.
Wiring
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Overvoltage Protection Components
Table 5-7 Protection of Cables with Overvoltage Protection Components
Succes-sive
Cables for ... ... at interface 0B <–> 1, connect: Order numbersiveno.
1 Power Supply PS for supplyand looping
• DC 24V
1 Netz-AK/1+1/ÜS/FM/Ex d
with EEx d enclosure, explosion-proof,ready to connect
4225* (serialnumber)
2 Interface module IM 152
• PROFIBUS RS 485-IS
1 Blitzductor CT type MD HFD Ex 62 shielding clamps for the bus cable
919507* and919 583*919 508*
3 • 8 DI NAMUR 8 x Blitzductor CT Type MD/Ex 30 919 507* and 919 581*
4 • 4 DO 4 x Blitzductor CT Type MD/Ex 30 919 507* and 919 581*
5 • 4 AI I 2WIRE HART 4 x Blitzductor CT Type MD/Ex 30 919 507* and 919 581*
6 • 4 AI I 4WIRE HART 4 x Blitzductor CT Type MD/Ex 30 919 507* and 919 581*
7 • 4 AI RTD 4 x Blitzductor CT Type MD/Ex 30 919 507* and 919 581*
8 • 4 AI TC 4 x Blitzductor CT Type MD/Ex 30 919 507* and 919 581*
9 • 4 AO I HART 4 x Blitzductor CT Type MD/Ex 30 919 507* and 919 581*
* These components can be ordered directly from: DEHN +SÖHNE GmbH + Co. KGElektrotechnische FabrikHans-Dehn-Str. 1D-92318 Neumarktwww.dehn.de
Note
For all the other PROFIBUS-DP components outside the hazardous area, werecommend that you follow the instructions in the PROFIBUS SIMATIC NETmanual.
!Caution
If you use overvoltage protection devices, the equipotential bonding should beinstalled using a minimum cross section of 6 mm2.
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5.4.4 Rules for the Interfaces between Lightning Protection Zones1...2 and higher
Rules of interfaces 1 <–> 2 and higher (local equipotential bonding)
The following rules apply to lightning protection zone interfaces 1 <–> 2 andhigher:
• Implement local equipotential bonding at every other lightning protection zoneinterface.
• At all other lighting protection zone interfaces, include all lines (for example:metal pipes) in the local equipotential bonding circuit.
• Include all metal installations located within the lightning protection zone in thelocal equipotential bonding system (for example, metal parts within lightningprotection zone 2 at interface 1 <–> 2).
Additional Measures
We recommend additional protection
• For all lightning protection zone interfaces 1 <–> 2 and higher
• For all cables that run through a lightning protection zone and that are longerthan 100 m
Lightning Protection Elements for the 24 V DC Power Supply
!Danger
To protect the Power Supply PS module, the lightning protection element must beinstalled in an EEx d enclosure. The overload of the protective element is indicatedby a floating contact led out to the exterior.
Lightning Protection Element for Signal Modules
The protective devices have a shield connecting clamp and the input and output. Ifthe bus connection is looped through, two protective devices must be used per IMmodule. The overload of a lightning protection element is indicated by thepermanent short-circuit (fail-safe) between the signal cores.
Protective Elements for 1 <–> 2 and higher
When installing the ET 200iSP, zone transition 1 <–> 2 and higher is not normallyused. If required, consult the table above and discuss the required measures withyour Siemens representative.
Wiring
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5.4.5 Example of Protection from Overvoltage for NetworkedET 200iSP Stations
Wiring Example
The schematic below shows an example of how to wire two networked ET 200iSPstations to achieve effective protection from overvoltages:
PS IM EM
Lightning protection zone 0B, field side
Lightning protection zone 1
PA
PS IM EM
Lightning protection zone 1Enclosure EEx e Enclosure EEx e
PA
6 mm2
16 mm2
6 mm2
L+
PROFIBUS RS 485-IS
Inputs and outputs
Figure 5-4 Example of the Wiring of Networked ET 200iSP Stations
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Components for the Wiring Example
The following table explains the consecutive numbers in the wiring example.
Table 5-8 Example of a Lightning-Protected Configuration
Cons. no.from figure
Component Meaningfrom figure
(1) Surge arrestor for 24 V power supply,depending on the EEx d enclosure:1 xNetz-AK/1+1/ÜS/FM/Ex dserial no. 4225*
Protection from indirect lightning effects andovervoltages from interface 0B <–> 1onwards
(2) Surge arrestor for PROFIBUS RS 485-IS,depending on the looping
1 x Blitzductor CT Type MD HFD Ex 6Order no.: 919 507* and 919 583*
1 x Blitzductor CT Type MD HFD Ex 6Order no.: 919 507* and 919 583*
Protection from indirect lightning effects andovervoltages from interface 0B <–> 1onwards
(3) I/O surge arrester dependent on the numberof double cores used, 1 x 1 St. BlitzductorCT
Type MD/Ex 30Order no.: 919 507* and 919 581*
per double core
Protection from indirect lightning effects andovervoltages from interface 0B<–> 1onwards
(4) Shield clamp for bus cable via EMC springterminal on the face section of theBlitzductor CT
Order no.: 919 508*
Discharge of interference currents
(5) Equipotential bonding cable 16 mm2 Standardization of reference potentials
(6) Equipotential bonding conductor 6 mm Discharge of interference currents
* These components can be ordered directly from: DEHN +SÖHNE GmbH + Co. KGElektrotechnische FabrikHans-Dehn-Str. 1D-92318 Neumarktwww.dehn.de
Installation in potentially explosive areas
Surge arrestors operating in potentially explosive areas must be installed in anenclosure of the following type:
• Zone 1: type of protection EEx e (increased safety)
• Zone 2: minimum degree of protection IP 54 (with manufacturer declaration forZone 2)
• Zone 21: dust-proof (certified), minimum degree of protection IP 6x
• Zone 22: dust-proof (certified), minimum degree of protection IP 5x
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5.5 Wiring the ET 200iSP
5.5.1 Rules for Wiring the ET 200iSP
Safety information
!Danger
When laying cables and wiring, make sure that you adhere to the installationregulations in EN 60 079-14 and any regulations specific to your country.
When operating the ET 200iSP in combustible atmospheres developing as a resultof dust (Zone 21, Zone 22), you need to observe EN 50281-1-2 as well.
!Danger
The interconnection of an intrinsically safe sensor, actuator, or HART field devicewith the input/output of an electronic module must produce an intrinsically safecircuit! For this reason:
When you select the sensor, actuator, or HART field device to be connected to theelectronic module, the resulting safety-related values must be checked!
The inductance and capacitance of the cable must also be taken into account! Seechapter 3.5.
!Warning
If the wrong electronic module is used, or the wrong terminals are connected tothe sensor, actuator, or HART field device, the intrinsic safety is jeopardized:
Connect only EEx i circuits to the intrinsically safe inputs and outputs of theelectronic modules!
Check the wiring between the electronic modules and sensors, actuators, andHART field devices!
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Table 5-9 Rules for Wiring the ET 200iSP
Wiring Rules for... TM-PS-A TM-IM/EM,TM-EM/EM (spring
and screw terminal)
Connectable wire cross-sections for solid-core cables 0.5 to 4 mm2 0.14 to 2.5 mm
Connectable conductorcross-sections of flexiblecables
Without wire endferrule
0.5 to 2.5 mm2 0.14 to 2.5 mm
cablesWith wire end ferrule 0.5 to 2.5 mm2 0.14 to 1.5 mm
Number of conductors per terminal 1 conductor 1 or combination of 2wires up to 1.5 mm(total) in a commonwire-end ferrule
Length of insulation to be stripped 11 mm
Wire-end ferrules toDIN 46228
Without insulatingcollar
Design A, to 12 mmlength
Design A, up to 21 mmlong
With insulation collar0.25 to 1.5 mm
Design E, up to 12 mmlong
Design E, up to 12 mmlong
Tightening torque 0.5 – 0.7 N/m
5.5.2 Wiring a Terminal Module with Screw Terminals
Features
• When wiring terminal modules with screw terminals, the wires are secured inthe terminal by screwing down the terminal.
• Wire-end ferrules are not necessary.
Requirements
Keep to the wiring rules.
Required Tools
Screwdriver with 3.5 mm blade
Wiring a Terminal Module with Screw Terminals
1. Strip the cables.
2. Insert the wires into the terminal.
3. Tighten the screw. Result: The wire is clamped into the terminal module.
Wiring
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5.5.3 Wiring a Terminal Module with Spring Terminals
Features
When wiring terminal modules with spring terminals, the wires are secured in theterminal simply by inserting them into the terminal.
Requirements
Keep to the wiring rules.
Required Tools
Screwdriver with 3.5 mm blade
Wiring a Terminal Module with Spring Terminals
1. Strip the cables.
2. Insert the screwdriver into the upper (round) opening of the terminal and push itin.
3. Insert the wire as far as it will go into the lower (square) opening in the terminal.
4. Remove the screwdriver.
Insert the screwdriver
Insert the conductor into the springterminal up to its stop.
Remove the screwdriver; theconductor is firmly clamped in.
Figure 5-5 Wiring with Spring Terminals
Wiring
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5.5.4 Grounding the Mounting Rail
Features
The mounting rail of the distributed I/O station must be connected to the groundingbusbar PA.
Requirements
• Switch off the power supply before you start wiring.
• Terminating the grounding conductor to the EEx e grounding bolt of themounting rail.
• To avoid any interference, the cross-section of the grounding conductor for themounting rail must be greater than the cross-section of the grounding conductoron the terminal module TM-PS-A or TM-PS-B.
Required Tools
• 10 mm wrench
• Stripping tool
• Crimp tool
Grounding the Mounting Rail
1. Strip the grounding conductor. Attach an M6 (ring) cable lug to the groundingconductor. Note: Minimum cross-section of the grounding conduct: 4 mm2.
2. Terminate the grounding conductor at the grounding bolt (M6 nut, washer, andspring washer) located on the mounting rail on the left of the TM-PS-A.Tightening torque: 2 N/m to 2.5 N/m.
3. Terminate the other end to the grounding busbar PA.
Figure 5-6 Grounding the Mounting Rail
Wiring
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5.5.5 Wiring Terminal Module TM-PS-A
Safety information
!Danger
Do not put explosion protection to risk in the potentially explosive areasZone 1 and Zone 21:
In Zone 1/ Zone 21, always switch off power before you disconnect the powersupply cable on terminal module TM-PS-A or TM-PS-B. In Zone 21, you may onlyopen the ET 200iSP enclosure in the absence of explosive dust!
!Danger
Do not put explosion protection to risk in the potentially explosive areasZone 2 and Zone 22:
In Zone 2/ Zone 22, always switch off power before you disconnect the powersupply cable on terminal module TM-PS-A or TM-PS-B if there is any risk ofexplosion. If there is no risk of explosion, the power supply cables can be disconnected fromterminal module TM-PS-A or TM-PS-B in Zone 2/ Zone 22 while power is on.
Features
Connect the ET 200iSP power supply to the terminal module TM-PS-A.
Connect the power supply for redundancy to the terminal module TM-PS-B.
The active Power Supply PS supplies interface module IM 152 and all electronicmodules with the required voltage.
Requirements
• Wire the terminal module only after you switched off power.
• Observe the wiring rules.
Required Tools
• Screwdriver with 3.5 mm blade.
• Stripping tool
Wiring
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Wiring Terminal Modules TM-PS-A or TM-PS-B
1. Strip the cables of the ET 200iSP power supply.
2. Pull the slide down until it engages.
You can only pull down the slide if both retainer screws of the terminal moduleare screwed onto the mounting rail.
3. Tighten the various conductors using a 3.5 mm screwdriver.
Note
Minimum cross-section of the grounding conductor PA: 4 mm2. Connect the otherend of the grounding conductor to the grounding busbar PA.
4. Push the slider up until it automatically moves up.
Terminal module TM-PS-A
2L+MPA
3
4
Slider
Figure 5-7 Connecting the Power Supply and Grounding Conductor PA to the TM-PS-A.
Wiring
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5.5.6 Wiring Terminal Modules TM-IM/EM and TM-IM/IM
Connect the PROFIBUS RS 485-IS connector to terminal module TM-IM/EM. Theconnector is located on the left side of the module. Terminal module TM-IM/EMalso forms the interface to the actuators and sensors. The terminals are located onthe right side of the module.
Connect the bus connector for redundant operation of the two IM 152s to terminalmodule TM-IM/IM.
Properties
Zone 1 and Zone 21 requirements
Observe the following rules in Zone 1 and Zone 21:
1. Use the RS 485-IS coupler (the order number is found in appendix A).
2. To loop PROFIBUS RS 485-IS to the next ET 200iSP, use the PROFIBUSconnector RS 485-IS (order no. 6ES7 972-0DA60-0XA0). To loop the bus,connect the bus cable to the second cable outlet of the bus connector.
3. Terminate PROFIBUS RS 485-IS by means of the PROFIBUS connector RS485-IS. The PROFIBUS connector RS 485-IS (6ES7 972-0DA60-0XA0) isequipped with an integrated terminating resistor.
4. Use the bus cable specified in appendix A for PROFIBUS RS 485-IS and markthe bus cable as an ”EEx i bus cable”. If you use a color as the identifier, youmust select light blue.
5. The bus cable shielding must be connected to one of the following locationsproviding an absolutely safe grounding connection PA:
– Either at the transition of the bus cable from the safe area to the hazardousarea
– or in the safe area directly at the RS 485-IS coupler. In this case, the shieldmust be installed as an active intrinsically save circuit, i.e. the bus cableshielding must also be touch protected (IP 20.)
Zone 2 and Zone 22 requirements
Observe the following rules in Zone 2:
• See items 1 to 5: Zone 1 and Zone 21 requirements
Requirements for the Safe Area
• See points 1 to 4: Zone 1 and Zone 21 requirements
Wiring
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Wiring Terminal Module TM-IM/EM
Connecting PROFIBUS RS 485-IS (left module)
1. Insert the bus connector into the PROFIBUS RS 485-IS socket.
Note
The shielding of the bus cable is connected in the terminal module TM-IM/EM viaa spring contact to the mounting rail and therefore with the equipotential bondingPA.
2. Tighten the retainer screws of the bus connector using a 3.5 mm screwdriver(torque: 0.5 N/m to 0.7 N/m).
3. Mark the bus cable as ”EEx i bus cable”.
Terminal module TM-IM/EM
For terminalassignments, refer to chapter 9.3
Connector for IM 152:PROFIBUS RS 485-IS
Connector for the electronicmodule:channel 0 to 3, orchannel 0 to 7
Figure 5-8 Wiring Terminal Module TM-IM/EM (PROFIBUS RS 485-IS)
Note
The PROFIBUS RS 485-IS of ET 200iSP is intrinsically safe due to the integrationof the RS 485-IS coupler. The bus connector may thus be removed or inserted inrun in Zone 1 and Zone 2. In Zones 21 and 22, you may only open the ET 200iSPenclosure in the absence of explosive dust!
Connecting sensors and actuators (right-hand module)
See chapter 5.5.7.
Wiring
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Wiring Terminal Module TM-IM/IM
Close both bus connectors for the redundant IMs. This procedure is explained forthe TM-IM/EM in Connecting PROFIBUS RS 485-IS (Left Module). Repeat thesame steps for the right module.
Terminal module TM-IM/IM
For terminalassignments,refer to section 9.4
Connector for IM 152 (a):PROFIBUS RS 485-IS
Connector for IM 152 (b):PROFIBUS RS 485-IS
Figure 5-9 Wiring Terminal Module TM-IM/IM (PROFIBUS RS 485-IS)
Wiring
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5.5.7 Wiring Terminal Modules TM-EM/EM
Properties
Terminal module TM-E forms the interface to the actuators and sensors.
Requirements
• Observe the wiring rules.
Required Tools
Screwdriver with 3.5 mm blade
Figure Wiring Terminal Module TM-E
1. Strip the sensor / actuator cables.
2. Terminate the various wires in the screw or spring terminals.
Terminal module TM-EM/EM
For terminal assignmentsrefer to chapter 9.5
Connector for the electronic module:channel 0 to 3, orchannel 0 to 7
Connector for the electronicmodule:channel 0 to 3, orchannel 0 to 7
Figure 5-10 Wiring the Terminal module TM-EM/EM
Note
The inputs and outputs of the ET 200iSP distributed I/O device are intrinsicallysafe. Disconnecting wires to the sensors, actuators, and HART field devices onthe terminal module TM-EM/EM is permitted during operation in zone 1 andzone 2. In Zones 21 and 22, you may only open the ET 200iSP enclosure in theabsence of explosive dust!
Wiring
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5.5.8 Terminating the Cable Shielding
Features
Connect the shielding of the cables of analog electronic modules to the groundingbusbar PA of the enclosure.
Requirements
• Tinned or galvanized standard mounting rail to EN 50022 (35 x 15/ 35 x 7.5)and fastening accessories
• Shielding terminals (6ES7 728-8MA11)
• Installation of the grounding conductor on the standard mounting rail:
– Zone 1 and Zone 21: EEx e terminal. Use a Weidmüller terminal WP 16/E(see the order numbers in appendix A)
– Zone 2, Zone 22 or safe area: standard terminal
• Screwdriver with 4.5 mm blade
• Stripping tool
Terminating the Cable Shielding
The procedure below describes an example of shielding termination: You may alsouse the enclosure features to terminate the shielding.
1. Install the standard mounting rail in the cubicle below the ET 200iSP(clearance to ET 200iSP: approx. 40 mm.)
2. Strip the cable insulation in the area of the standard mounting rail(approx. 40 mm).
3. Attach the cable to the standard mounting rail by means of the shieldingterminal element (torque: 0.8 N/m to 1.2 N/m.) Make sure that the shieldingterminal element contacts only the cable shielding.
Wiring
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4. Repeat steps 2 and 3 if you want to terminate further cable shielding.
Equipotentialbusbar PA
Standard mountingrail for shieldingtermination
EEx e terminalShieldingterminals
Figure 5-11 Terminating the Cable Shielding
Connecting the standard mounting rail to the grounding busbar PA
1. Strip the grounding conductor (4 to 16 mm2) and terminate it on the groundingterminal of the standard mounting rail (torque: 2 to 2.5 N/m.)
2. Terminate the other end to the grounding busbar PA.
5.5.9 Connecting a TC Sensor Module
Properties
The TC sensor module can be used for the internal compensation of the referencejunction temperature. It is supplied with the 4AI TC.
Requirements
The TC sensor module can only be connected to terminal modules with screwterminals.
Required Tools
Screwdriver with 3.5 mm blade
Wiring
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How to Connect a TC Sensor Module
1. Insert the TC sensor module into the third terminal row of the terminal module:conductors in 3, 7, 11; pin in terminal 15.
2. Tighten the TC sensor module using a 3.5 mm screwdriver. Tighten the screwsof terminals 3, 7 and 11.
3 7 11
15
Figure 5-12 TC-Sensor Module
5.6 Inserting and Labeling the Power Supply, Interface Module, and
Electronic Modules
Features
• The modules are mounted onto the relevant terminal modules.
• Using a labeling strip, you can identify the interface module and the electronicmodules.
• When you first insert an interface or electronic module, the coding elementengages into the terminal module. This prevents the wrong module beinginserted.
The interface module and the electronic modules are self-coding.
Requirements
Keep to the insertion rules. See chapter 3.
Wiring
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Required Tools
Screwdriver with 4.5 mm blade
Installing the Power Supply PS
1. Hang the Power Supply into the top of the bearing of terminal module TM-PS-A.
2. Swivel the Power Supply down until it engages on the terminal module.
3. If your configuration has a power supply for redundancy, repeat steps 1 and 2on terminal module TM-PS-B.
1
2
Figure 5-13 Installing the Power Supply PS
!Danger
Risk of injury!Despite its extremely compact design, the Power Supply PS is nonetheless quiteheavy with a weight of 2.7 kg, i.e. make sure to keep a firm hold on it.
Removing the Power Supply PS
1. Using a 4.5 mm screwdriver, push the slider on the bottom of terminal moduleTM-PS-A or TM-PS-B down until it engages.
2. Swing the power supply out of the bearing of terminal module TM-PS-A orTM-PS-B.
!Caution
During operation, the temperature of the Power Supply PS enclosure may rise upto 90 ° C. There is a risk of burns!
Wiring
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Installing and Labeling Interface Modules and Electronic Modules
1. Hang the interface or electronic module into the bearing on top of the terminalmodule.
2. Swivel the interface or electronic module down until it engages on the terminalmodule.
3. Use the included labeling strips to identify the module.
4. Finally, reinsert the labeling strip in the interface or electronic module.
2
3
Figure 5-14 Installing and Labeling Interface Modules and Electronic Modules
!Warning
Ensure the correct assignment between the terminal and electronic module withrespect to their application.
Note
If any gaps (of an electronic module) develop due to the ET 200iSP configuration,the following rules apply:
• The gap is located at the last slot of ET 200iSP: Insert a slot cover or a reservemodule into this gap. See chapter 4.5.
• The gap is located at another slot (for electronic modules): Insert a reservemodule into this gap.
Wiring
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Removing Interface and Electronic Modules
1. Use a screwdriver to release the interlock on the bottom of the interface orelectronic module.
2. Swivel it up.
3. Take the module off the bearer of the terminal module.
2
3
1
Figure 5-15 Removing Interface and Electronic Modules
Replacing a Defective Interface or Electronics Module
You have already removed the interface or electronic module:
1. Remove the detachable part of the coding element from the new interface orelectronic module. The coding element is located on the bottom of the interfaceor electronic module.
2. Mount the new interface or electronic module (same type) onto the terminalmodule until you hear it lock in place.
3. Label the new interface or electronic module.
Note
Check the coding element before you install the new interface or electronicmodule.
Wiring
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Changing the Type of an Electronic Module
You have already removed the electronics module:
1. Push the coding element out of the terminal module using a screwdriver.
2. Insert these coding elements into the old electronic module.
3. Mount the new electronic module (of a different type) onto the terminal moduleuntil you hear it lock in place.
4. Label the new electronic module.
!Danger
If you make changes to the coding, this can lead to dangerous states in your plant.In this case, check your system and adapt it accordingly. Observe the safety dataof the electronic module.
Figure 5-16 Changing the Type of an Electronic Module
Wiring
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5.7 Setting the PROFIBUS address
Properties
With the PROFIBUS address, you specify the address at which the ET 200iSPdistributed I/O device will be accessed on PROFIBUS RS 485-IS.
Requirements
• The PROFIBUS DP address for the ET 200iSP is set on the interface moduleby means of DIL switches. The DIL switches are located on the front panel ofthe interface module, and are protected by a hinged cover.
• The permitted PROFIBUS DP addresses are 1 to 125.
• Each address can only be assigned once on PROFIBUS.
Required Tools
Screwdriver with 3.5 mm blade
Setting the PROFIBUS DP Address
1. Open the cover to the right.
2. Set the required PROFIBUS DP address at the DIL switches using ascrewdriver.
3. Close the cover again.
Wiring
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Changing the PROFIBUS address
1. Set PROFIBUS DP address ”0” at the DIL switches, using a screwdriver.
2. Cycle power off and on at the ET 200iSP Power Supply PS. The memory iscleared when the SF LED flashes (0.5 Hz, duration approx. 10 s).
ET 200iSP saves the parameters to retentive flash memory in IM 152. Whenyou first commission or modify the system, you should therefore delete theseparameters.
3. Now you can set the new PROFIBUS DP address at the DIL switches. Onceagain, cycle power off and on at the Power Supply PS.
64
32
16
8
4
21
ON
Interface module
OFF Example:
DP address =
64
+ 32
+ 2
+ 1
= 99
_______*
* reserved
Figure 5-17 Setting the PROFIBUS DP Address
Note
If you change the PROFIBUS DP address without previously deleting the retentiveparameters in the flash memory, ET 200iSP cannot log on to PROFIBUS DP withthe old or new address.
Wiring
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5.8 Inserting and Changing the SIMATIC Micro MemoryCard (MMC)
Features
• A SIMATIC Micro Memory Card (MMC) is used as memory module for IM 152.The MMC supports firmware updates.
• The useful life of an MMC is determined in particular by the following factors:
– The number of delete or programming cycles
– external influences such as the ambient temperature.
At an ambient temperature of up to 60° C, the life of an MMC is 10 years with amaximum of 100,000 delete/write cycles.
!Caution
Always ensure that the maximum number of delete/write cycles is not exceeded toprevent data loss.
Requirements
Memory modules available:
Table 5-10 Available MMCs
Type Order numbers
MMC 2M 6ES7 953-8LL00-0AA0
MMC 4M 6ES7 953-8LM00-0AA0
MMC 8M 6ES7 953-8LP10-0AA0
Wiring
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Inserting and changing the MMC
1. The MMC supports hot-swapping. The chamfered edge of the MMC preventsfaulty insertion and protects from polarity reversal.
IM 152 checks the MMC for the FW update only during startup. The insertion orremoval of an MMC while the power is on therefore does not take effect untilthe next time power is cycled at the Power Supply PS.
2. The module slot is equipped with an extractor which allows you to remove theMMC. Using a small screwdriver or a pen, press down the extractor and thenremove the card.
Micro
Mem
oryC
ard
Extractor
IM 152
MMCModule slot
Figure 5-18 Position of the MMC Slot on the IM 152
Reference
For information on firmware updates by means of MMC, refer to chapter 7.6.
Wiring
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6-1Distributed I/O device ET 200iSPA5E00247483-02
Commissioning and Diagnostics
Function Principle of Configuring
Operating and monitoringwith WinCC
Potentially explosivearea: Zone 1
Zone 0
ET 200iSP in enclosure
PCS 7-OS
Industrial Ethernet
Configuring andparameterassignment usingSTEP7
RS 485-IS coupler
PROFIBUS RS 485-IS
PROFIBUS DP
PC
mA
Configuringusing GSD file
Assigning parameterswith SIMATIC PDM
CFC
PCS 7 driver
CPU
S7-400
1 2 3
1 Cyclic data exchange
User data of inputs andoutputs / value status
2 Cyclic data exchange
Configuration
Parameters
Reeading identification data
Diagnostics interrupts (onlyS7 DP, DPV1)
3 Acyclic data exchange
Parameters
Reading and writingidentification data
HART accesses
Figure 6-1 Function Principle of Configuring
6
Commissioning and Diagnostics
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Configuring
Configuration involves configuring and setting parameters for the ET 200iSP usinga programming device (PG).
Configuring
When you configure your project, you set only the basic properties of the DP slave(for example, network parameters, module selection in HW Config). You configurethe ET 200iSP with
• STEP 7
• COM PROFIBUS or with suitable configuration software (using the GSD file).
Parameter assignment
During parameter assignment, you set the parameters for the ET 200iSP and theHART field devices.
• With STEP 7, you assign parameters for the ET 200iSP from HW Config.
• Outside STEP 7, you assign parameters for the ET 200iSP and the HART fielddevices using SIMATIC PDM. SIMATIC PDM must be installed as astand-alone version.
• All modules have basic parameter settings when they leave the factory (refer tothe parameter defaults.) After you turn on the power supply for the ET 200iSP,the modules are initially in a safe state:
– Digital inputs: Input values 0, value status 0
– Digital outputs: off current or voltage (no substitute values)
– Analog inputs: input value 7FFFH
– Analog outputs: off current or voltage (no substitute values)
– All parameters (that you can set with SIMATIC PDM): disabled
Once parameters are assigned correctly (using HW Config or SIMATICPDM), they are saved to non-volatile memory in the modules. Theseparameters are applied then next time you power up the Power Supply PS.
The parameters will be deleted from the non-volatile memory if you set thePROFIBUS address to ”0” and then switch the power supply off and on atPower Supply PS.
Cyclic data exchange via PROFIBUS DP
Data are exchanged between the CPU (for example, S7-400) and the ET 200iSP.
The cyclic user data of the inputs and outputs, including the value status of theinputs, are transferred.
For plant visualization, these data can be prepared by the PCS 7 driver and theCFC (Continuous Function Chart) on the CPU and then displayed on the OS withWinCC.
Commissioning and Diagnostics
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Acyclic data exchange via PROFIBUS DP
The ET 200iSP and the PG / PC (SIMATIC PDM) exchange data in acyclic mode.ET 200iSP receives its parameters using acyclic data exchange. Identification datais also transferred and indicated in SIMATIC PDM.
• Diagnostics and alarms (with S7 DP slave and DPV1 slave)
• Data records
DPV0, S7 DP, or DPV1 slave
The ET 200iSP can be operated as a DPV0, S7 DP, or DPV1 slave. The tablebelow shows a comparison of the functions.
Table 6-1 Comparison of DPV1, S7 DP and DPV0
Function DPV0slave
S7 DPslave
DPV1slave
Note
Parameter assignment and configuration withGSD file
X ––– X
Configuration and parameter assignment withHW Config
X1) X X1)
Cyclic data exchange X X X
Acyclic data exchange(read/write data record):
• Free access toparameters on the fielddevice
• Reassignment of
Class 1 services(parameterassignmentmaster, e.g.PLC)
––– X X
• Reassignment ofparameters of theapplication process
Class 2 services(e.g. PG/OP)
X X X
Diagnostics One interrupt can bereported per diagnostic• ID-specific diagnostics X X Xreported per diagnosticdatagram. For DPV1 and
• Module status X X Xdatagram. For DPV1 andS7 DP slaves, an interruptconsists of a slave• Channel-specific diagnostics X X Xconsists of a slavediagnostic accompanied by
Interruptsdiagnostic accompanied byan acknowledgmentmechanism not included in• Diagnostic interrupt ––– X2) Xmechanism not included inDPV0.
• Process alarm ––– X2) XDPV0.
• Remove/insert interrupt ––– X X
• Update interrupt ––– ––– X
• Time stamping ––– X X
1) If you are configuring the ET 200iSP using the GSD file (in HW Config), you will need SIMATIC PDM forparameter assignment.
2) For the S7 DP slave, diagnostic and process interrupts are only reported when the CPU is in RUN mode.
Commissioning and Diagnostics
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Software requirements
Table 6-2 Software requirements
Engineering softwareused
Version Notes
STEP 7 STEP 7 V5.3, Service Pack1 or higher, and current HWupdate
The ET 200iSP is availablein the hardware catalog ofHW Config. You configureand assign parameters forthe ET 200iSP in HWConfig.
STEP 7 and SIMATIC PDM(SIMATIC PDM is integrated;it is also available as astand-alone version)
STEP 7 V4.02 or higher You need the GSD file forthe ET 200iSP andconfigure with HW Config...it is also available as a
stand-alone version) SIMATIC PDM V6.0 orhigher
... and configure inSIMATIC PDM.
PCS 7 (includes, amongother things, STEP 7 andSIMATIC PDM)
V6.1 or higher See the PCS7documentation.
COM PROFIBUS andSIMATIC PDM (SIMATICPDM is integrated; it is alsoavailable as a stand-aloneversion)
COM PROFIBUS Version5.0 or higher
You need the GSD file forthe ET 200iSP andconfigure with COMPROFIBUS...
version)SIMATIC PDM V5.2 orhigher
... and configure inSIMATIC PDM.
Other configuration softwareand SIMATIC PDM(SIMATIC PDM is integrated;it is also available as astand-alone version)
Other engineering software(for information on versions,refer to vendors)
You need the GSD file of theET 200iSP and configurewith a suitable engineeringtool...
stand-alone version)SIMATIC PDM V5.2 orhigher
... and configure inSIMATIC PDM.
Note
If you are configuring the ET 200iSP in STEP 7 using the GSD file, you will needSIMATIC PDM for parameter assignment.
Commissioning and Diagnostics
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6.1 Configuring in STEP 7
Features
• ET 200iSP is included in the hardware catalog of STEP 7
• Diagnostic interrupts, process interrupts, remove/insert interrupts (S7-400 only)and time stamping are supported.
Requirements
The required software is installed on the PG/PC or PCS 7 ES.
Configuration and parameter assignment procedures
1. Start SIMATIC Manager.
2. Configure the ET 200iSP with HW Config.
– Create a new project.
– Drag-and-drop the modules from the hardware catalog to the configurationtable
3. Configure time stamping (option).
4. Double-click the first module of ET 200iSP in the configuration table and set itsparameters.
5. Configure all other modules of ET 200iSP.
6. Save the configuration, or download it to the DP master.
Commissioning and Diagnostics
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6.2 Configuring with GSD File and SIMATIC PDM
Features
ET 200iSP is integrated as a DPV0 or DPV1 slave.
Requirements
• The required software is installed on the PG/PC or PCS 7 ES.
• You need GSD file SI028110.GSG. You require the GSD file from the InternetURL http//www.ad.siemens.de/csi_e/gsd. The GSD file is integrated into the configuration software as described below:
Note
The GSD file for the ET 200iSP is based on Revision 4. Result: Not all parametersare available in COM PROFIBUS.
Make sure that your configuration tool supports GSD files with Revision 4 so thatall parameters will be available.
STEP 7 V4.02 or higher COM PROFIBUS Version 5.0 or higher
1. Start STEP 7, open HW Config, thenselect Options > Install new GSD file.
2. From the next dialog box, select theGSD file you want to install and confirm
1. Copy the GSD file from the ET 200iS tothe COM PROFIBUS directory:...COMPB5\GSD (default). Copy the bitmap file to the ...COMPB5\BITMAPS
2. From the next dialog box, select theGSD file you want to install and confirmwith OK.Result: The ET 200iSP appears in thePROFIBUS-DP directory of the
map file to the ...COMPB5\BITMAPSdirectory.
2. Start COM PROFIBUS, then select File> Read in GSD file.PROFIBUS-DP directory of the
hardware catalog.> Read in GSD file.Result: ET 200iSP appears in thehardware catalog during the slaveconfiguration.
• To work online with SIMATIC PDM, you require a PROFIBUS-DP interface,such as CP 5611 (6GK1 561-1AA00). The CP must be set to thePROFIBUS-DP interface (in SIMATIC Manager: Options > Set PG/PCinterface).
!Warning
If you are configuring with the GSD file and SIMATIC PDM, create your project intwo steps:
1. Step: Configuring by means of GSD file
2. Step: Assigning parameters with SIMATIC PDM
Always ensure that the configuration (1st step) is consistent to the parameterassignment in SIMATIC PDM (2nd step). The slot assignment of step 1 mustmatch the parameters generated in SIMATIC PDM in step 2.
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How to configure the system
STEP 7 V4.02 or higher COM PROFIBUS V5.0 or higher, or anyother engineering tool
1. Start SIMATIC Manager.
2. Integrate the GSD file into HW Config(see requirements).
1. Run COM PROFIBUS or theengineering tool.
2. Integrate the GSD file into COM2. Integrate the GSD file into HW Config
(see requirements).
3. Configure the ET 200iSP with HWConfig.
2. Integrate the GSD file into COMPROFIBUS or into the engineeringsoftware (see requirements).Config.
– Create a new project.
– Drag-and-drop the modules from the
software (see requirements).
3. Configure ET 200iSP using COMPROFIBUS or your engineering tool.
– Drag-and-drop the modules from thehardware catalog to theconfiguration table.
PROFIBUS or your engineering tool.
4. Save the configuration, or download it tothe DP master.configuration table.
4. Save the configuration, or download it tothe DP master.
How to assign parameters to the electronic modules
1. Start SIMATIC Manager.
2. Select the process devices network view as the default view with Options >Settings > View > Process network view.
3. Select File > New to create a new project. The ”New” dialog box opens. Enteryour project name, and confirm with ”OK.”
4. Next, select the Networks icon, then right-click and select Insert new object >PC and Insert new object > PROFIBUS DP network.
5. From the left-hand pane of the window, select the PC icon. An icon labeled DPInterface now appears in the right-hand pane of the window. Right-click thisicon, then select ”Object Properties.” From the dialog box, select ”PROFIBUSDP Networks” under networks. Confirm with ”OK”.
6. Now select the icon labeled ”PROFIBUS DP Network”, right-click and selectInsert new object > Remote I/O. On the next dialog box, enter:Name: Name of the ET 200iSP station (ET 200iSP, for example).Address: The PROFIBUS address you set at the interface module.Number of ”Remote I/O” objects: Number of ET 200iSP stations youconfigure. Confirm with ”OK.” Result: The ET 200iSP station is now shown on theright-hand pane of the window.
7. Select the remote I/O object (ET 200iSP) you created in the previous step, thenright-click and select Insert new object > Remote I/O module. On the nextdialog box, enter:Name: Name of the module (8 DI NAMUR, for example).Address: Slot of the first electronic module in the ET 200iSP station (4).Number of ”Remote I/O” objects: Number of electronic modules in theET 200iSP station.Confirm with ”OK.” Result: The electronic modules are now displayed on theright-hand pane of the window.
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8. Select the first remote I/O object (electronic module in the left pane of SIMATICManager), then right-click and select the Open Objects menu command. On thenext dialog dialog, ”SIMATIC PDM Select Device”, select SIEMENS >ET 200iSP > Modules, then confirm with ”OK.”
9. From the next dialog box, select ”Specialist” as the user and confirm with ”OK.”In this mode, you can assign parameters. Result: SIMATIC PDM is started.
10.Once SIMATIC PDM has started, select the relevant electronic module as the”module type.” Next, click in one of the gray fields to update the window. Result:The parameters and identification data of the electronics module are indicated.
11.Next, set the parameters of the electronic module. Select File > Save to saveyour changes, then select Device > Download to Device to download theparameters to the electronic module. Close SIMATIC PDM.
12.Follow the procedure described in items 8 through 11 for each of the ET 200iSPobjects (electronic modules).
How to program the interface module
1. Select the remote I/O object (ET 200iSP in the left pane of SIMATIC Manager),then right-click and select Open Objects. On the next dialog, ”SIMATIC PDMSelect Device”, select SIEMENS > ET 200iSP > Head-End, then confirm with”OK”.
2. From the next dialog box, select ”Specialist” as the user and confirm with ”OK.”In this mode, you can assign parameters. Result: SIMATIC PDM is started.
3. Now set the parameters of the interface module. Select File > Save to saveyour changes, then select Device > Download to Device to download theparameters to the interface module. Close SIMATIC PDM.
How to assign parameters to all modules of ET 200iSP
1. Select the remote I/O object (ET 200iSP in the left pane of SIMATIC Manager),then right-click and select Open Objects. On the next dialog, ”SIMATIC PDMSelect Device”, select SIEMENS > ET 200iSP > Head-End, then confirm with”OK”.
2. In the next dialog, select ”Specialist” as the user and confirm with ”OK.”
3. Upload all parameters of the modules by selecting File > Full upload toPG/PC.
4. Set the parameters for all required modules. From the left-hand pane of theSIMATIC PDM window, you can select all the modules of the ET 200iSP.
5. Select File > Save to save your changes and update the files.
6. Select Device > Full download to device to download all parameters to themodules. Close SIMATIC PDM.
Reference
For more information on assigning parameters, refer to the documentation andonline help for SIMATIC PDM.
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6.3 Commissioning and Startup of ET 200iSP
Safety information
Note
Always observe national regulations when you commission the system.
Note
Always observe the guidelines according to EN 60 079-17 when performingoperation checks. This standard also contains the directives of internationalstandard IEC 60 079-17.
Performing tests
Note
You must provide for the safety of your facility. Before a system undergoes finalcommissioning, you should perform a complete function test and the necessarysafety tests.
Incorporate foreseeable errors when planning the tests. This will enable you toavoid endangering persons or property during operation.
6.3.1 Requirements for Commissioning
Table 6-3 Requirements for Commissioning
Step Prior Activity See...
1 ET 200iSP is installed Chapter Installation
2 PROFIBUS address is set on the ET 200iSP Chapter Wiring
3 ET 200iSP is wired Chapter Wiring
4 Zone 1, Zone 21, Zone 2 and Zone 22:Additional check of the installation and wiring ofthe ET 200iSP, connections, enclosure, andsupply lines.
5 ET 200iSP is configured and the parameters areset
Chapter Commissioning anddiagnostics
6 Supply voltage for DP master is switched on Manual for DP master
7 DP master switched to RUN mode Manual for DP master
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6.3.2 Commissioning the ET 200iSP
Table 6-4 Commissioning the ET 200iSP
Step Procedure See ...
1 Switch on the power supply to ET 200iSP. Chapter Wiring
2 Observe the STATUS LEDs on the ET 200iSPand on the DP master.
• Chapter Commissioning anddiagnostics
• Manual for DP master
Note
ET 200iSP supports default startup mode.
In this case the following conditions apply:
• Parameters already transferred will be saved, and are used after you switch onthe Power Supply PS.
• You can configure the system based on the AKF (general identification formatto PROFIBUS standard.)
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6.3.3 Startup of ET 200iSP
”ON” LED is lit, and ”BF” LED flashes or ”BF”LED is lit (no DP master found)
DP slave receives configuration data fromthe DP master
DP slave sets outputs to ”0” and accepts theset PROFIBUS address
Switch on the supplyvoltage for the DP slave
Parameter ”Operation if presetconfigurationactual configuration”disabled
Configuration data correct
LED ”BF” is switched off, and the inputs areenabled. Outputs when DP master is in STOPmode: Substitute values; when DP master is inRUN mode; current output values; dataexchange is possible.
ET 200iSP is configured(last valid configuration)
Remedy: Alignment of online andoffline configuration data
yes
no
Figure 6-2 Startup of ET 200iSP
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6.3.4 Startup of ET 200iSP with IM 152 redundancy
Principle of operation
When redundancy is configured, the two inserted IM 152 modules start upindependently. Figure 6-3 illustrates the startup of the IM 152 (a). For the IM 152 (b), the followingflow chart applies with the designations reversed accordingly.
IM 152
(a)
ET 200iSP
IM 152
(b)
EM EM EM EMPowerSupply PS
TM-PS-A TM-IM/IM TM-EM/EM TM-EM/EM
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Has the IM 152 (b) already
received configuration data from the DP master, checked it against
the ET 200iSP configuration, and started to exchange
data with the DP master?
Switch on the supply voltagefor IM 152 (a)
The ”ON” and ”BF” LEDs illuminate
Redundancynot configured
IM 152 (a) checks whether it is
inserted on TM-IM/IM
IM 152 (a) receives all data ofthe ET 200iSP from the IM 152(b) (if available)- Actual configuration- PROFIBUS state- Pending interrupts- Time stamp messages
IM 152 (a) receivesthe configuration data fromthe associated DP master
IM 152 (a) receives theconfiguration data fromthe DP master
Do the configuration data agree
with those of theIM 152(b)?
”BF” LED is extinguished. IM 152 (a)is ready for data exchange and waitsin standby mode if a switchover isrequired
No
No
No Configuration data arerejected, error messagesent to DP master
Configurationdata agree with theactual configuration?
The ”BF” LED isextinguished; the ”ACT”LED illuminates. Dataexchange is possible
Yes
Yes
Yes
Yes
Adjust configuration data inthe DP master
Startup as inFigure 6-2
IM 152 (a) checkswhether the IM 152 (b)
is inserted Timesynchronization
No
Timesynchroni-zation
NoYes
Data are exchanged onlywith the EMs correspondingto the preset configuration(the IM 152 reports the EMsthat are different or missingin the identifier-relateddiagnostic data)
... Then the IM 152 (a) is theactive module
... Then the IM 152 (a) isthe passive module
All LEDs illuminate for a few seconds during internal tests
Figure 6-3 Startup of the ET 200iSP with IM 152 redundancy
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6.3.5 Start up for time synchronization / time stamping of signalchanges
Principle of operation
Clockin IM 152
is set?
Do the time stamp parameters match the configuration
available?
Redundancy?
Generate startup data:read the states of the configured digitalinputs;process interrupt sent to DP master sothat the message buffer will be read
Monitoring of configured digital inputs:if a change occurs, generation of themessage and entry in the messagebuffer
No
No
Yes
Yes
Startup of the ET 200iSP iscomplete.IM 152 is ready to exchange datawith the DP master.
If redundancy is configured, thepassive IM 152 always has an imageof the time stamp messages.
Redundancy?
Reading the time datagram
Setting the IM 152 clock
current time-of-day
Diagnosis of the time datagram:upon failure or if time differenceexceeds the tolerance range,generate a special message andentry in the message buffer
Clock in IM 152
Process interrupt sent to DP master so that the message buffer will be read
Error message sent to DPmaster;digital input signals will not betime stamped. This has no influence on”standard” data exchange withthe DP master.
Redundancy?
The time is set to01.01.1984; 00:00 h
Figure 6-4 Starting Up Time Synchronization / Time Stamping
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6.4 Assigning Parameters for the ET 200iSP duringOperation using SIMATIC PDM
Properties
• When you configure the system in SIMATIC PDM, you can edit moduleparameters in RUN. Each new parameter setting that is correct is accepted bythe module and saved to non-volatile memory.
• Faulty parameter will be ignored. In this case, the module retains its currentparameter status.
• If the modules are restarted (after turning the supply voltage of the ET 200iSPoff –––> on), the current parameter assignment in the non-volatile memory ofthe modules is applied (SF LED of the modules is off).
• The parameter assignment in the non-volatile memory of the modules is appliedregardless of the communication between the ET 200iSP and the DP master.
• The outputs of the modules are controlled by the class 1 DP master.
Requirements
SIMATIC PDM Version 6.0 or higher (integrated or stand-alone version)
Procedure for Reassigning Parameters
1. Run SIMATIC PDM.
2. Open the project.
3. Change the view in SIMATIC Manager: select View > Process Network View.
4. From the left-hand pane of the window, select the required ET 200iSP module.Right-click the module, then select Open Objects from the menu. Result:SIMATIC PDM is started.
5. Upload the parameters and/or I&M of the module to the PG/PC.
6. Edit the parameters and/or the I&M.
7. Save the changes, then download the parameters and/ or identification data tothe module.
8. Check: Upload the parameters and/or identification data of the module to thePG/PC once again and check that the new parameter settings.
Reference
For more information on parameter assignment, refer to the documentation andonline help for SIMATIC PDM.
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6.5 Diagnostics by Means of the Process Input Image
Features
In addition to the diagnostic information provided by the LED and module/DPdiagnostics, the module also provides information about the validity of every inputsignal, i.e., the value status. The value status is entered in the process imagealong with the input signal.
Value Status of the Digital Input Modules
The value status is additional binary information of a digital input signal. The valuestatus is entered in the process image input table at the same time as the processsignal and provides information on the validity of the input signal.
The value status is influenced by the functions wire break/short-circuit detection,flutter monitoring, pulse stretching and plausibility check of changeover contacts.
• S7 format with value status
– Input signal is valid ”1B”
– Input signal is invalid ”0B”
Value Status of the Analog Input Modules
The input values of the analog input modules are written to the PII. If a measuredvalue is invalid, the following value status is entered as the input value:
• S7 format
– Input signal is valid No value status
– Input signal is invalid ”7FFFH” (bits 0 to 15 of the analog value)
Assignment of Inputs and Value Status in the PII
Each channel of the module is assigned a value status in the PII. For informationon this assignment, refer to Chapter D.
Evaluation of the Value Status in PCS 7
The value status is evaluated using the PCS 7 channel driver.
1. The PCS 7 channel driver reads the value status from the PII...
2. ...and forms the quality code for PCS 7.
Reference
For a detailed information on evaluating and processing the respective inputsignals, refer to the PCS 7 documentation.
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6.6 Status and Error LEDs on the ET 200iSP
IM 152 Interface Module
SFBF
PS1PS2
Group fault (red)Bus error (red)
Power supply (green)Power Supply PS 1 status (green, right-hand PS)
ACTON
Active IM in redundant system (yellow)
Power Supply PS 2 status (green, left-hand PS)
Figure 6-5 LED Display on IM 152 Interface Module
Status and Error LEDs on the IM 152
• LED PS1: a ––> power supply is switched on at Power Supply 1
• LED PS2: ON ––> For Power Supply PS when redundancy is configured:power supply is switched on at Power Supply 2
Table 6-5 Status and Error LEDs on the IM 152
LEDs Meaning Remedy
SF BF ACT ON
off off off off No voltage.
Defective Power Supply PS orIM 152.
Switch on the power at the PowerSupply PS.
Replace the Power Supply PS orIM 152.
on on on on Hardware test after power on. –––
off off * on Data exchange between theET 200iSP and the DP master.
Preset and actual configurationare consistent, no diagnostics.
–––
on off * on Data exchange between theET 200iSP and the DP master, atleast one diagnostic event and/orone inconsistency in the presetand actual configuration ispresent.
Check the process wiring.
Check the electronic modules.
Check the preset and actualconfiguration (wrong or missingmodule).
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Table 6-5 Status and Error LEDs on the IM 152, continued
LEDs RemedyMeaning
SF
RemedyMeaning
ONACTBF
* on * on No connection with the DP master(transmission rate detection).
Cause:
PROFIBUS DP communication isdown.
Check the bus installation (correctseating of the bus connector).
Check the terminating resistor andthe RS 485-IS coupler.
* flashes * on IM 152 is not configured properly -no data exchange is occurringbetween the DP master and theET 200iSP.
Causes:
wrong PROFIBUS DP address.
Inconsistent preset and actualconfiguration.
Disturbance on PROFIBUS DP.
Check the configuration(PROFIBUS DP address).
Check the preset and actualconfiguration (wrong or missingmodule).
Check the bus configuration (busconnector, terminating resistor,RS 485-IS coupler).
on off * on Illegal PROFIBUS DP address.
Causes:
PROFIBUS DP address 126 or127 is set.
PROFIBUS DP address waschanged without having deletedretentive data.
Assign IM 152 a valid PROFIBUSDP address.
After you change the PROFIBUSDP address, always delete theretentive data.
on on * off Deleting retentive data (power onwith PROFIBUS DP address ”0”,no MMC found).
–––
off flashesat 0.5 Hz
* off Retentive data are deleted, switchoff power.
Set the required PROFIBUS DPaddress before you power on thesystem.
on on * off Operating system update withMMC is busy.
–––
off flashesat 0.5 Hz
* off Operating system update MMCcompleted, remove the MMC andshut down.
–––
on flashesat 0.5 Hz
* off Error when updating the operatingsystem with MMC (incompatibleOS or wrong MMC, for example).
Use a compatible operatingsystem. Do not remove the MMCduring the update.
on flashesat 0.5 Hz
* off Internal error when updating theoperating system with MMC.
Repeat the update operation. Theinternal memory is defective if theLEDs show the same errorpattern.
* off on on The IM 152 is exchanging datawith the DP master and theelectronic modules of theET 200iSP. If redundancy is configured, thisIM 152 is the active interfacemodule of the ET 200iSP.
–––
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Table 6-5 Status and Error LEDs on the IM 152, continued
LEDs RemedyMeaning
SF
RemedyMeaning
ONACTBF
* off off on The IM 152 is receiving power. Ifredundancy is configured, thisIM 152 is the passive interfacemodule, that is, no data areexchanged with the electronicmodules.
–––
flashesat 0.5 Hz**
off off on If redundancy is configured, thisIM 152 is the passive interfacemodule and is not ready for abumpless switchover (forexample, the particular CPU is inSTOP mode).
Bring the H-system to theredundant state.
* irrelevant** After the transition to redundant operation, the SF LED continues to flash for another 20 s.
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Digital Electronic Modules
SF Group fault (red)
15
9133711
15
I/O status (green)
Input status (green)
Figure 6-6 LED Displays on the Digital Electronic Modules
Status and Error LEDs on the Digital Electronic Modules
Table 6-6 Status and Error LEDs on the Digital Electronic Modules
LEDs Meaning Remedy
SF 1 5 9 13 3 7 11 15
on Wrong module present or adiagnostic message is queued.
Evaluate thediagnosticinformation.
on Input DI0 or counter output 1 oroutput DO0 enabled
on Input DI1 or counter output 2 oroutput DO1 enabled
on Input DI2 or GATE 1 or output DO2 enabled
on Input DI3 or GATE 2 or output DO3 enabled
on Input DI4 or Reset counter 1 enabled
on Input DI5 or Reset counter 2 enabled
on Input DI6 or Reset output 1 enabled
on Input DI7 or Reset output 2 enabled
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Analog Electronic Modules
SF Group fault (red)
Figure 6-7 LED Displays on the Analog Electronic Modules
Status and Error LEDs on the Analog Electronic Modules
Table 6-7 Status and Error LEDs on the Analog Electronic Modules
LEDs Meaning Remedy
SF
on Wrong module present or adiagnostic message is queued.
Evaluate the diagnostic information.
6.7 Diagnostics in STEP 7
6.7.1 Introduction
Introduction
The slave diagnostics function is compliant with IEC 61784-1:2002 Ed1 CP 3/1.Depending on the DP master, diagnostic information can be read out for all DPslaves that comply with the standard using STEP 7.
The reading out and structure of the slave diagnostics is described in the followingsections.
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6.7.2 Reading Diagnostics Data
Options of reading diagnostic data
Table 6-8 Reading Diagnostics Data Using STEP 7
Automationsystem withDP master
Block or tab in STEP 7 Application See .
SIMATIC S7 ”DP Slave Diagnostics”tab
Slave diagnostics in plaintext on the STEP 7 userinterface
”Hardware Diagnostics” in theSTEP 7 online help
SFC 13 ”DPNRM_DG” Reading out slavediagnostics (store in dataarea of the user program)
For information on the structure,refer to the Structure of SlaveDiagnostics section; forinformation on SFCs, refer to theSFC59 ”RD_REC” Reading out data records
(DS0/1) of the S7diagnostics (store in thedata area of the userprogram)
Diagnostics section; forinformation on SFCs, refer to theSystem and Standard Functionsreference manual.
Example of Reading Out S7 Diagnostics with SFC 13 ”DPNRM _DG”
Here, you will find an example of how you can read out the slave diagnostics for aDP slave in the STEP 7 user program using SFC 13.
Assumptions
For this STEP 7 user program, the following is assumed:
• The diagnostic address of the ET 200iSP is 1022 (3FEH).
• The slave diagnostics are stored in DB 82: starting at address 0.0, length 96bytes.
• The slave diagnostic information consists of 96 bytes.
STEP 7-user program
STL Explanation
Call SFC 13REQ :=TRUELADDR :=W#16#3FERET_VAL :=MW 0RECORD :=P#DB82.DBX 0.0 BYTE 96BUSY :=M2.0
Read requestDiagnostics address of ET 200iSPRET_VAL of SFC 13Data record for the diagnosticinformation in DB82Read operation runs over several OB1cycles
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6.7.3 Diagnostic Messages of the Electronics Modules
Introduction
You can configure diagnostics message for the following modules:
• Digital Input Modules
• Digital Output Modules
• Analog Input Modules
• Analog Output Modules
Digital Input Modules
Table 6-9 Digital Input Modules
Diagnostic Message Applicability Programmable
Short-circuit Channel Yes
Wire break Channel Yes
Error Module No
Parameter assignment error Module No
External fault Channel No
Digital Output Modules
Table 6-10 Digital Output Modules
Diagnostic Message Applicability Programmable
Short-circuit Channel Yes
Wire break Channel Yes
Error Module No
Parameter assignment error Module No
Actuator shutdown Channel Yes1)
1) Enable shutdown of actuators by means of the group diagnostics parameter
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Analog Input Modules
Table 6-11 Analog Input Modules
Diagnostic Message Applicability Programmable
Short-circuit1) Channel Yes
Wire break Channel Yes
Value exceeded high limit of measuring range Channel Yes
Value exceeded low limit of measuring range Channel Yes
Error Module No
Parameter assignment error Module No
Reference channel error Module No
1) Not supported by 4 AI TC and 4 AI I 4WIRE HART
Analog Output Modules
Table 6-12 Analog Output Modules
Diagnostics message1) Applicability Programmable
Short-circuit Channel Yes
Wire break Channel Yes
Error Module No
Parameter assignment error Module No
1) Diagnostics message only with currents > 1 mA.
Actions Following a Diagnostic Message in STEP 7 or DPV1 mode
Every diagnostic message leads to the following actions:
• In S7 or DPV1 mode, diagnostics are reported as diagnostic interrupts.
• In DPV1 mode, diagnostics are also reported when the CPU is in STOP mode.
• A diagnostic message is
– written to the diagnostics datagram as diagnostics interrupt block (only oneinterrupt)
– written to the diagnostics buffer of the CPU
– written to channel-specific diagnostics data.
• The SF LED on the IM 152 is lit.
• OB82 is called. If OB82 is not found, the CPU changes to STOP mode.
• Acknowledgment of the diagnostic interrupt (following this a new interrupt ispossible).
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Actions Following a Diagnostic Message in DPV0 Mode
The error is entered in the channel-related diagnostic information in the diagnosticframe:
• The SF LED on the IM 152 is lit.
• There can be more than one diagnostic message at the same time.
Causes of Errors and Remedies
The causes of errors and corrective actions for diagnostic messages are describedin Section 6.7.11.
6.7.4 Evaluating Interrupts of the ET 200iSP (S7 DP Slave/ DPV1Slave)
Introduction
Interrupts are triggered by the DP slave when certain errors occur. Interruptevaluation differs depending on the DP master used.
Evaluating Interrupts with an S7 DP Master or DPV1 Master
Requirement: You have configured the ET 200iSP with STEP 7 (Version 5.3Service Pack 1 or higher), i.e., interrupts are only supported if you integrate theET 200iSP as an S7-DP slave or DPV1 slave.
In the event of an interrupt, interrupt OBs are automatically executed in the CPU ofthe DP master (see the System Software for S7-300/S7-400, Program Designprogramming manual).
Evaluating Interrupts with a Different DP Master
If you operate ET 200iSP with a different DP master or as a DP standard slave, nointerrupts are generated.
Triggering a Diagnostic Interrupt
When an event (for example wire break) enters all leaves the state, the moduletriggers a diagnostic interrupt if ”Enable: Diagnostic interrupt” is set.
The CPU interrupts execution of the user program and runs the diagnostic blockOB82. The event that led to the interrupt been triggered is entered in the startupinformation of OB82.
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Triggering a Process Interrupt
When the CPU receives a process alarm, it interrupts execution of the userprogram and executes process alarm block OB40.
The channel of the module that triggered the process alarm is entered in thestartup information of OB40 in the OB40_POINT_ADDR tag. The schematic belowshows the assignment of local data double word 8 to the bits.
• Analog input modules
LB 8
31 30 29 28 27 26 25 24
LB 9
19 18 17 16
LB 11LB 10
01 1 1 1
1 Bit no.
LD 8
Violation of the lo limit at channel 0
Violation of the hi limit at channel 0Violation of the hi limit at channel 1
Violation of the lo limit at channel 1Violation of the lo limit at channel 2
Violation of the lo limit at channel 3
11
Violation of the hi limit at channel 2Violation of the hi limit at channel 3
11
Figure 6-8 Interrupts from Analog Input Modules
Note
You will find a description of OB40 in the System and Standard Functionsreference manual.
Triggering of a Remove/Insert Interrupt
Remove/insert interrupts are supported only for the S7-400 and in DPV1 mode.
The CPU (S7-400) interrupts execution of the user program and runs diagnosticblock OB83. The event that led to the interrupt been triggered is entered in thestartup information of OB83.
Triggering an Update Interrupt
Update interrupts are supported only in DPV1 mode.
The CPU interrupts execution of the user program and runs the diagnostic blockOB56. The event that led to the interrupt been triggered is entered in the startupinformation of OB56.
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6.7.5 Structure of the Slave Diagnostics
Structure of Slave Diagnostics
Byte 0Byte 1Byte 2
Byte 3
Byte 4Byte 5
Byte 6
Byte 11
Byte 12
Byte 24
Byte 25
up tomax.byte 95
Station status 1 to 3 (see Section 6.7.6)
Manufacturer’s ID (see Section 6.7.8)
High byte
Low byte
Master PROFIBUS address (see Section 6.7.7)
Identifier-related diagnostic data1)
(see Section 6.7.8)
Module status1)
(see Section 6.7.9)
Channel-specificdiagnostics (3 bytes per channel)1)
(see Section 6.7.11)
(only 1 interrupt per slave diagnostics frame is possible)(see Section 6.7.13)
2) Interrupts are only supported if you configure the ET 200iSP as an S7 DP or DPV1 slave using STEP 7.
Interrupts2)max. 48 bytes
DPV0 S7 DP DPV1
1) If you use the GSD file to configure your system, you can deselect these diagnostics functions.
Byte zMax. of 6 bytes H-status only with the S7-400H and standard
redundancy (see Section 6.7.12)
Figure 6-9 Structure of Slave Diagnostics
6.7.6 Station Status 1 to 3
Definition
Station status 1 to 3 provides an overview of the status of a DP slave.
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Station Status 1
Table 6-13 Structure of Station Status 1 (byte 0)
Bit Meaning Cause / Remedy
0 1: The DP slave cannot beaddressed by the DP master. Thebit is always ”0” in the DP slave.
• Correct PROFIBUS address set onthe DP slave?
• Is the bus connector plugged in?
• Voltage at DP slave?
• RS 485 repeater set correctly?
• Has there been a RESET on the DPslave (off/on)?
1 1: The DP slave is not yet ready fordata exchange.
• Wait while the DP slave starts up.
2 1: The configuration data sent bythe DP master to the DP slave doesnot match the configuration of theDP slave.
The DP slave is okay, but the preset andactual slave configurations areinconsistent. Compare the preset andactual configurations.
Note:
If the last slot is not used, install the slotcover. The cover is available in the bustermination module.
3 1: External diagnostic informationexists.
Evaluate the channel-related diagnosticinformation, the module status and/orthe channel-related diagnosticinformation. As soon as all errors havebeen eliminated, bit 3 will be reset. Thebit will be set again when there is a newdiagnostic message in the bytes of thediagnostic information.
4 1: The requested function is notsupported by the DP slave (for example, changing thePROFIBUS address using thesoftware).
Check the configuration.
5 1: The DP master cannot interpretthe response from the DP slave.
Check the bus configuration.
6 1: Faulty DP parameter assignmentframe (incorrect slave type orparameter)
Correct the preset and actualconfigurations.
7 1: Parameters have been assignedto the DP slave by a different DPmaster (not the one that currentlyhas access to the DP slave).
The bit is always 1 if, for example, youare currently accessing the DP slavewith the programming device or adifferent DP master.
The PROFIBUS address of the DPmaster that assigned parameters for theDP slave is located in the ”masterPROFIBUS address” diagnostic byte.
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Station Status 2
Table 6-14 Structure of Station Status 2 (byte 1)
Bit Meaning
0 1: Parameters have to be reassigned to the DP slave.
1 1: A diagnostic message exists. The DP slave will not work until the fault hasbeen corrected (static diagnostic message).
2 1: The bit is always set to ”1” in the DP slave.
3 1: Response monitoring has been enabled for this DP slave.
4 1: The DP slave has received the ”FREEZE” control command.
5 1: The DP slave has received the ”SYNC” control command.
6 0: Bit is always ”0”.
7 1: Bit is always ”0”. Note: When reading the station status from the DP master,the bit is ”1” if the DP slave was disabled in the DP master, i.e., it is excludedfrom the current execution.
Station Status 3
Table 6-15 Structure of Station Status 3 (byte 2)
Bit Meaning
0 to 6 0: Bits are always ”0”.
7 1: There are more channel-related diagnostic messages than can be shown inthe diagnostic frame
6.7.7 Master PROFIBUS address
Definition
The master PROFIBUS address diagnostic byte contains the PROFIBUS addressof the DP master that:
• Assigned parameters for the DP slave and
• Has read and write access to the DP slave
The master PROFIBUS address is in byte 3 of the slave diagnostics.
DP Slave not Assigned Parameters by the DP Master (Class 1)
If byte 3 contains the value FFH as the master PROFIBUS address, the DP slavewas not assigned parameters by the DP master.
No cyclic data exchange.
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6.7.8 Manufacturer’s ID
Definition
The manufacturer’s ID contains a code that describes the type of the DP slave.
Manufacturer’s ID
Table 6-16 Structure of the Vendor ID
Byte 4 Byte 5 Vendor ID for
81 10 IM 152
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6.7.9 ID-related Diagnostics
Evaluation of the Slave Diagnostics
The figure below shows a systematic approach to evaluating slave diagnostics.Start with ID-specific diagnostics.
7 Bit no.
Byte 6
6
0 1 See Section 6.7.9
Identifier-related diagnostics, see Figure 6-11 (byte 6)
1 0 See Section 6.7.11
0 0
7 Bit no.Byte 13/x+1
Module status, see Figure 6-12 (byte 13); interrupts, see Figure 6-15 (x+1)
1 See Section 6.7.10
0 See Section 6.7.13
Figure 6-10 Evaluation of the Slave Diagnostics
Definition
The ID-related diagnostic information indicates whether any modules of theET 200iSP are faulty or not. ID-related diagnostic information starts at byte 6 andcomprises 6 bytes.
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Identifier-Related Diagnostics
The ID-related diagnostic information for the ET 200iSP has the followingstructure:
0 1 0 0 0 1 1 07 0
7 6 5 4 3 2 1 0
16 15 14 13 12 11 10 9
8 7 6 5 4 2
24 23 22 21 20 19 18 17
32 31 30 29 28 27 26 2535 34 33
Bit no.Byte 6
Length of the identifier-related diagnostics including byte 6 (= 6 bytes)
Code for ID-related diagnostics
Byte 7Byte 8Byte 9Byte 10Byte 11
Entries for IM 152 on slot 2, and modules on slots 4 to 8
Entries for modules on slot 9 to 16Entries for modules on slot 17 to 24Entries for modules on slot 25 to 32Entries for modules on slot 33 to 35
Legend of the entry for modules on slot x:
The bit is set when- a module is removed- a module is inserted that was not configured- an inserted module cannot be accessed- a module reports a diagnostics eventNon-existing slots are assigned a ”0” value by default.
Figure 6-11 Structure of the ID-Related Diagnostic Information for ET 200iSP
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6.7.10 Module Status
Definition
The module status functions returns the status of the configured modules andshows details of ID-related diagnostics with respect to the configuration or moduleerrors. The module status starts after the ID-related diagnostics and comprises 13bytes.
Module Status
The module status for ET 200iSP is structured as follows:
7 6 5 4 3 2 1 0
0 0 0 0 1 1 0 1
7 6 5 4 3 2 1 0
1 0 0 0 0 0 1 0
7 6 5 4 3 2 1 0
Byte 12
Byte 13
Byte 14
Byte 15
Byte 16Byte 17
0H
0H
8 7 6 512 11 10 916 15 14 1320 19 18 1724 23 22 2128 27 26 25
32 31 30 29 35 34 33
Slot 44
Byte 19
Byte 20
Byte 22
Byte 18
Byte 24
Byte 23
Byte 21
Code for device-specific diagnostics
Length of the module status including byte 12 (= 13 bytes)
Bit no.
Bit no.
Status type: ModuleStatus
7 0
Code for status message
2H = module status
Always ”0”
Always ”0”
Slots 5 to 8Slots 9 to 12Slots 13 to 16Slots 17 to 20Slots 21 to 24Slots 25 to 28
Slots 29 to 32
Bit no.
Slots 33 to 35
00B: Module OK; valid data01B: Module error; invalid data10B: Wrong module; invalid data11B: No module found (or module failure); invalid data
Legend of the entry for module status on slot x:
Example: Slot 35 1 0
5 4 Bit no.
10B: Wrong module; invalid data
Figure 6-12 Module Status
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6.7.11 Channel-Specific Diagnostics
Definition
Channel-specific diagnostics provides information about channel errors ofmodules and provides details of the ID-related diagnostics.
For each channel-specific diagnostic information, 3 bytes are added as perIEC 61784-1:2002 Ed1 CP 3/1.
Channel-specific diagnostics starts after the module status.
Channel-related diagnostics does not influence the module status.
Important: Group diagnostics must be activated for each module.
Channel-specific diagnostics
The maximum amount of channel-specific diagnostic information is limited by themaximum total length of the slave diagnostic information (i.e., 96 bytes) for theIM 152. The length of the slave diagnostic information depends on the amount ofchannel-specific diagnostic information currently pending. If the channel-specificdiagnostic information exceeds the amount that can be represented in the slavediagnostic information, bit 7 ”diagnostics overflow” is set in station status 3.
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7 6 5 4 3 2 1 0
1 0Byte x
Code for channel-specific diagnostics (for 00B, see Figure 6-15)
000001B to 100010B: ID number of the module
Bit no.
7 6 5 4 3 2 1 0
Byte x+1
Input/Output:
00000B to 11111B: Number of the channel orchannel group providing the diagnostics data
Bit no.
7 6 5 4 3 2 1 0
Channel type
Error type as defined in thePROFIBUS standard
Bit no.
starts atbyte 25*
Example: Slot 4 has the ID number 3;
01B: Input 10B: Output 11B: Input/Output
Byte x+2
001B: Bit010B: 2 bits011B: 4 bits100B: Byte101B: Word110B: 2 words
Byte x+3up to x+5
Next channel-specific diagnostics message(assignment as bytes 25 to 27)
max. byte 95 with IM 152
Slot 5 has the ID number 4 etc.
which provides the channel-specific diagnostics data.
* without deselection of diagnostics in the configuration
Figure 6-13 Structure of Channel-Specific D iagnostics
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Types of Error of the Electronic Modules
Table 6-17 Types of error of the electronic modules
Error type Error text Meaning Remedy
00001B 1D Short-circuit • Encoder cableshort-circuited to Ppotential
• Encoder cableshort-circuited to Mpotential
• Output cable short-circuitedto P potential
• Output cable short-circuitedto M potential
Correct the process wiring
Defective encoder Replace the encoder
Incorrect encoder typeassigned
Correct the parameterassignment
Output overload Eliminate overload
00010B 2D Undervoltage(HARTdiagnostics)
HART analog output current isdefined (HART diagnostics)
–––
00100B 4D Overload (HARTdiagnostics)
HART analog output current issaturated (HART diagnostics)
–––
00110B 6D Wire break • Break on the signal line toan encoder
• Break on the signal linefrom an actuator
• Break on the encoderpower supply cable
Correct the process wiring
Fault on the external circuit(resistor)
Eliminate the problem
Defective encoder Replace the encoder
Incorrect encoder typeassigned
Correct the parameterassignment
Input/output channel is unused(open)
Deactivate the ”groupdiagnostics” parameter forthis output channel
Load impedance too high Use an actuator with a lowerload impedance
00111B 7D Violation of hi limit The value is above theovershoot range
• Correct themodule/actuator tuning
• Change the measuringrange in the parameterassignment
01000B 8D Violation of lo limit The value is below theundershoot range
• Correct themodule/actuator tuning
• Change the measuringrange in the parameterassignment
01001B 9D Error Encoder signal flutters Eliminate the cause of error01001B 9D Error
Hardware fault on the module Replace the module
EMC interference Eliminate the cause of error
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Table 6-17 Types of error of the electronic modules, continued
Error type RemedyMeaningError text
10000B 16D Parameterassignment error
Faulty parameters Correct the parameterassignment
10001B 17D Sensor or loadvoltage missing
• Power Supply PS voltage ismissing or too low
• Power Supply PS is faulty
• Check the power supplyon the Power Supply PS
• Replace the PowerSupply PS
10011B 19D HARTcommunicationerror (HARTdiagnostics)
• HART field device does notrespond
• Timing fault
• Check the process wiring
• Correct the parametersettings
10101B 21D Reference channelerror
• Internal reference junction:TC sensor moduledefective or not present
• Remote reference junction(RTD): The parameterassignment does not pointto the RTD module
• Replace or connect theTC sensor module
• Correct the parameterassignment
10110B 22D Additional HARTstatus available(HART warning)
––– –––
10111B 23D reserved for HART(HART warning)
––– –––
11000B 24D Actuatordisconnection
Intrinsically safe switchingsignal active at 4 DO
–––
11010B 26D External fault • Encoder fault
• Faulty encoder powersupply
• Changeover contact fault
• Actuator fault
• Error in the HART fielddevice
• MMC error
• Replace theencoder/actuator/HARTfield device/MMC
• Correct the process wiring
11011B 27D HARTconfigurationchanged (HARTwarning)
––– –––
11101B 29D HART primaryvariable outsidethe limits (HARTdiagnostics)
––– –––
11110B 30D HART secondaryvariable outsidethe limits (HARTdiagnostics)
––– –––
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6.7.12 H-Status (Only with the S7-400H and Standard Redundancy)
The IM 152 supplies the H-status only if it is running on an S7-400H DP master oris operated redundantly according to the standard.
In the structure of the slave diagnostics, the H-status is represented by anadditional block, typically following the manufacturer’s ID.
Byte z
Byte z+1
Byte z+2
7 00H
Byte z+3
Always ”0”
7 0123456
00 0 000 0 1
Length of the H-status including byte x (= 8 bytes)
Code for device-specific diagnostics
7 01
1EH = Parameter assignment status (switchover by DP master)1FH = H-status
Code for status message
Byte z+4Not applicableNot applicable
Byte z+5 H-status of the IM 152 that is sending the status
7 0123456
0 0 0
Disabled
Hardware defectEnabled
IM 152 is exchanging dataMaster-State-Clear
Byte z+6 H-status of the other IM 152
7 0123456
0 0 0
Disabled
Hardware defectEnabled
IM 152 is exchanging dataMaster-State-Clear
Byte z+7 0H Always ”0”
Figure 6-14 Structure of the H-Status of the IM 152 (for S7-400H only)
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6.7.13 Interrupts
Definition
The interrupt section of the slave diagnostics provides information on the interrupttype and the reason that the interrupt was triggered. The maximum length of theinterrupt section is 48 bytes.
Position in the diagnostic datagram
The interrupt section is located after the channel-related diagnostic information orafter the ID-related diagnostic information (with STEP 7)
Example: If there are three items of channel-related diagnostic information, theinterrupt section starts at byte 34.
When an alarm is output, the channel-specific diagnostics is truncated in order tobe able to receive the interrupt information.
Contents
The content of the interrupt function depends on the interrupt type:
The system transfers 4 bytes of interrupt header and up to 44 byte additionalinterrupt information at each diagnostic interrupt (diagnostics data record 1) to theSIMATIC S7 station.
Process alarms consist of 4 bytes in the alarm header and 4 bytes of statusinformation.
For remove/insert interrupts, the length consists of 4 bytes of interrupt header and5 bytes of supplementary interrupt information.
For update interrupts, the length consists of 4 bytes of interrupt header and 2 bytesof supplementary interrupt information.
The following pages describe the significance of these bytes.
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Interrupts
The interrupt section for the ET 200iSP is structured as follows:
7 6 5 0
0 0Byte x
Code for interrupt diagnostics (for 10B, see Figure 6-13)
Length of the interrupt section including byte x (= max. 48 bytes)
Bit no.
Byte x+1
7 6 0
0
Interrupttype:
0000001B: Diagnostic interrupt0000010B: Process alarm0000011B: Remove interrupt0000100B: Insertion interrupt0000110B: Update interrupt
Byte x+27 0
Slot number
02: IM 152 outputs the interrupt (diagnostics interrupt, process alarm with time stamping)
04 to 35: Slot of the module returning the interrupt
Byte x+37 3 1 0
Interrupt sequencenumber (1 to 31)
00B: Process, remove/insert, or update interrupt01B: at least one error is pending10B: outgoing error11B: reserved
as of byte x+4 to ... ...Byte x+4 ...Byte x+4 ...Byte x+4 ...Byte x+4
Diagnosticsinterrupt?Continue with Figure 6-16
Processinterrupt? Continueat Figure6-22
Remove/insertinterrupt? Continue at Figure 6-24
Updateinterrupt?Continueat Figure6-25
Figure 6-15 Structure of the Interrupt Status of the Interrupt Section
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Diagnostic Interrupt, Bytes x+4 to x+7
Bytes x+4 to x+7 correspond to diagnostic data record 0 in STEP 7.
Bytes x+8 to x+43 correspond to diagnostic data record 1 in STEP 7.
7 6 5 4 3 2 1 0
0 0 0 0 1 1 1 1Byte x+4
Bit no.
7 6 5 4 3 2 1 0
0 0 1 1Byte x+5
Module error detectedInternal module fault
External fault Module can no longer be addressed
Channel error in module
Module class:
0100 for IM 152; set with the time stamp / self-diagnosismessage1001 for an electronic module as of byte x+8
Channel information available
User information available
Byte x+6
Byte x+7
Always ”0”
Always ”0”
7 0
7 0
Byte x+8...
Input or output modules without HART = 7BH/ 7CH? Continue at Figure 6-18
Input or output modules with HART = 65H? Continue at Figure 6-19
Interface module 152-1 = 55H? Continue at Figure 6-17
Figure 6-16 Structure of bytes x+4 to x+7 for Diagnostic Interrupts
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Diagnostics Interrupt from Interface Module IM 152
7 6 5 4 3 2 1 0Byte x+11
Byte x+8
Byte x+9
Byte x+10
7 6 5 4 3 2 1 0Byte x+12
55H: Self-diagnosis
Length of each channel-specific diagnosticinformation in bits
Number of channels permodule
Diagnostic event at channel 0 of the moduleDiagnostic event at channel 1 of the module
Error at Power Supply 1 (17)
Error at Power Supply 2 (17)
Byte x+13 15 14 13 12 11 10 9 8
Error type at channel 0: Bytes x+12 to x+19
Byte x+14 23 22 21 20 19 18 17 16
Byte x+15 31 30 29 28 27 26 25 24
Illegal MMC content (26)
1 1
Byte x+16 39 38 37 36 35 34 33 32
Byte x+17 47 46 45 44 43 42 41 40
Byte x+18 55 54 53 52 51 50 49 48
Byte x+19 63 62 61 60 59 58 57 56
Byte x+20 to x+27 Error type at channel 1: see bytes x+12 to x+19:Only available with redundant IM 152
The corresponding error type number ofthe channel-specific diagnostics isshown in parentheses.
For further information on the meaning andremedies, refer to Table 6-17 (Error Typesof Electronic Modules) in Section 6.7.11(Channel-Specific Diagnostics).
Figure 6-17 Structure Starting at Byte x+8 for Diagnostics Interrupt from Interface Module
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Diagnostic Interrupt from Input or Output Modules without HART
7 6 5 4 3 2 1 0Byte x+11
Byte x+8
Byte x+9
Byte x+10
7 6 5 4 3 2 1 0Byte x+12
7BH: Input channel
7CH: Output channel
Length of each channel-specific diagnosticinformation in bits
Number of channels per module
Diagnostic event at channel 0 of the moduleDiagnostic event at channel 1 of the module
Diagnostic event at channel 2 of the moduleDiagnostic event at channel 3 of the module
Short-circuitWire break
Upper measuringrange exceeded
Byte x+13 15 14 13 12 11 10 9 8
Error type at channel 0: Bytes x+12 to x+15
The set bit (0 to 31) corresponds with theerror type number
For further information on the meaning andremedies, refer to Table 6-17 (Error Typesof Electronic Modules) in Section 6.7.11(Channel-Specific Diagnostics).
Violation of measuring range lo limit
Error
Byte x+14 23 22 21 20 19 18 17 16
Byte x+15 31 30 29 28 27 26 25 24
Parameter assignment error
External fault
Bytes x+16 to x+19
Bytes x+20 to x+27
Bytes x+24 to x+27
Error type at channel 1: see bytes x+12 to x+15
Error type at channel 2: see bytes x+12 to x+15
Error type at channel 3: see bytes x+12 to x+15
Error type at channel 4: see bytes x+12 to x+15
Error type at channel 5: see bytes x+12 to x+15
Error type at channel 6: see bytes x+12 to x+15
Error type at channel 7: see bytes x+12 to x+15
Bytes x+28 to x+31
Bytes x+32 to x+35
Bytes x+36 to x+39
Bytes x+40 to x+43
Diagnostic event at channel 4 of the moduleDiagnostic event at channel 5 of the module
Diagnostic event at channel 6 of the moduleDiagnostic event at channel 7 of the module
1 1 1 1 1 1 1 1
Actuator shutdown in safety-oriented mode
Figure 6-18 Structure Starting at Byte x+8 for Diagnostic Interrupt (Input / Output Modules
without HART)
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Diagnostic Interrupt from Input or Output Modules with HART
7 6 5 4 3 2 1 0Byte x+11
Byte x+8
Byte x+9
Byte x+10
7 6 5 4 3 2 1 0Byte x+12
65H: HART input or output channel
Length of each channel-specific diagnosticinformation in bits
Number of channels permodule
Diagnostic event at channel 0 of the moduleDiagnostic event at channel 1 of the module
Diagnostic event at channel 2 of the moduleDiagnostic event at channel 3 of the module
Byte x+13 15 14 13 12 11 10 9 8
The corresponding error type number ofthe channel-specific diagnostics isshown in parentheses.
Bytes x+14 to x+15
Bytes x+16 to x+19
Bytes x+18 to x+19
Error type at channel 1: see bytes x+12 to x+13
Error type at channel 2: see bytes x+12 to x+13
Error type at channel 3: see bytes x+12 to x+13
Parameter fault (16)HART communication error (19)
Short-circuit to P (1)Short-circuit to M (1)
Wire break (6)Load voltage missing (17)
Overflow (7)Underflow (8)
HART master tag out of limits (29)HART auxiliary tag out of limits (30)
HART analog output current in saturation (4)HART analog output current is determined (2)
Further HART status available (22)reserved for HART (23)
HART configuration changed (27)Error in the HART field device (26)
Error type at channel 0: Bytes x+12 to x+13
For further information on the meaning andremedies, refer to Table 6-17 (Error Typesof Electronic Modules) in Section 6.7.11(Channel-Specific Diagnostics).
1
=16 bits
Figure 6-19 Structure Starting at Byte x+8 for Diagnostic Interrupt (Input or Output Module
with HART)
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Example of a Diagnostic Interrupt
Example:
Electronic module 8 DI NAMUR outputs a diagnostic interrupt ”wire break” at channel 2
0 0 1 0 1 1 0 0Byte x
Length of the interrupt section = 44 bytes
0 0 0 0 0 0 0 1Byte x+1
Diagnosticinterrupt
0 0 0 0 1 0 1 0Byte x+2
Slot number 10
0 0 0 0 1 0 0 1Byte x+3
Interrupt sequence number = 1
0 0 0 0 1 0 0 0Byte x+4
Channel error
0 0 0 1 1 1 1 1Byte x+5
Digital electronic module
At least one error is pending
Channel information available
Bytes x+6 and x+7 always ”0”
Byte x+8 0 1 1 1 1 0 1 1
Input module = 7BH
Code for device-specific diagnostics
Code for interrupt
Figure 6-20 Example of a Diagnostic Interrupt
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Byte x+9 0 0 1 0 0 0 0 0
Length of channel-specific diagnostics = 32 bits
Byte x+10 0 0 0 0 1 0 0 0
Number of channels per module = 8
Byte x+11 0 0 0 0 0 1 0 0
Diagnostics event at channel 2
Bytes x+12 to x+15 ”0” (channel 0)
Bytes x+16 to x+19 ”0” (channel 1)
Byte x+20 0 1 0 0 0 0 0 0
7 6 5 4 3 2 1 0
Bit x+20.6 = error type 6 at channel 2 = wire break
Bytes x+21 to x+23 ”0” (channel 2)
Bytes x+24 to x+27 ”0” (channel 3)
Bytes x+28 to x+31 ”0” (channel 4)
Bytes x+32 to x+35 ”0” (channel 5)
Bytes x+36 to x+39 ”0” (channel 6)
Bytes x+40 to x+43 ”0” (channel 7)
Figure 6-21 Example of a Diagnostic Interrupt (Continued)
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Process Interrupt for Analog Input Modules
7 6 5 4 3 2 1 0Byte x+4
7 6 5 4 3 2 1 0Byte x+5
Bytes x+6 and x+7:
1: Violation of the hi limit at channel 0
1: Violation of the hi limit at channel 1
1: Violation of the lo limit at channel 01: Violation of the lo limit at channel 1
are always 00H
1: Violation of the hi limit at channel 2
1: Violation of the hi limit at channel 3
1: Violation of the lo limit at channel 21: Violation of the lo limit at channel 3
Figure 6-22 Structure Starting at Byte x+4 for Hardware Interrupts (Analog Input)
Time Stamp Process Interrupt for Slot 2 (IM 152)
7 6 5 4 3 2 1 0Byte x+4
7 6 5 4 3 2 1 0Byte x+5
Byte x+7
1: Message buffer available for transfer on IM 1521: Overflow of the ”external” message buffer: permissiblemessage buffers are full.
1: Overflow of the ”internal” message buffer: messagesmay be lost.
Redundancy: active IM 1520: the right-hand IM of the TM-IM/IM is the active module1: the left-hand IM of the TM-IM/IM is the active module
Redundancy: Redundant mode enabled / disabled0: no redundant mode1: redundant mode
Restart the time stamp0: no restart occurs1: Currently being restarted
Not applicableStatus of synchronization by means of timedatagram0: no synchronization1: Synchronized
Status of time stamping
Data record number, if a data record is to befetched
7 6 5 4 3 2 1 0Byte x+6 Number of message block in the data record, 1 to 20
reserved
Figure 6-23 Structure Starting at Byte x+4 for Process Alarms (Time Stamping)
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Remove/insert interrupt
Bytes x+4 to x+8 contain the ID of the module that was removed or inserted. TheIDs of the modules can be found in the GSD file.
You can recognize whether the modules were removed or inserted by the interrupttype in byte x+1. (See Structure of the Interrupt Status of the Interrupt Section)
7 6 5 4 3 2 1 0Byte x+7
Byte x+4
Byte x+5
Byte x+6
Byte x+8
Not applicable
Type detection of the module; high byte
Type detection of the module; low byte
SKF identifier(STEP 7) See table 6-18
Figure 6-24 Structure Starting at Byte x+4 for Remove/Insert Interrupts
Table 6-18 SKF Identifiers (STEP 7)
Modules SKF-Identifier
8 DI NAMUR 79 CAH
4 DO DC23.1V/20mA 79 D1H
4 DO DC17.4V/27mA 79 D2H
4 DO DC17.4V/40mA 79 D3H
4 AI I 2WIRE HART 79 EBH
4 AI I 4WIRE HART 79 ECH
4 AI RTD 79 EFH
4 AI TC 79 EEH
4 AO I HART 79 F2H
Reserve module 8F C0H
Removed module DE C0H
Reserve identifier (CiR) B6 40H
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Update Interrupt
The update interrupt is signaled when the following conditions are met:
• The parameter assignment is a free of errors.
• The parameter settings for the ET 200iSP differ from the parameters andidentification data stored in retentive memory on the modules.
Byte x+4
Byte x+5
Data record index: Represents the number ofparameter data record which has led to theupdate interrupt.
Number of updates which could not bereported to the CPU.
Figure 6-25 Structure Starting at Byte x+4 for Update Interrupt
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6.7.14 Diagnostics for Incorrect Module Configuration States of theET 200iSP
Incorrect Module Configuration
The following incorrect module configurations in the ET 200iSP station lead itsfailure or prevent startup of data exchange. These reactions are independent onthe enable status of the IM 152 parameter ”Operation with online / offline<>configuration”
• 2 missing electronic modules
• Bus termination module missing
• Number of modules exceeds maximum configuration
• Backplane bus fault (for example, defective terminal module)
Note
If only one module is missing (gap), you can cycle power to startup the ET 200iSP.Startup is not possible if more than one module is missing.
If more than one electronic module is missing, a safe startup following insertion ofthe ET 200iSP can only be guaranteed after POWER OFF/ POWER/ON has beenperformed.
Diagnostics
You can recognize all faulty module configuration states based on the followingdiagnostic information:
Table 6-19 Diagnostics of Faulty Configuration of the ET 200iSP
ID-related diagnostics Module Status
All bits of slot 4 to 35 are set 01B: ”Module error, invalid user data” up tothe slot that caused the failure
11B: ”no module; invalid user data” startingat the slot that caused the failure
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Maintenance
7.1 Actions in Run
Features
The table below describes the actions allowed at ET 200iSP in Zone 1, Zone 2,Zone 21 and Zone 22 in RUN.
Requirements
!Warning
Potentially explosive area Zone 1 and Zone 2: You may open the ET 200iSPenclosure briefly for the purpose of authorized maintenance work.
Potentially explosive area Zone 21 and Zone 22: You may not open the ET 200iSPenclosure in environments containing combustible dust.
Permitted Actions / Tasks in the Potentially Explosive Areas
Table 7-1 Permitted actions / tasks in the potentially explosive areas
Activities / tasks Zone1
Zone2
Zone21
Zone22
See chapter ...
Inserting and removing modules during operation(hot swapping) in Zone 1 and Zone 2
X X Maintenance
Maintenance during operation (visual checks) X X X1) X1) Maintenance
Cleaning X X Maintenance
Removing and inserting the bus connector at terminal module TM-IM/EM in Zone 1 and Zone 2
X X Wiring
Isolating and disconnecting the cables to the encoders, actuators, and HART field devices at terminal module TM-EM/EM in Zone 1 andZone 2
X X Wiring
Editing parameter settings and modifying thediagnostics functions of ET 200iSP
X X Commissioningand Diagnostics
IM 152 firmware update via PROFIBUS-DP X X X1 X1) Maintenance1) You may not open the ET 200iSP enclosure in areas containing combustible dust for the purpose of
carrying out this task.
7
Maintenance
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Permitted Activities in Zone 2
In addition to the activities permitted in zone 1, the following activity is alsopermitted:
!Caution
Disconnecting and connecting cables for the 24 VDC supply voltage at terminalmodule TM-PS-A during operation. This activity is permitted only when there is norisk of explosion or when there is no power applied at terminal module TM-PS-A.
Maintenance
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7.2 Removing and Inserting Electronic Modules DuringOperation (Hot Swapping)
Features
• The ET 200iSP distributed I/O station supports the removal and insertion of oneelectronic module (1 gap) during operation (RUN mode).
• If only one electronic module is removed the ET 200iSP remains in the RUNmode.
• If you remove more than one electronics module, this leads to an ET 200iSPstation failure. After you have reinstalled all the electronic modules, restart theET 200iSP, i.e. cycle the power supply module PS off and on.
• If you install only one electronics module in an ET 200iSP, removing thiselectronics module will lead to an ET 200iSP station failure. When you insertthe electronics module, the ET 200iSP starts up again.
• All current parameters and identification data of the ET 200iSP are stored in aninternal flash memory in the IM 152. After you changed a module, IM 152automatically transfers these data to the new module. This function is alwaysactive on the ET 200iSP and cannot be influenced by the user.
– The current parameters and identification data are retained on the IM 152-2even if the power supply to the ET 200iSP fails.
– The default parameters of an electronics module are overwritten.
PROFIBUS RS 485-IS
Parameters and identification data aresecurely stored in the flash memory
New electronic moduleIM 152
The parameters and identification dataare automatically transferred to areplaced module.
Figure 7-1 Automatic Parameter Assignment after Replacing a Module
Maintenance
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Note
If you reduce an existing configuration and then expand it again, you should clearthe Flash memory before expanding.
Note
The flash memory (parameters and identification data) of the IM 152 will becleared if you set the PROFIBUS address to ”0” and then switch the supplyvoltage of the ET 200iSP off and on at the Power Supply PS.
Requirements
• When the ET 200iSP starts up, all modules must be inserted.
• Removing and inserting electronics modules during operation (RUN mode) ispossible only if you have enabled the IM 152 parameter Operation with offline<> online configuration.
• Only one electronic module may be removed at any given time.
• The following table describes which modules you can remove and insert duringoperation:
Table 7-2 Requirements
Module replacement Removal andinsertion
Effects on the ET 200iSP
Power Supply PS yes Removal: Failure of the ET 200iSP (status aswith shut down power supply.)
Insertion: Startup of ET 200iSP
Interface module IM152
yes Removal: Failure of the ET 200iSP
Insertion: Configuration of ET 200iSP requiredby means of PG (in STEP 7 only the I&M data)
Electronic module yes Removal: Failure of the sensor/actuator
Insertion: Sensor/actuator in operation
Removing and inserting electronic modules
Remove and insert the electronics modules as described in chapter 5.6.
Note
Check the coding element before you insert the new electronic module into theterminal module.
Maintenance
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7.3 Exchanging the Interface Module
Properties
The IM 152 saves the parameters and I&M data to an internal flash memory. Thecontents are retained even if the ET 200iSP experiences a power failure.
After the IM 152-1 is replaced, STEP 7 automatically assigns parameters to theET 200iSP. You only have to download the I&M data (if needed) to the ET 200iSPwith HW Config or SIMATIC PDM.
Requirements
Replacement interface module
Replacing an Interface Module without MMC
1. Remove the (defective) IM 152 from the terminal module.
2. Set the PROFIBUS DP address to ”0” on the new IM 152, and insert the newinterface module into the terminal module.
3. Switch the supply voltage of the ET 200iSP off and then on.
4. Wait until the retentive data of the interface module are deleted (BF LED flashes at 0.5 Hz).
5. Switch off the supply voltage of the ET 200iSP.
6. Now, set the PROFIBUS DP address of the (defective) old IM 152 on the newinterface module.
7. Switch on the supply voltage of the ET 200iSP.
8. Assign parameters for the ET 200iSP:
– If you are using STEP 7, parameters will be automatically reassigned to theET 200iSP. The ET 200iSP will then switch to data exchange with the DPmaster. If you need I&M data, you must download these data as well to theET 200iSP (HW Config Target System > Download ModuleIdentification).
– If you are using SIMATIC PDM, you must download all parameters and I&Mdata to the ET 200iSP (Device > Complete Download to Device).
Maintenance
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7.4 Maintenance during Operation
Features
Maintenance of the ET 200iSP is restricted to visual inspections. This may becarried out while the ET 200iSP is in RUN.
Requirements
A visual check in potentially explosive areas should be carried out at intervals of 6months.
Procedure
1. Verify that the cable inlets in the enclosure are seal-tight and intact.
2. Verify that there is no ingress of water or liquid. If there is, locate the cause.
3. Verify that all cables are securely wired (connectors, lines.)
7.5 Cleaning
Safety information for Zone 1 and Zone 2
!Warning
Plastic parts can become electrostatically charged when they are cleaned. Whenoperating the ET 200iSP in Zone 1 or Zone 2, this may represent a danger: Clean the ET 200iSP only with damp cloths. A sign with the warning ”Clean the ET 200iSP only with damp cloths” must beplaced inside the enclosure.
After you cleaned it, run a function check on the ET 200iSP.
Safety information for Zone 21 and Zone 22
!Warning
The dust layer on and at the ET 200iSP enclosure may not exceed a thickness of5 mm.
Remove the dust layers on and around the enclosure at regular intervals. Anyexplosion risk must be excluded when you clean the module.
Maintenance
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7.6 IM 152 Firmware Update
Features
• After you have implemented (compatible) functional expansions or performanceenhancements, you should update the IM 152 interface module to the latestfirmware version.
• The latest firmware versions are available from your Siemens representative orcan be downloaded from the Internet at:http://www.siemens.com/automation/service&support
Tip:
– Make a note of your actual firmware version before you start the update. Youcan read out the version number with HW Config or with SIMATIC PDM.
– If you then meet any problems with the new firmware, you can alwaysdownload the previous (current) firmware from the Internet and restore it onthe interface module.
• There are two ways to update the module:
– from the PG/PC via PROFIBUS DP and CPU
– by means of SIMATIC Micro Memory Card (MMC)
Requirements
Update via PROFIBUS DP
• STEP 7 V5.3, ServicePack 1
• The IM 152 of the station requiring the update must be online.
• The files containing the current (new) firmware version must be available in thePG/PC file system.
• To update the firmware, you receive the *.UPD files containing the currentfirmware.
Update by means of MMC
• STEP 7 V5.3, ServicePack 1
• The update files must be available on the MMC.
• To carry out a firmware update, you need MMCs with 2, 4, or 8 MBytes ofmemory.
Note
If the ET 200iSP is part of a redundant configuration, you must not update thefirmware for both IM 152 interface modules simultaneously!
If you have updated the firmware simultaneously, the ET 200iSP will not start up.In this case, you must clear the flash memory of both IM 152 interface modules(set PROFIBUS address to ”0” and then switch the supply voltage of theET 200iSP off and on).
Maintenance
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Firmware update via PROFIBUS DP
Connect the PG/PC containing the update files to the MPI interface of the CPU orvia the PROFIBUS DP interface. ET 200iSP is interconnected with the system viaPROFIBUS DP.
For information on this procedure, refer to the online help for STEP 7.
Firmware update by means of MMC
1. Use STEP 7 and your programming device to transfer the update files to ablank MMC ( 2 MB).
2. Switch off the supply voltage at terminal module TM-PS-A.
3. Insert the MMC containing the FW update in the slot of the IM 152.
4. Switch on the supply voltage again at TM-PS-A.
Result:
– The IM 152 automatically detects the MMC containing the FW update andthen starts the FW update.
– The SF and BF LEDs are lit during the FW update.
– When the update is complete, the BF LED flashes at 0.5 Hz.
For information on the LED displays during the update, refer to Section 6.6.
5. Switch off the power supply to the IM 152, then remove the update MMC fromthe module slot. To remove the MMC, push in the extractor in the lower sectionof the module slot using a small screw driver or a pen.
Maintenance
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Restart after update
Update via PROFIBUS DP
On the STEP 7 user interface you can set
• an automatic rest of IM 152 after the update in order to restart the module withthe new firmware.
Caution
If the ”Update firmware after download” box is set, a brief failure of the ET 200iSPstation is triggered. If you have not made any provisions for this situation, theupdate will cause to CPU to go to STOP mode due to a rack failure.
• Reset the IM 152 by cycling the power supply in order to restart it with the newfirmware.
Update by means of MMC
The IM 152 status after an update can only be exited by shutting down power.After the update is completed, IM 152 restarts with the new firmware after youpower it up.
Update
If the update fails, the IM 152 always restarts with its current (”old”) FW versionafter the supply voltage is switched off and then on. See Table 6-5 Status and Error LEDs on the IM 152.
Maintenance
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8-1Distributed I/O device ET 200iSPA5E00247483-02
General Technical Data
8.1 General Technical Data
What are general technical data?
The general technical data contain the standards and test values to which theET 200iSP distributed I/O station complies and adheres, and the criteria underwhich the ET 200iSP distributed I/O station was tested.
8.2 Standards and Certifications
CE certification
The ET 200iSP distributed I/O system meets the requirements and protectionobjectives of the following EC Directives and complies with the harmonizedEuropean Standards (EN) for programmable logic controllers published in theOfficial Gazettes of the European Community:
• 73/23/EEC” Electrical Equipment Designed for Use within Certain VoltageLimits” (low-voltage directive)
• 89/336/EEC “Electromagnetic Compatibility” (EMC Directive)
• 94/9/EC “Equipment and Protective Systems for Use in ExplosiveAtmospheres.”
8
General Technical Data
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ATEX certification
KEMA 04ATEX2242 (ET 200iSP system)in accordance with EN 50014:1997+A1+A2, EN 50018:2000+A1,EN 50019:2000, EN 50020:2002, and EN 50284:1999
The module identifiers are found in the technical data and in appendix E of thismanual.
The EC declarations of conformity are kept available for the responsible authoritiesat the following address:
Siemens AktiengesellschaftAutomation and DrivesA&D AS ST PLCPO Box 1963D-92209 Amberg
C-Tick mark (Australia)
The distributed I/O device ET 200iSP meets the requirements of the AS/NZS 2064 (Class A) standard.
IEC 61131
The ET 200iSP distributed I/O station meets the requirements and criteria ofIEC 61131-2 (Programmable Logic Controllers, Part 2: equipment requirementsand tests.)
PROFIBUS standard
The ET 200iSP distributed I/O device is based on IEC 61784-1:2002 Ed1 CP 3/1.
Marine Approval (requested)
Classification societies:
• ABS (American Bureau of Shipping)
• BV (Bureau Veritas)
• DNV (Det Norske Veritas)
• GL (Germanischer Lloyd)
• LRS (Lloyds Register of Shipping)
• Class NK (Nippon Kaiji Kyokai)
General Technical Data
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8.3 Electromagnetic Compatibility and Shipping andStorage Conditions
Definition
Electromagnetic compatibility is the ability of electrical equipment to functionproperly in its electromagnetic environment without influencing this environment.
The ET 200iSP distributed I/O device meets EMC requirements, including those ofthe EMC law for the single European market. This is only possible if the ET 200iSPdistributed I/O station corresponds to the regulations and directives for electricalinstallation.
Pulse-shaped disturbances
The following table shows the electromagnetic compatibility of the ET 200iSPdistributed I/O station with relation to pulse-shaped disturbances.
Pulse-shaped disturbance Tested with Corresponds to the degree of severity
Electrostatic dischargeaccording to IEC 61000-4-2
8 kV4 kV
3 (air discharge)2 (contact discharge)
Burst pulses (rapid transient disturbances) according toIEC 61000-4-4.
2 kV (power supplyline)
2 kV (signal line)
3
3
High-energy single pulse (surge) accordingto IEC 61000-4-5Only with lightning protection elements (see the chapter Wiring)
• asymmetrical coupling 2 kV (power supplyline)
2 kV (signal/dataline)
3
• symmetrical coupling 1 kV (power supplyline)
1 kV (signal/dataline)
General Technical Data
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Sinusoidal disturbances
The following table shows the electromagnetic compatibility of the ET 200iSPdistributed I/O station with relation to sinusoidal disturbances.
RF radiation according to IEC 61000-4-3Electromagnetic RF field
RF interference accordingto
IEC 61000-4-6amplitude modulated pulse modulated
IEC 61000-4-6
80 MHz to 1000 MHz/1.4 GHz to 2 GHz
900 MHz 5 MHz 0.15 to 80 MHz
10 V/m 10 Vrms unmodulated
80% AM (1 kHz) 50% ED 80% AM (1 kHz)
200 Hz repetitive frequency 150 source impedance
Emission of Radio Interferences
Emission of electromagnetic fields to EN 55011: Limit class A, group 1 (measuredat a distance of 10 m.)
Frequency Noise emission
from 30 to 230 MHz < 40 dB (V/m)Q
from 230 to 1000 MHz < 47 dB (V/m)Q
Shipping and Storage Conditions
The ET 200iSP distributed I/O device surpasses the requirements for shipping andstorage conditions defined in IEC 61131-2. The following specifications apply tomodules that are transported and stored in their original packaging.
Type of condition Permitted range
Free fall 1 m
Temperature from – 40 C to + 70 C
Temperature drift 20 K/h
Air pressure From 1080 hPa to 660 hPa (corresponds toan altitude of -1000 m to 3500 m)
Relative humidity from 5 to 95 %, without condensation
General Technical Data
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8.4 Mechanical and Climatic Ambient Conditions
Conditions of use
ET 200iSP is designed for use in weather-proof stationary applications. Theconditions of use surpass the requirements in DIN IEC 60721-3-3:
• Class 3M3 (mechanical requirements)
• Class 3K3 (climatic requirements)
Climatic Environmental ConditionsThe following climatic ambient conditions apply:
Ambient conditions Fields of application Comments
Temperature from –20 to 70C 1) 2) for horizontal installation
from –20 to 40C 1) 3) for all other mounting positions
Temperature drift 10 K/h
Relative humidity from 5 to max. 95 % without condensation
Air pressure from 1080 to 795 hPa Corresponds to an altitude of–1000 m to 2000 m
Contaminant concentration SO2: < 0.5 ppm;rel. humidity < 60 %, no dewingH2S: < 0.1 ppm;rel. humidity < 60 %, no dewing
Test:10 ppm; 4 days
1 ppm; 4 days
1) MMC (SIMATIC Micro Memory Card): Operational temperature range 0 to 60C2) Output current of Power Supply PS (6ES7 138-7EA00-0AA0)
at an ambient temperature of –20C to +60C: max. 5 Aat an ambient temperature of +60C to +70C: max. 3.5 A
3) Output current of Power Supply PS (6ES7 138-7EA00-0AA0): max. 5 A
Mechanical Environmental Conditions
The mechanical ambient conditions are shown in the following table in the form ofsinusoidal vibration.
Frequency range Continuous Infrequently
5 f 9 Hz 1.75 mm amplitude 3.5 mm amplitude
9 f 150 Hz 0.5 g constant acceleration
1 g constant acceleration
General Technical Data
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Test of mechanical ambient conditions
The following table contains information on the type and scope of the test ofmechanical ambient conditions.
Testing for ... Test standard Terminal- and Electronic Modules
Vibration Vibration test ac-cording toIEC 60068-2-6(sine)
Type of oscillation: Frequency sweep with a rate of change of1 octave/minute.5 Hz f 9 Hz, constant amplitude 3.5 mm9 Hz f 150 Hz, constant amplitude 1 gDuration of oscillation: 10 frequency sweeps per axis in each ofthe 3 mutual vertical axes
Shock Shock tested toIEC 60068-2-27
Type of shock: Half-sineType of shock: 15 g peak value, duration of 11 msType of shock: 33 shocks each in +/– direction in each of the 3mutually vertical axes
8.5 Information on Dielectric Tests, Class of Protection, Degree of Protection, and Rated Voltage of theET 200iSP
Test voltage
Insulation resistance is demonstrated in the type test with the following test voltagein accordance with IEC 61131-2:
Circuits with rated voltage Uin measured against other circuits or ground
Test voltage
< 50 V 500 V DC
< 150 V 2500 V DC
< 250 V 4000 V DC
Degree of Pollution / Overvoltage Category to IEC 61131
• Degree of pollution 2
• Overvoltage category
– at Vr = 24 V DC: II
Class of protection
Class of protection I to IEC 60536
General Technical Data
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Degree of protection IP30
Degree of protection IP 30 to IEC 60529 for all modules of the ET 200iSP, i.e.:
• Protection against contact with standard test probes
• Protection against foreign bodies with a diameter greater than 2.5 mm
• No particular protection against water
Rated operational voltage
The ET 200iSP distributed I/O device operates with the rated voltage specified inthe table below and within the corresponding tolerances.
Rated voltage Tolerance range
24 V DC 20 V DC to 30 V DC
General Technical Data
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Terminal Modules
9.1 Overview of Contents
Modules and Terminal Modules
The table below shows you which modules you can use on the various terminalmodules.
Table 9-1 Modules and Terminal Modules
Modules Terminal Modules
TM-PS-A
TM-PS-B
TM-IM/IM TM-IM/EM 60S
TM-IM/EM 60C
TM-EM/EM 60S
TM-EM/EM 60C
Order number 6ES7 193- 7DA00-0AA0
7DB00-0AA0
7AB00-0AA0 7AA00-0AA0
7AA10-0AA0
7CA00-0AA0
7CA10-0AA0
Power Supply PS
Interface module IM 152
8 DI NAMUR
4 DO DC23.1V/20mA
4 DO DC17.4V/27mA
4 DO DC17.4V/40mA
4 AI I 2WIRE HART
4 AI I 4WIRE HART
4 AI RTD
4 AI TC
4 AO I HART
Reserve module
9
Terminal Modules
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9.2 Terminal Modules TM-PS-A and TM-PS-B
Order number
Type Order No.
TM-PS-A 6ES7 193-7DA00-0AA0
TM-PS-B 6ES7 193-7DB00-0AA0
Features
• Terminal module for Power Supply PS
• Power supply for the entire ET 200iSP station
• Connected using screw terminals
• 3 terminals for connection to the power supply/grounding busbar PA
• Prewiring of the terminal module is possible
• Automatic discharge of interference from the interface module to the mountingrail via spring contact
• Polarity reversal protection guaranteed by the power supply module.
Terminal assignment
Table 9-2 Pinout on Terminal Modules TM-PS-A and TM-PS-B
View Terminal Name
L+ Power supply to the inserted PowerSupply Module (DC 24 V)
M
L+M
PA
PA Equipotential bonding
Terminal Modules
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Block diagram
PS
Powerbus
Backplane bus
Power supply terminals
Equipotential bonding
IM 152
TM-PS-A
PS
Supply voltage terminals
Equipotential bonding
TM-PS-B
Figure 9-1 Block Diagram of Terminal Modules TM-P-A and TM-PS-B
Technical dataDimensions and weight
Dimensions W x H x D(mm)
60 x 190 x 52
Weight Approx. 235 g
Module-specific data
Number of terminals 3 x power supply /PA
Conductor cross-section 0.5 to 4 mm2*
Type of protection
• CENELECII2 G (1) GD EEx deia/ib IIC T4
0344
Safety data
See EC Prototype Certifi-cate
KEMA 04ATEX2242
* Observe the wiring rules in Section 5.5.1.
Terminal Modules
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9.3 Terminal modules TM-IM/EM 60S and TM-IM/EM 60C
Order number
6ES7 193-7AA00-0AA0 (screw terminal)
6ES7 193-7AA10-0AA0 (spring terminal)
Features
• Terminal module for one interface module (left side) and one electronic module(right side)
• PROFIBUS RS 485-IS connection via 9-pin Sub D socket
• Connection of actuators and sensors by means of screw terminals for TM-IM/EM 60S
• Connection of actuators and sensors by means of spring terminals for TM-IM/EM 60C
• Self-generating interference leakage from the terminal module to the mountingrail by means of a spring contact
• Prewiring of the terminal module is possible
Note
The spring contact to the mounting rail connects the cable shield of thePROFIBUS-DP cable with the equipotential bonding under normal operatingconditions.
Terminal Modules
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Terminal assignment
Table 9-3 Pinout on the TM-IM/EM
View Terminal Name
1 PA Equipotential bonding
2 – –
59
3 RxD/TxD-P Data line B543
98
4 – –4321
876
5 ISGND Bus termination ground216
6 ISP Bus termination P
7 – –
8 RxD/TxD-N Data line A
9 –
1 5 9 13
2 6 10 14
3 7 11 15
4 8 12 16
For the pinout, refer to Section Digital and Analog Electronic Modules
Terminal Modules
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Block diagram
IM
1 5
3 7
4 8
2 6
EM
7
8
9 13
11 15
12 16
10 14
B:
A
Power bus
Terminals with connection to theelectronic module
Backplane bus
PROFIBUS RS 485-ISconnection
IM 152 power supply
Figure 9-2 Block diagram of Terminal Module TM-IM/EM
Technical data
Dimensions and weight
Dimensions W x H x D(mm)
60 x 190 x 52
Weight Approx. 235 g
Module-specific data
Terminal element 9-pin Sub D socketfor PROFIBUSRS 485-IS
Number of terminals 4 x 4
Cable cross-sections 0.14 mm to2.5 mm1)
Safety data
See EC Prototype Certifi-cate
KEMA 04ATEX2242
1) Observe the wiring rules. See chapter 5.5.1.
Terminal Modules
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9.4 Terminal module TM-IM/IM
Order number
6ES7 193-7AB00-0AA0
Features
• Terminal module for two interface modules (left and right side) for use when theIM 152 is configured for redundancy
• PROFIBUS RS 485-IS connection via 9-pin Sub D sockets
• Self-generating interference leakage from the terminal module to the mountingrail by means of spring contacts
• Prewiring of the terminal module is possible
Note
The spring contact to the mounting rail connects the cable shield of thePROFIBUS-DP cable with the equipotential bonding under normal operatingconditions.
Terminal assignment
Table 9-4 Pinout on the TM-IM/IM
View Terminal Name
1 PA Equipotential bonding
2 – –
593 RxD/TxD-P Data line B
543
98
4 – –4321
876
5 ISGND Bus termination ground21
76 6 ISP Bus termination P
7 – –
8 RxD/TxD-N Data line A
9 –
Terminal Modules
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Block diagram
IM IM
B
A
Power bus
Backplane bus
PROFIBUS RS 485-ISconnection (a)
IM 152
B
A PROFIBUS RS 485-ISconnection (b)
Figure 9-3 Block diagram of Terminal Module TM-IM/IM
Technical data
Dimensions and weight
Dimensions W x H x D(mm)
60 x 190 x 52
Weight Approx. 195 g
Module-specific data
Terminal element Two 9-pin Sub Dsockets forPROFIBUSRS 485-IS
Safety data
See EC Prototype Certifi-cate
KEMA 04ATEX2242
Terminal Modules
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9.5 Terminal modules TM-EM/EM 60S and TM-EM/EM 60C
Order number
6ES7 7CA00-0AA0 (screw terminal)
6ES7 7CA10-0AA0 (spring terminal)
Properties
• Terminal module for two electronic modules
• Connection of actuators and sensors by means of screw terminals for TM-EM/EM 60S
• Connection of actuators and sensors by means of spring terminals for TM-EM/EM 60C
• Self-generating interference leakage from the terminal module to the mountingrail by means of a spring contact
• Prewiring of the terminal module is possible
Pinout
Table 9-5 Pinout of Terminal Module TM-EM/EM
View Terminal Name
1 5 9 13 1 5 9 13
2 6 10 14
3 7 11 15
4 8 12 16
2 6 10 14
3 7 11 15
4 8 12 16
For the pinout, refer to Section Digital and Analog Electronic Modules
Terminal Modules
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Block diagram
EM
1 5
3 7
4 8
2 6
EM
7
8
9 13
11 15
12 16
10 14
Power bus
Backplane bus
1 5
3 7
4 8
2 6
7
8
9 13
11 15
12 16
10 14
Terminals with connection to theelectronic module
Figure 9-4 Block Diagram of Terminal Module TM-EM/EM
Technical Data
Dimensions and weight
Dimensions W x H x D(mm)
60 x 190 x 52
Weight approx. 275 g
Module-specific data
Number of terminals 8 x 4
Cable cross-sections 0.14 mm to2.5 mm1)
Safety data
See EC Prototype Certifi-cate
KEMA 04ATEX2242
1) Observe the wiring rules. See chapter 5.5.1.
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Power Supply PS
Order number
6ES7 138-7EA00-0AA0
Features
• supplies galvanically isolated output voltages required by ET 200iSP:
– Powerbus
– Interface module power supply
– Backplane bus
• Handles the safety-related limitation of the output voltages
Block diagram
L+
M
PA
Powerbus
Power supply IM
Backplane bus
Output voltages:
Figure 10-1 Block Diagram of the Power Supply PS
10
Power Supply PS
10-2Distributed I/O device ET 200iSP
A5E00247483-02
Technical data
Dimensions and weight
Dimensions W x H x D(mm)
60 x 190 x 136.5
Weight approx. 2700 g
Module-specific data
Type of protection of themodule
• CENELECII2 G EEx de [ib] IIC T4
0344
Voltages, currents, electrical potentials
Rated supply voltage 24 VDC 1)
• Polarity reversalprotection
yes
• Power failure bufferingPowerbus
at least 0.25 ms
• Power failure bufferingIM 152
at least 15 ms
• Power failure bufferingbackplane bus
at least 0.25 ms
Electrical isolation
• between the supplyvoltage and Powerbus
yes
• between the supplyvoltage and backplanebus as well as IMsupply
yes
Isolation tested
• between supply voltageand all output voltages
1500 VAC
• between all outputvoltages
500 VAC
Current consumption
• from L+ power supply max. 4 A
Power loss of the module 20 W
Permitted input power max. 78.6 W
Output current at ambienttemperature
• from –20C to +60Cwith horizontalinstallation, and –20C to +40C with allother mountingpositions
max. 5 A
• from +60C to +70Cwith horizontalinstallation
max. 3.5 A
Status, interrupts, diagnostics
Status display yes (on IM 152)
Interrupts No
Diagnostic functions
• Group error display No
• Reading of diagnosticdata
yes (via IM 152)
Safety data
See EC Prototype Certifi-cate
KEMA 04ATEX2263
UM 60 VDC
1) Fusing with 6 A automatic circuit breaker and tripping characteristic C (for each ET 200iSP station)
Note
Take appropriate measures to ensure that Um = 60 VDC is not exceeded.
Always use power supply modules with safe electrical isolation for the 24 VDCpower supply of the ET 200iSP.
11-1Distributed I/O device ET 200iSPA5E00247483-02
Interface Module
11.1 Interface module IM 152
Order number
6ES7 152-1AA00-0AB0
Features
Features of interface module IM 152:
• Connects the ET 200iSP with the PROFIBUS RS 485-IS
• Prepares the data for the assembled electronic modules
• PROFIBUS address setting by means of switch
• Switching off the 24 VDC supply voltage at terminal module TM-PS-A also switches off the IM 152 interface module.
• The maximum address space is 244 bytes for inputs, and 244 bytes for outputs.
• Operation as DPV0, S7 DP, and DPV1 slaves
• Module slot for MMC
• Firmware update via PROFIBUS DP or from MMC
• Backup of electronic module parameters:
– The parameters / data are stored in IM 152 flash memory.
– After you power on the ET 200iSP, the IM 152 distributes the storedparameter / data to the electronic modules (substitution values at outputmodules, for example).
– Then, PROFIBUS DP is enabled and the automation system is put intooperation by the DP master.
– Once the ET 200iSP begins exchanging data with the DP master, thesubstitute values (in the flash memory) in the output are replaced with thecurrent data of the DP master.
• Redundancy of IM 152 (V2.0 and higher)
11
Interface Module
11-2Distributed I/O device ET 200iSP
A5E00247483-02
Block diagram
Bac
kpla
ne b
us
ET 200iSP backplane
bus interface
Electronic circuit
PROFIBUS-DPconnection
Electricalisolation
BF ONSF
PROFIBUSaddress
PS1P
ower
bus
A1A2B1B2
ACT PS2
Figure 11-1 Block Diagram Interface Module IM 152
Interface Module
11-3Distributed I/O device ET 200iSPA5E00247483-02
Technical data
Dimensions and weight
Dimensions W x H x D (mm) 30 x 129 x 136.5
Weight approx. 245 g
Module–specific data
Transmission rate 9.6; 19.2; 45.45; 93.75;187.5; 500 kbps,1.5 Mbps
Bus protocol PROFIBUS RS 485-IS
Interface RS–485 (intrinsicallysafe)
SYNC capability yes
FREEZE capability yes
Vendor ID 8110H
PROFIBUS addresses 1 to 125 permitted
Direct Data Exchange yes, slave to slave aspublisher
Clock synchronization No
Time stamping yes (STEP 7 only)
• Accuracy class 20 ms
• Time resolution 1 ms
• Number of digitalinput signals
max. 64 at accuracyclass 20 ms
• Message buffer 15 message buffers,each for 20 messages
• Time interval forsending themessage bufferswhen a message isqueued
1 s
• Time stamp per digital input
per digital input module
entire ET 200iSP
• Time stamp at positive / negative edgeas coming or goingevent
• Time–of–day format RFC 1119 Internet (ISP)
Acyclic functions yes
• Interrupts yes
• Diagnostics yes
• Parameters yes
• Data records yes
Type of protection of the module
• CENELECII2 G EEx ib IIC T4
0344
Voltages, currents, electrical potentials
Electrical isolation
• between backplanebus and electroniccircuits
No
• between PROFIBUSRS 485-IS andelectronic circuits
yes
Current consumptionfrom power supply(Powerbus)
max. 30 mA
Power loss of themodule
0.5 W
Status, interrupts, diagnostics
Interrupts yes
Diagnostics function yes
• Group error
• Bus monitoring
• Redundancy
red LED ”SF”
red LED ”BF”
yellow LED ”ACT”
• Monitoring of thepower supply of theelectronic system
green LED ”ON”
• Monitoring of thesupply voltage atPower Supply PS 1
• Monitoring of thesupply voltage atPower Supply PS 2
green LED ”PS1”
green LED ”PS2”
Interface Module
11-4Distributed I/O device ET 200iSP
A5E00247483-02
Safety data
See EC PrototypeCertificate
KEMA 04ATEX1243
Maximum values for PROFIBUS RS 485-ISinterface:
• Vo 3.9 V
• Io 136 mA
• Po 132 mW
• Vi 4.2 V
11.2 Parameters for IM 152
Parameters
For information on parameter assignment, refer to chapter 6.
Table 11-1 Parameters for Interface Module IM 152-2
IM 152 parameters Range of values Default Effective range
Operation if Preset - <>Actual configuration
• disable
• enabled
disable ET 200iSP
Self-diagnostics • disable
• enabled
disable ET 200iSP
Redundant PowerSupply diagnostics
• No redundant PowerSupply
• Redundant PowerSupply
• Redundant PowerSupply required
No redundant PowerSupply
ET 200iSP
Diagnostics interrupts1) • disable
• enable
disable ET 200iSP
Process interrupts1) • disable
• enable
disable ET 200iSP
Time stamping (enable parameter)2)
• yes
• No
No ET 200iSP
Edge signal evaluationcoming event2)
• Rising edge (0-->1)
• Falling edge (1-–>0)
• channel–specific
Rising edge (0––>1) ET 200iSP
Data format • SIMATIC S7 SIMATIC S7 ET 200iSP
Interference frequencysuppression
• 50 Hz
• 60 Hz
50 Hz ET 200iSP
Unit of temperature • Celsius
• Fahrenheit
Celsius ET 200iSP
Interface Module
11-5Distributed I/O device ET 200iSPA5E00247483-02
Table 11-1 Parameters for Interface Module IM 152-2, continued
IM 152 parameters Effective rangeDefaultRange of values
Slot reference junction 1to 2
• None
• 4 to 35
None ET 200iSP
Input reference junction1 to 4
• RTD on channel 0
• RTD on channel 1
• RTD on channel 2
• RTD on channel 3
RTD on channel 0 ET 200iSP
1) These parameters can be edited or not, depending on the configuration tool used.2) Can only be assigned in HW Config and if the ET 200iSP is being operated as an S7 DP slave.
11.3 Description of the Parameters for IM 152
11.3.1 Operation if Preset-<> Actual configuration
When this parameter is enabled, and
• a module is inserted or removed in runtime, the ET 200iSP station will not fail
• the actual configuration differs from the preset configuration, the ET 200iSPcontinues to exchange data with the DP master.
When this parameter is disabled, and
• a module is inserted or removed in runtime, the ET 200iSP station will fail
• The actual configuration differs from the preset configuration, no data exchangetakes place between the DP master and the ET 200iSP.
11.3.2 Self–diagnostics
If this parameter is enabled, the diagnostic data for the redundant Power SupplyPS are evaluated.
Interface Module
11-6Distributed I/O device ET 200iSP
A5E00247483-02
11.3.3 Redundant Power Supply diagnostics
This parameter specifies the diagnostic behavior for the redundant Power Supply:
• ”No redundant Power Supply”: no diagnostics; station failure in event of PowerSupply failure.
• ”Redundant Power Supply”: Diagnostics for failure of Power Supply PS 1 orPS 2.
This setting is required if you are using two Power Supply units in a redundantconfiguration.
• ”Redundant Power Supply required”: Diagnostics and station failure in event ofPower Supply failure.
11.3.4 Diagnostics Interrupts
You can use this parameter to enable or disable diagnostics interrupts (”masterswitch” for ET 200iSP). Diagnostic interrupts are supported only if the ET 200iSP isin S7 DP or DPV1 mode.
11.3.5 Process Alarms
You can use this parameter to enable or disable process alarms (”master switch”for ET 200iSP). Process interrupts are supported only if the ET 200iSP is in S7 DPor DPV1 mode.
11.3.6 Time Stamping / Edge Evaluation
For information on time stamping, refer to chapter 3.9.
11.3.7 Data Format
Set the file format for all electronic modules of ET 200iSP at this parameter.
Interface Module
11-7Distributed I/O device ET 200iSPA5E00247483-02
11.3.8 Interference Frequency Suppression
The frequency of your AC power system can interfere with the measured value,particularly when measuring in low voltage ranges and using thermocouples. Here,enter the mains frequency in your system (50 Hz or 60 Hz).
The interference frequency suppression parameter applies to all analog electronicmodules. With this parameter, you also specify the integration and conversiontimes of the individual modules. See Technical Specifications of the AnalogElectronics Modules13.
11.3.9 Unit of temperature
With this parameter, you set the unit of temperature for the temperature sensorsand thermocouples.
”S7 Format” data format: Unit of temperature ”Celsius” or ”Fahrenheit” can beselected
The unit of temperature parameter is used for the 4AI RTD and 4AI TC analogelectronic modules.
11.3.10 Slot Reference Junction / Reference Junction Input
How to connect thermocouples is described in chapter 13.2.1.
11.4 Identification and Message Functions (I&M)
For information on I&M functions, refer to chapter 3.12.
Interface Module
11-8Distributed I/O device ET 200iSP
A5E00247483-02
12-1Distributed I/O device ET 200iSPA5E00247483-02
Digital Electronic Modules
12.1 Digital Electronic Module 8 DI NAMUR
Order number
6ES7 131-7RF00-0AB0
Features
• Digital electronic module with eight inputs
• Encoder power supply 8 VDC
• Suitable for NAMUR encoders and wired and unwired mechanical contacts
• Counting and frequency measurements
12
Digital Electronic Modules
12-2Distributed I/O device ET 200iSP
A5E00247483-02
Pinout for NAMUR Encoders or Encoders According to DIN 19234
Table 12-1 Pinout for NAMUR Encoders or Encoders According to DIN 19234
Terminal assignment and view Comments
Connection example of channel 0
1 5 9 13
2 6 1014
3 7 1115
4 8 1216
Channel
0 1 2 3
Channel
4 5 6 7
DI0 DI1 DI2 DI3
DI4 DI5 DI6 DI7
VS VS VS VS
VS VS VS VS
0 21 3
4 5 6 7
1
2
1 k
10 k
1
2
Encoder 1:channel 0: Terminals 1 and 2
Encoder 2:channel 1: Terminals 5 and 6
Encoder 3:channel 2: Terminals 9 and 10
Encoder 4:channel 3: Terminals 13 and 14
Encoder 5:channel 4: Terminals 3 and 4
Encoder 6:channel 5: Terminals 7 and 8
Encoder 7:channel 6: Terminals 11 and 12
Encoder 8:channel 7: Terminals 15 and 16
DI: Input signal VS: Encoder supply
Digital Electronic Modules
12-3Distributed I/O device ET 200iSPA5E00247483-02
Pinout for NAMUR Changeover Contacts or Encoders According to DIN 19234Changeover Contacts
Table 12-2 Pinout for NAMUR Changeover Contacts or Encoders According to DIN 19234Changeover Contacts
Terminal assignment and view Comments
Example of a channel 0 andchannel 1 connection
1 5 9 13
2 6 10
14
3 7 11
15
4 8 12
16
Channel
0 1 2 3
Channel
4 5 6 7
DI0 DI1 DI2 DI3
DI4 DI5 DI6 DI7
VS VS VS VS
VS VS VS VS
0 21 3
4 5 6 7
1 k10 k
15
2
15
2
or
NO contact
NC contact
Changeover contact 1Channel 0: Terminals 1 and2channel 1: Terminal 5
Changeover contact 2Channel 2: Terminals 9 and10channel 3: Terminal 13
Changeover contact 3Channel 4: Terminals 3 and4channel 5: Terminal 7
Changeover contact 4Channel 6: Terminals 11and 12channel 7: Terminal 15
DI: Input signal VS: Encoder supply
Digital Electronic Modules
12-4Distributed I/O device ET 200iSP
A5E00247483-02
Terminal Assignment of Single Contact with 10 k Load Resistance (Mechanical NO Contact)
Table 12-3 Terminal Assignment of Single Contact with 10 k Load Resistance (Mechanical NOContact)
Terminal assignment and view Comments
Example of a channel 0connection
1 5 9 13
2 6 1014
3 7 1115
4 8 1216
0 21 3
4 5 6 7
10 k
1
2
Channel
0 1 2 3
Channel
4 5 6 7
DI0 DI1 DI2 DI3
DI4 DI5 DI6 DI7
VS VS VS VS
VS VS VS VS
Single contact 1Channel 0: Terminals 1 and 2
Single contact 2Channel 1: Terminals 5 and 6
Single contact 3Channel 2: Terminals 9 and 10
Single contact 4Channel 3: Terminals 13 and 14
Single contact 5Channel 4: Terminals 3 and 4
Single contact 6Channel 5: Terminals 7 and 8
Single contact 7Channel 6: Terminals 11 and 12
Single contact 8:Terminals 15 and 16
DI: Input signal VS: Encoder supply
Digital Electronic Modules
12-5Distributed I/O device ET 200iSPA5E00247483-02
Terminal assignment of changeover contact with 10 k load resistance(mechanical NO contact)
Table 12-4 Terminal Assignment of Changeover Contact with 10 k Load Resistance(Mechanical Changeover Contact)
Terminal assignment and view Comments
Example of a channel 0 andchannel 1 connection
1 5 9 13
2 6 10
14
3 7 11
15
4 8 12
16
Channel
0 1 2 3
Channel
4 5 6 7
DI0 DI1 DI2 DI3
DI4 DI5 DI6 DI7
VS VS VS VS
VS VS VS VS
0 21 3
4 5 6 7
10 k15
2
Changeover contact 1Channel 0: Terminals 1 and 2channel 1: Terminal 5
Changeover contact 2Channel 2: Terminals 9 and 10channel 3: Terminal 13
Changeover contact 3Channel 4: Terminals 3 and 4channel 5: Terminal 7
Changeover contact 4Channel 6: Terminals 11and 12channel 7: Terminal 15
DI: Input signal VS: Encoder supply
Digital Electronic Modules
12-6Distributed I/O device ET 200iSP
A5E00247483-02
Terminal Assignment of a Single Contact without Load Resistance(Mechanical NO Contact with Single Contact)
Table 12-5 Terminal Assignment of a Single Contact without Load Resistance (Mechanical NO Contact with Single Contact )
Terminal assignment and view Comments
Example of a channel 0connection 1 5 9 1
3
2 6 10
14
3 7 11
15
4 8 12
16
Channel
0 1 2 3
Channel
4 5 6 7
DI0 DI1 DI2 DI3
DI4 DI5 DI6 DI7
VS VS VS VS
VS VS VS VS
0 21 3
4 5 6 7
1
2
Single contact 1Channel 0: Terminals 1 and2
Single contact 2Channel 1: Terminals 5 and6
Single contact 3Channel 2: Terminals 9 and10
Single contact 4Channel 3: Terminals 13 and14
Single contact 5Channel 4: Terminals 3 and4
Single contact 6Channel 5: Terminals 7 and8
Single contact 7Channel 6: Terminals 11 and12
Single contact 8:Terminals 15 and 16
DI: Input signal VS: Encoder supply
Digital Electronic Modules
12-7Distributed I/O device ET 200iSPA5E00247483-02
Terminal Assignment of a Changeover Contact without Load Resistance(Mechanical Changeover Contact)
Table 12-6 Terminal Assignment of a Changeover Contact without Load Resistance(Mechanical Changeover Contact)
Terminal assignment and view Comments
Example of a channel 0 andchannel 1 connection
1 5 9 13
2 6 10
14
3 7 11
15
4 8 12
16
Channel
0 1 2 3
Channel
4 5 6 7
DI0 DI1 DI2 DI3
DI4 DI5 DI6 DI7
VS VS VS VS
VS VS VS VS
0 21 3
4 5 6 7
15
2
Changeover contact 1Channel 0: Terminals 1 and2channel 1: Terminal 5
Changeover contact 2Channel 2: Terminals 9 and10channel 3: Terminal 13
Changeover contact 3Channel 4: Terminals 3 and4channel 5: Terminal 7
Changeover contact 4Channel 6: Terminals 11and 12channel 7: Terminal 15
DI: Input signal VS: Encoder supply
Block Diagram
Bac
kpla
ne b
us
Backplanebus
interfaceC
1
5
9
13
3
7
11
15
Inputwiring
Pow
erbu
s
26
101448
1216
DI:
Vs:
Figure 12-1 Block Diagram of 8 DI NAMUR
Digital Electronic Modules
12-8Distributed I/O device ET 200iSP
A5E00247483-02
Technical Data
Dimensions and weight
Dimensions W x H x D (mm) 30 x 129 x 136.5
Weight approx. 255 g
Module-specific data
Number of inputs 8
Cable length
• shielded max. 200 m
Type of protection
• CENELECII2 G (1) GD EEx ibia IIC T4
0344
Voltages, currents, electrical potentials
Number of inputs 8
Electrical isolation
• Between channels andbackplane bus
yes
• Between the channels No
Permitted potential difference
• Between different circuits 60 VDC, 30 VAC
Current consumption
• From supply voltage(power bus) with 8 xNAMUR encoders
max. 70 mA
• from power supply(Powerbus), open contact
max. 90 mA
Power loss of the module
• with 8 x NAMURencoders
0.84 W
• with open contact 1.1 W
Status, interrupts, diagnostics
Status display
• Inputs green LED perchannel
Interrupts
• Process alarm no
• Diagnostic interrupt yes, configurable
Diagnostic functions
• Group error display red LED ”SF”
• Reading of diagnosticdata
yes
Monitoring function
• Short-circuit Rload < 1501)
• Wire break Iload < 0.2 mA2)
Safety data
See EC Prototype Certificate KEMA04ATEX1248
Data for selecting an encoder
Input current for NAMURencoder
• for ”1” signal
• for ”0” signal
to NAMUR orEN 50227
min. 2.1 mA
max. 1.2 mA
Input current for 10 k wiredcontact• for ”1” signal min. 2.1 mA
• for ”0” signal max. 1.2 mA
Input current for annon-switched contact• for ”1” signal (channel 0,1) typically 9.5 mA
• for ”1” signal (channels 2 to 7)
typically 7.5 mA
• permitted quiescentcurrent
0.5 mA
Input delay
• ”0” to ”1” transition 2.8 ms to 3,5 ms
• ”1” to ”0” transition 2.8 ms to 3.5 ms
Tolerated settling time forchangeover contacts
300 ms
Parallel wiring of inputs No
Counter
Standard or periodic countingfunctions• Number 2
• Channel 0, 1
Cascaded counting function
• Number 1
• Channel 0
Cascaded counting function
Encoder (max. frequency)
• Pulse-no-pulse ratio 1:1
• Edge steepness min. 100 ms
• Line resistance Rcable 1 k
Input frequency
• max. cable length 20 m 5 kHz
• max. cable length 100 m 1 kHz
• max. cable length 200 m 500 Hz
Pulse duration 200 s
Digital Electronic Modules
12-9Distributed I/O device ET 200iSPA5E00247483-02
Frequency counter
Number 2
Channel 0, 1
Measuring frequency (GATEtime)
50 ms, 200 ms,1 s
Frequency resolution
• at a GATE time of 50 ms 20 Hz
• at a GATE time of 200 ms 5 Hz
• at a GATE time of 1 s 1 Hz
Input frequency 3)
• max. cable length 20 m 5 kHz
• max. cable length 100 m 1 kHz
• max. cable length 200 m 500 Hz
1) Applies to NAMUR encoders/ encodersaccording to DIN 19234 and NAMURchangeover contacts / encoders according toDIN 19234 changeover contacts.
2) Applies to NAMUR encoders/ encodersaccording to DIN 19234/ wired single contactwith 10 k and to NAMUR changeover contacts/encoders according to DIN 19234 changeovercontacts/ wired changeover contacts with 10 k.
3) The system is unable to output the correct actualvalues if the input frequency exceeds approx.8 kHz.
Digital Electronic Modules
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A5E00247483-02
Diagnostics with the changeover encoder type
With the diagnostic functions for the changeover encoder type, the digitalelectronic module monitors the changeover between two input channels. If there isno signal transition at the NC contact when the specified changeover time (seetechnical specifications) has expired, the module outputs diagnostics information.
Purpose
You can use the diagnostics function to
analyze the encoder
verify that the switch has changed between the NO contact and the NC contact.
Principle
If the digital inputs of a channel group are set to ”changeover contact”, the moduleruns diagnostics for the changeover encoder type for this channel group. Thetolerated changeover time between the two channels is set to the fixed value of300 ms.
If the plausibility check returns a negative result,
the module indicates an ”invalid” value status of the NO channel,
creates a diagnostic entry for the NO contact channel, and
triggers a diagnostics interrupt.
The digital input signal and the value status are updated only for the NO channel(channel 0, 2, 4, 6). For the NC channel (channel 1, 3, 5, 7), the digital input signalis set to the fixed value ”zero,” and the value status is ”invalid” because thischannel is used only for the validation of the sensor.
Note the following points in the diagnosis for the changeover contact type ofsensor:
• If there is already an error on the NO contact channel (wire break, for example),the module no longer carries out a diagnosis for changeover contact errors.Changeover errors are still monitored on the other channels.
• You will find further details in the table below:
Table 12-7 Changeover Contact Diagnostics
Changeover contact Negative check means ...
Changeover switch asNAMUR
• Short-circuit or
• Wire break
Also:
Changeover error orexternal error (in DP
changeover switch withload resistance
• Encoder defective or short-circuit
Here, no distinction between a defective encoderand short-circuit is possible.
Changeover error orexternal error (in DPdiagnostics)
changeover switch withoutR-circuit
Caution: no differentiation possible between
• ”0” signal and wire break
• ”1” signal and short-circuit
Digital Electronic Modules
12-11Distributed I/O device ET 200iSPA5E00247483-02
12.2 Digital Electronic Module 4 DO
Order number
Type Order number
4 DO DC23.1V/20mA 6ES7 132-7RD00-0AB0
4 DO DC17.4V/27mA 6ES7 132-7RD10-0AB0
4 DO DC17.4V/40mA 6ES7 132-7RD20-0AB0
Features
• 3 versions of digital output modules (see above)
• 4 outputs per module
• Rated load voltage 23.1 VDC or 17.4 VDC
• Outputs support EEx i magnetic solenoid valves, DC relays and actuators
• To enhance performance, you can connect in parallel two digital outputs of the4 DO 17.4 VDC/27 mA (6ES7 132-7RD10-0AB0) or 4 DO 17.4 VDC/40 mA(6ES7 132-7RD20-0AB0) electronic module for one actuator. This powerincrease measure is only allowed on the same module and between thefollowing channels:
– Channel 0 and channel 1: bridge between terminal 3 and 7
– Channel 2 and channel 3: bridge between terminal 11 and 15
• You can connect an intrinsic switching signal to the actuator disable input. Thisallows a simultaneous shut-down of all outputs of the electronic module. Theswitching signal must be routed across a safety barrier. This function does notinfluence the process image of outputs (PIO).
Digital Electronic Modules
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A5E00247483-02
Terminal assignment
Pinout with inserted electronic module 4 DO (6ES7 132-7RD00-0AB0,6ES7 132-7RD10-0AB0, 6ES7 132-7RD20-0AB0)
Table 12-8 4 DO Terminal Assignment
Terminal assignment and view Comments
3
Example of a channel 0 connection
1 5 9 13
2 6 10
14
3 7 11
15
4 8 12
16
Channel
0 1 2 3
DO0 DO1 DO2 DO3
M M M M
SI+ SIM
0 21 3
1
2
DO0 DO1 DO2 DO3
Power increase by wiring channel0 and 1 in parallel
7Actuator shutdown
4 16SI+ SIM
Actuator connections:channel 0: Terminals 1 and 2
Channel 1: Terminals 5 and6
Channel 2: Terminals 9 and10
Channel 3: Terminals 13 and14
Power increase:parallel wiring of channels 0and 1: bridge betweenterminal 3 and 7
parallel wiring of channel 2and channel 3: bridgebetween terminal 11 and 15
Actuator shutdown at alloutputs channel 0 tochannel 3:terminal 4 or 8: positivevoltage (intrinsically safe),see Figure 12-6
terminal 12 or 16 Chassisground
DO: Digital outputsM: Chassis groundSI+: Signal input for channelshutdownSIM: Chassis ground
Digital Electronic Modules
12-13Distributed I/O device ET 200iSPA5E00247483-02
Block DiagramB
ackp
lane
bus
Backplanebus
interfaceC
1
Pow
erbu
s
26
10
14
DO0
M
3
57
9111315
48
12
16
DO1
DO2
DO3
SI+
SIM
MM
MSIM
Figure 12-2 Block Diagram 4 DO
Digital Electronic Modules
12-14Distributed I/O device ET 200iSP
A5E00247483-02
Technical Data
Dimensions and weight
Dimensions W x H x D (mm) 30 x 129 x 136.5
Weight approx. 255 g
Module-specific data
Number of outputs 4
Cable length
• Unshielded max. 200 m
• shielded max. 200 m
Type of protection
• CENELECII2 G (1) GD EEx ibia IIC T4
0344
Voltages, currents, electrical potentials
Electrical isolation
• Between channels andbackplane bus
yes
• Between the channels No
• Between channels andload voltage (Powerbus)
yes
Permitted potential difference
• Between different circuits 60 VDC, 30 VAC
Current consumption frompower supply (Powerbus)
• 4 DO DC23.1V/20mA max. 340 mA
• 4 DO DC17.4V/27mA max. 300 mA
• 4 DO DC17.4V/40mA max. 400 mA
Power loss of the module
• 4 DO DC23.1V/20mA 2.5 W
• 4 DO DC17.4V/27mA 2.1 W
• 4 DO DC17.4V/40mA 2.8 W
Status, interrupts, diagnostics
Status display
• Outputs green LED perchannel
Interrupts
• Process alarm No
• Diagnostic interrupt yes, configurable
Diagnostic functions
• Group error display red LED ”SF”
• Reading of diagnosticdata
yes
Monitoring function
• Short-circuit R < 80 (oneoutput)
R < 40 (outputswired in parallel)
• Wire break R1) > 10 k
I < 100A
Safety data
See EC Prototype Certificate KEMA04ATEX1249
Limit values for intrinsic switching signal SO:
• Vi 28 V
• Ii irrelevant
• Pi 1.2 W
• Ci 3 nF
• Li 0 mH
Digital Electronic Modules
12-15Distributed I/O device ET 200iSPA5E00247483-02
Data for Selecting an Actuator
No-load voltage UAO
• 4 DO DC23.1V/20mA min. 23.1 V
• 4 DO DC17.4V/27mA min. 17.4 V
• 4 DO DC17.4V/40mA min. 17.4 V
Internal resistance Ri
• 4 DO DC23.1V/20mA 275
• 4 DO DC17.4V/27mA 150
• 4 DO DC17.4V/40mA 150
Trend limit values E for4 DO DC23.1/20mA
• Voltage UE min. 17.1 V
• Current IE min. 20 mA(one output)
Trend limit values E for4 DO DC17.4/27mA
• Voltage UE min. 13.2 V
• Current IE min. 20 mA(one output)
min. 54 mA(outputs inparallel)
Trend limit values E for4 DO DC17,4/40mA
• Voltage UE min. 11.0 V
• Current Ii min. 40 mA(one output)
min. 80 mA(outputs inparallel)
Output delay (with ohmicload)
• ”0” to ”1” transition 2 ms
• ”1” to ”0” transition 1.5 ms
Connecting 2 outputs inparallel
yes
Switching frequency No
• with ohmic load 100 Hz
• with inductive load 2 Hz
Short-circuit protection of theoutput
yes
Residual current of the output max. 25 A
Data for selecting an encoder for the safetybarrier2)
Minimum switched voltage 15 V
Minimum switched current 2 mA
1) R=load resistance+ line resistance2) Contact without load resistance required when
operated as input
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Output Characteristics 4 DO DC23.1V/20mA
0
5
10
15
20
25
30
0 10 20 30 40 50 60
I [mA]
U [V]17.1 V
23.1
one output
Figure 12-3 Output Characteristics 4 DO DC23.1V/20mA
Output Characteristics 4 DO DC17.4V/27mA
0
5
10
15
20
25
30
0 10 20 30 40 50 60
I [mA]
U [V]
two outputs in parallel
13.2 V
17.4
one output
13.2 V
27 54
Figure 12-4 Output Characteristics 4 DO DC17.4V/27mA
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Output Characteristics 4 DO DC17.4V/40mA
0
5
10
15
20
25
30
0 10 40 60 80 100 120
I [mA]
U [V]
two outputs in parallel
11.0 V
17.4
one output
11020 30 50 70 90
11.0 V
Figure 12-5 Output Characteristics 4 DO DC17.4V/40mA
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Actuator Shutdown by Means of Intrinsically Safe Switching Signal(Safety Barrier)
An intrinsic signal routed across a safety barrier can be used to switch off one orseveral digital output modules.
Enable this function by connecting the terminals of the safety barrier to terminals4/8 (+) and 12/16 (–) of the digital output module. Terminals 12/16 are wiredinternally to chassis ground of the electronic module.
You can also disconnect several digital output modules connected in parallel,depending on the maximum output current of the safety barrier (see Figure 12-6.)Note the maximum current of Imax = 4.4 mA per digital output module.
If an intrinsically safe switching signal is not input, the digital output moduleoperates in standard mode.
4
8
12
16
4 DO
PA
/ PA
+ 24 VUO = 28 V
Safety barrier
4 DO
4 DO
4
8
12
16
4
8
12
16
Figure 12-6 Actuator Shutdown by Means of Intrinsically Safe Switching Signal (Safety
Barrier)
Notice
You may only use safety barriers with equipotential ground PA!
Make sure you safely connect the safety barrier and the (last) digital electronicmodule controlled by the switching signal to the equipotential busbar PA. Thisautomatically interconnects ground of all outputs with the equipotential busbar PA.
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12.3 Parameters of the Digital Electronics Modules
12.3.1 Digital Electronic Module 8 DI NAMUR
Configuration with STEP 7 Version 5.3, Service Pack 1 or higher, and currentHW update
For a description, refer to the online help for STEP 7.
Configuration with GSD file
Several configuration options for the digital electronic module 8 DI NAMUR areavailable in the HW catalog of the engineering software:
• ”8 DI NAMUR” configuration: 8 digital inputs
• ”2 Count/ 6 DI NAMUR” configuration: 2 counters and 6 digital inputs
• ”2 Count/ 6 Control” configuration: 2 counters and 6 control signals
• ”2 Trace/ 6 DI NAMUR” configuration: 2 frequency counters and 6 digital inputs
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Parameter 8 DI NAMUR, configuration ”8 DI NAMUR”
For information on parameter assignment, refer to chapter 6.
Table 12-9 ”8 DI NAMUR” parameters
Parameters Range of values Default Effective range
Time stamping1) • enabled
• disabled
disabled channel
Edge signal evaluationcoming event1)
• Rising edge (0––>1)
• Falling edge (1––>0)
Rising edge (0––>1) channel
Encoder type • Channel disabled
• NAMUR encoder
• Single contact, noload resistance
• Single contact with10k loadresistance
• NAMUR changeovercontact
• Changeover contactwithout loadresistance
• Changeover contactwith 10k loadresistance
NAMUR encoder channel
Pulse stretching • none
• 0.5 s
• 1 s
• 2 s
none channel
Group diagnostics • enabled
• disabled
enabled channel
Wire break diagnostics • enabled
• disabled
enabled channel
Short-circuit diagnostics • enabled
• disabled
enabled channel
Flutter error diagnostics • enabled
• disabled
disabled channel
External error(faulty changeovercontact or encoderpower supply)
• enabled
• disabled
disabled channel
Flutter monitoring:Monitoring window2)
• 0.5 s
• 1 s to 100 s(resolutionadjustable in stepsof 1 s)
2 s channel
Flutter monitoring:Number of signaltransitions2)
2 to 31 5 channel
1) Can only be assigned in HW Config and if the ET 200iSP is being operated as an S7 DP slave.2) This parameter can only be edited if flutter error diagnostics is enabled.
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Parameter 8 DI NAMUR, configuration ”2 Count/ 6 DI NAMUR” and ”2 Count/ 6 Control”
In addition to the ”8 DI NAMUR” configuration, you can set the following countingparameters:
Table 12-10Parameters for ”2 Count/ 6 DI NAMUR” and ”2 Count/ 6 Control”
Parameters Range of values Default Effective range
Encoder type counterinputs
• Channel disabled
• NAMUR encoder
• Single contact, no loadresistance
NAMUR encoder channel
Counter 1 mode • Standard countingfunction
• Periodic counting function
• Cascaded countingfunction
Standard countingfunction
channel 0
Counter 2 mode • Standard countingfunction
• Periodic counting function
Standard countingfunction
channel 1
Parameter 8 DI NAMUR, configuration ”2 Count/ 6 Control”
In addition to the ”8 DI NAMUR” configuration, you can set the following countingparameters:
Table 12-11 ”2 Count/ 6 Control” Parameters
Parameters Range of values Default Effective range
Control channel • Channel disabled
• NAMUR encoder
• Single contact, no loadresistance
NAMUR encoder channel
Parameter 8 DI NAMUR, configuration ”2 Trace/ 6 DI NAMUR”
In addition to the ”8 DI NAMUR” configuration, you can set the following frequencycounting parameters:
Table 12-12Parameters for ”2 Trace/ 6 DI NAMUR”
Parameters Range of values Default Effective range
Encoder type frequencyinputs
• Channel disabled
• NAMUR encoder
• Single contact, no loadresistance
NAMUR encoder channel
Measuring window(GATE)
• 50 ms
• 200 ms
• 1 s
1 s channel
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12.3.2 Digital electronic module 4 DO
Parameters 4 DO
For information on parameter assignment, refer to chapter 6.
Table 12-13Parameters for 4 DO
IM 152 parameters Range of values Default Effective range
Parallel connection ofchannels*
• yes
• no
no channel 0
channel 2
Response when CPU/Master goes to STOPmode
• apply substitutevalue
• Hold last value
apply substitute value channel
Substitute value • 0
• 1
0 Channel
Group diagnostics • enabled
• disabled
enabled Channel
Wire break diagnostics • enabled
• disabled
enabled Channel
Short-circuit diagnostics • enabled
• disabled
enabled Channel
* Not possible for 4DO DC23.1V/20mA
!Danger
The substitution values are store in flash memory of IM 152. These are output atthe next startup of the ET 200iSP until it starts exchanging data with the DPmaster (see Section 11.1).
Make allowances for this reaction when you assign the ET 200iSP to a differentconfiguration environment.
Remedy: Delete flash memory in IM 152 (see chapter 7.2).
12.4 Parameters of the Digital Electronics Modules
12.4.1 Time Stamping
Use this parameter to enable tie stamping separately for each digital input of themodule. The time stamp will be passed from the ET 200iSP to the S7-400 or OS ifyou also enable the ”Time Stamp” parameter in the IM 152.
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12.4.2 Pulse Stretching
The pulse stretching is a function used to modify a digital input signal. A pulse at adigital input is stretched to at least the length set in the parameters. If the inputpulse is already longer than the selected length, it is not changed
Principle of Pulse Stretching
The figure below shows a few examples of input pulse modification.
Pulse stretching parameter = T1
Process signal
”processed”input signal
Pulse is shorter than T1,and is stretched to T1 .
Pulse is longer than T1 andis thus not changed.
Process signal
”processed”input signal
The second pulse output during activepulse stretching is shifted until thecurrent stretching period has expired.
Short pulses output within a pulsestretching cycle are ignored.
T1 for 0 > 1 edge T1 for 1 > 0 edge
Figure 12-7 Principle of Pulse Stretching
Note
If you set pulse stretching for an input channel, this also affects the fluttermonitoring enabled for this channel. The ”pulse stretched” signal is the input signalfor flutter monitoring. You should therefore adapt the pulse stretching parametersand flutter monitoring functions to each other. Select appropriate parameter valuesin order to tune the functions to your process.
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12.4.3 Flutter Monitoring
Flutter monitoring is a process control function for digital input signals. It detectsand reports unusual process control signal patterns, for example, frequentfluctuation of the ”0” and ”1” input signal. Such signal activities are an indicationthat a sensor is defective or that the process is unstable.
Enabling flutter monitoring
Enable flutter monitoring by setting the number of signal transitions to a value otherthan ”0.”
Detection of unusual signal patterns
A configurable monitoring window is available for each input channel. Themonitoring window is started at the first transition of the input signal. If the numberof input signal transitions within the monitoring window exceeds the set number,the system detects a flutter error. If a flutter error is not detected within themonitoring window, the monitoring window is started again at the next signalchange.
Reporting a Flutter Error
If a flutter error occurs, the current signal state is entered in the process image andthe value status of the signal is set to ”invalid”. The diagnostic information ”fluttererror” is entered and a diagnostic interrupt entering the state is triggered.
You must evaluate and process the value status and the diagnostic information inthe user program.
Resetting a Flutter Error
If no further fluttering of the input signal is detected during the triple monitoringwindow, the diagnostic entry is removed and an outgoing diagnostic interrupt istriggered. The value status of the current signal in the process image is set to”valid”.
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Principle
The following figure illustrates the principle behind flutter monitoring.
Module diagnostics ”Flutter error”incoming = report
Module diagnostics ”Flutter error” going= reset
Diagnostics
Processsignal
Detection
3 x monitoring window t = 3xParameter for monitoring window t = x
Parameter for the number of signal transitions = 9
Figure 12-8 Principle of Flutter Monitoring
12.4.4 Counting Parameters
The counting function is described in chapter 3.10.
12.4.5 Frequency Counting Parameters
The frequency counting function is described in chapter 3.11.
12.5 Identification and Message Functions (I&M)
For information on I&M functions, refer to chapter 3.12.
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Analog Electronic Modules
13.1 Analog Value Visualization
Electronic modules with analog inputs
With the electronics module with analog inputs, continuously variable signals, suchas those occurring in temperature measurement and pressure measurement, canbe acquired, evaluated, and converted to digital values for further processing.
Electronic modules with analog outputs
With the electronics modules with analog outputs, digital values set by a controllercan be converted to a corresponding analog signal (current) in an analog outputmodule and used to control suitable actuators (setpoint input for speed controllers,temperature controllers and similar).
Measured Values in the Event of Wire Break Dependent on Enabled Diagnostics
For the measuring range tables
• 4 to 20 mA
• Temperature sensor Pt100 standard and climatic, Ni100 standard and climatic
• Thermocouples type B, E, J, K, L, N, R, S, T, U
the following supplements and rules apply:
13
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Format of Analog Values S7
Table 13-1 Measured Values in the Event of Wire Break Dependent on Enabled Diagnostics (Format S7)
Module Parameter Assignment Measured Values Explanation
decimal hexadecimal
4 AI I • ”Wire break” diagnosticsenabled
32767 7FFFH • Diagnostics message”wire break”
• ”Wire break” diagnosticsdisabled1
• ”Overflow/underflow” diagnosticsenabled
–32768 8000H • Measured value afterleaving the undershootrange
• ”Value under low limit”diagnostic message
• ”Wire break” diagnosticsdisabled1
• ”Overflow/underflow” diagnosticsdisabled
– – • Measured value afterleaving the undershootrange
4 AI RTD
4 AI TC
• ”Wire break” diagnosticsenabled
32767 7FFFH • Diagnostics message ”wire break”4 AI TC
• ”Wire break” diagnosticsdisabled
– – • Open input: Undefined measuredvalue
1 Measuring range limits for detecting wire break in the measuring range 4 to 20 mA: at 3.6 mA
13.1.1 Analog Value Representation for Measuring Ranges withSIMATIC S7
Analog value visualization
With the same nominal range, the digitized analog value is the same for input andoutput values. Analog values are represented in two’s complement.
The following table shows the analog value representation of the analogelectronics modules.
Table 13-2 Analog Value Representation (SIMATIC S7 Format)
Resolution Analog Value
Bit number 15 14 13 12 11 10 9 8 7 6 5 4 3 2 1 0
Significance of the bits S 214 213 212 211 210 29 28 27 26 25 24 23 22 21 20
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Sign
The sign (S) of the analog value is always in bit number 15:
• ”0”
• ”1”
Examples
Table 13-3 Examples
Analog Value
decimal binary hexadecimal
–1 1111 1111 1111 1111 FFFFH
–32768 1000 0000 0000 0000 8000H
Measured Value Resolution
The following table shows the representation of the binary analog values and thecorresponding decimal and hexadecimal representation of the units of the analogvalues.
Table 13-4 presents the 11, 12, 13, and 15 bit + sign resolutions. Each analogvalue is entered left aligned in the ACCU. The bits marked with ”x” are set to ”0”.
Table 13-4 Measured Value Resolution of the Analog Values (SIMATIC S7 Format)
Resolution in Bits
Units Analog Value
Resolution in Bits decimal hexadeci-mal
High byte Low byte
11+S 16 10H S 0 0 0 0 0 0 0 0 0 0 1 x x x x
12+S 8 8H S 0 0 0 0 0 0 0 0 0 0 0 1 x x x
13+S 4 4H S 0 0 0 0 0 0 0 0 0 0 0 0 1 x x
15+S 1 1H S 0 0 0 0 0 0 0 0 0 0 0 0 0 0 1
Note
This resolution does not apply to temperature values. The converted temperaturevalues are the result of a conversion in the analog electronics module (seefollowing table)
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13.1.2 Measuring Ranges of the Analog Input Modules in S7 Format
Introduction
The tables in this section contain the digitized analog values for the measuringranges of the analog input modules.
Since the binary representation of the analog values is always the same, thesetables contain only a comparison of the measuring ranges with the units.
Voltage measuring ranges: 80 mV
Table 13-5 SIMATIC S7 Format: Measuring Range 80 mV
Measuring range 80 mV
UnitsRange 80 mV
decimal hexadecimalRange
> 94.071 32767 7FFFH Overflow
94.071 32511 7EFFH
: : : Overshoot range
80.003 27649 6C01H
Overshoot range
80.000 27648 6C00H
60.000 20736 5100H
: : : Nominal range
– 60.000 –20736 AF00H
– 80.000 –27648 9400H
– 80.003 –27649 93FFH
: : : Undershoot range
– 94.074 –32512 8100H
Undershoot range
< – 94.074 –32768 8000H Underflow
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Current measuring ranges: 0 to 20 mA, 4 to 20 mA
Table 13-6 SIMATIC S7 Format: Measuring Ranges 0 to 20 mA, 4 to 20 mA
Measuringrange
Measuringrange
UnitsRangerange
0 to 20 mArange
4 to 20 mA decimal hexadecimalRange
> 23.5178 > 22.8142 32767 7FFFH Overflow
23.5178 22.8142 32511 7EFFH
Overshoot: : : : Overshootrange
20.0007 20.0005 27649 6C01H
range
20.0000 20.0000 27648 6C00H
15.0000 16.0000 20736 5100H
: : : : Nominal range
0.0000 4.0000 0 0H
Negative values
3.9995 –1 FFFFH
UndershootNegative valuesare not possible
: : Undershootrangeare not possible
1.1852 –4864 ED00H
range
< 1.1852 –32768 8000H Underflow
Measuring ranges for resistive sensors: 600 absolute
Table 13-7 SIMATIC S7 Format: Measuring Ranges 600Ω Absolute
Measuring range 600 UnitsRange
decimal hexadecimalRange
> 705.53 32767 7FFFH Overflow
705.53 32511 7EFFH
: : : Overshoot range
600.02 27649 6C01H
Overshoot range
600.00 27648 6C00H
450.00 20736 5100H
: : : Nominal range
0.00 0 0H
–1 FFFFH
(negative values are notphysically possible)
: : Undershoot range1 (negative values are notphysically possible) –4864 ED00H
–32768 8000H Underflow1
1 with faulty connection
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Measuring range of resistive thermometer Pt 100 Standard
Table 13-8 SIMATIC S7 Format: Measuring Ranges Pt 100 Standard in °C and °F
Pt 100Standard in
C
Units Pt 100Standard in
F
UnitsStandard in
C(1 digit =
0.1C)
decimal hexadecimal
Standard inF
(1 digit = 0.1F)
decimal hexadecimal
Range
> 1000.0 32767 7FFFH > 1832.0 32767 7FFFH Overflow
1000.0
:
850.1
10000
:
8501
2710H
:
2135H
1832.0
:
1562.1
18320
:
15621
4790H
:
3D05H
Overshoot range
850.0
:
–200.0
8500
:
–2000
2134H
:
F830H
1562.0
:
–328.0
15620
:
–3280
3D04H
:
F330H
Nominal range
–200.1
:
–243.0
–2001
:
–2430
F82FH
:
F682H
–328.1
:
–405.4
–3281
:
–4054
F32FH
:
F02AH
Undershoot range
< – 243.0 –32768 8000H < – 405.4 –32768 8000H Underflow
Measuring range of resistive thermometer Pt 100 Climatic
Table 13-9 SIMATIC S7 Format: Measuring Ranges Pt 100 Climatic in in °C and °F
Pt 100Climatic
in C
Units Pt 100Climate
in F
UnitsClimatic
in C(1 digit =0.01C)
decimal hexadecimal
Climate in F
(1 digit =0.01 F)
decimal hexadecimal
Range
> 155.00 32767 7FFFH > 311.00 32767 7FFFH Overflow
155.00
:
130.01
15500
:
13001
3C8CH
:
32C9H
311.00
:
266.01
31100
:
26601
797CH
:
67E9H
Overshoot range
130.00
:
–120.00
13000
:
–12000
32C8H
:
D120H
266.00
:
–184.00
26600
:
–18400
67E8H
:
B820H
Nominal range
–120.01
:
–145.00
–12001
:
–14500
D11FH
:
C75CH
–184.01
:
–229.00
–18401
:
–22900
B81FH
:
A68CH
Undershoot range
< – 145.00 –32768 8000H < – 229.00 –32768 8000H Underflow
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Measuring range of resistive thermometer Ni 100 Standard
Table 13-10SIMATIC S7 Format: Measuring Ranges Ni 100 Standard in °C and °F
Ni 100Standard in
C
Units Ni 100Standard in
F
UnitsStandard in
C(1 digit =
0.1C)
decimal hexadecimal
Standard inF
(1 digit = 0.1F)
decimal hexadecimal
Range
> 295.0 32767 7FFFH > 563.0 32767 7FFFH Overflow
295.0 2950 B86H 563.0 5630 15FEH
: : : : : : Overshoot range
250.1 2501 9C5H 482.1 4821 12D5H
Overshoot range
250.0 2500 9C4H 482.0 4820 12D4H
: : : : : : Nominal range
–60.0 –600 FDA8H –76.0 –760 FDA8H
–60.1 –601 FDA7H –76.1 –761 FD07H
: : : : : : Undershoot range
–105.0 –1050 FBE6H –157.0 –1570 F9DEH
Undershoot range
< –105.0 –32768 8000H < –157.0 –32768 8000H Underflow
Measuring range of resistive thermometer Ni 100 Climate
Table 13-11 SIMATIC S7 Format: Measuring Ranges Ni 100 Climate in °C and °F
Ni 100Climate
in C
Units Ni100Climate
in F
UnitsClimate
in C(1 digit =0.01C)
decimal hexadecimal
Climate in F
(1 digit =0.01 F)
decimal hexadecimal
Range
> 295.00 32767 7FFFH > 325.11 32767 7FFFH Overflow
295.00
:
250.01
29500
:
25001
733CH
:
61A9H
327.66
:
280.01
32766
:
28001
7FFEH
:
6D61H
Overshoot range
250.00
:
–60.00
25000
:
–6000
61A8H
:
E890H
280.00
:
–76.00
28000
:
–7600
6D60H
:
E250H
Nominal range
–60.01
:
–105.00
–6001
:
–10500
E88FH
:
D6FCH
–76.01
:
–157.00
–7601
:
–15700
E24FH
:
C2ACH
Undershoot range
< – 105.00 –32768 8000H < – 157.00 –32768 8000H Underflow
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Measuring Range for Thermocouple: Type B
Table 13-12SIMATIC S7 Format: Measuring Range Type B in °C and °F
Type B Units
Type B Units
Type B in C decimal hexa
decimal
Type B in F decimal hexa
decimalRange
> 2070.0 32767 7FFFH > 3276.6 32767 7FFFH Overflow
2070.0
:
1820.1
20700
:
18201
50DCH
:
4719H
3276.6
:
2786.6
32766
:
27866
7FFEH
:
6CDAH
Overshoot range
1820.0
:
0.0
18200
:
0
4718H
:
0000H
2786.5
:
32
27865
:
320
6CD9H
:
0140H
Nominal range
–0.1
:
–120.0
–1
:
–1200
FFFFH
:
FB50H
31.9
:
–184.0
319
:
–1840
013FH
:
F8D0H
Undershoot range
< –120.0 –32768 8000H < –184.0 –32768 8000H Underflow
Measuring range for thermocouple type E
Table 13-13SIMATIC S7 Format: Measuring Range Type E in °C and °F
Type E Units
Type E Units
Type E in C decimal hexa
decimal
Type E in F decimal hexa
decimalRange
> 1200.0 32767 7FFFH > 2192.0 32767 7FFFH Overflow
1200.0
:
1000.1
12000
:
10001
2EE0H
:
2711H
2192.0
:
1832.1
21920
:
18321
55A0H
:
4791H
Overshoot range
1000.0
:
–270.0
10000
:
–2700
2710H
:
F574H
1832.0
:
–454.0
18320
:
–4540
4790H
:
EE44H
Nominal range
< –270.0 – 32768 8000H < –454.0 – 32768 8000H Underflow
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Measuring range for thermocouple type J
Table 13-14SIMATIC S7 Format: Measuring Range Type J in °C and °F
Type J Units
Type J Units
Type J in C decimal hexa
decimal
Type J in F decimal hexa
decimalRange
> 1450.0 32767 7FFFH > 2642.0 32767 7FFFH Overflow
1450.0
:
1200.1
14500
:
12010
38A4H
:
2EEAH
2642.0
:
2192.1
26420
:
21921
6734H
:
55A1H
Overshoot range
1200.0
:
–210.0
12000
:
–2100
2EE0H
:
F7CCH
2192.0
:
–346.0
21920
:
–3460
55A0H
:
F27CH
Nominal range
< –210.0 – 32768 8000H < –346.0 – 32768 8000H Underflow
Measuring range for thermocouple type K
Table 13-15SIMATIC S7 Format: Measuring range type K in °C and °F
Type K Units
Type K Units
Type K in C decimal hexa
decimal
Type K in F decimal hexa
decimalRange
> 1622.0 32767 7FFFH > 2951.6 32767 7FFFH Overflow
1622.0
:
1372.1
16220
:
13721
3F5CH
:
3599H
2951.6
:
2501.7
29516
:
25062
734CH
:
61B9H
Overshoot range
1372.0
:
–270.0
13720
:
–2700
3598H
:
F574H
2501.6
:
–454.0
25061
:
–4540
61B8H
:
EE44H
Nominal range
< –270.0 – 32768 8000H < –454.0 – 32768 8000H Underflow
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Measuring range for thermocouple type L
Table 13-16SIMATIC S7 Format: Measuring Range Type L in °C and °F
Type L Units
Type L Units
Type L in C decimal hexa
decimal
Type L in F decimal hexa
decimalRange
> 1150.0 32767 7FFFH > 2102.0 32767 7FFFH Overflow
1150.0
:
900.1
11500
:
9001
2CECH
:
2329H
2102.0
:
1652.1
21020
:
16521
521CH
:
4089H
Overshoot range
900.0
:
–200.0
9000
:
–2000
2328H
:
F830H
1652.0
:
–328.0
16520
:
–3280
4088H
:
F330H
Nominal range
< –200.0 –32768 8000H < –328.0 –32768 80000H Underflow
Measuring range for thermocouple type N
Table 13-17SIMATIC S7 Format: Measuring Range Type N in °C and °F
Type N Units
Type N Units
Type N in C decimal hexa
decimal
Type N in F decimal hexa
decimalRange
> 1550.0 32767 7FFFH > 2822.0 32767 7FFFH Overflow
1550.0
:
1300.1
15500
:
13001
3C8CH
:
32C9H
2822.0
:
2372.1
28220
:
23721
6E3CH
:
5CA9H
Overshoot range
1300.0
:
–270.0
13000
:
–2700
32C8H
:
F574H
2372.0
:
–454.0
23720
:
–4540
5CA8H
:
EE44H
Nominal range
< –270.0 –32768 8000H –32768 8000H <EE44H Underflow
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Measuring range for thermocouple type R, S
Table 13-18SIMATIC S7 Format: Measuring Range Type R, S in °C and °F
Type R, S Units
Type R, S Units
Type R, S in C decimal hexa
decimal
Type R, S in F decimal hexa
decimalRange
> 2019.0 32767 7FFFH > 3276.6 32767 7FFFH Overflow
2019.0
:
1769.1
20190
:
17691
4EDEH
:
451BH
3276.6
:
3216.3
32766
:
32163
7FFEH
:
7DA3H
Overshoot range
1769.0
:
–50.0
17690
:
–500
451AH
:
FE0CH
3216.2
:
–58.0
32162
:
–580
7DA2H
:
FDBCH
Nominal range
–50.1
:
–170.0
–510
:
–1700
FE0BH
:
F95CH
–58.1
:
–274.0
–581
:
–2740
FDBBH
:
F54CH
Undershoot range
< –170.0 –32768 8000H < –274.0 –32768 8000H Underflow
Measuring range for thermocouple type T
Table 13-19SIMATIC S7 Format: Measuring Range Type T in °C and °F
Type T Units
Type T Units
Type T in C decimal hexa
decimal
Type T in F decimal hexa
decimalRange
> 540.0 32767 7FFFH > 1004.0 32767 7FFFH Overflow
540.0
:
400.1
5400
:
4001
1518H
:
0FA1H
1004.0
752.1
10040
7521
2738H
1DC1H
Overshoot range
400.0
:
–270.0
4000
:
–2700
0FA0H
:
F574H
752.0
:
–454.0
7520
:
–4540
1D60H
:
EE44H
Nominal range
< –270.0 –32768 8000H < –454.0 –32768 8000H Underflow
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Measuring range for thermocouple type U
Table 13-20SIMATIC S7 Format: Measuring Range Type U in °C and °F
Type U Units
Type U Units
Type U in C decimal hexa
decimal
Type U in F decimal hexa
decimalRange
> 850.0 32767 7FFFH > 1562.0 32767 7FFFH Overflow
850.0
:
600.1
8500
:
6001
2134H
:
17771H
1562.0
1112.1
15620
11121
3D04H
2B71H
Overshoot range
600.0
:
–200.0
2000
:
–2000
1770H
:
F830H
1112.0
:
–328.0
11120
:
–3280
2B70H
:
F330H
Nominal range
< –200.0 –32768 8000H < –328.0 –32768 8000H Underflow
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13.1.3 Output Ranges of the Analog Output Modules in S7 Format
Introduction
The table in this section contains the digitized analog values for the measuringranges of the analog output modules.
Since the binary representation of the analog values is always the same, thesetables contain only a comparison of the measuring ranges with the units.
Current output ranges: 0 to 20 mA, 4 to 20 mA
Table 13-21SIMATIC S7 Format: Output Ranges 0 to 20 mA, 4 to 20 mA
Output range0 to 20 mA
Output range4 to 20 mA
UnitsRange0 to 20 mA 4 to 20 mA
decimal hexadecimalRange
0 0 > 32511 > 7EFFH Overflow
23.5178 22.8100 32511 7EFFH
Overshoot: : : : Overshootrange
20.0007 20.0005 27649 6C01H
range
20.0000 20.0000 27648 6C00H
: : : : Nominal range
0 4.0000 0 0H
0 3.9995 –1 FFFFH
Undershoot: : : : Undershootrange
0 0 –6912 E500H
range
0 0 < –6913 < E4FFH Underflow
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13.2 Basics of Analog Value Processing
13.2.1 Connecting Thermocouples
Introduction
This section contains additional information on connecting thermocouples.
Compensation of the Reference Junction Temperature
There are several ways in which you can measure the reference junctiontemperature to obtain an absolute temperature value from the difference intemperature between the reference junction and the measurement junction.
Table 13-22Compensation of the Reference Junction Temperature
Option Explanation Reference junctionparameter
No compensation You obtain not only the temperatureof the measurement junction. Thetemperature of the reference junction(transition from copper line tothermocouple line) influences thethermoelectromotive force as well.The measured value is thus faulty.
none
Use of aresistancethermometerPt100 climaterange to measurethe referencejunctiontemperature(practical method)
You can measure the referencejunction temperature using aresistance thermometer (Pt100climate range). If parameterizedaccordingly, this temperature value isdistributed to the 4 AI TC modules in the ET 200iSPwhere it is offset against thetemperature value obtained at themeasuring location.
Number of reference junctions: 2
The parameters of IM152 andof the 4 AI TC must beadapted:
• 4 AI RTD set to Pt100climate range in thecorrect slot;
• 4 AI TC: Referencejunction: ”yes”; selectreference junction number”1” or ”2”
• IM 152-1:Assignment of thereference junction to a slotwith 4 AI RTD; channelselection;
Internalcompensation 4 AITC
The TC sensor module (temperaturesensor) is mounted onto theterminals of terminal module EM 4AI TC. The temperature sensorreports the terminal temperature tothe 4 AI TC. This value is computedwith the measured value of thechannel of the electronic module.
• 4 AI TC:reference junction number”Internal”
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Extension to a reference junction
From their point of connection, thermocouples can be extended using equalizingcables as far as the reference junction (transition to copper wiring). The referencejunction can also be an ET 200iSP terminal module.
The compensation cables are made of the same material as the wires of thethermocouple. The connecting cables are made of copper. Make sure that you donot reverse polarity.
Compensation by means of resistive thermometer at the 4 AI RTD
If thermocouples connected to the inputs of the 4 AI TC have the same referencejunction, compensate using a 4 AI RTD.
You can assign the channels of the 4 AI TC module the reference junction number”1”, ”2” or ”Internal.” If you select ”1” or ”2”, the same reference junction (RTDchannel) is always used for all four channels.
IC+
M–
M+:
IC–
M–
M+:
4 AI RTD 4 AI TC
Abbreviations used:
M+: Measuring cable positive
M–: Measuring cable negative
IC+ Constant current cable positive
IC–: Constant current cable negative
Insulated thermocoupleswith externalcompensation by meansof resistive thermometer,connected to 4 AI RTD(channel 0)
4 AI RTD configured formeasuring range Pt100 climaterange
1 5 9 13
2 6 10 14
3 7 11 15
4 8 12 16
1 5 9 13
2 6 10 14
3 7 11 15
4 8 12 16
1 5 9 13
2 6 10 14
3 7 11 15
4 8 12 16
1 5 9 13
2 6 10 14
3 7 11 15
4 8 12 16
Figure 13-1 Compensation by 4 AI RTD
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Setting Parameters for the Reference Junction
You can set the reference junction for the 4 AI TC electronics modules using thefollowing parameters:
Table 13-23Reference Junction Parameters
Parameters Module Range of values Description
Slot reference junction1 to slot 2
IM 152 none, 4 to 35 With this parameter, you canassign up to 2 slots (none, 4 to35), in which the channels forreference temperaturemeasurement (calculating thecompensation value).
Input reference junctionreference junction 1 to 4input reference junction
IM 152 RTD on channel 0
RTD on channel 1
RTD on channel 2
RTD on channel 3
With this parameter you specifythe channel (0/1/2/3) forreference temperaturemeasurement (calculating thecompensation value) for therelevant slot.
Reference junction E0 toreference junction E3
4 AI TC none
yes
With these parameters, you canenable the use of the referencejunction.
Reference junctionnumber
4 AI TC 1
2
Internal
With this parameter, you assignthe reference junction (1 to 2)containing the referencetemperature (compensationvalue).
Example of the Configuration of Reference Junctions
• Structure: For simplification purposes, Figure 13-2 shows only RTD and TCmodules:
Referencejunction 1
Compensation by 4 AI RTD modules
Example
... 4 A
I RT
D
E0
E1
E2
E3
... 4 A
I RT
D
E0
E1
E2
E3
... 4 A
I TC
E0
E1
E2
E3
... 4 A
I TC
E0
E1
E2
E3
...
4 A
I TC
E0
E1
E2
E3
...
Referencejunction 2
8 11 15 22 32
Figure 13-2 Example of the Configuration of Reference Junctions
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• Relevant parameters for interface module IM 152-2
Parameters Value
Slot reference junction 1 8
Input reference junction 1 RTD on channel 0
Slot reference junction 2 11
Input reference junction 2 RTD on channel 1
• Relevant parameters for 4 AI RTD and 4 AI TC:
Slot Parameters Value
8 (4 AI RTD) Measurement type / range I0 RTD-4 wire connection/ Pt 100 climatic range
11 (4 AI RTD) Measurement type/range I0 RTD-4 wire connection/ Pt 100 climatic range
15 (4 AI TC) Reference junction I0 yes
Reference junction E1/E2/E3 none
Reference junction number 2
Measuring range E0 Type...
Reference junction E1/E2/E3 (any)
22 (4 AI TC) Reference junction E0/E1 yes
Reference junction E2/E3 none
Reference junction number 1
Measuring range E0/E1 Type...
Measuring range E2/E3 (any)
32 (4 AI TC) Reference junction I0 none
Reference junction E1 yes
Reference junction E2/E3 none
Reference junction number 1
Measuring range E0 (any)
Measuring range E1 Type...
Measuring range E2/E3 (any)
Non-insulated thermocouples
If you use non-insulated thermocouples, make sure that you adhere to thepermitted common mode voltage.
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13.3 Basics of HART
What is HART?
With the HART functionality, you can operate the analog modules with additionaldigital communications options. The HART protocol has become established as the”de facto” standard protocol for communication with intelligent field devices: HARTis a registered trademark of the ”HART Communication Foundation” (HCF), whichholds all rights for the HART protocol.
Note
The HART analog modules support the HART Protocol V6.0.
13.3.1 HART Features
What Are the Advantages of HART?
Advantages of using HART analog modules:
• Connection compatible with the analog modules: current loop 4 – 20 mA
• Additional digital communication using the HART protocol
• Low energy requirements of HART, important for applications in hazardousareas
• Numerous field devices with HART functions are in use
What Are the Typical Applications for HART?
• Commissioning of field devices (centralized parameter assignment)
• Online changeability of field device parameters
• Information, maintenance, and diagnostic displays for the field devices
13.3.2 Function Principle of HART
Introduction
The HART protocol describes the physical form of the transfer:
transfer procedures, message structure, data formats and commands.
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HART Signal
The following figure shows the analog signal as carrier of the modulated HARTsignal (FSK technique) composed of 1200 Hz and 2200 Hz sine waves having anaverage value of zero. It can be filtered out using an input filter so that the originalanalog signal is available again.
+0.5 mA
0
–0.5 mA1200 Hz
”1”2200 Hz
”0”
Analog signal
4 mA
20 mA
Time (seconds)
A=AnswerC
A C A CA
C=Command
0
Figure 13-3 The HART Signal
HART Commands and Parameters
With SIMATIC PDM, you can assign parameters for the HART field devices usingHART commands and read them out using HART response messages. TheHART commands and their parameters are divided into three groups with thefollowing properties:
• universal
• general usage
• device-specific
Universal commands must be supported by all manufacturers of HART fielddevices, and common practice commands should be supported. There are alsocommands specific to the device that apply only to the particular field device.
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Examples of HART Parameters
The following table presents HART parameters of the various groups:
Table 13-24Examples of HART Parameters
Parameter Group Parameters of the HART Field Device
universal Measured value or manipulated variable(primary variable), manufacturer, tag, oridentifier for actuator, other measuredvalues or manipulated variables
general usage Measuring range, filter time, alarmparameters (message, alarm and warninglimits, output range)
device-specific Special diagnostic information
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13.3.3 Integration of HART Field Devices with ET 200iSP
Use in the ET 200iSP
With a HART analog module, you can connect a field device to each of the fourchannels. The module operates as the HART master, the field devices as HARTslaves.
SIMATIC PDM sends and receives data via the HART analog module, comparableto a client to which the HART analog module acts as a server.
ET 200iSP in enclosure
Measuring transducer Final control elements
for exampleSIPART PS
Intelligent fielddevices suchas SITRANS P
HART slave
4 AI I 2WIRE HART = HART master = 4 AO I HART
lowestlayer:
Figure 13-4 Location of the HART Analog Modules in the Distributed System
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13.3.4 Use of HART
System Environment for Using HART
To use an intelligent field device with HART functionality, you require the followingsystem environment:
Current loop 4 – 20 mA via the analog electronics modules: 4 AI I 2WIRE HART,4 AI I 4WIRE HART or 4AO I HART.
The HART analog module takes over the function of a ”master” by receiving thecommands from the HART parameter assignment tool, passing them on to theintelligent field device, and then returning the response messages. The interface ofthe HART analog module is represented by data records that are transferred viathe I/O bus. These data records are generated or interpreted by the HARTparameter assignment tool (SIMATIC PDM).
The analog values are entered in the process input and output image in 16-bitformat and with up to 4 IEEE tags (master or auxiliary tags).
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STEP 7, SIMATIC PDM, HART-Handheld
You can assign the HART parameters either with an external HART handhelddevice or with SIMATIC PDM. SIMATIC PDM accesses through the HART analog module, while the HARThandheld is connected directly in parallel to the field device.
SIMATICPDM
4 to 20 mA
L+ 24 V
ADC
HART- resistor
Analog/Digital Conversion
of the cyclic measured value
modemFiltering of
M : Chassis ground
HART- signal
RS 485 IS coupler
PROFIBUS-DP
HART Handheld (EEx i)
Field device with HARTfunctionality
Figure 13-5 System Environment for HART Applications
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Transparent Message Data Format
The ET 200iSP HART analog modules support the transparent message dataformat. With SIMATIC PDM, you therefore have direct access to the HART fielddevices for commands and response messages.
Every HART analog module is equipped with a shared HART modem for the fourchannels. This means that you can only directly access one channel of the moduleat any given time with SIMATIC PDM (channel multiplexing). Simultaneous, directaccess to the second channel of the same module is not possible.
If the channels are on different HART analog modules, you can access a maximumof 6 channels directly with SIMATIC PDM.
Additional Properties of the ET 200iSP HART Analog Modules
Table 13-25Properties of the ET 200iSP HART Analog Modules
Features Explanation
Secondary master cannot be connected
(secondary master exclusion)
no
Direct response with the validity of the data following awrite request
(application supported parameter check)
no
Several HART field devices are supplied over one line.
(multi-drop mode)
no, analog value = 0
Type of communication in HART in which the masterrequests the HART field device to send responsescyclically and continuously at a predefined HARTcommand (for example, reading the measured variable)
(burst mode)
no
HART master cyclically sends a predefined HARTcommand to the connected HART field device.
(scan mode)
no
Use of the compact data format
(Compact HART Message Format)
no
A HART client sends a sequence of HART commands. Noother client can interrupt this sequence
(successive HART commands mode)
no
Parameters are stored in non-volatile memory.
(Parameter Stored Non Volatile)
no
Automatic disabling of the burst mode
(Burst-Mode Auto Disable)
no
Maximum data field length
(data length)
64 bytes (corresponds to 75byte data record in thetransparent message dataformat)
Client management
(Client Management)
no, only 1 client per channel(4 ”mailboxes” per module)
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13.3.5 IEEE Tags
Features
Each analog module with HART can read up to four IEEE tags in addition to theanalog value. These tags are represented in IEEE 754 format. This is theFloat Format to IEEE Standard 754 Short Real Number (floating point format).
Each IEEE tag is accompanied by a status byte. The status byte informs you aboutthe validity of the measured value.
The representation of a tag in IEEE754 format requires 4 bytes + 1 status byte.
Byte xByte x+1Byte x+2Byte x+3
Byte x+4 Status byte
IEEE tag (IEEE754 format)
Figure 13-6 IEEE Tag
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HART Measured Value in IEEE Format (byte x to byte x+3)
Below you can see the representation of a HART measured value in IEEE format,and the conversion of an IEEE word to a decimal value.
–192
–182
–172
–202
–232
–222
–212
–112
–102
–92
–122
–152
–142
–132
–162
Byte x Byte x +1
Byte x +2 Byte x +3
ExponentialS Mantissa
Mantissa Mantissa
Byte x / Byte x +1
Byte x +2 / Byte x +3
S=Sign
Example: Conversion of an IEEE value to a decimal value
0100 0000 1111 0000 0000 0000 0000 0000B: = 40 F0 00 00H
Byte x Byte x+1 Byte x+2 Byte x+3
Exponential= 129d 2-3 =0.125
2-2 =0.252-1 =0.5
Mantissa with bit ”1”
Measured value = (-1)S x 2(Exponent-127) x (1+Mantissa with bit ”1”)
Measured value = (-1)0 x 2(129-127) x (1+2-1+2-2 +2-3 )
Measured value = (1 x 4 x (1+0.5+0.25 +0.125)
Measured value = 7.5
–82
7 6 5 4 3 2 1 015 14 13 12 11 10 9 8
52
62
72
42
12
22
32
31 30 29 28 27 26 25 24–32
–22
–12
–42
–72
–62
–52
02
23 22 21 20 19 18 17 16
S
Figure 13-7 IEEE754 Format
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Status byte (byte x +4)
The structure of the status byte corresponds to the PROFIBUS-PA profile.The ET 200iSP uses the following status codes of the PROFIBUS-PA profile:
7 6 5 4 13 2 0HART status byte for HART measuredvalue 1, as specified by HART
Limits: reports violation of limits
Substatus: differentiates and enhances the quality of thecorresponding measured value. The meaning depends on ”Quality”,see the operating manual of the HART field device
Quality: describes the basic quality of a measured value
Byte x+4
Status codes of the PROFIBUS-PA profile used in ET 200iSP:
01 0011 00 (4CH) uncertain, initial value (prior to first negotiation)00 0110 00 (18H) bad, no communication (communication error)00 0011 00 (0CH) bad, device failure01 0001 11 (47H) uncertain, last usable event, constant (device is busy)10 0001 00 (84H) good, update event (reconfiguring)10 0000 00 (80H) good, ok (no error)
Figure 13-8 Status Byte
13.3.6 HART Data Records
Requirements
You require this information if you want to go beyond the standard applications ofSTEP 7 and PDM or use your own configuration tool for HART communication.
Data Record Interface
Analog modules with HART use data records as the input and output interface:
The mapping of HART commands and HART response messages inPROFIBUS-DP data records is based on the PROFIBUS Profile HART Version1.0. For more detailed information on the HART protocol, refer to PROFIBUS DPHART Profile Application Guidelines.
You can obtain this documentation from the PNO (PROFIBUS users organization)on the Internet at http://www.profibus.com.
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Table 13-26HART Data Records
Datarecordnumber
Read / Write Size in bytes Description
148 read 13 Directory process data
DR information (data record directory): This data record contains the data recordnumbers (index) of all HART data records and information on numbers and revisions.
149 read 3 HMD Feature Parameter Process Data
HART Feature Flags:This data record describes which optional HART features aresupported.
129 Read / Write 6 HMD Parameter Process Data
HART parameters: This data record contains the parameters for the HART master. Whenthis data record is read, you can evaluate the status of the configuration. There are novendor–specific parameters for the analog modules with HART.
140 Read / Write 12 HART Mapping Data Record
HART Mapping Data Record: This data record contains the assignment of the individualHART measured values to the module channels.
80 write 75 HART Request Write Process Data
Mailbox channel 0: This data record contains the transfer data for the command from theclient to the HART field device (on channel 0).
81 read 75 HART Response Read Process Data
Mailbox channel 0: This data record contains the transfer data for the reply from theHART field device (on channel 0) to the client.
82 write 75 HART Request Write Process Data
Mailbox channel 1:This data record contains the transfer data for the command from theclient to the HART field device (on channel 1).
83 read 75 HART Response Read Process Data
Mailbox channel 1: This data record contains the transfer data for the reply from theHART field device (on channel 1) to the client.
84 read 75 HART Request Write Process Data
Mailbox channel 2: This data record contains the transfer data for the command from theclient to the HART field device (on channel 2).
85 read 75 HART Response Read Process Data
Mailbox channel 2: This data record contains the transfer data for the reply from theHART field device (on channel 2) to the client.
86 read 75 HART Request Write Process Data
Mailbox channel 3: This data record contains the transfer data for the command from theclient to the HART field device (on channel 3).
87 read 75 HART Response Read Process Data
Mailbox channel 3: This data record contains the transfer data for the reply from theHART field device (on channel 3) to the client.
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Reading and Writing Data Records
To read and write data records, use the following SFCs:
• Read data record: SFC59 ”RD_REC”
• Write data record: SFC 58 ”WR_REC”
For more detailed information on SFCs, refer to the System Software forS7–300/400 System and Standard Functions.
13.4 Response of the Analog Modules during Operation and ifFaults Occur
Influence of the Power Supply and the Operating State
The input and output values of the analog modules are dependent on the supplyvoltage for electronics/sensors and on the operating state of the PLC (CPU of theDP master).
Table 13-27Dependencies of the Input and Output Values on the Operating State of the PLC (CPU of theDP Master) and the Supply Voltage L +
Operating Stateof the PLC (CPUof the DP Master)
Power supplyL + an
ET 200iSP(power supply
module)
Input value of the electronicsmodule with analog inputs(evaluation possible in CPU
of the DP master)
Output Value of the Electron-ics Module with Analog Out-
puts
module)S7 format
POWERON
RUN L + present Process values PLC valuesON
7FFFH until first conversionafter startup, or afterassignment of parameters forthe module is completed.
Until first value output:
• After startup, a signal of 0 Vis output.
• Dependent on theparameter ”CPU/ masterSTOP”
POWERON
STOP L + present Process value Dependent on the parameter”CPU/ master STOP”
L + missing 7FFFH –
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Influence of the Value Range on the Analog Input
The response of the electronics modules with analog inputs depends on the part ofthe value range in which the input values are located. Table 13-28 illustrates therelationship.
Table 13-28Response of the Analog Modules, Depending on the Location of the Analog Input Value in theRange of Values
Measured value is in Input value in SIMATIC S7 format
Nominal range Measured value
Overrange/underrange Measured value
Overflow 7FFFH
Underflow 8000H
Until valid measured values are available 7FFFH
Influence of the Value Range on the Analog Output
The response of the electronics modules with analog outputs depends on the partof the value range in which the output values are located. Table 13-29 illustratesthis relationship.
Table 13-29Response of the Analog Modules, Depending on the Location of the Analog Output Value inthe Range of Values
Output Value is in Output value in SIMATIC S7 format
Nominal range Value from DP master
Overrange/underrange Value from DP master
Overflow 0-signal
Underflow 0-signal
Before parameter assignment 0-signal
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13.5 Analog Electronic Module 4 AI I 2WIRE HART
Order Number
6ES7 134-7TD00-0AB0
Features
• 4 inputs for connecting HART field devices, 2-wire transducers (standardapplications)
• Configurable input range: HART / 4 to 20 mA
• Resolution 12 bits + sign
Terminal Assignment
Table 13-30Terminal Assignment of 4 AI I 2WIRE HART
Terminal assignment and view Comments
Example of a channel 0connection
1 5 9 13
2 6 10 14
3 7 11 15
4 8 12 16
Channel
0 1 2 3
M0+ M2+ M3+
0 21 3
1
2
mAmA
M1+
M0– M2– M3–M1–
2-wire transducer 1
Channel 0: Terminals 1 and 2
2-wire transducer 2
Channel 1: Terminals 5 and 6
2-wire transducer 3
Channel 2: Terminals 9 and 10
2-wire transducer 4
Channel 3: Terminals 13 and 14
M+: Input signal ”+”
M–: Input signal ”–”
The 2-wire transducers aresupplied over the measurementcircuits.
Analog Electronic Modules
13-32Distributed I/O device ET 200iSP
A5E00247483-02
Block DiagramB
ackp
lane
bus
Backplanebus
interfaceC
1
Pow
erbu
s
2
HART modem
Multiplexer
Converter 5
6
910
13
14
Inputs
Figure 13-9 Block Diagram of 4 AI I 2WIRE HART
Technical data
Dimensions and weight
Dimensions W x H x D(mm)
30 x 129 x 136.5
Weight approx. 230 g
Module-specific data
Supports clocksynchronized mode
No
Number of inputs 4
Cable length
• shielded max. 200 m
Type of protection
• CENELECII2 G (1) GD EEx ibia IIC T4
0344
Analog Electronic Modules
13-33Distributed I/O device ET 200iSPA5E00247483-02
Voltages, currents, electrical potentials
Power supply of the measuring transducers
yes
• Supply current max. 23 mA (per channel)
• Short-circuit proof yes
Electrical isolation
• Between channels andbackplane bus
yes
• Between the channels No
• Between channels andPowerbus
yes
Current consumption
• Current consumptionfrom power supply(Powerbus)
max. 320 mA
Power loss of the module 2.7 W
Analog Value Formation
Measurement principle integrating(Sigma-Delta)
Integration/conversion time/ resolution (per channel)
• Integration timeselectable
No
• Interference frequencysuppression in Hz
60; 50
• Basic conversion timeincluding integrationtime (per channel) in ms
30
• Cycle time in ms Number of activechannels permodule x basicconversion time
• Resolution (incl.overshoot range)
12 bits + sign
Smoothing of measuredvalues
yes, configurable in4 levels1)
Level: Time constant:
none 1 x cycle time
weak 4 x cycle time
medium 32 x cycle time
strong 64 x cycle time
Interference Suppression, Error Limits
Interference voltage suppression for f= n x(f11%), f1 = interference frequency
• Common modeinterference (peak valueof interference < ratedvalue of the input range)
min 70 dB
Crosstalk between inputs min. – 50 dB
Operational limits (in theentire temperature range,relative to the input range)
0.15%
Basic error limit (operationallimit at 25 C, related to theinput range)
0.1%
Temperature error (relativeto the input range)
0.005%/K
Linearity error (relative tothe input range)
0.015%
Repetition accuracy (in transient state at 25 C,relative to input range)
0.01%
Status, interrupts, diagnostics
Interrupts
• Limit value interrupt yes, configurable
• Diagnostic interrupt yes, configurable
Diagnostic functions
• Group error display red LED ”SF”
• Reading of diagnosticdata
yes
Monitoring function
• Short-circuit ILoad > 25 mA2)
• Wire break ILoad < 3.6 mA
Safety information
See EC PrototypeCertificate
KEMA 04ATEX1244
Analog Electronic Modules
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Data for selecting an encoder
Input ranges (rated values)/ input resistance
• Current 4 to 20 mA
Permitted current at currentinput (destruction limit)
90 mA
Connection of signalgenerators
possible
• For currentmeasurement
As 2-wire transducer possible
• Load of 2-wiretransducer
max. 750
1) Time elapsed until 63% of the level-change value is reached (see Figure 13-14)
2) I is in current limitation Current limitation is triggered at 25 mA. Short-circuit with <100 load
13.6 Analog Electronic Module 4 AI I 2WIRE HART
Order Number
6ES7 134-7TD50-0AB0
Features
• 4 inputs for connecting HART field devices, 4-wire transducer (standardapplications)
• Configurable input range: HART / 0 to 20 mA / 4 to 20 mA
• Resolution 12 bits + sign
Note
If you connect up to four encoders to the electronic module, you must connect the”–” measuring connections of the encoders one below the other or connect eachwith equipotential bonding using wires. The lines must be indifferent to interrupts.
Further measures are not required if you connect up to two encoders to channel 0and channel 2 (channels 1 and 3 have no R circuit.
Analog Electronic Modules
13-35Distributed I/O device ET 200iSPA5E00247483-02
Terminal Assignment
Table 13-31Terminal Assignment of 4 AI I 4WIRE HART
Terminal assignment and view Comments
Example of a channel 0connection
1
2
mAmA
1 5 9 13
2 6 10 14
3 7 11 15
4 8 12 16
Channel
0 1 2 3
M0+ M2+ M3+
0 21 3
M1+
M0– M2– M3–M1–
4-wire transducer 1
Channel 0: Terminals 1 and 2
4-wire transducer 2
Channel 1: Terminals 5 and 6
4-wire transducer 3
Channel 2: Terminals 9 and 10
4-wire transducer 4
Channel 3: Terminals 13 and 14
M+: Input signal ”+”
M–: Input signal ”–”
Block Diagram
Bac
kpla
ne b
us
Backplanebus
interfaceC
1
Pow
erbu
s
2
HART modem
Multiplexer
Converter 5
6
910
13
14
Inputs
Figure 13-10 Block Diagram of 4 AI I 4WIRE HART
Analog Electronic Modules
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Technical data
Dimensions and weight
Dimensions W x H x D(mm)
30 x 129 x 136.5
Weight approx. 230 g
Module-specific data
Supports clocksynchronized mode
No
Number of inputs 4
Cable length
• shielded max. 200 m
Type of protection
• CENELECII2 G (1) GD EEx ibia IIC T4
0344
Voltages, currents, electrical potentials
Power supply of the measuring transducers
No
Electrical isolation
• Between channels andbackplane bus
yes
• Between the channels No
• Between channels andPowerbus
yes
Current consumption
• Current consumptionfrom power supply(Powerbus)
max. 30 mA
Power loss of the module 0.4 W
Analog Value Formation
Measurement principle integrating(Sigma-Delta)
Integration/conversion time/ resolution (per channel)
• Integration timeselectable
yes
• Interference frequencysuppression in Hz
60; 50
• Basic conversion timeincluding integrationtime (per channel) in ms
30
• Cycle time in ms Number of activechannels permodule x basicconversion time
• Resolution (incl.overshoot range)
12 bits + sign
Smoothing of measuredvalues
yes, configurable in4 levels1)
Level: Time constant:
none 1 x cycle time
weak 4 x cycle time
medium 32 x cycle time
strong 64 x cycle time
Interference Suppression, Error Limits
Interference voltage suppression for f= n x(f11%), f1 = interference frequency
• Common modeinterference (peak valueof interference < ratedvalue of the input range)
min 70 dB
Crosstalk between inputs min. – 50 dB
Operational limits (in theentire temperature range,relative to the input range)
0.15%
Basic error limit (operationallimit at 25 C, related to theinput range)
0.1%
Temperature error (relativeto the input range)
0.005%/K
Linearity error (relative tothe input range)
0.015%
Repetition accuracy (in transient state at 25 C,relative to input range)
0.01%
Analog Electronic Modules
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Status, interrupts, diagnostics
Interrupts
• Limit value interrupt yes, configurable
• Diagnostic interrupt yes, configurable
Diagnostic functions
• Group error display red LED ”SF”
• Reading of diagnosticdata
yes
Monitoring function
• Wire break I < 3.6 mA
Safety information
See EC PrototypeCertificate
KEMA 04ATEX1245
Data for selecting an encoder
Input ranges (rated values)/ input resistance
• Current 0 to 20 mA / min. 295
4 to 20 mA / min. 295
Permitted current at currentinput (destruction limit)
50 mA
Connection of signalgenerators
possible
• For currentmeasurement
As 4-wire transducer possible
• Load of 4-wiretransducer
max. 750
1) Time elapsed until 63% of the level-change value is reached (see Figure 13-14)
13.7 Analog Electronic Module 4 AI RTD
Order Number
6ES7 134-7SD50-0AB0
Features
• 4 inputs for resistance thermometer or resistance measurement
• Input ranges:
– Resistance thermometer: Pt 100, Ni 100
– Resistance measurement: 600 ohms absolute
• Resolution 15 bits + sign
Analog Electronic Modules
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Terminal Assignment
Table 13-32Terminal Assignment of 4 AI RTD
Terminal assignment and view Comments
Example of a channel 0connection
1
2
1 5 9 13
2 6 10 14
3 7 11 15
4 8 12 16
Channel
0 1 2 3
M0+ M2+ M3+
0 21 3
M1+
M0– M2– M3–M1–
IC0+ IC2+ IC3+IC1+
IC0– IC2– IC3–IC1–
2-wire
1
2
1
2
3-wire 4-wire
3
4
3
Resistive thermometer 1
Channel 0: Terminals 1 to 4
Resistive thermometer 2
Channel 1: Terminals 5 to 8
Resistive thermometer 3
Channel 2: Terminals 9 to 12
Resistive thermometer 4
Channel 3: Terminals 13 to 16
M+: measuring line positive
M+: measuring line negative
IC+: constant current line positive
IC–: constant current line negative
Block Diagram
Bac
kpla
ne b
us
Backplanebus
interfaceC
1
Pow
erbu
s
2
Multiplexer
Converter5
6
Inputs
34
7
8
9
10
1314
1112
1516
Figure 13-11 Block Diagram of 4 AI RTD
Analog Electronic Modules
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Technical data
Dimensions and weight
Dimensions W x H x D(mm)
30 x 129 x 136.5
Weight approx. 230 g
Module-specific data
Supports clocksynchronized mode
No
Number of inputs 4
Cable length
• shielded max. 200 m
Type of protection
• CENELECII2 G (1) GD EEx ibia IIC T4
0344
Voltages, currents, electrical potentials
Constant measuring currentfor resistive encoder
typ. 1 mA
Electrical isolation
• Between channels andbackplane bus
yes
• Between the channels No
• Between channels andPowerbus
yes
Current consumption
• Current consumptionfrom power supply(Powerbus)
max. 22 mA
Power loss of the module 0.4 W
Analog Value Formation
Measurement principle integrating(Sigma-Delta)
Integration/conversion time/ resolution (per channel)
• Integration timeselectable
yes
• Interference frequencysuppression in Hz
60; 50
• Basic conversion timeincluding integrationtime (per channel) in ms
66; 80
• Additional conversiontime for wire breakcheck
5
• Cycle time in ms Number of activechannels permodule x basicconversion time
• Resolution (incl.overshoot range)
15 bits + sign
Smoothing of measuredvalues
yes, configurable in4 levels1)
Level: Time constant:
none 1 x cycle time
weak 4 x cycle time
medium 32 x cycle time
strong 64 x cycle time
Analog Electronic Modules
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Interference Suppression, Error Limits
Interference voltage suppression for f= n x(f11%), f1 = interference frequency
• Common modeinterference
min. 90 dB
• Common modeinterference (peak valueof interference < ratedvalue of the input range)
min 70 dB
Crosstalk between inputs min. – 50 dB
Operational limits (in theentire temperature range,relative to the input range)
• Resistive encoder 0.15%
• Pt100, Ni100 Standard 0 8 K
• Pt100, Ni100 Climate 0.3 K
Basic error limit (operationallimit at 25 C, related to theinput range)
• Resistive encoder 0.1%
• Pt100, Ni100 Standard 0.5 K
• Pt100, Ni100 Climate 0.2 K
Temperature error (relativeto the input range)
0.02%/K
Linearity error (relative tothe input range)
0.015%
Repetition accuracy (in transient state at 25 C,relative to input range)
0.01%
Status, interrupts, diagnostics
Interrupts
• Limit value interrupt yes, configurable
• Diagnostic interrupt yes, configurable
Diagnostic functions
• Group error display red LED ”SF”
• Reading of diagnosticdata
yes
Monitoring function
• Wire break R > 2 k
Safety information
See EC PrototypeCertificate
KEMA 04ATEX1247
Data for selecting an encoder
Input ranges (rated values)/ input resistance
• Resistance 600 absolute min 2 M
• Thermoresistor
Pt100 / min 2 M
Ni100 / min 2 M
Connection of signalgenerators
• For resistancemeasurement / RTD
4-wire connection possible
3-wire connection possible
2-wire connection possible
Characteristics linearization yes
• For resistivethermometers
Technical unit for dataformats
configurable
1) Time elapsed until 63% of the level-change value is reached (see Figure 13-14)
Analog Electronic Modules
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13.8 Analog Electronic Module 4 AI TC
Order Number
6ES7 134-7SD00-0AB0
Features
• 4 inputs for thermocouples or voltage measurement
• Input ranges:
– Thermal e.m.f. measurement: 80 mV
– Thermocouples: type B, E, J, K, L, N, R, S, T, U
– functional galvanic isolation, permissible common mode voltage 6.5 VDC,30 VppAC
• Linearization of the sensor characteristic curves
• Resolution 15 bits + sign
• Internal compensation of the reference junction temperature by means of TCsensor module (temperature sensor). The TC sensor module is supplied withthe 4 AI TC. This is mounted to the terminal module of 4 AI TC. For furtherinformation, refer to chapter 13.2.1.
Terminal Assignment
Table 13-33Terminal Assignment of 4 AI TC
Terminal assignment and view Comments
Example of a channel 0connection
1 5 9 13
2 6 10 14
3 7 11 15
4 8 12 16
Channel
0 1 2 3
M0+ M2+ M3+
0 21 3
M1+
M0– M2– M3–M1–
TC TC TC
TC sensormodule
TC
1
2
37
11 15
Thermocouple 1
Channel 0: Terminals 1 and 2
Thermocouple 2
Channel 1: Terminals 5 and 6
Thermocouple 3
Channel 2: Terminals 9 and 10
Thermocouple 4
Channel 3: Terminals 13 and 14
TC sensor module
Terminals 3, 7, 11, 15
M+: measuring linepositive
M+: measuring linenegative
Analog Electronic Modules
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A5E00247483-02
Block DiagramB
ackp
lane
bus
Backplanebus
interfaceC
1
Pow
erbu
s
2
Opto-multiplexer
Converter
5
6
Inputs
9
10
1314
711
3
TC sensor module
Figure 13-12 Block Diagram of 4 AI TC
Analog Electronic Modules
13-43Distributed I/O device ET 200iSPA5E00247483-02
Technical data
Dimensions and weight
Dimensions W x H x D(mm)
30 x 129 x 136.5
Weight approx. 230 g
Module-specific data
Supports clocksynchronized mode
No
Number of inputs 4
Cable length
• shielded max. 50 m
Type of protection
• CENELECII2 G (1) GD EEx ibia IIC T4
0344
Voltages, currents, electrical potentials
Electrical isolation
• Between channels andbackplane bus
yes
• Between the channels yes, functional
• Between channels andPowerbus
yes
Current consumption
• Current consumptionfrom power supply(Powerbus)
max. 30 mA
Power loss of the module 0.4 W
Analog Value Formation
Measurement principle integrating(Sigma-Delta)
Integration/conversion time/ resolution (per channel)
• Integration timeselectable
yes
• Interference frequencysuppression in Hz
60; 50
• Basic conversion timeincluding integrationtime (per channel) in ms
66; 80
• Additional conversiontime for wire breakcheck in ms
5
• Cycle time in ms Number of activechannels permodule x basicconversion time
• Resolution (incl.overshoot range)
15 bits + sign
Smoothing of measuredvalues
yes, configurable in4 levels1)
Level: Time constant:
none 1 x cycle time
weak 4 x cycle time
medium 32 x cycle time
strong 64 x cycle time
Interference Suppression, Error Limits
Interference voltage suppression for f= n x(f11%), f1 = interference frequency
• Common modeinterference (UCM < 60 V)
min. 90 dB
• Common modeinterference (peak valueof interference < ratedvalue of the input range)
min 70 dB
Crosstalk between inputs min. – 50 dB
Operational limits in theentire temperature range,relative to the input range 2)
1.5 K
Basic error limit (operationallimit at 25 C, relative toinput range)2)
1 K
Temperature error (relativeto the input range)
0.02%/K
Linearity error (relative tothe input range)
0.015%
Repetition accuracy (in transient state at 25 C,relative to input range)
0.01%
Limits of total error whenusing internal compensa-tion with TC sensor module
Analog Electronic Modules
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• Operational error limit(across the entiretemperature range instatic thermal state,ambient temperaturefluctuation < 10 K/h).See climatic ambientconditions.
3.5 K
• Base error limit(operational error limit at25C in static thermalstate, ambienttemperature fluctuation< 0.3 K/min)
2 K
Status, interrupts, diagnostics
Interrupts
• Limit value interrupt yes, configurable
• Diagnostic interrupt yes, configurable
Diagnostic functions
• Group error display red LED ”SF”
• Reading of diagnosticdata
yes
Monitoring function
• Wire break yes, configurable
• TC sensor module forinternal temperaturecompensation
yes
Safety information
See EC PrototypeCertificate
KEMA 04ATEX1246
1) Time elapsed until 63% of the level-change value is reached (see Figure 13-14)
2) the specified error limits apply as of thefollowing temperatures:thermocouple type T: –200Cthermocouple type B: +700Cthermocouple type N: –150Cthermocouple type E: –150Cthermocouple type R: +200Cthermocouple type S: +100C
Data for selecting an encoder
Input ranges (rated values)/ input resistance
• Thermal e.m.f. 80 mV/ min. 1M
• Thermocouple Typ. E, N, J, K, L, S,R, B, T, V/min. 1 M
Connection of signalgenerators
• For thermal e.m.f.measurement
possible
Characteristic curvelinearization
yes
• Thermal e.m.f.measurement:
Rated range linear
• Thermocouple Type E, N, J, K, L, S,R, B, T, U
Temperature compensation
• Internal temperaturecompensation
possible by meansof the supplied TCsensor module
• External temperaturecompensation
possible by meansof a temperaturevalue acquired at ananalog module ofthe same ET 200iSPstation
Analog Electronic Modules
13-45Distributed I/O device ET 200iSPA5E00247483-02
13.9 Analog Electronic Module 4AO I HART
Order Number
6ES7 135-7TD00-0AB0
Features
• 4 current outputs
• Output range (configurable)
– HART
– 4 to 20 mA
– 0 to 20 mA
• Resolution 14 bits
Analog Electronic Modules
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Terminal assignment
Terminal assignment and view Comments
Example of a channel 0connection
1 5 9 13
2 6 10 14
3 7 11 15
4 8 12 16
Channel
0 1 2 3
QI0+ QI2+ QI3+
0 21 3
QI1+
QI0+ QI2+ QI3+QI1+
1
2
Actuator 1
Channel 0: Terminals 1 and 2
Actuator 2
Channel 1: Terminals 5 and 6
Actuator 3
Channel 2: Terminals 9 and 10
Actuator 4
Channel 3: Terminals 13 and 14
QI: positive output (analog output current)
M: chassis ground
Block Diagram
Bac
kpla
ne b
us
Backplanebus
interfaceC
1
Pow
erbu
s
2
HART modem
Currentregulator
Converter5
6
910
13
14
Outputs
Figure 13-13 Block Diagram of 4AO I HART
Analog Electronic Modules
13-47Distributed I/O device ET 200iSPA5E00247483-02
Technical Data
Dimensions and weight
Dimensions W x H x D(mm)
30 x 129 x 136.5
Weight approx. 265 g
Module-specific data
Supports clocksynchronized mode
No
Number of outputs 4
Cable length
• shielded max. 200 m
Type of protection
• CENELECII2 G (1) GD EEx ibia IIC T4
0344
Voltages, currents, electrical potentials
Electrical isolation
• Between channels andbackplane bus
yes
• Between the channels No
• Between channels andPowerbus
yes
Current consumption
• From Powerbus loadvoltage
max. 330 mA
Power loss of the module 2.7 W
Analog Value Formation
Resolution (incl. overshootrange)
14 bits
• Cycle time in ms 3.6 ms
Settling time
• For resistive load max. 4 ms
• For capacitive load max. 40 ms
• For inductive load max. 40 ms
Interconnectablesubstitution values
yes
Interference Suppression, Error Limits
Crosstalk between outputs min. – 50 dB
Operational limits (in theentire temperature range,relative to the input range)
0.15%
Basic error limit (operationallimit at 25 C, related to theinput range)
0.1%
Temperature error (relativeto the input range)
0.005%/K
Linearity error (relative tothe input range)
0.015%
Repetition accuracy (in transient state at 25 C,relative to input range)
0.01%
Status, interrupts, diagnostics
Interrupts
• Diagnostic interrupt yes, configurable
Diagnostic functions
• Group error display red LED ”SF”
• Reading of diagnosticdata
yes
Monitoring function
• Short-circuit Iload > 1 mA
Rload < 30...60
• Wire break Iload > 1 mA
Rload < 0.68...24k)
Interconnectablesubstitution values
yes, configurable
Safety information
See EC PrototypeCertificate
KEMA 04ATEX1250
1) wire break depending on load current
Analog Electronic Modules
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Data for selecting an actuator
Output ranges (ratedvalues)
• Current 0 to 20 mA
4 to 20 mA
Load impedance (in thenominal range of theoutput)
max. 750
Connection of actuators
• For currentmeasurement
2-wire connection possible
13.10 Parameters of the Analog Electronic Modules
13.10.1 Parameters of the Analog Electronic Modules 4 AI I 2WIREHART, 4 AI I 4WIRE HART
Configuration with STEP 7 Version 5.3 Service Pack 1 or higher, and currentHW update
For a description, refer to the online help for STEP 7.
Configuration with GSD file
You can select various configurations for the analog electronic modules 4 AI I2WIRE HART and 4 AI I 4WIRE HART from the following entries in the HWcatalog of the engineering software.
• Configurations ”4 AI I 2WIRE HART” and ”4 AI I 4WIRE HART”:
Analog values are output in S7 format.
• Configurations ”4 AI I 4W+x” and ”4 AI I 4W+x”:
Analog values are output in S7 format. In addition, up to four IEEE tags (masteror auxiliary tag) are available in IEEE 754 format. You define the number ofIEEE tags (1 to 4) in the configuration data:
– ...4W+1
– ...4W+2
– ...4W+3
– ...4W+4
Analog Electronic Modules
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Parameters of the ”4 AI I 2WIRE HART” and ”4 AI I 4WIRE HART” Configurations
Table 13-34Parameters of the ”4 AI I 2WIRE HART” and ”4 AI I 4WIRE HART” Configurations
Parameters Range of values Default Effectiverange
4 AI I 2WIRE HART 4 AI I 4WIRE HARTrange
Process alarm (when limit value is exceeded) • enabled
• disabled
disabled channel
Measuring range ––– • disabled
• 4 to 20 mA
• HART
HART channel
––– Measuring range • disabled
• 0 to 20 mA
• 4 to 20 mA
• HART
HART channel
Group diagnostics • enabled
• disabled
enabled module
Overflow/underflow diagnostics • enabled
• disabled
enabled module
Smoothing • none
• weak
• medium
• strong
none channel
Hi limit value Lo to hi limit valueof the overshootrange(SIMATIC S7)
Hi limit value channel
Lo limit value Lo to hi limit valueof the overshootrange(SIMATIC S7)
Lo limit value channel
Wire break diagnostics • enabled
• disabled
enabled channel
Short-circuitdiagnostics
––– • enabled
• disabled
enabled channel
Analog Electronic Modules
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Parameters of the ”4 AI I 2W+x and ”4 AI I 4W+x” configurations
In addition to the ”4 AI I 2WIRE HART” and ”4 AI I 4WIRE HART” configurations,you can set the following parameters at the ”...W+x” configurations:
Table 13-35Parameters of the ”...W+x” Configuration
Parameters Range of values Default Effectiverange
2 AI I 2WIRE HART 2 AI I 4WIRE HARTrange
channel • 0
• 1
• 2
• 3
0 channel
IEEE tag • none
• master tag
• 1. auxiliary tag
• 2. auxiliary tag
• 3. auxiliary tag
none channel
HART warning • enabled
• disabled
disabled module
HART diagnostics • enabled
• disabled
disabled module
13.10.2 Parameters of the Analog Electronic Modules 4 AI RTD and4 AI TC
4 AI RTD and 4 AI TC Parameters
Table 13-364 AI RTD and 4 AI TC Parameters
Parameters Range of values Default Effectiverange4 AI RTD 4 AI TC
Range of values Default Effectiverange
Process alarm (when limit value isexceeded)1)
• enabled• disabled
disabled channel
Measurement type ––– • disabled• RTD 4-wire connection• RTD 3-wire connection• RTD 2-wire connection• R 4-wire connection• R 3-wire connection• R 2-wire connection
RTD 4-wireconnection
channel
Measuring range ––– • Pt 100 standard range• Pt 100 climate range• Ni 100 standard range• Ni 100 climate range• 600 absolute
Pt 100standard range
channel
Analog Electronic Modules
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Table 13-364 AI RTD and 4 AI TC Parameters
Parameters Effectiverange
DefaultRange of values
4 AI RTD
Effectiverange
DefaultRange of values
4 AI TC––– Measuring range • disabled
• 80 mV• Type B [PtRh-PtRh]• Type N [NiCrSi-NiSi]• Type E [NiCr-CuNi]• Type R [PtRh-Pt]• Type S [PtPh-Pt]• Type J [Fe-CuNi]• Type L [Fe-CuNi]• Type T [Cu-CuNi]• Type K [NiCr-Ni]• Type U [Cu-CuNi]
Type K[NiCr-Ni]
channel
Group diagnostics • enabled• disabled
enabled Module
Overflow/underflow diagnostics • enabled• disabled
enabled Module
Wire break diagnostics • enabled• disabled
enabled channel
Short-circuitdiagnostics2)
––– • enabled• disabled
enabled channel
––– Reference junction • none• yes• RTD
none channel
––– Reference junctionnumber
• 1• 2• Internal
1 channel
Smoothing • none• weak• medium• strong
none channel
Hi limit value Lo to hi limit value of theovershoot range(SIMATIC S7)
Hi limit value channel
Lo limit value Lo to hi limit value of theovershoot range(SIMATIC S7)
Lo limit value channel
1) refers to the ”Hi limit” and ”Lo limit” parameters2) Underflow is not indicated if short-circuit diagnostics is enabled.
Analog Electronic Modules
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13.10.3 Parameters of the Analog Electronic Module 4AO I HART
Configuration with STEP 7 Version 5.3 Service Pack 1 or higher, and currentHW update
For a description, refer to the online help for STEP 7.
Configuration with GSD file
Several configuration options for the digital electronic module 4AO I HART areavailable in the HW catalog of the engineering software:
• ”4AO I HART” configuration:
Analog values are output in S7 format.
• ”4AO I +x” configurations:
Analog values are output in S7 format. In addition, up to four IEEE tags (masteror auxiliary tag) are available in IEEE 754 format. You define the number ofIEEE tags (1 to 4) in the configuration data:
– ...I +1
– ...I +2
– ...I +3
– ...I +4
Analog Electronic Modules
13-53Distributed I/O device ET 200iSPA5E00247483-02
Parameters of the ”4AO I HART” Configuration
Table 13-37Parameters of the ”4AO I HART” Configuration
Parameters Range of values Default Effectiverange
Group diagnostics • enabled
• disabled
enabled module
Wire break diagnostics • enabled
• disabled
enabled channel
Short-circuit diagnostics • enabled
• disabled
enabled channel
Output range • disabled
• 0 to 20 mA
• 4 to 20 mA
• HART
HART channel
Response when CPU/master goes to STOPmode
• Output at zerocurrent/zerovoltage
• apply substitutevalue
• hold last value
apply substitutevalue
channel
Substitute value any value of therated range
0 to 20 mA: 0mA
4 to 20 mA andHART: 4 mA
channel
!Warning
The substitution values are store in flash memory of IM 152. These are output atthe next startup of the ET 200iSP until it starts exchanging data with the DPmaster (see Section 11.1).
Make allowances for this reaction when you assign the ET 200iSP to a differentconfiguration environment.
Remedy: Delete flash memory in IM 152 (see chapter 7.2).
Analog Electronic Modules
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Parameters of the ”...I +x” Configuration
In addition to the ”4AO I HART” configuration, you can set the followingparameters at the ”...I +x” configurations:
Table 13-38Parameters of the ”...I +x” Configuration
Parameters Range of values Default Effectiverange
Channel • 0
• 1
• 2
• 3
0 Channel
IEEE tag • none
• master tag
• 1. auxiliary tag
• 2. auxiliary tag
• 3. auxiliary tag
none Channel
HART warning • enabled
• disabled
disabled module
HART diagnostics • enabled
• disabled
disabled module
13.11 Description of the Parameters of the Analog ElectronicModules
13.11.1 Reference Junction / Reference Junction Number
A description of these parameters is found in chapter 13.2.1.
13.11.2 Smoothing
Using Smoothing
A reliable analog signal is made available for further processing by smoothing theanalog values.
The smoothing of analog values is useful with slow measured value fluctuation, forexample in temperature changes.
Analog Electronic Modules
13-55Distributed I/O device ET 200iSPA5E00247483-02
Parameters
The measured values are smoothed by means of digital filters. Smoothing isachieved by the module forming a mean value from a specified number ofconverted (digitized) analog values.
The user can set up to four smoothing levels, namely none, weak, medium orstrong. The level determines the number of analog signals used to form the meanvalue.
The stronger the smoothing, the more reliable the smoothed analog value, and thelonger it takes until the smoothed analog signal is applied following a stepresponse (see the example below).
Example
The following diagram illustrates the number of module cycles it takes for thesmoothed analog value to be applied at approaching 100% following a stepresponse depending on the selected smoothing. The diagram applies to everysignal change at the analog input.
50
100
0
63
50 100 150Module cycles
weakmediumstrong
200 250 300
Step response for any analog input signalSignal changes aspercentage:
Smoothing:
Figure 13-14 Example of the Influence of Smoothing on the Step Response
Analog Electronic Modules
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13.11.3 Channel and IEEE Tag
Features
The 4 AI I 2WIRE/HART, 4 AI I 4WIRE/ HART, and 4AO I HART analog electronicmodules support up to four IEEE tags.
The PII provides up to 20 bytes per module for the IEEE tags. Thus, four blocks of5 bytes each are available for the four IEEE tags within the PII.
Requirements
The HART field device must support the assigned number of IEEE tags.
Analog Electronic Modules
13-57Distributed I/O device ET 200iSPA5E00247483-02
Assigning IEEE Tags
You assign the IEEE tags of the field devices to any one of the four blocks in thePII.
PII of a HART input modulewith ”...W+4” configuration
Analogvalue 1
Analogvalue 2
Analogvalue 3
Analogvalue 4
IEEE tag4 ofchannel 3
IEEE tag1 ofchannel 1
IEEE tag3 ofchannel 2
IEEE tag4 ofchannel 0
EB xEB x+1EB x+2EB x+3EB x+4EB x+5EB x+6EB x+7
EB x+8EB x+9EB x+10EB x+11EB x+12
EB x+13EB x+14EB x+15EB x+16EB x+17
EB x+18EB x+19EB x+20EB x+21EB x+22
EB x+23EB x+24EB x+25EB x+26EB x+27
HART field device on channel 0
HART field device on channel 1
HART field device on channel 2
Analog value (corresponds to HV1))IEEE tag 1 (HV)
HART field device on channel 3
IEEE tag 2IEEE tag 3IEEE tag 4
IEEE tag 2IEEE tag 3IEEE tag 4
Analog value (corresponds to HV1))IEEE tag 1 (HV)IEEE tag 2IEEE tag 3IEEE tag 4
IEEE tag 2IEEE tag 3IEEE tag 4
Analog value (corresponds to HV1))IEEE tag 1 (HV)IEEE tag 2IEEE tag 3IEEE tag 4
IEEE tag 2IEEE tag 3IEEE tag 4
Analog value (corresponds to HV1))IEEE tag 1 (HV)IEEE tag 2IEEE tag 3IEEE tag 4
IEEE tag 2IEEE tag 3IEEE tag 4
HART inputmodule
for example
permanent assignment of analog values in the PII
user-specific assignment of IEEE tags in the PII
Example: Mapping the IEEE tags
1) HV=master tag
Auxiliary value 1
Auxiliary value 2
Auxiliary value 3
Auxiliary value 4
Figure 13-15 Assigning the IEEE Tags
Analog Electronic Modules
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Configuring IEEE Tags with STEP 7 Version 5.3 Service Pack 1 or Higher, andCurrent HW Update
For a description, refer to the online help for STEP 7.
Configuring IEEE Tags With GSD File
First, you must configure the number of IEEE tags required (1 to 4). Select thecorresponding entry from the configuration table of the engineering software:
• ...+1
• ...+2
• ...+3
• ...+4
Assigning Parameters for IEEE Tags
Next, you must select the required IEEE tag of the field device. The PII providesthe following parameters in each block for the analog electronic modules 4 AI I2WIRE/HART, 4 AI I 4WIRE/ HART and 4AO I HART:
Channel parameter: With this parameter you define the channel or field devicefrom which the IEEE tag is to be read in.
IEEE tag parameter: Here, you select the IEEE tag (1 to 4) of the field device thatis assigned to the PII.
13.11.4 HART Warning
If you enable this parameter, a diagnostic interrupt will be triggered for the followingHART warnings (see error types in Section 6.7.11):
• Further HART status available
• HART configuration changed
13.11.5 HART Diagnostics
If you enable this parameter, a diagnostic interrupt will be triggered for the followingHART diagnostics (see error types in Section 6.7.11):
• HART analog output current is defined
• HART analog output current in saturation
• HART communication error
• HART master tag out of limits
• HART auxiliary tag out of limits
Analog Electronic Modules
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13.12 Identification and Message Functions (I&M)
For information on I&M functions, refer to chapter 3.12.
Analog Electronic Modules
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14-1Distributed I/O device ET 200iSPA5E00247483-02
Reserve Module
Order Number
6ES7 138-7AA00-0AA0
Features
Features of the reserve module:
• suitable for all terminal modules which can receive an electronic module
• reserved for a slot on any electronic module. Insert the reserve module on thereserved slot of the ET 200iSP configuration.
• If any gaps (of an electronic module) develop due to the ET 200iSPconfiguration, the following rules apply:
– the gap is located at the last slot of ET 200iSP: Insert a reserve module orthe slot cover into the gap (see Sections 4.5 and 6.7.14).
– the gap is located at another slot (for electronic modules): Insert a reservemodule into this gap (see Section 6.7.14).
Procedure with CiR
See the Modifying the System during Operation via CiR function manual.
Terminal Assignment
The reserve module is not connected to the terminals of the terminal module. Youcan thus fully wire the terminal module in preparation for future applications.
14
Reserve Module
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Technical DataDimensions and weight
Dimensions WHD (mm) 30129136.5
Weight approx. 180g
Module–specific data
Type of protection
• CENELECII2 G EEx ib IIC T4
0344
Voltages, currents, electrical potentials
Power loss of the module
max. 0.03 W
Status, Interrupts, Diagnostics
Status display No
Diagnostic functions No
Safety data
See EC Prototype Cer-tificate
KEMA 04ATEX1251
A-1Distributed I/O device ET 200iSPA5E00247483-02
Order Numbers
A.1 Order numbers
Introduction
You will find the order numbers for the ET 200iSP distributed I/O station and thePROFIBUS accessories that you may need in conjunction with the ET 200iSPbelow.
Interface Module
Table A-1 Interface module
Description Number Order number
Interface module IM 152 1 piece 6ES7 152-1AA00-0AB0
Terminal Modules
Table A-2 Terminal Modules
Description Number Order number
TM-PS-A 1 piece 6ES7 193-7DA00-0AA0
TM-PS-B 1 piece 6ES7 193-7DB00-0AA0
TM-IM/IM and terminating module 1 piece 6ES7 193-7AB00-0AA0
TM-IM/EM 60S (screw terminals) andterminating module
1 piece 6ES7 193-7AA00-0AA0
TM-IM/EM 60C (spring terminals)and terminating module
1 piece 6ES7 193-7AA10-0AA0
TM-EM/EM 60S (screw terminals) 1 6ES7 193-7CA00-0AA0
TM-EM/EM 60C (spring terminals) 1 6ES7 193-7CA10-0AA0
A
Order Numbers
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Power Supply
Table A-3 Power Supply
Name Quantity Order Number
Power Supply PS 1 6ES7 138-7EA00-0AA0
Digital Electronic Modules
Table A-4 Digital Electronic Modules
Name Quantity Order Number
8 DI NAMUR 1 piece 6ES7 131-7RF00-0AB0
4 DO DC23.1V/20mA 1 piece 6ES7 132-7RD00-0AB0
4 DO DC17.4V/27mA 1 6ES7 132-7RD10-0AB0
4 DO DC17.4V/40mA 1 6ES7 132-7RD20-0AB0
Analog Electronic Modules
Table A-5 Analog electronic modules
Name Quantity Order Number
4 AI I 2WIRE HART 1 piece 6ES7 134-7TD00-0AB0
4 AI I 4WIRE HART 1 piece 6ES7 134-7TD50-0AB0
4 AI RTD 1 piece 6ES7 134-7SD50-0AB0
4 AI TC and TC sensor module 1 6ES7 134-7SD00-0AB0
4 AO I HART 1 6ES7 135-7TD00-0AB0
Reserve Module
Table A-6 Reserve module
Name Quantity Order Number
Reserve module 1 6ES7 138-7AA00-0AA0
Order Numbers
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ET 200iSP Accessories
Table A-7 ET 200iSP Accessories
Name Quantity Order Number
EEx e terminal WPE 16/E (for shielding terminal rail)
1 17522900*
Mounting rail for S7 installation technique
480 mm
530 mm
585 mm
830 mm
885 mm
1
6ES7 390-1AE80-0AA0
6ES7 390-1AF30-0AA0
6ES7 390-1AF85-0AA0
6ES7 390-1AJ30-0AA0
6ES7 390-1AJ85-0AA0
Label sheet DIN A4, 20 labelingstrips for interface modules, and 60labeling strips for electronic modules,film for laser printing or plotter
• Light beige
• yellow
• red
• petrol
10 sheets
6ES7 193-7BA00-0AA0
6ES7 193-7BB00-0AA0
6ES7 193-7BD00-0AA0
6ES7 193-7BH00-0AA0
Slot number without labeling 100 piece 8WA8848-2AY
Slot number labels 10 x labeled 1 to20
200 pieces 8WA8861-0AB
Slot number labels 5 x labeled 1 to40
200 8WA8861-0AC
Slot number labels 2 x labeled 1 to68, and 1 x labeled 1 to 64
200 8WA8861-0DA
* Order nos. of Weidmüller GmbH, An der Talle 89, 33102 Paderborn, Phone: 05252-960-0, Fax: 05252-960-116
Order Numbers
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Enclosure for ET 200iSP
Table A-7 Enclosures for ET 200iSP
Name Quantity Order Number
Wall-mount enclosures for Zone 1/ 2, type of protectionEEx e, stainless steel, screw-on lid
• 600x400x230, suitable for up to 11 electronicmodules
• 800x400x230, suitable for up to 16 electronicmodules
• 1050x400x230, suitable for up to 25 electronicmodules
1 piece
6DL2804-0AA00
6DL2804-0AB00
6DL2804-0AC00
Wall-mount enclosures for Zone 1/ 2, EEx e type ofprotection, stainless steel, screw-on cover; with cableinlet for I/O signals; with installation and wiring ofET 200iSP in wall-mount enclosure1
• 600x400x230, suitable for up to 11 electronicmodules
• 800x400x230, suitable for up to 16 electronicmodules
• 1050x400x230, suitable for up to 25 electronicmodules
1 piece
6DL2804-1AA00
6DL2804-1AB00
6DL2804-1AC00
Wall-mount enclosures for Zone 1/ 2, type of protectionEEx e, stainless steel, hinged lid
• 650x450x230, suitable for up to 15 electronicmodules
• 950x450x230, suitable for up to 25 electronicmodules
1 piece
6DL2804-0AD00
6DL2804-0AE00
Wall-mount enclosures for Zone 21/ 22, degree ofprotection IP65, stainless steel, hinged lid
• 650x450x230, suitable for up to 15 electronicmodules
• 950x450x230, suitable for up to 25 electronicmodules
1 piece
6DL2804-0DD00
6DL2804-0DE00
Wall-mount enclosures for Zone 1/ 2, EEx e type ofprotection; stainless steel; certified separately; hingedcover; with cable inlets for I/O signals; with installationand wiring of ET 200iSP in wall-mount enclosure1)
• 650x450x230, suitable for up to 15 electronicmodules
• 950x450x230, suitable for up to 25 electronicmodules
1
6DL2804-1AD00
6DL2804-1AE00
Wall-mount enclosures for Zone 21/ 22, IP65 degree ofprotection, stainless steel; certified separately; hingedcover; with cable inlets for I/O signals; with installationand wiring of ET 200iSP in wall-mount enclosure1)
• 650x450x230, suitable for up to 15 electronicmodules
• 950x450x230, suitable for up to 25 electronicmodules
1
6DL2804-1DD00
6DL2804-1DE00
1) Without ET 200iSP components. Please purchase these separately.
Order Numbers
A-5Distributed I/O device ET 200iSPA5E00247483-02
Network components
The table below lists all the network components you require to operate theET 200iSP.
Table A-8 Network Components for ET 200iSP
Name Quantity Order Number
RS 485-IS Coupler 1 piece 6ES7 972-0AC80-0XA0
PROFIBUS connector RS 485 IS, withchamfered cable outlet, switched active busterminating resistor
1 6ES7 972-0DA60-0XA0
PROFIBUS cable 1 6XV1 830-0EH10
Order Numbers
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STEP 7 and SIMATIC S7 Manuals
To program and commission the ET 200iSP with STEP 7 , you require one of thefollowing manuals.
Table A-9 STEP 7 and SIMATIC S7 Manuals
Name Contents
Automation systems basics, explosionprotection
• Manual
Includes
• Current standards and directives onexplosion protection
• Description of safety measures andidentification of equipment
• Information on the installation,operation, and maintenance of Exequipment
S7-300 Automation Systemdocumentation package consisting of:
For example,
• Reference Manual
– CPU Data:CPU 312 IFM to 318-2 DP
– CPU Data: CPU 31xC and CPU 31x
• Description of the operation, functionsand technical data of the CPUs.
• Manual
– CPU 31xC: CPU 31xC:Process-Related Functions Including CD with Examples
• Description of the various technologyfunctions
• Installation manual
– S7-300 Automation System: Installation: CPU 312 IFM to 318-2 DP
– S7-300 Automation System: Installation: CPU 31xC and CPU 31x
• Description of the configuration,mounting, wiring, networking andcommissioning of an S7-300
• Reference manual
– S7-300 Programmable Controller Module Specifications
• Technical data and descriptions of thefunctions of signal modules, powersupply modules and interfacemodules.
• Instruction list 312 IFM to 3182 DP (can beordered separately)
• Instruction list CPU 31x C and CPU 31x(can be ordered separately)
• Listing of the instruction set of theCPU and the corresponding executiontimes. Listing of executable blocks andexecution times.
• Getting Started • Example of the various steps incommissioning required to achieve afully functioning application.
Order Numbers
A-7Distributed I/O device ET 200iSPA5E00247483-02
Table A-9 STEP 7 and SIMATIC S7 Manuals, Fortsetzung
Name Contents
Documentation package S7 F systems includes:
For example,
• ”S7 F/FH Systems” manual • Description of the various tasks to becarried out in order to create andcommission a fail-safe S7 F/FHsystem.
• Manual / Online Help ”S7 Distributed Safety, Configuring andProgramming
• Description of the
– Configuration of the F CPU and F I/O
– Configuration of safety functions
– Programming the F CPU in F FBDor F LAD
• ”Distributed I/O System ET 200S, Fail-safeModules” manual
• Description of the hardware of failsafemodules in ET 200S (includesinstallation, wiring, technical data)
• ”S7-300 Automation System, Fail-SafeSignal Modules
• System description ”Safety technology inSIMATIC-S7”
• Description of the hardware of fail-safesignal modules in S7-300 (includesinstallation, wiring, and technical data)
• Provides an overview of the use,installation, and principle of operationof the S7-300F and S7-400F/FHfail-safe automation systems.
• Contains technical details that can bepresented for the F technology inS7-400, S7-300.
• Contains monitoring and reaction timecalculations for the F systemsS7-300F and S7-400F/FH.
S7-400 and M7-400 Automation System
Installation.
• Manual
For example,
• Description of the PROFIBUS-DPmaster interface in S7-400 andM7-400
• Installation of a PROFIBUS-DP network
• RS 485 repeater
System Software for S7-300/400
Program design
• Programming manual
For example,
Description of addressing and diagnosticsin SIMATIC S7
System Software for S7-300/400
System and Standard Functions
• Reference Manual
Description of the SFCs in STEP 7
• Description SIMATIC NET PROFIBUS networks wiring and cabling
Order Numbers
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Reference for PROFIBUS DP with SIMATIC S7 and STEP 7
Table A-10 Reference for PROFIBUS DP with SIMATIC S7 and STEP 7
Book Order Number Contents
Dezentralisieren mit PROFIBUS DP- Aufbau, Projektierung und Einsatzdes PROFIBUS DP mit SIMATIC S7[Distributed Systems withPROFIBUS DP-Installation,Configuration, and Implementation ofPROFIBUS DP with SIMATIC S7] –Josef Weigmann, Gerhard KilianPublicis MCD Verlag, 1998
In bookshops:ISBN 3-89578-074-X
At your SIEMENSbranch:A19100-L531-B714
Familiarizes you with thetopics of PROFIBUS-DPand how to implementautomation tasks withPROFIBUS DP and SIMATIC S7. The use ofPROFIBUS DP isillustrated with numerouspractical example basedon SIMATIC S7.
B-1Distributed I/O device ET 200iSPA5E00247483-02
Dimensional Drawings
Introduction
This chapter contains the dimension drawings of the most important componentsof the ET 200iSP.
Terminal Module TM-PS-A, TM-PS-B with Inserted Power Supply PS
60
65.5
67.4
190
166.5
57.1
Figure B-1 Terminal Module TM-PS-A with Inserted Power Supply PS
B
Dimensional Drawings
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Terminal Module TM-IM/EM with Inserted Interface Module and ElectronicModule
60
65.5
67.4
116.6
167
152
19057
.1
Figure B-2 Terminal Module TM-IM/EM with Inserted Interface Module and Electronic Module
Terminal Module TM-EM/EM with Inserted Electronic Modules
60
65.5
67.4
190
116.6
167
152
57.1
Figure B-3 Terminal Module TM-EM/EM with Inserted Electronic Modules
Dimensional Drawings
B-3Distributed I/O device ET 200iSPA5E00247483-02
Terminating module
65.5
32.520
154.
6
44.732
57.1
Figure B-4 Terminating module
Dimensional Drawings
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C-1Distributed I/O device ET 200iSPA5E00247483-02
Reaction Times
Function principle
The figure below shows the different response times between the DP master andthe ET 200iSP.
DP master
DPinterface
DP cycle
DP slave
ET 200iSP
ET 200iSP
DI: DO AI AOIM
CPU
Figure C-1 Response times between the DP master and the ET 200iSP
C.1 Response times at the DP master
You will find information on the response times in the manual for the DP master.
C
Reaction Times
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C.2 Reaction Times on the ET 200iSP
Reaction time
The reaction time on the ET 200iSP depends on:
• The number of modules
• The number of diagnostic messages
• Removing and inserting modules
• Interrupts
C.3 Reaction Times with Digital Input Modules
Input delay
The reaction times of the digital input modules depend on the input delay. See thetechnical data in chapter 12.
C.4 Reaction Times with Digital Output Modules
Output Delay
The reaction times correspond to the output delay. See the technical data inchapter 12.
C.5 Reaction Times of Analog Input Modules
Conversion Time
The conversion time is made up of the basic conversion time and the time forprocessing wire break monitoring diagnostics (see the technical data 4 AI RTD and 4 AI TC in chapter 13).
With integrating conversion procedures, the integration time is included directly inthe conversion time.
Reaction Times
C-3Distributed I/O device ET 200iSPA5E00247483-02
Cycle time
The analog–to–digital conversion and the transfer of the digitized measured valuesto the memory or to the backplane bus take place sequentially. In other words, theanalog input channels are converted one after the other. The cycle time; in otherwords, the time until an analog input value is converted again is the sum of theconversion times of all active analog input channels of the input modules. Unusedanalog input channels should be deactivated in the parameter settings to reducethe cycle time. The conversion and integration times for a deactivated channel are0.
Figure C-2 provides you with an overview of what makes up the cycle time for ann-channel analog input module.
Conversion time channel 0
Conversion time channel 1
Cycle time
Conversion time channel 2
Conversion time channel 3
Figure C-2 Cycle Time of the Analog Input Module
Reaction Times
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C.6 Reaction Times of Analog Output Modules
Conversion Time
The conversion time of the analog output channels comprises the time for thetransfer of the digitized output values from the internal memory and thedigital-to-analog conversion.
Cycle time
The conversion of the analog output channels involves a processing time for themodule and sequential conversion times for channels 0.1 and 2.
The cycle time, the other words, the time until an analog output value is convertedagain is the sum of the conversion times of all activated analog output channelsand the processing time of the analog output module.
Figure C-3 provides an overview of the makeup of the cycle time for an analogoutput module.
Conversion time channel 0
Conversion time channel 1 Cycle time
Execution time Module
Conversion time channel 2
Conversion time channel 3
Figure C-3 Cycle Time of the Analog Output Module
Settling time
The settling time (t2 to t3), in other words, the time from applying the convertedvalue to reaching the specified value at the analog output is load dependent. Adistinction must be made between resistive, capacitive, and inductive load.
Reaction Times
C-5Distributed I/O device ET 200iSPA5E00247483-02
Response Time
The worst–case response time (t1 to t3), in other words, the time from theavailability of the digital output values in the internal memory until the specifiedvalue is reached and the analog output is the sum of the cycle time and settlingtime. The worst case occurs when the analog channel was converted shortlybefore transferring a new output value and will only the converted again followingthe conversion of the other channels (cycle time).
Figure C-4 shows the response time of an analog output channel.
tA
tC
tI
t1 t2
tA= response time
tC = cycle time according to the processing time of the module andconversion time of the channel
tI = settling time
t1 = a new digital output value is queued
t2 = output value accepted and processed
t3 = specified output value reached
t3
Figure C-4 Response Time of an Analog Output Channel
Reaction Times
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D-1Distributed I/O device ET 200iSPA5E00247483-02
Address Space of the Inputs and Outputs
D.1 Digital Input Module
8 DI NAMUR
The address range of the process input and output image that is occupied isdependent on the configuration, i.e., by the selection of the relevant entry in theengineering software.
8 DI NAMUR with ”8 DI NAMUR” configuration
• Assignments of the PII
EB x+1EB x+2
EB x Channels 0 to 7 of the input signal
7 136 5 4 2 0
6 025 4 3 17
S7 format
n.c.
Value status channels 0 to 7:
1B: Valid input signal0B: Input signal is invalid
24
7 6 5 4 13 2 07 6 5 3 1 0
Figure D-1 PII with ”8 DI NAMUR” Configuration
• Assignments of the PIO
The PIO is not used.
D
Address Space of the Inputs and Outputs
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8 DI NAMUR with ”2 Counter/ 6 DI NAMUR” or ”2 Counter/ 6 Control” configuration
• Assignments of the PII
EB x+5EB x+6
EB x
7 136 5 4 2 0
6 25 4 37
S7 format
n.c.
Value status channels 2 to 7:
1B: Valid input signal0B: Input signal is invalid
EB x+1EB x+2EB x+3
Actual value counter 1
Actual value counter 2
7 6 5 4 13 2 0EB x+4
Counter output 1Counter output 2
Digital input 2Digital input 3
Digital input 4Digital input 5
Digital input 6Digital input 7
Actual value counter 1 (cascading function)
PII:
EB xEB x+1
Example: Actual value counter 1, standard function
108852AH
85H
EB xEB x+1
Example: Actual value counter 1 (cascading function)
117573
00H
01H
EB x+2EB x+3
CBH45H
Figure D-2 PII with ”2 Counter/ 6 DI NAMUR” Configuration
• Assignments of the PIO
AB xAB x+1AB x+2AB x+3
Setpoint counter 1
Setpoint counter2
7 6 5 4 13 2 0AB x+4
n.c.n.c.
Control signal GATE 1Control signal GATE 2
Control signal reset counter 1Control signal reset counter 2
Control signal reset counter output 1Control signal reset counter output 2
Setpoint value counter 1 (cascadingfunction)
PIO:
Figure D-3 PII with ”2 Counter/ 6 DI NAMUR” Configuration
Address Space of the Inputs and Outputs
D-3Distributed I/O device ET 200iSPA5E00247483-02
8 DI NAMUR with ”2 Trace/ 6 DI NAMUR” configuration
• Assignments of the PII
EB x+5EB x+6
EB x
7 136 5 4 2 0
6 25 4 37
S7 format
n.c.
Value status channels 2 to 7:
1B: Valid input signal0B: Input signal is invalid
EB x+1EB x+2EB x+3
Frequency counter 1
Frequency counter 2
7 6 5 4 13 2 0EB x+4
n.c.n.c.
Digital input 2Digital input 3
Digital input 4Digital input 5
Digital input 6Digital input 7
PII:
EB xEB x+1
Example: Frequency counter 1
2317 = 2.317 kHz09H
0DH
Figure D-4 PII with ”2 Trace/ 6 DI NAMUR” Configuration
• Assignments of the PIO
The PIO is not used.
D.2 Digital Output Module
AB x+1
AB x Channels 0 to 3 of the output signal
S7 format
2
7 6 5 4 13 2 03 1 0
n.c.
Figure D-5 PIO with Digital Output Module
Address Space of the Inputs and Outputs
D-4Distributed I/O device ET 200iSP
A5E00247483-02
D.3 Analog Input Modules
EB xEB x+1EB x+2EB x+3
Input valuechannel 0
S7 format
Input valuechannel 1Input valuechannel 2Input valuechannel 3
EB x+4EB x+5EB x+6EB x+7
7 136 5 4 2 0
EB xEB x+1
Example: Input value channel 0: 61A8H
61HA8H
Input value channel 0: 25000
PII:
Figure D-6 PII with Analog Input Modules
D.4 Analog Output Modules
AB xAB x+1AB x+2AB x+3AB x+4AB x+5AB x+6AB x+7
7 136 5 4 2 0
AB xAB x+1
Example: Output value channel 0: 61A8H
61HA8H
Output value channel 0: 25000
S7 format
PIO:
Output valuechannel 0
Output valuechannel 1Output valuechannel 2
Output valuechannel 3
Figure D-7 PIO with Analog Output Modules
Address Space of the Inputs and Outputs
D-5Distributed I/O device ET 200iSPA5E00247483-02
D.5 Analog Input Modules with HART (4 AI I 2WIRE HART, 4 AI I 4WIRE HART)
EB xEB x+1EB x+2EB x+3
Input valuechannel 0
S7 format
Input valuechannel 1Input valuechannel 2
Input valuechannel 3
EB x+4EB x+5EB x+6EB x+7
7 136 5 4 2 0
EB x+8EB x+9EB x+10EB x+11
IEEE754 floating-point format
EB x+127 6 5 4 13 2 0
HART status byte for IEEE tag 1, asspecified for HART (see Section 13.3.5)
EB x+13 to 17
IEEE tag 1 in floating-point formatas specified in HART
EB x+18 to 22
EB x+23 to 27
You can definethe number ofIEEE tags in yourconfiguration.
You can mapeach IEEE tag ofa field device tothe PII as desired.
See chapter13.3.5.
PII:Analog Value
IEEE tag 2 in floating-point format as specified inHART, and HART status byte (for structure, seeIEEE tag 1)
IEEE tag 3 in floating-point format as specified inHART, and HART status byte (for structure, seeIEEE tag 1)
IEEE tag 4 in floating-point format as specified inHART, and HART status byte (for structure, seeIEEE tag 1)
Status codes of the PROFIBUS-PA profile used in ET 200iSP:
00 0110 00 (18H) bad, no communication (communication error)00 0011 00 (0CH) bad, device failure01 0001 11 (47H) uncertain, last usable event, constant
(device is busy)10 0001 00 (84H) good, update event (reconfiguring)10 0000 00 (80H) good, ok (no error)
01 0011 00 (4CH) uncertain, initial value (prior to first negotiation)
Figure D-8 PIO with Analog Input Modules with HART
Address Space of the Inputs and Outputs
D-6Distributed I/O device ET 200iSP
A5E00247483-02
D.6 Analog Output Module with HART (4 AO I HART)
EB xEB x+1EB x+2EB x+3
IEEE tag 2 in floating-point format as specified inHART, and HART status byte (for structure, seeIEEE tag 1)
IEEE754 floating-point format
EB x+5 to 9
IEEE tag 1 in floating-point formatas specified in HART
IEEE tag 3 in floating-point format as specified inHART, and HART status byte (for structure, seeIEEE tag 1)
EB x+10 to 14
IEEE tag 4 in floating-point format as specified inHART, and HART status byte (for structure, seeIEEE tag 1)
EB x+15 to 19
AB xAB x+1AB x+2AB x+3AB x+4AB x+5AB x+6AB x+7
7 136 5 4 2 0
S7 format
PIO:
PII:
You can definethe number ofIEEE tags in yourconfiguration.
You can mapeach IEEE tag ofa field device tothe PII as desired.
See chapter13.3.5.
Output valuechannel 0
Output valuechannel 1Output valuechannel 2
Output valuechannel 3
Analog Value
EB x+47 6 5 4 13 2 0
HART status byte for IEEE tag 1, asspecified for HART (see Section 13.3.5)
00 0110 00 (18H) bad, no communication (communication error)00 0011 00 (0CH) bad, device failure01 0001 11 (47H) uncertain, last usable event, constant
(device is busy)10 0001 00 (84H) good, update event (reconfiguring)10 0000 00 (80H) good, ok (no error)
Status codes of the PROFIBUS-PA profile used in ET 200iSP:01 0011 00 (4CH) uncertain, initial value (prior to first negotiation)
Figure D-9 PIO/PII with Analog Output Module with HART
E-1Distributed I/O device ET 200iSPA5E00247483-02
Certifications
E.1 EC Prototype Certificates
E
Certifications
E-51Distributed I/O device ET 200iSPA5E00247483-02
E.2 EC Declarations of Conformity
Glossary-1Distributed I/O device ET 200iSPA5E00247483-02
Glossary
ACCU
Accumulators are registers in the CPU used as buffer storage for load and transferoperations, as well as comparison, arithmetic, and conversion operations.
Accumulated current
Total current of all output channels of a digital output module.
Automation system
An automation system is a programmable logic controller consisting of at least oneCPU, various input and output modules, and operator interfaces.
Backplane bus
A serial data bus used by interface module IM 151-2 to communicate with theelectronics modules. Also supplies these with the required voltage. The variousmodules are interconnected by means of terminal modules.
Bus connector
Physical connection between the bus nodes and the bus cable.
Bus termination module
The ET 200iSP distributed I/O station is terminated by the bus termination module.ET 200iSP will not operate without bus termination module.
Bus
Shared data transmission path to which all nodes are connected. It has two definedends.
In an ET 200 system, the bus is a twisted-pair cable or optical fiber cable.
Chassis ground
Chassis ground includes all the interconnected inactive parts of equipment thatmust not carry a hazardous voltage even in the event of a fault.
Glossary
Glossary-2Distributed I/O device ET 200iSP
A5E00247483-02
Diagnostics
The detection, localization, classification, visualization and further evaluation oferrors, faults and messages.
Provides monitoring functions which are executed automatically when the systemis in RUN. Increases plant availability by reducing commissioning times and downtimes.
Distributed I/O systems
These are input/output units that are not located in the base unit; instead, they aredistributed at some distance from the CPU.
• ET 200M, ET 200X, ET 200L, ET 200S, ET 200iSP
• DP/AS-I Link
• Other DP slaves from either Siemens or other vendors
The distributed I/O systems are connected to the DP master by means ofPROFIBUS DP.
DP master
A master that complies with IEC 61784–1:2002 Ed1 CP 3/1 is known as a DPmaster.
DP slave
A slave running on the PROFIBUS on the basis of the PROFIBUS DP protocol inaccordance with IEC 61784-1:2002 Ed1 CP 3/1 is known as a DP slave.
DP standard
The DP standard is the bus protocol of the ET 200 distributed I/O system inaccordance with IEC 61784-1:2002 Ed1 CP 3/1.
DPV1
Enhanced version of the original PROFIBUS standard IEC 61784-1:2002 Ed1 CP 3/1.
Earth
The electrical potential of conductive ground can be pulled down to zero at anypoint. In the area of earth connections, ground may assume a potential other thanzero. For this reason, the term ”reference ground” is often used.
Glossary
Glossary-3Distributed I/O device ET 200iSPA5E00247483-02
Equipotential bonding
Electrical connection (equipotential bonding conductor) that keeps electricalequipment and extraneous conductive objects to the same or almost the samepotential in order to prevent disturbing or dangerous voltages between theseobjects.
ET 200
The ET 200 distributed I/O system with PROFIBUS DP protocol allows theconnection of distributed I/O to a CPU or adequate DP master. The ET 200 systemis characterized by its fast reaction times as a result of reduced data traffic, i.e. onlyfew bytes are transferred.
ET 200 is based on IEC 61784–1:2002 Ed1 CP 3/1.
The ET 200 works on the master/slave principle. Examples of DP masters are theIM308-C master interface or the CPU 315-2 DP.
DP slaves can be the distributed I/O devices ET 200M, ET 200X, ET 200L,ET 200S, ET 200iSP, or DP slaves from Siemens or other vendors.
Flutter monitoring
Flutter monitoring is a process control function for digital input signals. Fluttermonitoring detects and reports unusual signal profiles.
FREEZE
This is a control command of the DP master to a group of DP slaves.
When a DP slave receives the FREEZE control command, it freezes the currentstatus of the inputs and transfers them cyclically to the DP master.
After each subsequent FREEZE control command, the DP slave freezes the statusof the inputs again.
The input data are not transferred from the DP slave to the DP master againcyclically until the DP master sends the UNFREEZE control command.
Grounding busbar PA
Term describing the connection of electrical equipment operated in potentiallyexplosive areas to the equipotential busbar.
Grounding
Refers to connecting a conductive element to earth via a grounding system.
GSD file
The GSD file (device master file) contains all the properties specific to a DP slave.The format of a GSD file is defined in IEC 61784-1:2002 Ed1 CP 3/1.
Glossary
Glossary-4Distributed I/O device ET 200iSP
A5E00247483-02
HART
English: Highway Adressable Remote Transducer
Hot swapping
Refers to the removal and insertion of modules while ET 200iSP is in RUN.
I&M (identification data)
Identification data represent information stored on a module.I data: Module information, usually available on a the label of the moduleenclosure. I data are read only.
M data: System-specific information such as the installation locations and date.M data are generated during configuration and written to the module.
Isolated
In the case of isolated input/output modules, the reference potentials of the controland load circuit are galvanically isolated – for example, by means of opticalisolators, relays, or transformers. Input/output circuits can be grouped.
Master
A master station which is in possession of the token can send data to other nodesand request data from these (= active node.) Examples of DP masters are theCPU 315-2 DP or the IM308–C.
NAMUR sensor
A NAMUR sensor provides functions for monitoring cable breaks and short-circuits.
Node
A device that can send, receive, or repeat data on the bus (for example, a DPmaster, DP slave, or RS 485 repeater).
Non-isolated
In the case of non-isolated input/output modules, the reference potentials of thecontrol and load circuit are electrically connected.
Parameter assignment
Parameter assignment is the transfer of slave parameters from the DP master tothe DP slave.
Glossary
Glossary-5Distributed I/O device ET 200iSPA5E00247483-02
PCS7–OS
Operator station (operating and monitoring system) for the SIMATIC PCS 7process control system.
Permanent wiring
All the elements carrying wiring (terminal modules) are installed on a mounting rail.The electronics modules are inserted into the terminal modules.
Prewiring
Wiring the terminal modules before the electronics modules are inserted.
Process image
The process image is a component of the system memory of the DP master. At thestart of the cyclic program, the signal states of the input modules are transferred tothe process image of inputs (PII.) At the end of the cyclic program, the values ofthe process-image output area are transferred to the DP slave as the signal states.
PROFIBUS address
Each bus node must receive a PROFIBUS address to identify it uniquely on thePROFIBUS.
The PC/programming device has the PROFIBUS address “0”.
The PROFIBUS addresses 1 to 125 are permitted for the ET 200iSP distributedI/O device.
PROFIBUS
PROcess FIeld BUS, process and field–bus standard, which is defined inIEC 61784-1:2002 Ed1 CP 3/1. Specifies the functional, electrical and mechanicalcharacteristics of a serial bits stream field bus system.
PROFIBUS is available with the protocols DP (= distributed peripherals, that is,distributed or remote I/O), FMS (= field bus message specification), PA (= process automation), or TF (= technology functions).
Pulse stretching
Function used to stretch the duration of a digital input signal. Stretches the signal ata digital input by a configured value.
Reference potential
Reference for the evaluation / measuring of the voltages of participating circuits.
Glossary
Glossary-6Distributed I/O device ET 200iSP
A5E00247483-02
RTD
Measuring temperatures with resistive thermometers RTD (resistance temperaturedetection.)
Segment
The bus cable between two terminating resistors forms a segment. An RS 485 ISsegment (on RS 485-IS Coupler) contains between 0 and 16 bus nodes.
SIMATIC PCS 7
Powerful process control system with integrated programming, operating andmonitoring functions. PCS 7 allows direct interconnections with the control controlsystem. For further information, refer to the ST 70 Catalog and the integratedPCS 7 Online Help.
SIMATIC PDM
Process Device Manager. Versatile tool for configuring, setting parameters,commissioning, and diagnostics of intelligent process devices of any manufacturer.SIMATIC PDM provides a uniform user interface for the configuration of a widerange of process devices.
Slave
A slave can only exchange data with a master after it has been requested to senddata by the master. Slaves include all DP slaves such as the ET 200X, ET 200M,ET 200S, ET 200iSP, etc.
SYNC
This is a control command of the DP master to a group of DP slaves.
By means of the SYNC control command, the DP master causes the DP slave tofreeze the current statuses of the outputs. With the subsequent frames, the DPslave stores the output data, but the statuses of the outputs remain unchanged.
After each new SYNC control command, the DP slave sets the outputs that it hasstored as output data. The outputs are not cyclically updated again until the DPmaster sends the UNSYNC control command.
TC
Measuring temperatures with thermocouples (TC = thermocouple.)
Glossary
Glossary-7Distributed I/O device ET 200iSPA5E00247483-02
Time stamping
Function used to time stamp binary input signals when these change. All the binaryinput signals selected for time stamping must be time stamped with a specifiedaccuracy throughout the system when they change, i.e. when two transducers ondifferent stations of different PROFIBUS DP master systems respond at the sametime, the time stamps of these signal changes may not differ by more than thisselected accuracy.
Time stamp
Information on the date and time of messages.
Time synchronization
Time synchronization ensures that all the clocks in a system are set to the sametime-of-day. A master clock distributes the time in a configurable cycle to all othercomponents in the system that have a clock. The components use this time to settheir own clocks.
Transmission rate
The speed at which data is transmitted on the network. Specifies the number oftransferred bits per second (= bit rate.)
Value status
The value status is additional binary information of a digital input signal. The valuestatus is entered in the PII at the same time as the process signal, and providesinformation on the validity of the input signal.
WinCC
PCS 7 standard package
Glossary
Glossary-8Distributed I/O device ET 200iSP
A5E00247483-02
Index-1Distributed I/O device ET 200iSPA5E00247483-02
Index
Numbers16–bit down counter, 3-1916–bit up counter, 3-1832–bit down counter, 3-198 DI NAMUR, 12-1
Parameters, 12-20, 12-21
AAccessories, A-1ACCU, Glossary-1Accumulated current, Glossary-1Actions in run, 7-1Actuators, 3-2Address, 5-32Address space, 3-12
Analog Input Modules, D-4Analog input modules with HART, D-5Analog output module with HART, D-6Analog Output Modules, D-4Digital Input Module, D-1Digital Output Module, D-3
Address Space of Inputs, D-1Address Space of Outputs, D-1Analog Electronic Module 4 AI I 2WIRE HART,
13-31Block Diagram, 13-32Features, 13-31Order Number, 13-31Technical data, 13-32Terminal Assignment, 13-31
Analog Electronic Module 4 AI I 4WIRE HART,13-34Block Diagram, 13-35Features, 13-34Order Number, 13-34Technical data, 13-36Terminal Assignment, 13-35
Analog Electronic Module 4 AI RTD, 13-37Block Diagram, 13-38Features, 13-37Order Number, 13-37Technical data, 13-39Terminal Assignment, 13-38
Analog Electronic Module 4 AI TC, 13-41Block Diagram, 13-42Features, 13-41Order Number, 13-41Technical data, 13-43Terminal Assignment, 13-41
Analog Electronic Module 4AO I HART, 13-45Block Diagram, 13-46Features, 13-45Order Number, 13-45Technical Data, 13-47Terminal assignment, 13-46
Analog Electronic Modules, 13-1Analog electronic modules, 6-21Analog value processing, Basics, 13-14Analog Value Visualization, 13-1Analog value visualization, 13-2
for resistive thermometers, 13-6, 13-7for thermocouple, 13-8, 13-9, 13-10, 13-11,
13-12Analog values S7, 13-2Application, 2-1Approval, Marine, 8-2Assigning frequency counter parameters, 3-26ATEX label, 8-2Automation system, Glossary-1
BBackplane bus, Glossary-1Basic functions, 2-1Burst pulses, 8-3Bus, Glossary-1Bus cable, 1-6Bus connector, 2-7, 5-21, Glossary-1Bus terminating module, 1-6Bus termination module, 4-6, 4-13, Glossary-1
Index
Index-2Distributed I/O device ET 200iSP
A5E00247483-02
CCable glands, 4-3Cascaded counting function, 3-19CE certification, 8-1Certification, CE, 8-1Certifications, E-1Changing parameter settings in RUN, 6-15
Procedure, 6-15channel, 13-56Channel–related diagnostics, 2-16Channel–specific diagnostics, 6-34Chassis ground, Glossary-1CiR, 3-34
Procedure, 14-1Class of protection, 8-6Cleaning, 7-6Climatic ambient conditions, 8-5Commissioning, 6-1
Requirements, 6-9the ET 200iSP, 6-9
Compensation by means of resistivethermometer, 13-15
Compensation of the reference junctiontemperature, 13-14
Conductor cross–sections, 5-16Configuration changes in RUN, 3-34Configuring, 6-2
Features, 6-5, 6-6Function principle, 6-1in STEP 7, 6-5Procedure, 6-5, 6-7Requirements, 6-5, 6-6with GSD file, 6-6with SIMATIC PDM, 6-6
Configuring an IEEE tag, 13-58Configuring counters, 3-20, 3-22Configuring frequency counters, 3-24Conversion Time
Analog input modules, C-2Analog output modules, C-4
Counting, 3-17Current Consumption Calculation Table, 3-10Cycle time
Analog input modules, C-3Analog output modules, C-4
DData exchange
acyclic, 6-3cyclic, 6-2
DC 24 V supply, 5-2DC relays, 3-2Default startup, 6-10Definition, Electromagnetic compatibility, 8-3Degree of contamination, 8-6Degree of Protection IP 20, 4-5Degree of Protection IP 54, 4-4Degree of protection IP30, 8-7Diagnostic interrupt, 6-25, 6-41
HART input modules, 6-44HART output modules, 6-44Input modules, 6-42, 6-43Output modules, 6-43
Diagnostic Message of the electronic modules , 6-23Digital Input Modules, 6-23Digital Output Modules, 6-23
Diagnostics, 6-1, 6-3, Glossary-2channel–specific, 6-3Expanded, H-status, 6-38ID–relevant, 6-3in STEP 5, 6-21Module status, 6-3Process alarm, 6-3
Diagnostics datagram, 2-14Diagnostics using the process image, 6-16Dielectric strength test, 8-6Digital Electronic Module 4 DO, 12-11
Block Diagram, 12-13Features, 12-11Figure Output Curve, 12-16Order number, 12-11Technical Data, 12-14Terminal assignment, 12-12
Digital electronic module 4 DOFigure Output Curve, 12-17Parameters, 12-22
Digital Electronic Module 8 DI NAMUR, 12-1Block Diagram, 12-7Features, 12-1Order number, 12-1Technical Data, 12-8Terminal assignment, 12-2
Digital electronic modules, 6-20Direct Data Exchange, 3-12Distributed I/O devices, Fields of application,
1-1Distributed I/O systems, Glossary-2DP master, 3-12, Glossary-2DP slave, 6-3, Glossary-2DP standard, Glossary-2
Index
Index-3Distributed I/O device ET 200iSPA5E00247483-02
DP-master, 1-2, 1-8DP-Slave, 1-2DPV0 slave, 6-3DPV1, Glossary-2DPV1 slave, 6-3
EEarth, Glossary-2EC Declarations of Conformity, E-51EC Prototype Test Certificates, E-1Editing parameter settings in RUN
Features, 6-15Requirements, 6-15
Electrical arcs, 1-10Electrical installation, 5-6Electromagnetic compatibility, 8-3Electronic module, 1-6, 2-8, 3-2, 4-16, 5-27Electrostatic discharge, 8-3EMC, 8-3EMERGENCY-OFF -equipment, 5-1Emission of RF interference, 8-4EN 60079–14, 3-8Enclosure, 1-4, 2-4, 4-5Equipment, 1-9Equipotential bonding, Glossary-3Equipotential bonding PA, 5-5Error case, 2-14Error LEDs
of IM 152, 6-17on digital electronic modules, 6-20on the analog electronic modules, 6-21
ET 200, Glossary-3ET 200iSP, commissioning, 6-10ET 200iSP Distributed I/O station, Definition,
1-3Ex equipment, 1-11Example, 2-1
FFields of application, 2-2Firmware update, for IM 152, 7-7Flutter monitoring, 1-8, 12-24, Glossary-3FREEZE, Glossary-3Frequency counter, 3-23Function check, 2-1, 7-6Function principle of counting, 3-18Function principle of the frequency counters,
3-24
GGeneral Technical Data, 8-1General wiring rules , 5-1Ground conductor, 5-18Grounding, Glossary-3Grounding busbar, 5-18Grounding busbar PA, 5-26, Glossary-3Grounding connection, 5-21GSD file, Glossary-3
HH-status, 6-38HART, 13-18, Glossary-4
Advantages, 13-18Applications, 13-18Communication, 3-2Data records, 13-27diagnostics, 13-58Field devices, 3-2Protocol, 13-18Signal, 13-19System environment, 13-22Use in the ET 200iSP, 13-21warning, 13-58
Hot swapping, 7-1, 7-3, Glossary-4
II&M, 3-27, 12-25, 13-59ID–related Diagnostics, 6-32ID–related diagnostics, 2-16Identification Data, 3-27Identification data, 1-8, 7-3, Glossary-4
reading and writing, 3-27Identification functions, 12-25, 13-59Identifier:, 1-11IEC 60536, 8-6IEC 61131, 8-2IEC 61784–1:2002 Ed1 CP 3/1 standard, 1-2IEEE tag, 13-56
assigning, 13-57configuring, 13-58
IEEE tags, 13-25Features, 13-25
IM 152 interface module, 6-17Implementation of a GSD file into the
engineering software , 5-3Incorrect Module Configuration, 6-50Increased safety e, 1-10Indicator lamps, 3-2Input delay, C-2Insertion interrupt, 6-26, 6-48Installation, 2-4, 4-1
Index
Index-4Distributed I/O device ET 200iSP
A5E00247483-02
Installation Dimensions, 4-2Installation rules, 2-1Installing the bus termination module, 4-13Installing the mounting rail, 4-7Installing the Slot Cover, 4-13Installing the Slot Number Labels, 4-16Installing the Terminal Modules TM–IM/EM,
TM–EM/EM, 4-11Interface, 2-7, 5-21, 5-24Interface module, 1-6, 3-12, 5-19, 5-27Interface Module IM 152, 11-1Interface module IM 152, 4-6, 5-32
Block diagram, 11-2Description of the parameters, 11-5Example configuration for redundancy, 3-31exchanging, 7-5Features, 11-1Order number, 11-1Parameters, 11-4Startup, 6-12Technical data, 11-3
Interrupts, 6-3, 6-25, 6-39, 6-40Diagnostic interrupt, 6-3Insertion interrupt, 6-3Removal interrupt, 6-3Time stamping, 6-3Update interrupt, 6-3
Intrinsic safety i, 1-10Isolated, Glossary-4
LLabel, 1-7Label sheet, 1-6Labeling strip, 5-27Layout:, 4-6Lightning protection, 5-7
MMeasuring range in S7-format, 13-4Mains, 5-2Maintenance, 7-1Maintenance in RUN, 7-6Marine, Approval, 8-2Mark for Australia, 8-2Master, Glossary-4Maximum configuration, 3-12, 4-6Measured Value Resolution, 13-3Measuring range with SIMATIC S7, 13-2Mechanical ambient conditions, 8-5Message functions, 12-25, 13-59Minimum clearances, 4-6Module Status, 6-33
Mounting position, 4-5Mounting rail, 1-4, 2-4, 2-5, 4-7, 4-8, 4-11, 5-18
NNAMUR encoder, 3-2Node, Glossary-4Non–isolated, Glossary-4
OOB82, 2-14Operational current consumption, 3-10Order Numbers, A-1
Interface Module, A-1Order numbers, A-1
Accessories, A-3Analog Electronic Modules, A-2Book, A-8Digital Electronic Modules, A-2Enclosure, A-4Manuals, A-6Network Components, A-5Power Supply, A-2Reserve Module, A-2STEP 7 and SIMATIC S7 Manuals, A-6Terminal Modules, A-1
Output Delay, C-2Overall configuration, 5-4Overvoltage protection, 5-7
PParameter assignment, 6-2, Glossary-4
all modules, 6-8Electronic module, 6-7Interface module, 6-8Procedure, 6-5, 6-7, 6-8
Parameter description, 13-54of the digital electronic modules, 12-22
ParametersElectronic module 8 DI NAMUR, 12-19of IM 152, 11-5of the analog electronic modules, 13-48of the digital electronic modules, 12-19
PCS7, 1-12PCS7–OS, Glossary-5Periodic counting function, 3-19Power supply, 2-7, 3-4, 5-4, 5-18, 5-20, 9-2Power Supply Module PS, 1-10
Index
Index-5Distributed I/O device ET 200iSPA5E00247483-02
Power Supply PS, 1-5, 3-4, 4-8, 10-1Block diagram, 10-1Order number, 10-1Technical data, 10-2
Powerbus, 1-7Pressure–proof encapsulation, 1-10Prewiring, Glossary-5Process alarm, 6-26
Analog Input Modules, 6-47Time stamping, 6-47
Process control engineering, 1-12Process control system, 1-12Process image, Glossary-5PROFIBUS, Glossary-5PROFIBUS address, Glossary-5PROFIBUS RS 485-IS, 1-1PROFIBUS standard, 8-2PROFIBUS-DP, 1-1, 1-2
Supported devices, 1-2PROFIBUS-DP-network, Layout:, 1-2Protective elements, 5-3Protective measures, 5-3Pulse stretching, 1-8, 12-23, Glossary-5Pulse–shaped disturbances, 8-3
RRack, 2-5Rated voltage, 8-7Reaction Times, C-1Reaction times
of analog output modules, C-4of ET 200iSP, C-2on the DP master, C-1with analog input modules, C-2with digital input modules, C-2with digital output modules, C-2
Redundancy, with IM 152, 3-29, 3-31Redundancy of power supply, 3-33Reference junction, 13-16, 13-54Reference junction number, 13-54Reference potential, Glossary-5Regulations for the prevention of accidents,
2-2Removal and insertion, 7-3Remove interrupt, 6-26, 6-48Requirements, 2-1Reserve Module, 14-1
Order Number, 14-1Reserve module
Features, 14-1Technical data, 14-2Terminal assignment, 14-1
Response Time, Analog output modules, C-5
RIO-format, 6-16Risk of explosion, 1-9, 5-19, 7-2RS 485-IS Coupler, 1-6RTD, Glossary-6Rules for Installation, 4-1, 4-6
SSafe area, 3-7Segment, Glossary-6Selection help, 3-2Settling time, Analog output modules, C-4SFC13, 2-14Shipping conditions, 8-3Shock, 8-6SIMATIC PCS7, Glossary-6SIMATIC PDM, Glossary-6Sinusoidal disturbances, 8-4Slave, Glossary-6Slave diagnostics, Layout:, 6-27Slot number labels, 1-6, 4-16Smoothing, 13-54Software redundancy, 3-32Solenoid valves, 3-2Sparks, 1-10Specific application, 5-1Standard counting function, 3-18Start information, 2-14Startup
for time stamping, 6-14for time synchronization, 6-14of ET 200iSP, 6-9, 6-11
Status LEDsof IM 152, 6-17on digital electronic modules, 6-20on the analog electronic modules, 6-21
STL program, 2-13Storage conditions, 8-3SYNC, Glossary-6
TTC, Glossary-6Technical data
Climatic ambient conditions, 8-5Electromagnetic compatibility, 8-3Mechanical ambient conditions, 8-5Shipping and storage conditions, 8-3
Temperature, 8-4Terminal module, 1-5
Terminal module TM–PS, 4-1Terminal Module TM-EM/EM 60C, Order
number, 9-9
Index
Index-6Distributed I/O device ET 200iSP
A5E00247483-02
Terminal Module TM-EM/EM 60S, Ordernumber, 9-9
Terminal Module TM-IM/EMBlock diagram, 9-6Features, 9-4, 9-9Technical data, 9-6Terminal assignment, 9-5, 9-9
Terminal module TM-IM/EMBlock diagram, 9-10Technical data, 9-10
Terminal Module TM-IM/EM 60C, Ordernumber, 9-4
Terminal Module TM-IM/EM 60S, Ordernumber, 9-4
Terminal module TM-IM/IM, 9-7Block diagram, 9-8Order number, 9-7Pinout, 9-7Properties, 9-7Technical data, 9-8
Terminal module TM-IM-EM, 4-6Terminal Module TM-PS-A, installing, 4-8, 4-9Terminal module TM-PS-A, 4-6, 4-8Terminal Modules, 3-3, 4-8, 4-11, 5-16, 9-1
Overview of Contents, 9-1Terminal modules TM-IM-EM, 4-6Terminal Modules TM-PS-A and TM-PS-B, 9-2
Block diagram, 9-3Order No., 9-2Pinout, 9-2Properties, 9-2removing, 4-10Technical Data, 9-3
Terminal modules TM-PS-B, installing, 4-10Terminal- and Electronic Modules, 1-3Test voltage, 8-6The Lightning Protection Zone concept, 5-8Thermocouples:, connecting, 13-14Time stamp, Glossary-7Time stamping, 1-8, 12-22, Glossary-7Time synchronization, Glossary-7Transmission rate, Glossary-7
Type of protection, 1-10Types of protection, 1-9
UUngrounded installation, 5-4Update interrupt, 6-26, 6-49User data, 6-2User program, in STEP 7, 6-22
VValue status, Glossary-7
Assignment of inputs in the PII, 6-16Evaluation in PCS 7, 6-16of analog input modules, 6-16of digital input modules, 6-16
Vendor ID, IM 152, 6-30Vibrations, 8-6
WWidth, 3-12WinCC, Glossary-7Wiring, 5-1
permanent, Glossary-5Wiring rules, 5-15Wiring the ET 200iSP, 5-15
YYear of Production, 3-36
ZZone 1, 3-5, 4-2Zone 2, 3-6, 4-4Zone 21, 3-6, 4-3Zone 22, 3-7, 4-5Zones, 1-9, 3-4
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