Products & Services
www.micross.com
Semiconductors
•Hermetic/CeramicPackages•Hi-RelMemory•CustomDevicePackaging•CSP/QFNAssembly•PlasticPackaging•RadiationTolerantDevices•DeviceTesting/Programming•COBAssembly•ASICDesign
Electro-Mechanical
•Hi-RelLeadAttach•RoboticHot-SolderDipping•SolderExchange(Pb&PbFree)•BGAReballing•PackageTrim&Form•XRF&OtherTesting•3DScanningTape&Reel
Bare Die & Passives
•SiliconICs•SiliconDiscretes•ChipCapacitors•ChipResistors•SiCDiscretes•KnownGoodDie(KGD)
Packaged Parts
Wafer Processing
Long-Term Storage
Obsolescence Management
Anti-Counterfeit Program
Micross Components is your single source of high-reliabilty electronics.
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Products & Services
April 13, 2015 • Revision 3.4
7725 N. Orange Blossom Trail • Orlando, FL 32810 • 407.298.7100 • [email protected] • www.micross.com
Hermetic/Ceramic Packaging
SRAM 256Kb to 16Mb Mono, 16Mb MCM, 5V & 3.3V, 10ns to 100ns, x8/x16/x32
Legacy DRAM 256Kb to 64Mb, 5V, x1 and x4 LCC, Flatpack and DIP
EEPROM 1Mb Mono, 4Mb MCM, 5V, in Flatpack, LCC, CSOJ, PGA, and CQFP
Flash 1Mb & 4Mb Mono, 16Mb to 64Mb MCM, 5V & 3V, 60ns to 150ns, multiple packages including DIP, Flatpack, LCC and CQFP
UVEPROM 256Kb to 1Mb Mono, 55ns to 200ns, in LCC, DIP
VRAM 1Mb/4Mb, 100ns to 200ns, in LCC, DIP and CSOJ
Radiation Tolerant Devices
Custom Packaging
Silicon
Linear / AnalogMixed-SignalDigitalSRAM
EEPROMNAND & NOR FlashnvSRAM
Micro-controllersSDRAM/DDRDiscretes
Custom & Standard
Ceramic
DIP (300, 400, 600 mil), ZIP, SOJ, QFP, PGA, LCC, FLATPACK
Plastic
TSOP, TQFP, QFN BGA, SOJ, LCC
Metal Can
TO-18 - TO-3(2 to 18 Pin), TO-257, TO-258, TO-254
Plastic Packaging
SDRAM SDR – 64Mb, 128Mb, 256Mb, 512Mb, PC100 or PC133
iPEMSDR– 1.2Gb, 25mm x 32mm
iPEMDDR – 1.2Gb, 2.4Gb, 25mm x 32mm & 16mm x 23mm
iPEMDDR2 – 2.1Gb, 2.4Gb, 4.2Gb, 4.8Gb, 25mm x 32mm & 16mm x 23mm
SRAM 256Kb to 16Mb, 10ns - 85ns, 5V and 3.3V
SRAM 256Kb to 16Mb, 10ns - 85ns, 5V and 3.3V
Sync SRAM 4.0Mb to 36Mb, 100-250MHZ, 3.3V, Pipeline, Flow-Through & ZBL
Flash & EEPROM
1Mb to 16Mb, 70ns to 120ns, 3V and 5V
DRAM
Standard and Low Power options available on most
Packaging: PBGA, PSOJ, SOJ, TSOP, TSOPII, TQFP
• Hermetic/ceramic packages
• Hi-rel memory
• Custom device packaging
• CSP/QFN assembly
• Plastic packaging
• Radiation tolerant devices
• COB assembly
• ASIC design
• Extensive test and burn-in capabilities
• Environmental/stress screening
• Device up-screening
• Engineering/analytical services
• IC counterfeit detection
Certifications
• DSCC QML
� MIL-PRF-38534, Class H (full)
� MIL-PRF-38535, Class Q (full)
� MIL-PRF-38535, Class V (assembly)
� MIL-STD-883, Commercial Laboratory Suitability
• Certified Class 100 Clean Room
• SMD, M Level and Q Level
• AS9100 Rev. C Registered
Flows
• Customer specific, Source Control Drawing (SCD)
• COTS/PEMS Plastic Flow
• JEDEC Standards for Plastics
Quality
Services
Micross Components is transforming specialty electronics
by offering the most comprehensive range of
high-reliability and custom solutions available from any one source.
Products & Services
April 13, 2015 • Revision 3.4
7725 N. Orange Blossom Trail • Orlando, FL 32810 • 407.298.7100 • [email protected] • www.micross.com
Robotic Hot Solder Dipping & Solder ExchangeMicrossSXT™ (Solder Exchange Technology) is a robotic, automated solder-dipping process developed by Micross Components to increase component reliability and mitigate tin-whisker formation. With MicrossSXT™, unwanted finish can be replaced on a wide range of electronic components regardless of packaging style.
The GEIA-STD-0006 compliant process includes:
• Robotic-controlled six-axis dipping
• Solder dipping under a nitrogen blanket
• Solder-level sensing for accurate solder dipping
• Integral component wash and dry facility
• Preheating of components to negate thermal shock
• Lead tinning/solder dip
• Terminal finish conversion
• Solder exchange from Pb free (RoHS) ↔ SnPb
Anti-Counterfeit Program & BOM ManagementMicross Components is uniquely positioned to take a trusted role in your semiconductor supply chain to provide a counterfeit-free purchasing experience. Throughout our 35+ year history of providing authentic
high-reliability products, we’ve developed the software and the skills needed to handle everything from diodes to microprocessors.
If counterfeit protection is what you’re looking for... Get Real. Get Micross.
Hi-Rel Lead Attach
• Thermocompression weld lead
and high-temp solder lead
attachment processes
• J, Gullwing, and Spider Gullwing
lead forms
Trim & Form Components
• Trim, form, and solder dip to SOIC,
SOJ packages (other packages
not limited to DIP, PSOP, TSOP,
FP’s and QFP’s)
• Realign and Reform
Component Leads
3D Scanning Tape & Reel
BGA Modifications
• BGA re-balling for conversion
to tin-lead (SnPb)
• Ball attach
• BGA re-work
Test
• X-ray fluorescence
analysis (XRF)
• Ionic cleanliness test
• Solderability testing
• Particle Impact Noise Detection
test (PIND)
• Fine and gross leak testing
• Lead integrity/bond strength
Products & Services
April 13, 2015 • Revision 3.4
7725 N. Orange Blossom Trail • Orlando, FL 32810 • 407.298.7100 • [email protected] • www.micross.com
Passives
Die Banking & Obsolescence Management
• Die and finished product banking (multiple global storage sites)
• Qualifications and approvals
• Production planning
• DMS/EOL and whole-life product support
• Form, fit and function alternative or MCM hybrid
• Risk mitigation
Complete Wafer Processing
• Wafer saw, sort and inspect
• Electrical test/environmental screening
• Wafer thinning
• Wafer bumping and RDL
Support
• Diverse supplier base
• Cross-functional relationships with suppliers, providing enhanced design and product support to end customers
• Review of SCDs with correlation to generic parts
• Class 100, 1K, and 100K clean rooms
• Full lot and wafer traceability
• Tracking for previously evaluated lots
• Visual inspection to appropriate MIL standard
• Maintain large inventory
• Mechanical and electrical verification of capacitors
Line Cards
Bare Die
Micross Components is not limited to the manufacturers above. Please contacts us for all your die, wafer and passive component needs.
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