EL-MF877-00 Page 1
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Product End-of-Life Disassembly Instructions Product Category: Notebooks and Tablet PCs
Marketing Name / Model [List multiple models if applicable.]
HP Pro Slate 12
Purpose: The document is intended for use by end-of-life recyclers or treatment facilities. It provides the basic instructions for the disassembly of HP products to remove components and materials requiring selective treatment, as defined by EU directive 2002/96/EC, Waste Electrical and Electronic Equipment (WEEE).
1.0 Items Requiring Selective Treatment
1.1 Items listed below are classified as requiring selective treatment. 1.2 Enter the quantity of items contained within the product which require selective treatment in the right column, as applicable.
Item Description Notes
Quantity of items included in product
Printed Circuit Boards (PCB) or Printed Circuit Assemblies (PCA)
With a surface greater than 10 sq cm
1
Batteries All types including standard alkaline and lithium coin or button style batteries
1
Mercury-containing components For example, mercury in lamps, display backlights, scanner lamps, switches, batteries
0
Liquid Crystal Displays (LCD) with a surface greater than 100 sq cm
Includes background illuminated displays with gas discharge lamps
0
Cathode Ray Tubes (CRT) 0
Capacitors / condensers (Containing PCB/PCT) 0
Electrolytic Capacitors / Condensers measuring greater than 2.5 cm in diameter or height
0
External electrical cables and cords 0
Gas Discharge Lamps 0
Plastics containing Brominated Flame Retardants weighing > 25 grams (not including PCBs or PCAs already listed as a separate item above)
0
EL-MF877-00 Page 2
Template Revision B
PSG instructions for this template are available at EL-MF877-01
Components and parts containing toner and ink, including liquids, semi-liquids (gel/paste) and toner
Include the cartridges, print heads, tubes, vent chambers, and service stations.
0
Components and waste containing asbestos 0
Components, parts and materials containing refractory ceramic fibers
0
Components, parts and materials containing radioactive substances
0
2.0 Tools Required
List the type and size of the tools that would typically be used to disassemble the product to a point where components and materials requiring selective treatment can be removed.
Tool Description Tool Size (if applicable)
Description #1
Description #2
Description #3
Description #4
Description #5
3.0 Product Disassembly Process
3.1 List the basic steps that should typically be followed to remove components and materials requiring selective treatment:
1. 2. 3. 4. 5. 6. 7. 8. 9.
3.2 Optional Graphic. If the disassembly process is complex, insert a graphic illustration below to identify the items contained in the product that require selective treatment (with descriptions and arrows identifying locations).
PPP2 Disassembly SOP
Disassembly battery case
Notice:
1.沿着 Docking 孔一侧,用吸盘
将下侧电池盖卡勾打开
2.用镊子将电池背胶拉带挑出
3.通过拉带将背胶从电池盖内抽
出来
4.在沿着顺时针方向用吸盘将电池
盖卡勾依次打开
5.最后在拆 camera 一角时需用镊
子将 camera 从 camera ring 中挑出
Disassembly battery
Notice:
1.依次将电池固定的三个背胶通
过拉带抽出
2.将电池接口从两边拔出
3.将电池从电池槽内取出
PPP2 Disassembly SOPDisassembly VGA & Camera & MIC FPC
Notice:
1.打开钢琴盖,将 VGA 从上盖上
取下
2.打开钢琴盖,将 Camera 从上
盖中取下
PPP2 Disassembly SOPDisassembly M/B
Notice:
1.用螺丝起将固定大板的 5 颗螺
丝松掉
2.依次将 sun board FPC,TouchFPC,Docking FPC,LCM FPC取下
3.最后从上侧将大板抬起并取出
注意:
螺丝扭力为:0.7±0.1kgfcm
PPP2 Disassembly SOPDisassembly Left sub board & Left speaker
Notice:
1.用螺丝起子松掉板子上 4 颗螺丝
2.将左侧的 speaker box& wlan 天
线拆下
3.再将 sub board 拆下
注意:
螺丝扭力为:0.7±0.1kgfcm
Disassembly right sub board
Notice:
1.松掉板子上的 3 颗螺丝
2.拆开 audio jack FPC3.将 sub board 拆下
4. 在拆下 right speaker box 及audio jack注意:
螺丝扭力为:0.7±0.1kgfcm
PPP2 Disassembly SOPDisassembly docking FPC
Notice:
1.将 docking FPC 上的两颗螺丝
卸下
2.由上往下降 docking FPC 取出
注意:
螺丝扭力为:0.5±0.1kgfcm
Disassembly metal ring
Notice:1.依次将 metal ring 上的 15 颗螺
丝卸下
2.用 mylar 片将 metal ring 从上盖
上划开,注意拆解时不能用力
过大,造成铁框变形
注意:
螺丝扭力为:1.1±0.1kgfcm
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