NotesCHIP Name: X-SAP-WDY-CHIP:BSSP_NOTES
CL_BSSP_NOTES Feeder Class:
Description
In the Notes CHIP, you can store, display, change, or delete notes.
Inports
Port Parameter Data Element Parameter Tags
BORTYPE SWO_OBJTYP /BSSP/:BORTYPE
AttachmentsCHIP Name: X-SAP-WDY-CHIP:BSSP_ATTACHMENTS
CL_BSSP_ATTACHMENTS Feeder Class:
Description
In the Attachments CHIP, you can store, display, change, or delete attachments.
Inports
Port Parameter Data Element Parameter Tags
BORTYPE SWO_OBJTYP /BSSP/:BORTYPE
General Ledger AccountCHIP Name: X-SAP-WDY-CHIP:BSSP_GL_ACCOUNT
CL_BSSP_GL_ACCOUNTFeeder Class: BUS3006 BOR Object:
Description
This CHIP displays the data of the General Ledger Account.
Inports
Port Parameter Data Element Parameter Tags
BUKRS BUKRS /BSSP/:BUKRS
SAKNR SAKNR /BSSP/:SAKNR
CustomerCHIP Name: X-SAP-WDY-CHIP:BSSP_DEBITOR
CL_BSSP_DEBITORFeeder Class: KNB1 BOR Object:
Description
This CHIP displays the data of the customer.
Inports
Port Parameter Data Element Parameter Tags
BUKRS BUKRS /BSSP/:BUKRS
KUNNR KUNNR /BSSP/:KUNNR
VendorCHIP Name: X-SAP-WDY-CHIP:BSSP_CREDITOR
CL_BSSP_CREDITORFeeder Class: LFB1 BOR Object:
Description
This CHIP displays the data of the vendor data.
Inports
Port Parameter Data Element Parameter Tags
BUKRS BUKRS /BSSP/:BUKRS
LIFNR LIFNR /BSSP/:LIFNR
Cost CenterCHIP Name: X-SAP-WDY-CHIP:BSSP_COSTCENTER
CL_BSSP_COSTCENTERFeeder Class: BUS0012 BOR Object:
Description
This CHIP displays the data of cost center.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 6
Inports
Port Parameter Data Element Parameter Tags
KOKRS KOKRS /BSSP/:KOKRS
KOSTL KOSTL /BSSP/:KOSTL
Profit CenterCHIP Name: X-SAP-WDY-CHIP:BSSP_PROFITCENTER
CL_BSSP_PROFITCENTERFeeder Class: BUS0015 BOR Object:
Description
This CHIP displays the data of the profit center.
Inports
Port Parameter Data Element Parameter Tags
PRCTR PRCTR /BSSP/:PRCTR
KOKRS KOKRS /BSSP/:KOKRS
Internal OrderCHIP Name: X-SAP-WDY-CHIP:BSSP_INTERNALORDER
CL_BSSP_INTERNALORDERFeeder Class: BUS2075 BOR Object:
Description
This CHIP displays the data of the internal order.
Inports
Port Parameter Data Element Parameter Tags
AUFNR AUFNR /BSSP/:AUFNR
UserCHIP Name: X-SAP-WDY-CHIP:BSSP_USER
CL_BSSP_USERFeeder Class: USER BOR Object:
Description
This CHIP displays the data of the user.
Inports
Port Parameter Data Element Parameter Tags
BAPIBNAME XUBNAME /BSSP/:BAPIBNAME
Statistical KeyfigureCHIP Name: X-SAP-WDY-CHIP:BSSP_KEYFIGURE
CL_BSSP_KEYFIGUREFeeder Class: BUS1138 BOR Object:
Description
This CHIP displays the data of the statistical keyfigure.
Inports
Port Parameter Data Element Parameter Tags
KOKRS KOKRS /BSSP/:KOKRS
STAGR STAGR /BSSP/:STAGR
Company CodeCHIP Name: X-SAP-WDY-CHIP:BSSP_COMPANYCODE
CL_BSSP_COMPANYCODEFeeder Class: BUS0002BOR Object:
Description
This CHIP displays the data of the company code.
Inports
Port Parameter Data Element Parameter Tags
BUKRS BUKRS /BSSP/:BUKRS
Activity TypeCHIP Name: X-SAP-WDY-CHIP:BSSP_ACTIVITYTYPE
CL_BSSP_COMPANYCODEFeeder Class: BUS1031 BOR Object:
Description
This CHIP displays the data of the activity type.
Inports
Port Parameter Data Element Parameter Tags
LSTAR LSTAR /BSSP/:LSTAR
KOKRS KOKRS /BSSP/:KOKRS
MaterialCHIP Name: X-SAP-WDY-CHIP:BSSP_MATERIAL
CL_BSSP_MATERIALFeeder Class: BUS1001 BOR Object:
Description
This CHIP displays the data of the material.
Inports
Port Parameter Data Element Parameter Tags
MATNR MATNR /BSSP/:MATNR
WERKS WERKS /BSSP/:WERKS
Bank AccountCHIP Name: X-SAP-WDY-CHIP:BSSP_BANK_ACCOUNT
CL_BSSP_BANK_ACCOUNTFeeder Class: BSSP_ACEXT BOR Object:
Description
This CHIP displays the data of the bank account.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 2
Inports
Port Parameter Data Element Parameter Tags
BKKRS BSSP_BKKRS /BSSP/:BKKRS
ACNUM_EXT BSSP_ACNUM_EXT /BSSP/:ACNUM_EXT
Bank DataCHIP Name: X-SAP-WDY-CHIP:BSSP_BANK
CL_BSSP_BANK_DATAFeeder Class: BUS1011 BOR Object:
Description
This CHIP displays the data of the bank data.
Inports
Port Parameter Data Element Parameter Tags
BANKS BSSP_BANKS /BSSP/:BANKS
BANKL BSSP_BANKL /BSSP/:BANKL
Business AreaCHIP Name: X-SAP-WDY-CHIP:BSSP_BUSINESSAREA
CL_BSSP_BUSINESSAREAFeeder Class: BUS0003 BOR Object:
Description
This CHIP displays the data of the business area.
Inports
Port Parameter Data Element Parameter Tags
GSBER GSBER /BSSP/:GSBER
Business PartnerCHIP Name: X-SAP-WDY-CHIP:BSSP_BUSINESSPARTNER
CL_BSSP_BUSINESSPARTNERFeeder Class: BUS1006 BOR Object:
Description
This CHIP displays the data of the business partner.
Inports
Port Parameter Data Element Parameter Tags
PARTNER BU_PARTNER /BSSP/:PARTNER
Business ProcessCHIP Name: X-SAP-WDY-CHIP:BSSP_BUSINESSPROCESS
CL_BSSP_BUSINESSPROCESSFeeder Class: BUS1036 BOR Object:
Description
This CHIP displays the data of the business process.
Inports
Port Parameter Data Element Parameter Tags
KOKRS KOKRS /BSSP/:KOKRS
PRZNR PRZNR /BSSP/:PRZNR
CommodityCHIP Name: X-SAP-WDY-CHIP:BSSP_COMMODITY
CL_BSSP_COMMODITYFeeder Class: BUS5120 BOR Object:
Description
This CHIP displays the data of the commodity data.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 3.
Inports
Port Parameter Data Element Parameter Tags
COMMODITY_ID CHAR18 /BSSP/:COMMODITY_ID
CompanyCHIP Name: X-SAP-WDY-CHIP:BSSP_COMPANY
CL_BSSP_COMPANYFeeder Class: BUS0014 BOR Object:
Description
This CHIP displays the data of the company data.
Inports
Port Parameter Data Element Parameter Tags
RCOMP RCOMP_D /BSSP/:RCOMP
Controlling AreaCHIP Name: X-SAP-WDY-CHIP:BSSP_CONTROLLINGAREA
CL_BSSP_CONTROLLINGAREAFeeder Class: BUS0004BOR Object:
Description
This CHIP displays the data of the controlling area.
Inports
Port Parameter Data Element Parameter Tags
KOKRS KOKRS /BSSP/:KOKRS
Cost ElementCHIP Name: X-SAP-WDY-CHIP:BSSP_COSTELEMENT
CL_BSSP_COSTELEMENTFeeder Class: BUS1030 BOR Object:
Description
This CHIP displays the data of the cost element.
Inports
Port Parameter Data Element Parameter Tags
KSTAR KSTAR /BSSP/:KSTAR
KOKRS KOKRS /BSSP/:KOKRS
Cost ObjectCHIP Name: X-SAP-WDY-CHIP:BSSP_COSTOBJECT
CL_BSSP_COSTOBJECTFeeder Class: BUS1079 BOR Object:
Description
This CHIP displays the data of the cost object.
Inports
Port Parameter Data Element Parameter Tags
KSTRG KSTRG /BSSP/:KSTRG
Fixed AssetCHIP Name: X-SAP-WDY-CHIP:BSSP_FIXEDASSET
CL_BSSP_FIXEDASSETFeeder Class: BUS1022 BOR Object:
Description
This CHIP displays the data of the fixed asset.
Inports
Port Parameter Data Element Parameter Tags
BUKRS BUKRS /BSSP/:BUKRS
ANLN1 ANLN1 /BSSP/:ANLN1
ANLN2 ANLN2 /BSSP/:ANLN2
Functional AreaCHIP Name: X-SAP-WDY-CHIP:BSSP_FUNCAREA
CL_BSSP_FUNCAREAFeeder Class: BUS0023 BOR Object:
Description
This CHIP displays the data of the functional area.
Inports
Port Parameter Data Element Parameter Tags
FKBER FKBER /BSSP/:FKBER
Futures AccountCHIP Name: X-SAP-WDY-CHIP:BSSP_FUTURES_ACCOUNT
CL_BSSP_FUTURES_ACCOUNTFeeder Class: BSSP_FUTAC BOR Object:
Description
This CHIP displays the data of the futures account.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 6
Inports
Port Parameter Data Element Parameter Tags
FUKRT FUKRT /BSSP/:FUTAC
BUKRS BUKRS /BSSP/:BUKRS
Securities AccountCHIP Name: X-SAP-WDY-CHIP:BSSP_SECURITIES_ACCOUNT
CL_BSSP_SECURITIES_ACCOUNTFeeder Class: BSSP_SECAC BOR Object:
Description
This CHIP displays the data of the securities account.
Inports
Port Parameter Data Element Parameter Tags
SECAC BSSP_SECACC /BSSP/:SECAC
BUKRS BUKRS /BSSP/:BUKRS
Security ID NumberCHIP Name: X-SAP-WDY-CHIP:BSSP_FINANCIAL_PRODUCT
CL_BSSP_FINANCIAL_PRODUCTFeeder Class: BUS1076 BOR Object:
Description
This CHIP displays the data of the security ID number.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 2.
Inports
Port Parameter Data Element Parameter Tags
SECURITY_NUMBER VVRANLWTR /BSSP/:SECURITY_NUMBER
Accounts Payable ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_FI_AP
: CL_BSSP_FINREP_FI_APFeeder Class: LFB1 BOR Object
Description
This CHIP displays links to the accounts payable reporting.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.
Inports
Port Parameter Data Element Parameter Tags
LIFNR LIFNR /BSSP/:LIFNR
BUKRS BUKRS /BSSP/:BUKRS
Accounts Receivable ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_FI_AR
: CL_BSSP_FINREP_FI_ARFeeder Class: KNB1 BOR Object
Description
This CHIP displays links to the accounts receivable reporting.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.
Inports
Port Parameter Data Element Parameter Tags
KUNNR KUNNR /BSSP/:KUNNR
BUKRS BUKRS /BSSP/:BUKRS
Asset Accounting ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_FI_AA
: CL_BSSP_FINREP_FI_AAFeeder Class: BUS1022 BOR Object
Description
This CHIP displays links to the asset accounting reporting.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.
Inports
Port Parameter Data Element Parameter Tags
BUKRS BUKRS /BSSP/:BUKRS
ANLN1 ANLN1 /BSSP/:ANLN1
ANLN2 ANLN2 /BSSP/:ANLN2
Cost Center ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_CO_OM_CCA
: CL_BSSP_FINREP_CO_OMFeeder Class: BUS0012 BOR Object
Description
This CHIP displays links to the cost center reporting.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.
Inports
Port Parameter Data Element Parameter Tags
KOKRS KOKRS /BSSP/:KOKRS
KOSTL KOSTL /BSSP/:KOSTL
Document FlowCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_DOCFLOW
: CL_BSSP_DOCUMENT_FLOW Feeder Class
Description
This CHIP displays a link to the Document Relationship Browser.
Inports
Port Parameter Data Element Parameter Tags
BORTYPE SWO_OBJTYP /BSSP/:BORTYPE
Email ServicesCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_EMAIL
: CL_BSSP_EMAIL Feeder Class
Description
This CHIP displays links to Email Services
Inports
Port Parameter Data Element Parameter Tags
BORTYPE SWO_OBJTYP /BSSP/:BORTYPE
Internal Order ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_CO_OM_OPA
: CL_BSSP_FINREP_CO_OMFeeder Class: BUS2075 BOR Object
Description
This CHIP displays links to the internal order reporting.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.
Inports
Port Parameter Data Element Parameter Tags
AUFNR AUFNR /BSSP/:AUFNR
KOKRS KOKRS /BSSP/:KOKRS
General Ledger ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_FI_GL
: CL_BSSP_FINREP_FI_GLFeeder Class: BUS3006BOR Object
Description
This CHIP displays links to the general ledger reporting.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.
Inports
Port Parameter Data Element Parameter Tags
BUKRS BUKRS /BSSP/:BUKRS
SAKNR SAKNR /BSSP/:SAKNR
Product Cost ReportingCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_CO_PC
: CL_BSSP_FINREP_CO_PCFeeder Class: BUS1001 BOR Object
Description
This CHIP displays links to the product cost reporting.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4; some reports require even Enhancement Package 5.
Inports
Port Parameter Data Element Parameter Tags
MATNR MATNR /BSSP/:MATNR
Asset Accounting Posted DepreciationCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AA_POSTED_DEPREC_C
CL_BSSP_FINREP_FI_AAFeeder Class: BUS1022 BOR Object:
Description
This CHIP displays the posted depreciation in asset accounting.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4.
Inports
Port Parameter Data Element Parameter Tags
BUKRS BUKRS /BSSP/:BUKRS
ANLN1 ANLN1 /BSSP/:ANLN1
ANLN2 ANLN2 /BSSP/:ANLN2
Cost Center Breakdown Actual Planned Costs byPeriodCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_OM_CC_PERIOD_BD_C
CL_BSSP_FINREP_CO_OM Feeder Class: BUS0012 BOR Object:
Description
This CHIP displays the breakdown of actual versus planned costs by period for a certain cost center.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4.
Inports
Port Parameter Data Element Parameter Tags
KOKRS KOKRS /BSSP/:KOKRS
KOSTL KOSTL /BSSP/:KOSTL
Cost Center Cumulative Actual versus Planned CostsCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_OM_CC_ACT_PLAN_AGGR_C
CL_BSSP_FINREP_CO_OMFeeder Class: BUS0012 BOR Object:
Description
This CHIP displays the cumulative actual versus planned costs for a certain cost center.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4.
Inports
Port Parameter Data Element Parameter Tags
KOKRS KOKRS /BSSP/:KOKRS
KOSTL KOSTL /BSSP/:KOSTL
Customer Balances Period Drill DownCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_PERIOD_C
CL_BSSP_FINREP_FI_ARFeeder Class: KNB1 BOR Object:
Description
This CHIP displays a period drill down for customer balances.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
KUNNR KUNNR /BSSP/:KUNNR
BUKRS BUKRS /BSSP/:BUKRS
Customer Balances TotalsCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_TOTALS_C
CL_BSSP_FINREP_FI_ARFeeder Class: KNB1 BOR Object:
Description
This CHIP displays the totals for customer balances.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
KUNNR KUNNR /BSSP/:KUNNR
BUKRS BUKRS /BSSP/:BUKRS
Customer Due Date AnalysisCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_DUE_ANALYSIS_C
CL_BSSP_FINREP_FI_ARFeeder Class: KNB1 BOR Object:
Description
This CHIP displays a due date analysis for a certain customer.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
KUNNR KUNNR /BSSP/:KUNNR
BUKRS BUKRS /BSSP/:BUKRS
Customer Due Date ForecastCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_DUE_FORECAST_C
CL_BSSP_FINREP_FI_ARFeeder Class: KNB1 BOR Object:
Description
This CHIP displays a due date forecast for a certain customer.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
KUNNR KUNNR /BSSP/:KUNNR
BUKRS BUKRS /BSSP/:BUKRS
Customer Overdue AnalysisCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_OVERDUE_C
CL_BSSP_FINREP_FI_ARFeeder Class: KNB1 BOR Object:
Description
This CHIP displays an overdue analysis for a certain customer.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
KUNNR KUNNR /BSSP/:KUNNR
BUKRS BUKRS /BSSP/:BUKRS
General Ledger Account BalanceCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_GL_ACC_BALANCE_C
CL_BSSP_FINREP_FI_GLFeeder Class: BUS3006 BOR Object:
Description
This CHIP displays the data of the G/L account balance.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
BUKRS BUKRS /BSSP/:BUKRS
SAKNR SAKNR /BSSP/:SAKNR
Internal Order Actual vs. Planned Costs by PeriodCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_OM_IO_PERIOD_BD_C
CL_BSSP_FINREP_CO_OMFeeder Class: BUS2075 BOR Object:
Description
This CHIP displays the cumulative actual versus planned costs for an internal order.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4.
Inports
Port Parameter Data Element Parameter Tags
AUFNR AUFNR /BSSP/:AUFNR
KOKRS KOKRS /BSSP/:KOKRS
Internal Order Cumulative Actual-Planned CostsCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_OM_IO_ACT_PLAN_AGGR_C
CL_BSSP_FINREP_CO_OMFeeder Class: BUS2075 BOR Object:
Description
This CHIP displays the cumulative actual versus planned costs for an internal order.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4.
Inports
Port Parameter Data Element Parameter Tags
AUFNR AUFNR /BSSP/:AUFNR
KOKRS KOKRS /BSSP/:KOKRS
Material - Aggregated Actual versus Planned CostsCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_PC_MAT_ACT_PLAN_AGGR_C
CL_BSSP_FINREP_CO_PCFeeder Class: BUS1001 BOR Object:
Description
This CHIP displays the aggregated actual versus planned costs for a material.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package
Inports
Port Parameter Data Element Parameter Tags
MATNR MATNR /BSSP/:MATNR
Material - Breakdown Actual versus Planned CostsCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_PC_MAT_PERIOD_BD_C
CL_BSSP_FINREP_CO_PCFeeder Class: BUS1001 BOR Object:
Description
This CHIP displays the breakdown of the actual versus planned costs by period for a material.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4.
Inports
Port Parameter Data Element Parameter Tags
MATNR MATNR /BSSP/:MATNR
Vendor Balances - Period DrilldownCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_PERIOD_C
CL_BSSP_FINREP_FI_APFeeder Class: LFB1 BOR Object:
Description
This CHIP displays the period drilldown for vendor balances.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
LIFNR LIFNR /BSSP/:LIFNR
BUKRS BUKRS /BSSP/:BUKRS
Vendor Balances _ TotalsCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_TOTALS_C
CL_BSSP_FINREP_FI_APFeeder Class: LFB1 BOR Object:
Description
This CHIP displays the vendor balances.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
LIFNR LIFNR /BSSP/:LIFNR
BUKRS BUKRS /BSSP/:BUKRS
Vendor Due Date AnalysisCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_DUE_ANALYSIS_C
CL_BSSP_FINREP_FI_APFeeder Class: LFB1 BOR Object:
Description
This CHIP displays the analysis of the vendor due dates.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4.
Inports
Port Parameter Data Element Parameter Tags
LIFNR LIFNR /BSSP/:LIFNR
BUKRS BUKRS /BSSP/:BUKRS
Vendor Due Date ForecastCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_DUE_FORECAST_C
: CL_BSSP_FINREP_FI_APFeeder Class LFB1 BOR Object:
Description
This CHIP displays the vendor due date forecast.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4.
Inports
Port Parameter Data Element Parameter Tags
LIFNR LIFNR /BSSP/:LIFNR
BUKRS BUKRS /BSSP/:BUKRS
Vendor Overdue AnalysisCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_OVERDUE_C
CL_BSSP_FINREP_FI_APFeeder Class: LFB1 BOR Object:
Description
This CHIP displays the vendor overdue analysis.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
LIFNR LIFNR /BSSP/:LIFNR
BUKRS BUKRS /BSSP/:BUKRS
Asset Accounting - Posted DepreciationCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AA_POSTED_DEPREC
CL_BSSP_FINREP_FI_FORMFeeder Class: BUS1022 BOR Object:
Description
This CHIP displays the posted depreciation in asset accounting.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4.
Inports
Port Parameter Data Element Parameter Tags
BUKRS BUKRS /BSSP/:BUKRS
ANLN1 ANLN1 /BSSP/:ANLN1
ANLN2 ANLN2 /BSSP/:ANLN2
Customer Balances - TotalsCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_TOTALS
CL_BSSP_FINREP_FORMFeeder Class: KNB1 BOR Object:
Description
This CHIP displays the totals for the customer balances.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
KUNNR KUNNR /BSSP/:KUNNR
BUKRS BUKRS /BSSP/:BUKRS
Customer Due Date Analysis.CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_DUE_ANALYSIS
CL_BSSP_FINREP_FORMFeeder Class: KNB1 BOR Object:
Description
This CHIP displays the due date analysis for a customer.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
KUNNR KUNNR /BSSP/:KUNNR
BUKRS BUKRS /BSSP/:BUKRS
Customer Due Date Forecast.CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_DUE_FORECAST
CL_BSSP_FINREP_FORMFeeder Class: KNB1 BOR Object:
Description
This CHIP displays the due date forecast for a customer.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4.
Inports
Port Parameter Data Element Parameter Tags
KUNNR KUNNR /BSSP/:KUNNR
BUKRS BUKRS /BSSP/:BUKRS
Customer Overdue Analysis.CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AR_OVERDUE
CL_BSSP_FINREP_FORMFeeder Class: KNB1 BOR Object:
Description
This CHIP displays the overdue analysis for a customer.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
KUNNR KUNNR /BSSP/:KUNNR
BUKRS BUKRS /BSSP/:BUKRS
Internal Order - Cumulative Actual versus PlannedCostsChip Name: X-SAP-WDY-CHIP:BSSP_CO_OM_IO_ACT_PLAN_AGGR
CL_BSSP_FINREP_FORMFeeder class: BUS2075BOR object:
Description
This CHIP displays the cumulative actual versus planned costs for an internal order.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Port Parameter Data Element Parameter Tags
AUFNR AUFNR /BSSP/:AUFNR
KOKRS KOKRS /BSSP/:KOKRS
Material Aggregated Actual versus Planned CostsCHIP Name: X-SAP-WDY-CHIP:BSSP_CO_PC_MAT_ACT_PLAN_AGGR
CL_BSSP_FINREP_FORMFeeder Class: BUS1001 BOR Object:
Description
This CHIP displays the aggregated actual versus planned costs for a material.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4.
Inports
Port Parameter Data Element Parameter Tags
MATNR MATNR /BSSP/:MATNR
Vendor Balances - TotalsCHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_TOTALS
CL_BSSP_FINREP_FORMFeeder Class: LFB1 BOR Object:
Description
This CHIP displays the totals for the vendor balances.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
LIFNR LIFNR /BSSP/:LIFNR
BUKRS BUKRS /BSSP/:BUKRS
Vendor Due Date Analysis.CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_DUE_ANALYSIS
CL_BSSP_FINREP_FORMFeeder Class: LFB1 BOR Object:
Description
This CHIP displays the analysis of the vendor due dates.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4.
Inports
Port Parameter Data Element Parameter Tags
LIFNR LIFNR /BSSP/:LIFNR
BUKRS BUKRS /BSSP/:BUKRS
Vendor Due Date Forecast.CHIP Name: X-SAP-WDY-CHIP: BSSP_FI_AP_DUE_FORECAST
CL_BSSP_FINREP_FORMFeeder Class: LFB1 BOR Object:
Description
This CHIP displays the due date forecast for a vendor.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
LIFNR LIFNR /BSSP/:LIFNR
BUKRS BUKRS /BSSP/:BUKRS
Vendor Overdue Analysis.CHIP Name: X-SAP-WDY-CHIP:BSSP_FI_AP_OVERDUE
CL_BSSP_FINREP_FORMFeeder Class: LFB1 BOR Object:
Description
This CHIP displays the overdue analysis for a vendor.
Information for Side-by-Side Scenario
Available as of ECC 6.0, Enhancement Package 4
Inports
Port Parameter Data Element Parameter Tags
LIFNR LIFNR /BSSP/:LIFNR
BUKRS BUKRS /BSSP/:BUKRS
Web Services (Bank)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_BANKL
CL_BSSP_LAUNCHPAD_LINKSFeeder Class: BUS1011 BOR Object:
Description
This CHIP displays links to external Web Services
Inports
Port Parameter Data Element Parameter Tags
BANKS BSSP_BANKS /BSSP/:BANKS
BANKL BSSP_BANKL /BSSP/:BANKL
Web Services (Business Partner)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_BUPA
CL_BSSP_LAUNCHPAD_LINKSFeeder Class: BUS1006 BOR Object:
Description
This CHIP displays links to external web services.
Inports
Port Parameter Data Element Parameter Tags
PARTNER BU_PARTNER /BSSP/:PARTNER
Web Services (Company)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_RCOMP
CL_BSSP_LAUNCHPAD_LINKSFeeder Class: BUS0014 BOR Object:
Description
This CHIP displays links to external Web Services
Inports
Port Parameter Data Element Parameter Tags
RCOMP RCOMP_D /BSSP/:RCOMP
Web Servics (Cost Center)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_KOSTL
CL_BSSP_LAUNCHPAD_LINKSFeeder Class: BUS0012 BOR Object:
Description
This CHIP displays links to external Web Services
Inports
Port Parameter Data Element Parameter Tags
KOKRS KOKRS /BSSP/:KOKRS
KOSTL KOSTL /BSSP/:KOSTL
Web Services (Customer)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_KUNNR
CL_BSSP_LAUNCHPAD_LINKSFeeder Class: KNB1 BOR Object:
Description
This CHIP displays links to external Web Services
Inports
Port Parameter Data Element Parameter Tags
KUNNR KUNNR /BSSP/:KUNNR
BUKRS BUKRS /BSSP/:BUKRS
Web ServicesCHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES
CL_BSSP_LAUNCHPAD_LINKS Feeder Class:
Description
This CHIP displays links to external Web Services.
Inports
Port Parameter Data Element Parameter Tags
BORTYPE SWO_OBJTYP /BSSP/:BORTYPE
Web Services (Profit Center)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_PRCTR
CL_BSSP_LAUNCHPAD_LINKSFeeder Class: BUS0015 BOR Object:
Description
This CHIP displays links to external Web Services
Inports
Port Parameter Data Element Parameter Tags
PRCTR PRCTR /BSSP/:PRCTR
KOKRS KOKRS /BSSP/:KOKRS
Web Services (Vendor)CHIP Name: X-SAP-WDY-CHIP:BSSP_LPD_WEB_SERVICES_LIFNR
CL_BSSP_LAUNCHPAD_LINKSFeeder Class: LFB1 BOR Object:
Description
This CHIP displays links to external Web Services
Inports
Port Parameter Data Element Parameter Tags
LIFNR LIFNR /BSSP/:LIFNR
BUKRS BUKRS /BSSP/:BUKRS
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