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Nano CoatingAdvantages of Nano Coating forApplication in Au surface
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CONTENT
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Nano Coating is Big Efficiency
Nano Cotaing Decrease Cost
Nano Coting Increase Life Time
01 Nano Coating Introduce
The Nano Coating Technology for Pogo Pins, Pro
be Cards and PCBs is a novel protection solution
based on conductive polymers. A diamond like thi
n conducting polymer film is attached to the metal
surface order to reduce the surface energy and i
ncrease the surface hardness.
The Nano layer works anti adhesive and can incr
eases the life time clearly. Consequently, environ
mental contaminations will be clearly reduced, the
fact which results in homogeneous and even low
er electrical resistance. This method is leading in r
educing costs and longer time lifes of pins in the
mass production
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Cost
Reliablity
Clean
Resulting in homogeneous low
electrical resistance
Increases the surface hardness
It acts contamination-unfriendly
and decreases thus the deposition
of material during the unleaded
bonding
Decreases oxidising processes
on the metal surface
Waterbased,
free of organic solvents
Environmetal friendly,
free of nanoparticles and hea
vy metal ions
Reduces environmental
contaminations
Nano Coating can reduce
Au plating thickness
Nano coating can save 50%
of Au material cost
Increases life time of electric co
ntacts
02 Nano Coating Merits
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Nano Coating Structure03
Metal SubstrateAu, Ag, Cu
Adhesion groups
Conducting layer
Functional end groups
Lotus Effect
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Nano Coating Structure03
Diamond like nano polymer film is attached to the metals surface
to reduce massively the surface energy on metals
Emulating the nature of lotus on metals with nano polymer
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Nano Coating Structure03
Pure AU Nano Coating Pure AU Nano Coating
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Nano Coating Structure03
SR
CCL
Cu
Ni
Au
SR
CCL
Cu
NiAu
Reduce Au Thickness
Increase risk of
corrosion and insertion life
Au surface with Nano Layer
Benefits of Anticorrosion
and Anti-wearing
Gas and moisture penetrate ways
3~5nm Nano Layer
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Evaluation Data : Anti-Stick04
Massively Stick with Tin
Little Tin is stick
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Evaluation Data : Hard & Slip04
Pure Au Au + Nano Coating
!"# %&%' ('&)*%+ ,'-*.*#- /0 102.&(# 1"'31 & 1*+%*.*(&%)45 "*+"#26("#,*(&4 7 ,#("&%*(&4 1)&8*4*)5 #9#% /0 )"*(:%#11 2#-0(# ;
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Evaluation Data : Hard & Slip04
The investigations shows a massive scratch/friction reduction on the coated contact. The sliding friction is reduced by a factor of 10.
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Evaluation Data : Anti-Acid04
Load tests on coated Gold and uncoated Gold.
Test methods:
1. Aggressive Thioacetamide Test (120h) > Pass2. Aggressive Nitric Acid Test (3h) > Pass
Typical results of 100 performed loading tests > Pass
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Evaluation Data : Salt Test04
Immersion
Au 0.07um
Electro-PlatingAu 0.25um
Electro-Plating
Au 0.5um
Electro-PlatingAu 0.75um
24hr. Pure AU 24Hr. Nano Coating 48Hr. Pure AU 48Hr. Nano Coating
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Evaluation Data : Against NaOH04
Au surface without Coating
Contact Angle=69.7
Au surface Af ter coated by SM-150
Contact Angle=91.6
Au surface Af ter NaOH 5%@45C for 30min.
Contact Angle=90.6
!It means Nano Film is against NaOH
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Evaluation Data : Against CuCl204
Au surface without Coating
Contact Angle=80.7
Au surface Af ter coated by SM-150
Contact Angle=104.2
Au surface Af ter CuCl2@25C for 30min.
Contact Angle=104.82
!It means Nano Film is against CuCl2
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Evaluation Data : Against FeCl204
Au surface without Coating
Contact Angle=74.6
Au surface Af ter coated by SM-150
Contact Angle=104.9
Au surface Af ter FeCl2@50C for 15min.
Contact Angle=101.8
!It means Nano Film is against FeCl2
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Evaluation Data : Against Heat04
Au surface without Coating
Contact Angle=69.9
Au surface Af ter coated by SM-150
Contact Angle=104.6
Au surface Af ter Heat@150C for 2.5Hrs.
Contact Angle=102.6
!It means Nano Film is against Heat
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Evaluation Data : Against Plasma04
Au surface Af ter coated by SM-150
Contact Angle=90.6
Au surface Af ter [email protected] 5~10Sec.
Contact Angle=23.1
!It means Nano Film is completely removed by plasma
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Evaluation Data : Cost Save04
Au cost is 25%~30% of PCB DRAM Module
Au cost is 25%~40% of MicroSD
Gold price > USD1800/ounce
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50> 65> 50>
NANO 1%MA02 10%
2Min. 10Sec. 1Min. 6Min. 1Min.10Sec.
Cleaning Rinse Pre heat Coating Cooling Stabilize Dry
Nano Coating Process
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Company Name EZEN Trading co., ltd
Representative Philip IM
Foundation May, CY2012
Capital USD50,000
Addrress
704-904, 194, Jungja-Dong, Bundang-Gu,
Seongnam-City, Gyeonggi-Province, Korea
Staffs 2 People
Biz Parts
Semiconductor Process Chemical
Substrate & PCB
Medical Business
In order to grow with the reliable Company,
EZEN will make a greater effort
We make a firm promise to meet yours and bec
ome the strong partner.
06 EZEN Trading Profi le
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We hope to be your good partner
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