M. Letheren, EAB 3 July 2001; MIC group activities 1
EP-Microelectronics group
Overview of activities & Project Summaries
(more info at: http://web-micfe.web.cern.ch/web-micfe )
M. Letheren, EAB 3 July 2001; MIC group activities2
Overview
Design Projects Infrastructure and Services R&D Other Responsibilities
M. Letheren, EAB 3 July 2001; MIC group activities3
Overview (1) – Design
MIC group collaborates (mainly) with LHC teams and other HEP electronics groups to:
Develop mixed-signal, (rad-hard) electronics for front-ends and data acquisition systems:
System design & partitioning into ASICs. Prototype ASIC development.
(spec., design, fab., evaluation) Proto ASIC integration.
(hybrids, modules, beam tests)
M. Letheren, EAB 3 July 2001; MIC group activities4
Overview (2) – Support HEP-wide support for rad-tolerant design:
Rad-tol digital library & design kit for 0.25um process.(responsibility shared with RAL)
Multi-Project Wafer service for 0.25um process. Packaging and mounting of chips on hybrids.
(assembly, glueing, wire bonding, etc.) Mixed-signal IC test lab.
(verification of prototypes and small production volumes) X-ray irradiation. COTS assistance (advice, SEU testing, database) Wafer storage.
(Controlled environment: N2-flow, antistatic, temp., humidity, access)
Organization of ASIC volume production & test. Participation in volume testing for some projects.
M. Letheren, EAB 3 July 2001; MIC group activities5
Overview (3) – R&D Completed R&Ds:
RD9 – Rad-hard SOI (Thomson). (RD29) – Rad-hard SOI (DMILL). RD19 – Hybrid pixel detector systems. RD31 – Event Building with ATM switches. RD48 – Hardening of Si detectors.
R&Ds continuing as common projects: RD49 – Rad-tolerant design in deep submicron. COTS – Understanding COTS issues at LHC.
R&D for future experiments? Ultra-hard electronics (cryogenics, < 0.1um). Monolithic systems.
M. Letheren, EAB 3 July 2001; MIC group activities6
Overview (4) – other responsibilities
Integration of CMS Tracker electronics(A. Marchioro)
Electronics coordination for LHCb(J. Christiansen)
M. Letheren, EAB 3 July 2001; MIC group activities7
MIC Group Structure
B. van KoningsveldM. Letheren
Staff:F. AnghinolfiG. AnelliP. AspellJ.-P. Avondo-BedoneM. CampbellF. Cossey-Puget (0.5)F. FaccioJ. KaplonJ.-C. Santiard
Staff:G. CervelliJ. ChristiansenC. LjuslinP. MoreiraE. MurerC. Paillard
VisitorsM. DespeisseN. PellouxS. SaramadR. Szczygiel
Visitors:
P. Vazquez
Staff:M. Glaser
Visitors:M. Moll
R. Eggert
A. Marchioro
Digital designs (DG)
M. Letheren
Semiconductor detectors (SD)
P. Jarron
Front-ends (FE)
CAE support
Moved to TA1-SD(01/01/2001)
K. Haensler
M. Letheren, EAB 3 July 2001; MIC group activities8
DESIGN PROJECTS
M. Letheren, EAB 3 July 2001; MIC group activities9
MIC design projects (1)ATLAS
SCT (CERN, Cracow, Geneva, RAL)
ABCD baseline DMILL
ABCD 0.25um backup
SCTA analog (DMILL)
Chip & module test TRT (CERN, Cracow, Geneva, U-Penn)
DTMROC in DMILL DTMROC 0.25um
CMS Tracker (CERN, RAL, IC,…)
Fast controls, FEC ASICs for opto-links Electronics
integration Preshower (CERN, Lyon)
Delta+PACE (DMILL) Fast controls + GOL
ECAL 1 Gbit/s opto-link
(GOL) Muons
0.75ns TDC (0.25um)
M. Letheren, EAB 3 July 2001; MIC group activities10
MIC design projects (2)ALICE
ITS - Pixels (MIC, ED)
Pixel readout chip Pilot-chip, GOL Bump-bonding Testing
ITS - Si-drift (RD49 -> Torino)
PASCAL front-end HMPID & DiMuon
Spect Gassiplex, DiLogic &
hybrids (MWPC readout).
TOF Hi-res TDC (<50ps)
LHCb RICH (MIC, ED, TA2)
Pixel readout chip Bumping & testing
VELO (MIC -> ED)
Adapted SCTA (DMILL)
Muons (CERN, Rio de Janeiro)
Carioca fast FE amp & discriminator(readout of MWPCs for L0 trigger)
M. Letheren, EAB 3 July 2001; MIC group activities11
Common developmentsRad-hard chips:
TTC receiver (TTCrx) All
Gigabit Optical Link -----
G-link & Gigabit ethernet 800 and 1600 Mbit/s CMS + Alice
Programmable delay All
Voltage Regulators(ST Microelectronics)
All
M. Letheren, EAB 3 July 2001; MIC group activities12
INFRASTRUCTURE & SERVICES
M. Letheren, EAB 3 July 2001; MIC group activities13
Rad-tolerant design support
Rad-tol design support: Library
Core cells, pads, memory, etc. CAE customisation
Cadence, Synopsys, Hercules, etc.
0.25um NRE runs & MPWs: Demand-driven MPWs
(~3-4 per year, 20 designs each)
Services: Forecasting & billing, DRC, reticle assembly, polygon filling, fab submission, dicing & shipping, Fab interface for problems &
“specials”.
M. Letheren, EAB 3 July 2001; MIC group activities14
Packaging & module assembly
M. Letheren, EAB 3 July 2001; MIC group activities15
IC Test Lab Mixed-signal test system
Automatic wafer prober ->
* 112 digital channels @ 200 MHz
* VXI analog instrumentation (synchronized)
* Labview environment for DAQ & analysis
* Test vector down-load from CAE
* Step and Repeat with pattern recognition
* Stand alone or interfaced to IMS
M. Letheren, EAB 3 July 2001; MIC group activities16
X-ray irradiation facility
X-ray energy: 20 – 60 keV
Beam diameter: 100 um – 1 cm
Dose rate: 20 – 800 rad/s
8-inch wafer probe equipped with CCD camera
Thermal chuck: -25 0C – 200 0C
M. Letheren, EAB 3 July 2001; MIC group activities17
R&D PROJECTS
M. Letheren, EAB 3 July 2001; MIC group activities18
Low-key R&D activities RD49+
Prepare for next-generation technology: IBM 0.25um frame contract valid thru Q4 2003.
Extension possible until which date? Prepare rad-tol design support for next-generation.
Choose & characterize a technology. Develop design method & tools (CAE, test). Develop low-voltage analog circuit design
techniques. Develop LHC Demonstrators.
Ultra rad-hard systems (NA60 beamscope, LHC luminosity upgrade) Cryogenic detectors => cryogenic electronics. Characterization of 0.25um CMOS at cryogenic
temps.(device model and parameters)
Readout ASIC for NA60 cryogenic beamscope.
M. Letheren, EAB 3 July 2001; MIC group activities19
Future R&D activities? Monolithic Systems?
Integration of sensor on electronics wafer.
Integrated APDs (EPFL). Integrated pixels.
CERN/Berne patent pending (with ETT) Assisting LEPSI (Strasbourg) with 0.25um
What else? LHC upgrade study groups being set
up.
M. Letheren, EAB 3 July 2001; MIC group activities20
OTHER RESPONSIBILITIE
S
M. Letheren, EAB 3 July 2001; MIC group activities21
APVs
CLK - T1
CCU
DCU
Det
PLL
A/DMemory
TTCrx
I2C
FED
FEC
IV
TTCrx
PCIIntfc
CLK
& T
1
A/D
Temp
FE Hybrid
CCU Module
FEC ctrl
DataPath
ControlPath
toDAQ
LD
Integration of CMS tracker electronics.(A. Marchioro)
M. Letheren, EAB 3 July 2001; MIC group activities22
CMS Tracker IntegrationTracker electronics:
FE chip (APV25) RAL + IC
FED RAL FEC CERN Opto links CERN Fast controls CERN
(rad-hard ASICs) CCU – Communication & Control
Unit PLL - Phased Locked Loop
DCU – Detector Control Unit
LD - Laser Driver
RX40 – 40 Mbit/s receiver
TTCrx – TTC receiver
etc.
Tracker system tests: 1. CERN 25ns structured beam: * Confirm functionality * Synchronization of front-ends
2. Milestone -> 2 working Rods
M. Letheren, EAB 3 July 2001; MIC group activities23
LHCb electronics coordination(J. Christiansen ~ 50%)
Common LHCb front-end architecture Modeling and simulation studies
Organizing LHCb electronics meetings.
Organizing Reviews etc.
M. Letheren, EAB 3 July 2001; MIC group activities24
Summary of MIC activities
ASIC developments for all LHC experiments
Infrastructure & support for design, test, packaging, module assembly, radiation studies, etc.
Technology R&D for future experiments. Direct involvement in LHC collaborations
(CMS tracker integration, LHCb electronics coordination)
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