www.EVGroup.com
Enabling More-than-Moore Devices
Manufacturing with leading edge equipment
EV Group (EVG)
Markus Wimplinger, Corporate Technology Development & IP Director
Prepared for and presented at Semicon Europe, TechARENA2
www.EVGroup.com EV Group Confidential and Proprietary
EV Group at a glance
2
Founded in 1980
Installed base in excess of 2,200 tools world wide
in High Volume Production and R&D
Corporate headquarters in Austria
Subsidiaries in the US, Japan, South Korea, China and Taiwan
More than 750 employees worldwide
World wide sales and customer support organization
R&D investment: 20 % of sales revenue
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EV Group at a glance
3
EV Group (EVG) is a global supplier of
Wafer Bonders
Aligners
Coaters / Developers
Temporary Bonders / Debonders (Laminator)
Cleaners
Inspection Systems
EV Group (EVG) is a global supplier to
Advanced Packaging, 3D Interconnect
MEMS (MicroElectroMechanical Systems)
SOI (Silicon-On-Insulator)
Compound Semiconductor and Silicon based Power Devices
Nanotechnology
EV Group holds the dominant share of the market for wafer bonding
equipment and is a leader in lithography for
advanced packaging and nanotechnology.
www.EVGroup.com EV Group Confidential and Proprietary
Manufacturing Solutions for More-than-Moore
Device Manufacturing Solutions
4 4
3D IC CMOS Image Sensors High Brightness LEDs
Logic / Memory MEMS Devices Microfluidics
SAW Devices SOI Wafers Photonics
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Diversity as Strategy or Necessity?
5
Organic Growth & Technical
Leadership
Vision / Mission
Diversity of Customer Types &
Diversity of Market
Segments
Diversity Stability
Diversity
cannot be an
isolated
choice
Diversity
need to be in
the DNA of a
company
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Our Vision
6
Our vision of “being the first in exploring new techniques and serving next
generation applications of micro and nano fabrication technologies” enables our
customers to successfully commercialize their new product ideas.
This ensures continuous effective development and
economic stability.
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Our Philosophy: Triple i®
invent With our equipment and processes, we constantly bring to market emerging
applications and develop new technologies in partnership with our customers.
innovate Faster than others, we develop new technologies and processes through
constant innovation and continuous improvement. Achieving the shortest time
lapse between R&D and small-scale production is among our targets.
implement Our equipment is designed for high volume industrial production. We
implement cost efficient large-scale manufacturing technologies for new value-
added products to supply our customers’ industries.
7
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Order Intake by Type of Account
Order Value Percentage
8
0%
10%
20%
30%
40%
50%
60%
70%
80%
90%
100%
2008 2009 2010 2011 2012 2013 2014
50% 59%
69%
81%
70% 72% 73%
26% 10%
6%
8%
10% 16% 15% 10%
18% 16%
8%
11%
9% 4% 14% 13% 9%
3% 9%
4% 8%
Research of Universities / Institutes
Industry Research
Small to Midscale Production
High Volume Manufacturing
Fiscal Year
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Account Type vs Wafer Size
9
Research of Universities / Institutes 200mm
6“
4“
Industry Research 300mm
200mm
150mm
Small to Midscale Production 200mm
150mm
High Volume Manufacturing 300mm
200mm
…dependent on market &
technology
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EV Group at a Glance
10
EV Group (EVG) is a global supplier of
Wafer Bonders
Aligners
Coaters / Developers
Temporary Bonders / Debonders (Laminator)
Cleaners
Inspection Systems
EV Group (EVG) is a global supplier to
Advanced Packaging, 3D Interconnect
MEMS (MicroElectroMechanical Systems)
SOI (Silicon-On-Insulator)
Compound Semiconductor and Silicon based Power Devices
Nanotechnology
EV Group holds the dominant share of the market for wafer bonding
equipment and is a leader in lithography for
advanced packaging and nanotechnology.
www.EVGroup.com EV Group Confidential and Proprietary
EV Group at a Glance
11
EV Group (EVG) is a global supplier of
Wafer Bonders
Aligners
Coaters / Developers
Temporary Bonders / Debonders (Laminator)
Cleaners
Inspection Systems
EV Group (EVG) is a global supplier to
Advanced Packaging, 3D Interconnect
MEMS (MicroElectroMechanical Systems)
SOI (Silicon-On-Insulator)
Compound Semiconductor and Silicon based Power Devices
Nanotechnology
EV Group holds the dominant share of the market for wafer bonding
equipment and is a leader in lithography for
advanced packaging and nanotechnology.
www.EVGroup.com EV Group Confidential and Proprietary
Markets, Products & Wafer Sizes
12
Market Products Wafer Size
Advanced Packaging,
3D Interconnect
- Lithography
- Bonders
300mm
200mm
MEMS - Lithography
- Bonders
- Nanoimprint
200mm
6“
SOI & Engineered
Substrates
- Bonders
300mm 200mm
6“ 4“
Compound
Semiconductor and
Silicon based Power
Devices
- Bonders
- Lithography
- Nanoimprint
200mm 6“
4“ 3“
2“
Nanotechnology - Nanoimpint
- Bonders
200mm 6“, 4“
G2, G5 & G8 display
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Strategies for Dealing with Diversity
13
Understand the Technology early on.
Start in R&D (iii- Mission)
Supporting R&D also creates diversity!
Modular equipment design / platform strategy
Vertially integrated business model
Understand the entire picture
Engage in process dev. & process support
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Platform Strategy
14
Unique
Config.
Requirement
Unique
Config.
Requirement
Unique
Config.
Requirement
300mm
Platform
200mm
Platform
Variety of
process
modules
Variety of
process
modules
Software Platform identical between 200 and 300mm
Same automation features available on 200mm as for 300mm!
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300 mm Lithography Systems
Advanced Packaging, 3D Interconnect
15
EVG®150
Automated
Resist Processing
System
IQ Aligner ®
Automated
Mask Alignment
System
EVG®40
Automated
Measurement System
EVG®770
Automated
NIL Stepper
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200 mm Lithography Systems
MEMS
SOI
Compound Semiconductor
Power Devices
16
EVG®150
Automated Resist
Processing System
EVG®40
Automated
Measurement
System
EVG®120
Automated Resist
Processing System
EVG®6200
Automated Mask
Alignment System
EVG®620HBL
Automated Mask
Alignment System
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200 mm Systems – EVG®150 Layouts
Exemplified configuration layout
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EVG®150XT – High Throughput Configuration (exemplified)
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300 mm Systems – EVG®150XT
Up to 8 process modules (200 mm / 300 mm)
Fully automated two robot handling
Up to 8 process modules
customizable in kind and number
EFEM - advanced FOUP-handling
and buffer storage
Independent user interface
for highest process control
Achieves highest throughput
More than 100 uph
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World Class Facility for…
Customer demonstrations
Process development
Joint R&D with partners
Small volume pilot line production
Process training
IP management
Process technology licenses
Process Support & Development
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Our Process Portfolio
22
EVG Process Expertise
Most complete equipment portfolio for semiconductor
and MEMS processes on a wafer level up to 300 mm!
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Summary
23
Supporting More-than-Moore and diversity
cannot be an isolated choice inside an
organization
The entire business model has to be aligned
with this strategy
Diversity can be managed by a solid platform
strategy, solid understanding of the
technology and a high degree of vertical
integration
At EVG, 200mm equipment is NOT secondary
equipment
Leading edge technology and automation
available
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Data, design and specifications may not simultaneously apply; or depend on individual equipment configuration, process conditions and materials and may vary accordingly. EVG reserves the right to
change data, design and specifications without prior notice. All trademarks, logos, website addresses or equipment names that contain the letters or words "EVG" or "EV Group" or any combination thereof,
as well as the following names and acronyms are registered trademarks and/or the property of EV Group: ComBond®, CoverSpinTM, EZB®, EZ Bond®, EZD®, EZ Debond®, EZR®, EZ Release®, GEMINI®,
HERCULES®, HyperIntegration®, IQ Aligner®, LowTempTM, NanoAlign®, NanoFillTM, NanoSprayTM, NIL-COM®, NILPhotonicsTM, OmniSpray®, SmartEdge®, SmartView®, The Triple "i" Company Invent-
Innovate-Implement®, Triple i®. Other product and company names may be registered trademarks of their respective owners.
File: EV Group Corporate Profile.pptx / Status: 21 JUL 2016
Thank you!
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