EE C247B/ME C218: Introduction to MEMSLecture 1m: Admin & Overview
CTN 1/17/17
Copyright @ 2017 Regents of the University of California
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 1
EE C247B – ME C218Introduction to MEMS Design
Spring 2017
Prof. Clark T.-C. Nguyen
Dept. of Electrical Engineering & Computer SciencesUniversity of California at Berkeley
Berkeley, CA 94720
Lecture Module 1: Admin & Overview
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 2
Instructor: Prof. Clark T.-C. Nguyen
• Education: Ph.D., University of California at Berkeley, 1994
• 1995: joined the faculty of the Dept. of EECS at the University of Michigan
• 2006: (came back) joined the faculty of the Dept. of EECS at UC Berkeley
• Research: exactly the topic of this course, with a heavy emphasis on vibrating RF MEMS
• Teaching: (at the UofM) mainly transistor circuit & physics; (UC Berkeley) 140/240A, 143, 243, 245,247B/ME218
• 2001: founded Discera, the first company to commercialize vibrating RF MEMS technology
•Mid-2002 to 2005: DARPA MEMS program managerran 10 different MEMS-based programstopics: power generation, chip-scale atomic clock, gas
analyzers, nuclear power sources, navigation-grade gyros, on-chip cooling, micro environmental control
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 3
Course Overview
• Goals of the course:Accessible to a broad audience (minimal prerequisites)Design emphasis
Exposure to the techniques useful in analytical design of structures, transducers, and process flows
Perspective on MEMS research and commercialization circa 2017
• Related courses at UC Berkeley:EE 143: Microfabrication TechnologyEE 147/247A: Introduction to MEMSME 119: Introduction to MEMS (mainly fabrication)BioEng 121: Introduction to Micro and Nano
Biotechnology and BioMEMSME C219 – EE C246: MEMS Design
• Assumed background for EE C247B/ME C218: graduate standing in engineering or physical/bio sciencesknowledge of microfabrication technology
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 4
Course Overview
• The mechanics of the course are summarized in the course handouts, described in lecture todayCourse Information Sheet
Course descriptionCourse mechanicsTextbooksGrading policy
SyllabusLecture by lecture timeline w/ associated reading
sectionsMidterm Exam: Tuesday, March 21Final Exam: Friday, May 12, 7-10 p.m. (Group 20)Project due date TBD (but near semester’s end)
EE C247B/ME C218: Introduction to MEMSLecture 1m: Admin & Overview
CTN 1/17/17
Copyright @ 2017 Regents of the University of California
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 5
What Should You Know?
P
P Well - NMOS SubstrateN Well - PMOS Substrate
PNP+ P+ N+ N+
S G D S G D
G
D
S S
D
GSub Sub
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 6
What Should You Know?
• Basic circuit analysis & design using op amps
• Example: Find the transfer function vo(s)/vi(s) of the circuit below.
-
+
Cf
Rf
vivo
R1
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 7
Lecture Outline
• Reading: Senturia, Chapter 1
• Lecture Topics:Definitions for MEMSMEMS roadmapBenefits of Miniaturization
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 8
Angle set by mechanical meansto control the path of light
MEMS: Micro Electro Mechanical System
• A device constructed using micromachining (MEMS) tech.
• A micro-scale or smaller device/system that operates mainly via a mechanical or electromechanical means
• At least some of the signals flowing through a MEMS device are best described in terms of mechanical variables, e.g., displacement, velocity, acceleration, temperature, flow
MEMS
Input:voltage, current
acceleration, velocitylight, heat …
Output:voltage, current
acceleration, velocitylight, heat, …
Control:voltage, current
acceleration velocity
light, heat, …
[Wu, UCLA]Transducer to
Convert Controlto a Mechanical Variable (e.g., displacement,
velocity, stress, heat, …)
Transducer to Convert Controlto a Mechanical Variable (e.g., displacement,
velocity, stress, heat, …)
EE C247B/ME C218: Introduction to MEMSLecture 1m: Admin & Overview
CTN 1/17/17
Copyright @ 2017 Regents of the University of California
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 9
Other Common Attributes of MEMS
• Feature sizes measured in microns or less
•Merges computation with sensing and actuation to change the way we perceive and control the physical world
• Planar lithographic technology often used for fabricationcan use fab equipment identical to those needed for IC’showever, some fabrication steps transcend those of
conventional IC processing
MEMSTechnology
Gimballed, SpinningMacro-Gyroscope
MicromechanicalVibrating Ring Gyroscope
Signal Conditioning Circuits
80 mm
1 mm
(for 80X sizeReduction)
[Najafi, Michigan]
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 10
Silicon Substrate
Glass Substrate
Bulk Micromachining and Bonding
• Use the wafer itself as the structural material
• Adv: very large aspect ratios, thick structures
• Example: deep etching and wafer bonding
Silicon SubstrateSilicon Substrate
Glass Substrate
Silicon Substrate
Metal InterconnectAnchor
MovableStructure Electrode
MicromechanicalVibrating Ring Gyroscope
1 mm
Microrotor(for a microengine)
[Najafi, Michigan][Pisano, UC Berkeley][Pisano, UC Berkeley]
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 11• Fabrication steps compatible with planar IC processing
Surface Micromachining
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 12
• Completely monolithic, low phase noise, high-Q oscillator (effectively, an integrated crystal oscillator)
• To allow the use of >600oC processing temperatures, tungsten (instead of aluminum) is used for metallization
OscilloscopeOutput
Waveform
Single-Chip Ckt/MEMS Integration
[Nguyen, Howe 1993][Nguyen, Howe 1993]
EE C247B/ME C218: Introduction to MEMSLecture 1m: Admin & Overview
CTN 1/17/17
Copyright @ 2017 Regents of the University of California
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 13
3D Direct-Assembled Tunable L
[Ming Wu, UCLA]
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 14
Technology Trend and Roadmap for MEMS
inc
rea
sin
g a
bilit
y t
o c
om
pu
te
increasing ability to sense and act
Nu
mb
er
of
Tra
nsis
tors
Number of Mechanical Components
100
101
102
103
104
105
106
107
108
109
100 101 102 103 104 105 106 107 108 109
AdaptiveOptics
Integrated FluidicSystems
DistributedStructural
ControlTerabit/cm2
Data Storage
Optical Switches& Aligners
InertialNavigationOn a Chip
Displays
Weapons,Safing, Arming,
and Fusing
Majority ofEarly MEMS
Devices(mostly sensors)
ADXL-50
Digital MicromirrorDevice (DMD)
ADXL-278
Future MEMSIntegration Levels
Enabled Applications
OMM 32x32
ADXL-78
CPU’s
Pentium 4
ADXRS
i-STAT 1Caliper
Phased-ArrayAntenna
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 15
Example: Micromechanical Accelerometer
• The MEMS Advantage: >30X size reduction for
accelerometer mechanical element allows integration with IC’s
xo
x
a
Acceleration
Inertial Force
Spring
Proof Mass
Basic Operation Principle
400
m
Analog Devices ADXL 78
Displacement
maFx i
Tiny mass means small output need integrated transistor
circuits to compensate
Tiny mass means small output need integrated transistor
circuits to compensate
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 16
DisplaysPhased-ArrayAntenna
Technology Trend and Roadmap for MEMS
inc
rea
sin
g a
bilit
y t
o c
om
pu
te
increasing ability to sense and act
Nu
mb
er
of
Tra
nsis
tors
Number of Mechanical Components
100
101
102
103
104
105
106
107
108
109
100 101 102 103 104 105 106 107 108 109
AdaptiveOptics
Integrated FluidicSystems
DistributedStructural
ControlTerabit/cm2
Data Storage
Optical Switches& Aligners
InertialNavigationOn a Chip
Weapons,Safing, Arming,
and Fusing
Majority ofEarly MEMS
Devices(mostly sensors)
ADXL-50
Digital MicromirrorDevice (DMD)
ADXL-278
Future MEMSIntegration Levels
Enabled Applications
OMM 32x32
ADXL-78
CPU’s
Pentium 4
i-STAT 1
ADXRSCaliper Microfluidic Chip
Adv.: small size, small sample, fast analysis speed
Adv.: small size, small sample, fast analysis speed
Caliper
Analog Devices ADXRSIntegrated Gyroscope
Adv.: small sizeAdv.: small size
OMM 8x8 OpticalCross-Connect Switch
Adv.: faster switching, low loss, larger networks
Adv.: faster switching, low loss, larger networks
Adv.: low loss, fast switching, high fill factor
Adv.: low loss, fast switching, high fill factor
TI Digital Micromirror Device
EE C247B/ME C218: Introduction to MEMSLecture 1m: Admin & Overview
CTN 1/17/17
Copyright @ 2017 Regents of the University of California
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 17
Technology Trend and Roadmap for MEMSin
cre
as
ing
ab
ilit
y t
o c
om
pu
te
increasing ability to sense and act
Nu
mb
er
of
Tra
nsis
tors
Number of Mechanical Components
100
101
102
103
104
105
106
107
108
109
100 101 102 103 104 105 106 107 108 109
AdaptiveOptics
Integrated FluidicSystems
DistributedStructural
ControlTerabit/cm2
Data Storage
Optical Switches& Aligners
InertialNavigationOn a Chip
Weapons,Safing, Arming,
and Fusing
Majority ofEarly MEMS
Devices(mostly sensors)
ADXL-50
Digital MicromirrorDevice (DMD)
ADXL-278
Future MEMSIntegration Levels
Enabled Applications
OMM 32x32
ADXL-78
CPU’s
Pentium 4
inc
rea
sin
g p
ow
er
co
ns
um
pti
on
ADXRS
i-STAT 1Caliper
DisplaysPhased-ArrayAntenna
Lucrative Ultra-Low Power Territory(e.g, mechanically powered devices)
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 18
Benefits of Size Reduction: MEMS
MEMS extends the benefits of size reductionbeyond the electrical domain
Performance enhancements for applicationdomains beyond those satisfied by electronics
in the same general categories
Speed
Power Consumption
Complexity
Economy
Frequency , Thermal Time Const.
Actuation Energy , Heating Power
Integration Density , Functionality
Batch Fab. Pot. (esp. for packaging)
Robustness g-Force Resilience
• Benefits of size reduction clear for IC’s in elect. domainsize reduction speed, low power, complexity, economy
•MEMS: enables a similar concept, but …
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 19
Vibrating RF MEMS
EE C247B/ME C218: Introduction to MEMS Design LecM 1 C. Nguyen 8/20/09 20
Basic Concept: Scaling Guitar Strings
Guitar String
Guitar
Vibrating “A”String (110 Hz)
Vibrating “A”String (110 Hz)
High Q
110 Hz Freq.
Vib
. A
mp
litu
de
Low Q
r
ro
m
kf
2
1
Freq. Equation:
Freq.
Stiffness
Mass
fo=8.5MHzQvac =8,000
Qair ~50
Mechanical Resonator
Performance:Lr=40.8m
mr ~ 10-13 kgWr=8m, hr=2md=1000Å, VP=5VPress.=70mTorr
[Bannon 1996]
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