iCE40 Ultra Wearable Development Platform User Guide
EB100 Version 1.0, July 2015
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iCE40 Ultra Wearable Development Platform
IntroductionThe iCE40 Ultra Wearable Development Platform is an easy-to-use platform which demonstrates how the iCE40 Ultra and MachXO2 FPGAs can be utilized in wearable and mobile applications. Along with the evaluation board and acces-sories, there are reference designs available to demonstrate the functionality of the boards and components.
The iCE40 Ultra Wearable Development Platform consists of two boards: the Main Board and the Sensor Board. The Main Board contains the iCE40 Ultra and MachXO2 FPGAs, which drive various components on the board. The iCE40 Ultra focuses on interfacing with peripheral components such as LEDs, sensors and BLE connectivity. The MachXO2 focuses on driving the MIPI DSI Display from a Quad SPI flash functioning as a frame buffer and storage device. The Sensor Board contains several sensors that are typically found in mobile and wearable devices. By separating the two boards, the interconnect headers can be used to directly interface with peripherals for testing (see the Headers section).
The contents of this user guide include a description of the board features, header connection descriptions and pinouts, instructions on loading demonstration bitstreams, a complete set of schematics, and the bill of materials.
FeaturesThe iCE40 Ultra Wearable Development Platform includes:
• iCE40 Ultra Wearable Development Platform Main Board:— iCE40 Ultra (iCE5LP-4K-SWG36) device in a 36-ball WLCSP package— MachXO2 (LCMXO2-2000ZE-1UWG49) device in a 49-ball WLCSP package— High-current IR, White, and RGB LEDs— Stereo Microphones— Connector and driver circuitry for MIPI DSI Display— Headers for I2C, SPI, and UART— Mini-USB programming connection— Battery charger— RoHS-compliant packaging and process
• iCE40 Ultra Wearable Development Platform Sensor Board:– Bluetooth Low-Energy Module– Heart-rate/SpO2 Sensor and Analog Front End– Skin temperature sensor– Pressure sensor– Accelerometer/Gyroscope– Pads for soldering on battery (charger accepts Li-Ion and Li-Po)
• Syma 652030 Battery – 3.7 V, 250 mAh Lithium-Polymer Battery provides power while the USB cable is discon-nected
• LG LH154Q01 Display – 240x240 Single Lane MIPI DSI Display. Must be attached prior to power-up
• USB Connector Cable – A mini-USB port provides power and a programming interface for the board
• Watch Strap – A watch strap comes pre-attached to the Sensor Board
Note: Static electricity can severely shorten the lifespan of electrical components. Use care while handling the iCE40 Ultra Wearable Development Platform to avoid ESD damage.
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iCE40 Ultra Wearable Development Platform
Figure 1 through Figure 4 show the top and bottom sides of the Main and Sensor boards, with key features high-lighted.
Figure 1. Main Board (Top Side)
Figure 2. Main Board (Bottom Side)
Reset Button
User LEDs (XO2)
RGB LED
High-Brightness LED
IR LED
Battery Charger Status LEDs
Microphone (L)
Display ConnectorMachXO2
iCE5LP Config LED MachXO2 Config LED
iCE5LP
FTDI Power JumperLED Select Jumper
Microphone (R)
Power Switch
FTDI Programming Chip
Mini -USB Socket
Battery Charger
Backlight Driver
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iCE40 Ultra Wearable Development Platform
Figure 3. Sensor Board (Top Side)
Figure 4. Sensor Board (Bottom Side)
Heart Rate/Oxygen Sensor Analog Front End
Bluetooth Low -Energy Module
Pressure Sensor
Accelerometer/Gyroscope
Heart Rate/Oxygen Sensor
Skin Temperature Sensor
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iCE40 Ultra Wearable Development Platform
Lattice Semiconductor DevicesThe Main Board features an iCE5LP4K and a MachXO2-2000ZE FPGA.
The iCE5LP4K has a 1.2 V core supply and is packaged in a 36-ball WLCSP package. For a complete description of this device, see DS1048, iCE40 Ultra Family Data Sheet.
The MachXO2-2000ZE has a 1.2 V core supply and is packaged in a 49-ball WLCSP package. For a complete description of this device, see DS1035, MachXO2 Family Data Sheet.
Software RequirementsThe following software must be installed before designs can be developed for this board:
• iCEcube2 2014-12 (or higher)
• Diamond® 3.4 (or higher)
• Diamond Programmer 3.4 (or higher)
This software is available at the Lattice website Design Software & IP page.
Board PowerThe iCE40 Ultra Wearable Development Platform uses the USB connection as its primary source of power. It is also equipped with a battery and charger for use without a wired connection. A power switch (SW2) allows for the regulators to be disabled while allowing the battery to continue charging. Two status LEDs allow the battery charger to be monitored (see Table 12).
The battery charger and regulators are located on the Main Board. The battery attaches to the Sensor Board. Power is transferred between the two boards using the Power Connector header. See Table 2 for connections.
The VREG_ADJ I/O supply net for the iCE5LP is adjustable, but is an internal, reserved feature. Changing this net from 3.3 V (default) to 1.8 V will cause voltage-level mismatches that can permanently damage the iCE5LP.
To allow current measurements to be made for specific supplies, resistors with test points have been inserted into the circuit. Refer to Table 1 to see which test points correspond to which supplies.
Table 1. Supply Current Test Points
Supply TP+ TP- Resistance
MachXO2 1.2 V TP20 TP21 0.5 Ohms
MachXO2 3.3 V TP18 TP19 0.5 Ohms
iCE5LP 1.2 V TP20 TP33 0.5 Ohms
iCE5LP 3.3 V TP18 TP32 0.5 Ohms
3.3 V Regulator TP16 TP17 0.5 Ohms
Display 3 V TP25 TP24 0.5 Ohms
Display 1.8 V TP22 TP23 0.5 Ohms
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iCE40 Ultra Wearable Development Platform
HeadersFour headers are used to connect the Main Board and the Sensor Board. The signals and connections are shown in the tables below:
Figure 5. Headers
Power Connector (Main Board J7, Sensor Board J5): Power connection between the two boards
Table 2. Power Connector
I2C Connector (Main Board J5, Sensor Board): Interface for pressure sensor, temperature sensor, and accelerom-eter/gyroscope
Table 3. I2C Connector
SPI Connector (Main Board J6, Sensor Board): Interface for the Analog Front-End of the Heart Beat/SpO2 sensor
Table 4. SPI Connector
Pin Number Signal Description
1 3V3 Regulated 3.3 V supply
2 BT_3V7 Unregulated ~3.7 V battery voltage
3 VREG_ADJ Adjustable I/O Voltage (3.3 V default)
4 GND Ground
Pin Number Signal iCE5LP Ball #
1 Sensor SCL C1
2 Sensor SDA E2
Pin Number Signal iCE5LP Ball #
1 AFE SCLK D6
2 AFE MISO F6
3 AFE Ready B5
4 AFE SS D5
5 AFE MOSI E6
6 GND —
SPI Connector
I2C Connector
Power Connector
BLE Connector
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iCE40 Ultra Wearable Development Platform
BLE Connector (Main Board J3, Sensor Board): Contains a UART connection to iCE5LP and a configuration SPI connection for the iCE5LP
Table 5. BLE Connector
JumpersThe following jumpers can be used for adjusting board functionality:
• High-current LED select (J50): Controls whether the IR LED (1+2) or High-current White LED (2+3) is driven by the iCE5LP device
• FTDI Power (J51): To minimize power consumption and increase battery life, the FTDI programming chip can have its power supply cut-off by removing the jumper from J51. J51 must be in place prior to powering up in order to program the devices on this board.
Pin Number Signal Ball #
1 BLE Prog MachXO2 G2
2 BLE SS Config
3 BLE MISO Config
4 BLE MOSI Config
5 BLE SCLK Config
6 CRSTb —7 CDONE MachXO2 E3
8 UART Rx (out) iCE5LP F5
9 UART Tx (in) iCE5LP E5
10 GND —
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iCE40 Ultra Wearable Development Platform
Test PointsSeveral test points have been included into the design to ease debug. Descriptions of these test points can be found below:
Table 6. Main Board Test Points
Test Point Signal/Function
1 Configuration Signal: CResetn_FTDI
2 Configuration Signal: iCE_CDONE
3 Configuration Signal: FTDI_TCK (XO2)
4 Configuration Signal: FTDI_TDI (XO2)
5 Configuration Signal: FTDI_TDO (XO2)
6 Configuration Signal: FTDI_TMS (XO2)
11 Configuration Signal: JTAGEN (XO2)
12 Configuration Signal: PROGRAMN (XO2)
13 Configuration Signal: INITN (XO2)
16 Current Measurement (See Table 1)
17 Current Measurement (See Table 1)
18 Current Measurement (See Table 1)
19 Current Measurement (See Table 1)
20 Current Measurement (See Table 1)
21 Current Measurement (See Table 1)
22 Current Measurement (See Table 1)
23 Current Measurement (See Table 1)
24 Current Measurement (See Table 1)
25 Current Measurement (See Table 1)
28 Configuration Signal: FLASH_MISO (iCE)
29 Configuration Signal: FLASH_MOSI (iCE)
30 Configuration Signal: FLASH_CSB (iCE)
31 Configuration Signal: FLASH_SCLK (iCE)
32 Current Measurement (See Table 1)
33 Current Measurement (See Table 1)
34 3.3 V Regulator Output Control (See TPS7A7200)
35 3.3 V Regulator Output Control (See TPS7A7200)
36 3.3 V Regulator Output Control (See TPS7A7200)
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iCE40 Ultra Wearable Development Platform
Table 7. Sensor Board Testpoints
Device InterconnectsSix general purpose connections have been made between Lattice MachXO2 and iCE5LP devices for communica-tion between FPGAs. Level translators have been implemented on these lines, which limit their operation fre-quency. Table 8 lists connection ports and maximum operation frequencies:
Table 8. MachXO2 and iCE5LP Interconnections
Test Point Signal/Function
1 AFE4403: CLKOUT
2 BLE Config: SWCLK
3 LPS25H: INT1
4 AFE4403: TX3
5 AFE4403: INN
6 AFE4403: INP
7 AFE4403: ADC_RDY
8 AFE4403: LED_DRV_SUP
9 AFE4403: VCM
10 AFE4403: TXP
11 AFE4403: TXN
12 Battery Connector (+)
13 Battery Connector (-)
14 LSM330DLC: INT1_G
15 LSM330DLC: INT2_G
16 BLE Config: SWDIO
17 AFE4403: Manual Reset, short to TP18
18 AFE4403: Manual Reset, short to TP17
Net Number MachXO2 Ball iCE5LP Ball Max Frequency
1 E6 C2 20 MHz
2 E5 B1 20 MHz
3 D5 D2 100 MHz
4 D4 B2 100 MHz
5 G4 B4 100 MHz
6 F4 F4 100 MHz
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iCE40 Ultra Wearable Development Platform
DisplayThe iCE40 Ultra Wearable Development Platform includes an LG LH154Q01 Display and necessary driving cir-cuitry. MIPI DSI clock and data signals are driven by the Lattice MachXO2 device, through a resistor network for achieving proper voltage levels. This display also provides a frame-sync signal, B_Sync, which is routed to a MachXO2 pin. Display supplies and the backlight driver are controlled by outputs from the MachXO2.
Table 9. Display Signals
Note: For the high-speed differential signals (Clock HS, Data HS) only the positive channel must be assigned, the negative channel will be automatically placed.
Clock SourcesThe Main Board has a single 27 MHz clock source that connects to the Lattice MachXO2 device. To use this exter-nal clock with the iCE5LP device, the 27 MHz clock can be routed from the MachXO2 via one of the six general purpose interconnects. These connections can be found in Table 8.
Table 10. Clock Sources
Reset ButtonA button (SW1) is included for performing resets of systems on board the iCE40 Ultra Wearable Development Plat-form. By default, this button will perform a configuration reset of the iCE5LP, MachXO2, and the Bluetooth module.
Table 11. Reset Resistors and Pins
Note: If VREG_ADJ (see the Board Power section) is changed, these resistors must be removed to prevent voltage level mismatches.
Signal MachXO2 Ball I/O Type
Clock HS+ C4 LVDS25
Clock HS- D3 (Auto) LVDS25 (Auto)
Clock LP+ C7 LVCMOS12
Clock LP- C6 LVCMOS12
Data HS+ C1 LVDS25
Data HS- D2 (Auto) LVDS25 (Auto)
Data LP+ A7 LVCMOS12
Data LP- B6 LVCMOS12
Reset B2 LVCMOS33
B_Sync A3 LVCMOS33
Backlight PWM C3 LVCMOS33
3 V Enable C2 LVCMOS33
1.8 V Enable E2 LVCMOS33
Source Frequency XO2 Ball iCE Ball
Oscillator 27 MHz E4 —
Device Resistor FPGA Ball
MachXO2 R110 B3
iCE5LP R62 —Seeed BLE R63 —
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iCE40 Ultra Wearable Development Platform
LEDsThe Main Board has four system status LEDs, two user LEDs, an RGB LED, an IR LED, and a High-current White LED.
The iCE40 Ultra has I/O ports specially built for sinking current from high-power LEDs. The RGB LED ports (A6, B6, and C6) are able to sink 24 mA each, while the high-current LED port (A2) is able to sink up to 500 mA.
Please note that the IR LED is only rated for 100 mA and can be damaged by incorrectly configuring the port in custom designs. This is not a problem for the RGB LED and High-current White LED, since they are rated for more current than the ports can sink.
The LED functions and FPGA connections are detailed below:
Table 12. Main Board LEDs
Sensors and PeripheralsThe iCE40 Ultra Wearable Development Platform utilizes several third-party devices. Links for more information can be found below:
Table 13. Main Board Sensors and Peripherals
LED Number MachXO2 Ball iCE40 Ball Function
D1 — — Power Source Connected
D2 — — Battery Charging
D3 Config — MachXO2 CDONE
D4 E7 — User LED
D5 F7 — User LED
D8 — Config iCE40 CDONE
D9 (R) — C6 RGB LED (Red)
D9 (G) — B6 RGB LED (Green)
D9 (B) — A6 RGB LED (Blue)
D10 — A2* IR LED (see the Jumpers section)
D11 — A2* High-current White LED (see the Jumpers section)
NameReference Number Interface
FPGA Connections Part Number Link
Microphone U6, U7 I2S iCE5LP: Clock (F3), Data (E3)
MP34DB01 http://www.st.com/web/en/catalog/sense_power/FM125/SC1564/PF250941
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iCE40 Ultra Wearable Development Platform
Table 14. Sensor Board Sensors and Peripherals
Flash Memory DevicesThe Lattice MachXO2 and iCE5LP are each equipped with an external SPI Flash memory device.
Table 15. Flash Devices
The iCE5LP external Flash memory is intended for holding configuration data, while the MachXO2 external Flash memory is intended for storing data, such as images for the included display. Because of the target application, the Flash device connected to the MachXO2 is capable of using the higher-bandwidth Quad-SPI protocol.
Table 16. Flash Connections
NameReference Number Interface
FPGA Connections Part Number Link
Temperature Sensor
U7 I2C See Table 3 TMP112 http://www.ti.com/prod-uct/tmp112
Pressure Sensor U3 I2C See Table 3 LPS25H http://www.st.com/web/catalog/sense_power/FM89/SC1316/PF255230
Accelerometer/Gyroscope
U4 I2C See Table 3 LSM330DLC http://www.st.com/web/en/catalog/sense_power/FM89/SC1448/PF252427
Heart Rate & Oxygen Sensor
U6 — — SFH7050 http://www.osram-os.com/osram_os/en/products/product-promo-tions/infrared-products/sensor-family/biomon-sensor-sfh-7050/index.jsp
Analog Front End
U2 SPI See Table 4 AFE4403 http://www.ti.com/prod-uct/afe4403
BLE Module U5 UART See Table 5 Seeed 113050012
http://www.seeedstu-dio.com/wiki/BLE_Micro
Master Device Reference Number Part Number
MachXO2 U5 Micron N25Q032A13ESC40G
iCE5LP U10 Micron M25P80-VMN6TP
Master Device Reference Number Signal FPGA Ball
MachXO2 U5 DQ0 G1
DQ1 F5
DQ2 F3
DQ3 G3
SCLK F6
CS G7
iCE5LP U10 MISO F2
MOSI D1
SCLK E1
CS F1
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iCE40 Ultra Wearable Development Platform
Board Configuration and ProgrammingLattice MachXO2The Lattice MachXO2 features internal configuration Flash. This allows configuration data to be stored internally while the external Flash memory device is used for auxiliary functions.
1. Ensure that header J51 is shunted and the power switch (SW2) is in the on position.
2. Plug in the mini-USB cable (J1).
3. Launch Diamond Programmer.
4. Select Create a new project from a scan and click Detect Cable.
5. Select the FTUSB-1 Port.
6. Select MachXO2 and LCMXO2-2000ZE in the Device Family and Device columns.
7. Double click on the Operation column and select the appropriate operation.a. Internal Flash: Flash Programming Mode: SPI Flash Erase, Program, Verifyb. External Flash: SPI Flash Programming: SPI Flash Erase, Program, Verify
8. If targeting the External Flash memory, copy the SPI Flash Options from Figure 6.
9. Select the programming bitstream in the “File Name” column.
10. Click the Program Icon or select Program from the Design dropdown menu.
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iCE40 Ultra Wearable Development Platform
Figure 6. MachXO2 External Flash
Lattice iCE5LPThe Lattice iCE5LP can be directly programmed, however, unless single-time programmable NVCM is used, the configuration data will be lost when the device is powered down.
1. Ensure that header J51 is shunted and the power switch (SW2) is in the on position.
2. Plug in the mini-USB cable (J1).
3. Launch Diamond Programmer.
4. Select Create a new project from a scan and click Detect Cable.
5. Select the FTUSB-0 Port.
6. Select iCE5LP and iCE5LP4K in the Device Family and Device columns.
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iCE40 Ultra Wearable Development Platform
7. Double click on the Operation column and select the appropriate operationa. Direct Program: CRAM Programming: Fast Program (Volatile)b. NVCM (Single-use): NVCM Programming Mode: NVCM Program, Verify, Securec. External Flash: SPI Flash Programming: SPI Flash Erase, Program, Verify
8. If targeting the External Flash memory, copy the SPI Flash Options from Figure 7.
9. Select the programming bitstream in the File Name column
10. Click the Program Icon or select Program from the Design dropdown menu
Figure 7. iCE5LP External Flash
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iCE40 Ultra Wearable Development Platform
Pre-Loaded Demonstration DesignThe iCE40 Ultra Wearable Development Platform comes pre-loaded with the Parallel-to-MIPI DSI demo. In order to run the demo, follow these steps:
1. Ensure that the display is attached in the proper orientation, with the connector ribbon extending toward the right edge of the device (see Figure 8).
Figure 8. Display Connector
2. Plug a mini-USB cable into the mini-USB port (J1) to supply power to the device.
3. Switch power switch to the on position.
4. The screen should alternate between two images, with the User LEDs (D4, D5) indicating the demo mode.
For more detailed operation instructions, please refer to the Quick Start User Guide included with the demo design.
This demo design can be reprogrammed onto the board by downloading the project (see the Additional Demon-stration Designs section) and following the documented instructions. Please note that in this demo, the MachXO2 uses its internal Flash to store configuration data and the external Flash to store image data, so two programming procedures must be performed.
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iCE40 Ultra Wearable Development Platform
Additional Demonstration DesignsSeveral additional demonstration designs have been developed for the iCE40 Ultra Wearable Development Plat-form. These designs can be found under the Design File Tab of the Documentation section of the board web page here: http://www.latticesemi.com/ultrawearable.
Ordering Information
Technical Support AssistanceSubmit a technical support case through www.latticesemi.com/techsupport.
Revision History
© 2015 Lattice Semiconductor Corp. All Lattice trademarks, registered trademarks, patents, and disclaimers are as listed at www.latticesemi.com/legal. All other brand or product names are trademarks or registered trademarks of their respective holders. The specifications and information herein are subject to change without notice.
Description Ordering Part Number China RoHS Environment-Friendly Use Period (EFUP)
iCE40 Ultra Wearable Development Plat-form
ICE5LP4K-WDEV-EVN
Date Version Change Summary
July 2015 1.0 Initial release.
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iCE40 Ultra Wearable Development Platform
Appendix A. Main Board Schematic DiagramsFigure 9. Block Diagram
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
BQ24232
Battery Charger
Regulators
XO2-2000ZE
WLCS49
Bank 0
5035481220
MIPI DSI
Display Connector
Bank 2
Bank 5
N25Q032A
NOR FLASH
Video Frame Buffer
LEDs
iCE40 Ultra
SWG36Bank 0
Bank 2
Bank 1
FT2232H
FTDI USB
SPI Config
JTAG Config
Port 0
Port 1
SPI Header J6
SPI UART CFG Header J3
M25P80
CFG SPI Flash
I2C Header J5
ASCSM-27.000MHZ
27Mhz Oscillator
MP34DB01
Left Microphone
MP34DB01
Right Microphone
RGB LED
Voltage Header J7
Mini USB
Connector
ON/OFF
Switch
Wearable (Top) Main Board
Reset
Push Button
Y2
U6
U7
U9
D9
SW1
U10
J2
U4
U5
D4-D5
U2
J1
U1
SW2
U13,U14,U16
2X3 1X2
2X5
2X6
IR LED
D10
LED
D11
2X2
Connect to Wearable
(Bottom) Sensor Board
Connect to Wearable
(Bottom) Sensor Board
Connect to Wearable
(Bottom) Sensor Board
Connect to Wearable(Bottom) Sensor Board
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iCE40 Ultra Wearable Development Platform
Figure 10. Mechanical Design
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Mic
3.3 Reg
Battery Chg
LED Driver
VLED
3, 1.8 Reg
1.2 Reg
SPI J4
Voltage
i2c
A. Front End
Pressure
Acc/
Gyro
Osc
Top
Bottom
Bottom
Top
IR LED
RGB LED
Flash
Button
Switch
iCE
X02
EEPROM
Osc
Osc
Display Conn.
Battery
Conn. Pads
Mic
i2c
SPI+
UART
Voltage
Sensor Board
Main Board
SPI
SPI+
UART
J2
J5
J3
Cutout
Cutout
BLE
Cutout
Boost
Regulator
Cutout
Cutout
PPG
Temp
Cutout
Flash
Level
Shifter
LED Selector
FTDI Power
FDTI USB
Mag
Mag
Mag
Mag
J5
J6
J3
J7
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iCE40 Ultra Wearable Development Platform
Figure 11. Battery Charger Connections
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Ba
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ry C
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on
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Iterm is set to be 25 mA.
Default timings are used for timer programming.
5-hour fast charge and 30-minute precharge
Input Current Limit is set to be 500 mA
Fast-charge current is set to be 200 mA
+5V
_US
B
BT
_3V
7
+5V
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BB
T_3
V7
VO
UT
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iCE40 Ultra Wearable Development Platform
Figure 12. USB-FTDI Connections
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
US
B-B
MIN
I
US
B-F
TD
I Co
nn
ect
ion
s
60mA
150mA
EE
DA
TA
EE
SK
EE
CS
VC
C18
FT
V3P
3_F
TD
I
V3P
3_F
TD
I
+5V
_US
B
V3P
3_F
TD
I
V3P
3_F
TD
I
V3P
3_F
TD
I
V3P
3_R
EG
V3P
3_R
EG
V3P
3_F
TD
I
FT
DI_
TC
K[5
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FT
DI_
TM
S[5
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TD
I_T
DO
[5]
FT
DI_
TD
I[5
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FT
DI_
SC
LK[6
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TD
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TD
I_D
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umbe
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heet
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<Doc
>B
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47
Tue
sday
, Jun
e 02
, 201
5
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ocum
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umbe
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ev
Dat
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of
<Doc
>B
B
47
Tue
sday
, Jun
e 02
, 201
5
C9
0.1u
F
C04
0216
V
C12
0.1u
F
C04
0216
V
TP
1
U3
93LC
56B
T
Man
ufac
ture
r =
Mic
roch
ip T
echn
olog
yP
AR
T_N
UM
BE
R =
93L
C56
BT
-I/O
T
CS
5
DIN
3
DO
UT
1
VC
C6
CLK
4
VS
S2
R11
4.7K
5% R04
02
R68
2.2k
R04
025%
R17
10K
R04
025%
12
TP
4
R18
10K
R04
025%
12
Y1
12M
Hz
13
2
4
TP
2
R15
0
5VD-
D+ID
G
US
B P
WR
J1
1
2
3
4
S2
5
S1
S3
S4
C11
10uF
10V
C04
02
C10
0.1u
F
C04
0216
V
C14
0.1u
F
C04
0250
V
C7
4.7u
F
C04
0216
V
R16
1K 5% R04
02
C16
27pF
50V
C04
02
R13
0
TP
5
R10
4.7K
5% R04
02
C17
0.1u
FC
0402
16V
R20
2.2K
5%R
0402
12
C8
0.1u
F
C04
0216
V
R12
0
L1 600o
hm, 5
00m
A
L060
3
C13
10uF
10V
C04
02R
812
k1%
R04
02
R9
4.7K
5% R04
02
R19
10K
R04
025%
12
L3 600o
hm, 5
00m
A
L060
3
TP
3
J51
1X2
HE
AD
ER
_RT
_AN
GLE
PA
RT
_NU
MB
ER
= M
22-5
3302
05M
anuf
actu
rer
= H
arw
in In
c
1
2
C15
27pF
50V
C04
02
L260
0ohm
, 500
mA
L060
3
FT
22
32
H
FT
DI H
igh
-Sp
ee
d U
SB
FT
2232
HQ
U2
PA
RT
_NU
MB
ER
= F
T22
32H
QM
anuf
actu
rer
= F
TD
I
VR
EG
IN50
VR
EG
OU
T49
DM
7
DP
8
RE
F6
RE
SE
T#
14
EE
CS
63
EE
CLK
62
EE
DA
TA
61
OS
CI
2
OS
CO
3
TE
ST
13
AD
BU
S0
16
AD
BU
S1
17
AD
BU
S2
18
AD
BU
S3
19
VPHY4
VPLL9
VCORE112
VCORE237
VCORE364
VCCIO120
VCCIO231
VCCIO342
VCCIO456
AGND10
GND11
GND25
GND311
GND415
GND525
GND635
GND747
GND851
PW
RE
N#
60
SU
SP
EN
D#
36
AD
BU
S4
21
AD
BU
S5
22
AD
BU
S6
23
AD
BU
S7
24
AC
BU
S0
26
AC
BU
S1
27
AC
BU
S2
28
AC
BU
S3
29
AC
BU
S4
30
AC
BU
S5
32
AC
BU
S6
33
AC
BU
S7
34
BD
BU
S0
38
BD
BU
S1
39
BD
BU
S2
40
BD
BU
S3
41
BD
BU
S4
43
BD
BU
S5
44
BD
BU
S6
45
BD
BU
S7
46
BC
BU
S0
48
BC
BU
S1
52
BC
BU
S2
53
BC
BU
S3
54
BC
BU
S4
55
BC
BU
S5
57
BC
BU
S6
58
BC
BU
S7
59
R14
0
TP
6
WE
AR
AB
LE S
OLU
TIO
N -
MA
IN B
OA
RD
22
iCE40 Ultra Wearable Development Platform
Figure 13. MachXO2-2000ZE Connections
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
XO
2-2
00
0Z
E C
on
ne
ctio
ns
Duty C
ycle i
s =
80%
NO
R F
lash
0201
LE
D D
RIV
ER
DONE
Pla
ce F
lash
pa
rt a
s cl
ose
to
XO
2 a
s p
oss
ible
27
MH
Z C
lock
MIP
I_C
lock
_out
_HS
_PM
IPI_
Clo
ck_o
ut_H
S_N
MIP
I_D
ata_
0_ou
t_H
S_P
MIP
I_D
ata_
0_ou
t_H
S_N
CD
ON
E
RE
SE
T_X
O2
JTA
GE
N
XO
2_LE
D1
XO
2_LE
D2
B_S
ync
Dis
play
_res
et_L
T
PW
M_C
TR
L
PR
OG
RA
MN
LED
+LE
D-
XO
2_S
CLK
XO
2_C
S
PW
M_C
TR
L
XO
2_D
Q0
XO
2_D
Q1
XO
2_D
Q2
XO
2_D
Q3
INIT
N
MIP
I_C
lock
_out
_PM
IPI_
Clo
ck_o
ut_N
MIP
I_D
ata_
0_ou
t_P
MIP
I_D
ata_
0_ou
t_N
B_S
ync
LED
+LE
D-
MIP
I_D
ata_
0_ou
t_N
MIP
I_D
ata_
0_ou
t_P
MIP
I_C
lock
_out
_N
MIP
I_C
lock
_out
_P
MIP
I_D
ata_
0_ou
t_LP
MIP
I_D
ata_
0_ou
t_LN
MIP
I_C
lock
_out
_LP
MIP
I_C
lock
_out
_LN
Ena
ble_
LED
_1V
8E
nabl
e_LE
D_3
V0
MIP
I_D
ata_
0_ou
t_LP
MIP
I_D
ata_
0_ou
t_LN
MIP
I_C
lock
_out
_LP
MIP
I_C
lock
_out
_LN
XO
2_iC
E3_
LTX
O2_
iCE
4_LT
Dis
play
_res
etD
ispl
ay_r
eset
_LT
XO
2_iC
E3
XO
2_iC
E5
XO
2_iC
E6
XO
2_iC
E3_
LT
XO
2_iC
E5_
LTX
O2_
iCE
6_LT
XO
2_iC
E4_
LTX
O2_
iCE
4
XO
2_C
LK
XO
2_iC
E1_
LTX
O2_
iCE
2_LT
TS
_CLK
BLE
_MO
D_C
DO
NE
MIP
I_D
ata_
0_ou
t_H
S_P
MIP
I_D
ata_
0_ou
t_H
S_N
MIP
I_C
lock
_out
_HS
_P
MIP
I_C
lock
_out
_HS
_NX
O2_
CS
XO
2_C
LK
XO
2_S
CLK
XO
2_D
Q1
TS
_CLK
XO
2_D
Q0
XO
2_D
Q2
BLE
_MO
D_p
rog
XO
2_iC
E6_
LT
XO
2_iC
E5_
LTX
O2_
DQ
3
XO
2_iC
E1
XO
2_iC
E2
XO
2_iC
E1_
LT
XO
2_iC
E2_
LT
V3P
3_X
O2
V3P
3_X
O2
V3P
3_X
O2
V3P
3_R
EG
V3P
3_R
EG
V3P
3_R
EG
VD
D_V
3P0
VE
E_V
1P8
V1P
2_X
O2
V3P
3_X
O2
V1P
2_X
O2
VE
E_V
1P8
V3P
3_R
EG
VR
EG
_AD
JV
3P3_
RE
G
V3P
3_R
EG
V3P
3_R
EG
VR
EG
_AD
JV
1P2_
RE
G
V3P
3_R
EG
FT
DI_
TD
O[4
]F
TD
I_T
DI
[4]
FT
DI_
TC
K[4
]F
TD
I_T
MS
[4]
RE
SE
T_X
O2
[6] Ena
ble_
LED
_1V
8[7
]E
nabl
e_LE
D_3
V0
[7]
XO
2_iC
E3
[6]
XO
2_iC
E6
[6]
XO
2_iC
E5
[6]
XO
2_iC
E4
[6]
BLE
_MO
D_C
DO
NE
[6]
BLE
_MO
D_p
rog
[6]
XO
2_iC
E2
[6]
XO
2_iC
E1
[6]
Titl
e
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
<Doc
>B
B
57
Tue
sday
, Jun
e 02
, 201
5
Titl
e
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
<Doc
>B
B
57
Tue
sday
, Jun
e 02
, 201
5
Titl
e
Siz
eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
<Doc
>B
B
57
Tue
sday
, Jun
e 02
, 201
5
R24
2k2
5% R04
02
TP
13
C62
700.
1uF
C04
0216
V
330
R35
5%R02
01
TP
11
LCM
XO
2-2
00
0Z
E
LCM
XO
2-20
00Z
E-1
UW
G49
U4D VC
CD
1
VC
CD
7G
ND
A4
GN
DD
6
GN
DE
1
GN
DG
5
C20
0.1u
F
C02
0116
V
U5
NO
R F
lash
PA
RT
_NU
MB
ER
= N
25Q
032A
13E
SC
40G
Man
ufac
ture
r =
Mic
ron
CS
_L1
DQ
05
SC
LK6
DQ
23
DQ
37
VC
C8
VS
S4
DQ
12
DN
LR
111
R04
02
R26
1K R04
025%
C62
730.
1uF
C04
0216V
330
R34
5%R02
01
R40
10k
R04
025%
R41
0R04
02
U12
2-B
IT_T
RA
NS
LAT
OR
Man
ufac
ture
r =
Tex
as In
stru
men
tsP
AR
T_N
UM
BE
R =
TX
B01
02Y
ZP
R
GN
DB
1
VC
CA
C1
A1
D2
OE
C2
VC
CB
B2
B1
A2
B2
A1
A2
D1
BANK2
LCM
XO
2-2
00
0Z
E
SE
C 2
/4
LCM
XO
2-20
00Z
E-1
UW
G49
U4B PB
3AE
7
PB
3BF
7
PB
5A ||
CS
SP
ING
7
PB
8A ||
MC
LKF
6
PB
8B ||
SO
F5
PB
11A
|| P
CLK
TE
4
PB
11B
|| P
CLK
CE
3
VC
CIO
2G
6
PB
12A
F4
PB
12B
F3
PB
16A
|| P
CLK
TG
4
PB
16B
|| P
CLK
CG
3
PB
25A
|| S
NG
2
PB
25B
|| S
IG
1
U8
TP
S61
061
Man
ufac
ture
r =
TI
PA
RT
_NU
MB
ER
= T
PS
6106
1
SW
6
GN
D1
FB
4
VIN
8
VO
UT
7
EP9
ILE
D3
EN
2P
GN
D5
D5
Red
1 2
Y2
27.0
00M
Hz
PA
RT
_NU
MB
ER
= A
SC
SM
-27.
000M
HZ
-LR
-TM
anuf
actu
rer
= A
brac
on
TS
1
GN
D2
VC
C4
OU
T3
330
R30
5%R02
01
D3
GR
EE
N
1 2
BANK5
LCM
XO
2-2
00
0Z
E
LCM
XO
2-20
00Z
E-1
UW
G49
U4C
PL2
A ||
GP
LLT
_IN
A7
PL2
B ||
GP
LLC
_IN
B6
PL3
AC
7
PL3
BC
6
VC
CIO
5B
7
PL5
AE
6
PL5
BE
5
30R33
R02
015%
R67
33 R04
025%
C22
0.1u
F
C02
0116
V
C29
0.1u
F16
VC
0402
30R25
R02
015%
TP
12
D4
Red
1 2
R42
12 R04
025%
330
R31
5%R02
01
R11
71K R
0402
5%
C35
1uF
35V
C12
06
C28
0.1u
F
C02
0116
V
C24
0.1u
F
C02
0116
V
C18
1uF
16V
C04
02
C62
660.
1uF
C02
01
30R32
R02
015%
C34
1uF
16V
C04
02
R27
1K R04
025%
C19
0.1u
F
C02
0116
V
L422
uHL0
805
C21
1uF
C04
0216
V
J2 5035
48-1
220
Man
ufac
ture
r =
Mol
ex In
c
PA
RT
_NU
MB
ER
= 5
0354
8122
0
2 4 6 8 10 12
1 3 5 7 9 11
U15
1-B
IT_T
RA
NS
LAT
OR
Man
ufac
ture
r =
Tex
as In
stru
men
tsP
AR
T_N
UM
BE
R =
SN
74A
UP
1T34
DS
FR
VC
CA
1
A2
GN
D3
VC
CB
6
B4
NC
5
C23
1uF
16V
C04
02
C62
710.
1uF
C04
0216
V
C27
0.1u
F
C02
0116
V
C62
720.
1uF
C04
0216
V
U11
4-B
IT_T
RA
NS
LAT
OR
Man
ufac
ture
r =
Tex
as In
stru
men
tsP
AR
T_N
UM
BE
R =
TX
B01
04Y
ZT
R
GN
DD
2
VC
CA
B2
A1
A3
OE
C2
VC
CB
A2
B1
A1
B2
B1
A2
B3
A3
C3
A4
D3
B3
C1
B4
D1
C62
690.
1uF
C04
0216
V
C62
650.
1uF
C02
01
BANK0
LCM
XO
2-2
00
0Z
E
U4A
LCM
XO
2-20
00Z
E-1
UW
G49
PT
17B
|| P
CLK
CD
3P
T17
A ||
PC
LKT
C4
PT
16C
|| T
CK
B4
PT
16D
|| T
MS
B5
PT
10A
D5
PT
10B
D4
PT
12C
|| T
DO
A6
PT
12D
|| T
DI
C5
PT
18C
B3
PT
18D
|| S
DA
C3
VC
CIO
0_1
A2
VC
CIO
0_2
A5
PT
20A
A3
PT
20B
B2
PT
20C
|| J
TA
GE
NF
2
PT
20D
|| P
RO
GR
AM
NF
1
PT
23A
E2
PT
23B
C2
PT
24A
C1
PT
24B
D2
PT
24C
|| IN
ITN
B1
PT
24D
|| D
ON
EA
1
30R36
R02
015%
WE
AR
AB
LE S
OLU
TIO
N -
MA
IN B
OA
RD
SE
C 4
/4
SE
C 1
/4
SE
C 3
/4
23
iCE40 Ultra Wearable Development Platform
Figure 14. iCE5LP4K Connections
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Plac
e Ne
ar F
PGA
Pin
Place Near FPGA Pin
Plac
e Ne
ar F
PGA
Pin
Place Near FPGA Pin
Place Near FPGA Pin
iCE
5L
P4
K C
on
ne
ctio
ns
DONE
CRST
Pu
sh B
utt
on
NO
R F
lash
SP
I SE
NS
OR
BL
E M
OD
UL
E
I2C
SE
NS
OR
Tri
Co
lou
r
RIG
HT
MIC
LE
FT
MIC
500mA traces
100mA trace
Pla
ce 0
oh
m r
esi
sto
rs f
or
SP
I fla
sh a
s cl
ose
to t
he
iCE
pa
rt a
s p
oss
ible
CR
ES
ET
_iC
EiC
E_C
DO
NE
MIC
_CLK
MIC
_DA
TA
AF
E_S
PI_
SC
LK
BLE
_MO
D_F
LAS
H_C
SB
BLE
_MO
D_i
CE
40_M
OS
IB
LE_M
OD
_iC
E40
_MIS
O
BLE
_MO
D_F
LAS
H_S
CLK
BLE
_MO
D_C
RS
Tb
CR
ES
ET
n_F
TD
I
FLA
SH
_SC
LK
FLA
SH
_MO
SI
FLA
SH
_MIS
O
FLA
SH
_CS
B
FLA
SH
_SC
LK
BLE
_MO
D_F
LAS
H_S
CLK
BLE
_MO
D_F
LAS
H_C
SB
FLA
SH
_CS
B
SP
I_S
CLK
SP
I_C
S
BLE
_MO
D_i
CE
40_M
ISO
BLE
_MO
D_i
CE
40_M
OS
I
FLA
SH
_MIS
O
FLA
SH
_MO
SI
SP
I_M
OS
I
SP
I_M
ISO
MIC
_CLK
MIC
_DA
TA
MIC
_CLK
MIC
_DA
TA
AF
E_S
PI_
ST
E
AF
E_S
PI_
MIS
O
CR
ES
ET
_iC
E
SP
I_M
ISO
SP
I_S
CLK
SP
I_C
S
SP
I_M
OS
I
AF
E_S
PI_
ST
E
AF
E_S
PI_
MIS
OA
FE
_SP
I_M
OS
IA
FE
_SP
I_S
CLK
iCE
40_I
RLE
D
AF
E_S
PI_
MO
SI
UA
RT
_RX
UA
RT
_TX
Sen
sor_
SD
A
Sen
sor_
SC
L
BLE
_MO
D_C
RS
Tb
UA
RT
_TX
UA
RT
_RX
Sen
sor_
SC
LS
enso
r_S
DA
RE
SE
T_X
O2
AF
E_R
DY
AF
E_R
DY
V1P
2_iC
E
V1P
2_iC
E
V3P
3_iC
E
V3P
3_R
EG
V3P
3_R
EG
V3P
3_R
EG
V3P
3_R
EG
V3P
3_R
EG
V3P
3_R
EG
V3P
3_iC
E
V3P
3_iC
E
VR
EG
_AD
J
VR
EG
_AD
J
VD
D_M
IC1
VD
D_M
IC2
VR
EG
_AD
JV
RE
G_A
DJ
VR
EG
_AD
JV
DD
_MIC
1
VD
D_M
IC2
iCE
40_B
LUE
[6] iC
E40
_GR
EE
N[6
]iC
E40
_RE
D[6
]
iCE
_CD
ON
E[4
]
iCE
40_B
LUE
[6]
iCE
40_G
RE
EN
[6]
iCE
40_R
ED
[6]
CR
ES
ET
n_F
TD
I[4
]
FT
DI_
SS
B[4
]
FT
DI_
SC
LK[4
]
FT
DI_
DI
[4]
FT
DI_
DO
[4]
BLE
_MO
D_C
DO
NE
[5]
BLE
_MO
D_p
rog
[5]
RE
SE
T_X
O2
[5]
XO
2_iC
E3
[5]
XO
2_iC
E4
[5]
XO
2_iC
E1
[5]
XO
2_iC
E2
[5]
XO
2_iC
E5
[5]
XO
2_iC
E6
[5]
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e 02
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5
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rR
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Dat
e:S
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67
Tue
sday
, Jun
e 02
, 201
5
C50
0.1u
F
C02
0116
V
C37
10nF
16V
C02
01
C33
0.1u
F
C04
0216
V
C45
0.1u
F
C02
0116
V
R38
DN
L
0R
112
R04
02
R44
1K R04
025%
D11
LED
Manufacturer = Cree IncPART_NUMBER = XBDAWT-00-0000-00000LCE3
1 2
R61
10k
R04
025%
U10
NO
R-F
LAS
H
PA
RT
_NU
MB
ER
= M
25P
80-V
MN
6TP
Man
ufac
ture
r =
Mic
ron
CS
1
SD
I5
SC
K6
WP
3
HO
LD7
VCC8
GND4
SD
O2
��
��
��
��
U6
MIC
_LE
FT
Man
ufac
ture
r =
ST
Mic
roel
ectr
onic
sP
AR
T_N
UM
BE
R =
MP
34D
B01
TR
CLK
1
LR2
VD
D3
DO
UT
4
GN
D5
R56
1K R02
015%
C36
0.1u
F
C04
0216
V
D12
CD
BU
05201
2
0R
113
R04
02
C32
10uF
10V
C04
02
TP
28
R97
0R
0201
C40
0.1u
F
C02
0116
V
TP
30
0R
60R
0402
0R
58R
0402
BA
NK
0
BA
NK
1
BA
NK
2
iCE
5L
P4
K
iCE
5LP
4K
U9
Man
ufac
ture
r =
Latti
ceP
AR
T_N
UM
BE
R =
iCE
5LP
-4K
-SW
G36
IRLE
DA
2
IOB
_10A
B4
IOB
_11B
_G5
F4
CR
ES
ET
_BD
3
IOB
_16A
F3
IOB
_20A
E3
IOB
_25B
_G3
C2
IOB
_26A
B1
IOB
_27B
D2
IOB
_29B
E2
IOB
_30A
C1
IOB
_31B
B2
IOB
_32A
_SO
_MIS
O_S
PI1
F2
IOB
_33B
_SI_
MO
SI_
SP
I1D
1
IOB
_34A
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K_S
CK
_SP
I1E
1
IOB
_35B
_SS
_MC
SN
O_S
PI1
F1
SP
I_V
CC
IO1
C3
IOB
_12A
_G4_
CD
ON
EE
4
IOB
_2A
_MIS
O_S
PI2
F6
IOB
_3B
_G6_
MO
SI_
SP
I2E
6
IOB
_4A
_SC
K_S
PI2
D6
IOB
_5B
_MC
SN
0_S
PI2
D5
IOB
_6A
F5
IOB
_7B
E5
VC
CIO
_2C
4
VC
CP
LLB
3
IOT
_46B
_G0
B5
RG
B2
A6
RG
B1
B6
RG
B0
C6
VC
CIO
_0A
4
VP
P_2
V5
D4
VC
CA
5
GN
D1
A3
GN
D2
C5
VS
SIO
_LE
DA
1C
511u
F
C04
0216
V
0R
52R
0402
0R
59R
0402
0R
51R
0402
0R
57R
0402
0R
50R
0402
C43
1uF
C04
0216
V0
R53
R04
02
0R
49R
0402
R46
10k
R04
025%
0R
110
R04
02
J5
1X2
SO
CK
ET
Man
ufac
ture
r =
Sul
lins
PA
RT
_NU
MB
ER
= N
PP
C02
1KF
XC
-RC
1 2
0R
55R
0402
C48
10nF
16V
C02
01
R47
0 1% R04
02
R95
0R
0201
R37
0R
0402
0R
63R
0402
0R
48R
0402
J3
2x5
HE
AD
ER
PA
RT
_NU
MB
ER
= 0
0159
1010
0M
anuf
actu
rer
= M
olex
Inc
1 2 3 4 5678910
C44
0.1u
F
C02
0116
V
D8
GR
EE
N
1 2
C38
10nF
16V
C02
01
0R
62R
0402
��
��
��
��
U7
MIC
_RIG
HT
Man
ufac
ture
r =
ST
Mic
roel
ectr
onic
sP
AR
T_N
UM
BE
R =
MP
34D
B01
TR
CLK
1
LR2
VD
D3
DO
UT
4
GN
D5
C42
0.1u
F
C02
0116
V
R43
0 R04
02
C53
0.1u
F
C04
0216
V
TP
29C
461u
F
C04
0216
V
C49
10nF
16V
C02
01
C31
0.1u
F
C04
0216
V
R45
10k
R04
025%
J50
1X3
R/A
HE
AD
ER
Man
ufac
ture
r =
Har
win
Inc
PA
RT
_NU
MB
ER
= M
22-5
3303
05
1 2 3
C41
1uF
C04
0216
V
TP
31
C30
10uF
10V
C04
02
0R
54R
0402
D10
IR_L
ED
Manufacturer = OSRAMPART_NUMBER = SFH 4645
1 2
R10
610
k
R02
015%
SW
1
PB
Man
ufac
ture
r =
E-S
witc
hP
AR
T_N
UM
BE
R =
TL1
015A
F16
0QG
C47
0.1u
F
C02
0116
V
C39
10nF
16V
C02
01
BLUE
GREE
N
RED
D9 TR
ICO
LOU
R_L
ED
Man
ufac
ture
r =
Kin
gbrig
htP
AR
T_N
UM
BE
R =
AP
TF
1616
SE
EZ
GQ
BD
C
1
234R
940
R02
01
J6
2X3
HE
AD
ER
Man
ufac
ture
r =
Mol
ex In
cP
AR
T_N
UM
BE
R =
001
5910
100
1 2
4 5 63
R10
710
k
R02
015%
R39
DN
L
WE
AR
AB
LE S
OLU
TIO
N -
MA
IN B
OA
RD
24
iCE40 Ultra Wearable Development Platform
Figure 15. Regulator Connections
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
PO
WE
R C
ON
NE
CT
OR
ON
/OF
F S
WIT
CH
3.3
V @
2 A
Re
gu
lato
r C
on
ne
ctio
ns
Input / Output capacitor's requirement
- ESR < 1 ohms, X7R / X5R type is recommended
Dan
ger:
This
resi
stor
opt
ion
supp
orts
1.8
V fo
r ban
k 1
of th
e iC
E5LP
4K.
The
SEEE
D B
LE, F
TDI,
FLA
SH a
nd X
O2,
stil
l are
pow
ered
by
a 3.
3V ra
il.It
is re
quir
ed to
als
o pu
ll al
l 0 o
hm re
sist
ors
rela
ted
to th
e BL
E, F
TDI a
nd F
LASH
that
are
con
nect
ed to
the
SPI b
us.
It is
als
o re
quir
ed th
at th
e XO
2 be
un-
prog
ram
med
or h
ave
sign
als
conn
ecte
d be
twee
nth
e XO
2 an
d iC
E pa
rt s
et to
hig
h im
peda
nce.
If th
is a
ctio
n is
not
per
form
ed th
e iC
E5LP
4Kco
uld
beco
me
perm
anen
tly d
amag
ed
1.2
V @
3.0
mA
1.8
V @
1.5
mA
3.0
V @
1.5
mA
Ena
ble_
LED
_1V
8E
nabl
e_LE
D_3
V0
RE
G_E
NA
BLE
RE
G_E
NA
BLE
RE
G_E
NA
BLE
V3P
3_X
O2
VO
UT
_BT
VD
D_V
3P0
VE
E_V
1P8
VO
UT
_BT
VO
UT
_BT
V1P
2_X
O2
VR
EG
_AD
J
V3P
3_iC
E
V1P
2_iC
E
V1P
2_R
EG
V3P
3_R
EG
V3P
3_R
EG
BT
_3V
7
VO
UT
_BT
V3P
3_R
EG
VE
E_V
1P8
V3P
3_R
EG
VR
EG
_AD
J
Ena
ble_
LED
_1V
8[5
]E
nabl
e_LE
D_3
V0
[5]
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Titl
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Tue
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e 02
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5
C68
1uF
C04
0216
V
R10
20.
5
C62
751u
F16
VC
0402
TP
18
R10
90 D
NI
TP
24
C71
4.7u
F10
VC
0402
R11
610
K
R04
025%
12
C70
100u
F10
VC
1206
C54
1uF
16V
C04
02
C69
1uF
C04
0216
V
TP
34
TP
21
R10
10.
5R
100
0.5
TP
36
C61
1uF
C04
02 16V
R10
40.
5
TP
35
TP
19
MIC
5320
U13
PA
RT
_NU
MB
ER
= M
IC53
20-P
GY
MT
TR
Man
ufac
ture
r =
Mic
rel I
nc
3.0V
O6
3.0E
N4
1.8E
N3
1.8V
O5
VIN1
GND2
EP7
J7
2X2
HE
AD
ER
Man
ufac
ture
r =
Mol
ex In
cP
AR
T_N
UM
BE
R =
001
5910
100
1 2
3 4
C55
4.7u
F10
VC
0402
TP
25T
P22
C62
741u
F16
VC
0402
C63
1uF
C04
0216
VT
P33
R11
40.
5
C67
1uF
C04
0216
V
MIC
5504
U16
PA
RT
_NU
MB
ER
= M
IC55
04-1
.2Y
MT
TZ
Man
ufac
ture
r =
Mic
rel I
nc
1.2E
N3
1.2V
O1
VIN
4
GN
D2
EP
5
C60
1uF
C04
0216
V
TP
32
SW
2
ON
/OF
F S
WIT
CH
Man
ufac
ture
r =
C&
KP
AR
T_N
UM
BE
R =
PC
M12
SM
TR
11
22
33
44
55
66
77
C62
7622
uF10
VC
0603
C62
0.1u
FC
0402 16V
TP
17
R10
30.
5
��
��
��
��
�
U14
TP
S7A
7200
Man
ufac
ture
r =
Tex
as In
stru
men
tsP
AR
T_N
UM
BE
R =
TP
S7A
7200
RG
TT
SN
S1
FB
2
PG
3
SS
11
EN
12
IN1
13
IN2
14O
UT
115
OU
T2
16
GN
D7
EP
AD
117
50m
V4
100m
V5
200m
V6
400m
V8
800m
V9
1.6V
10
C56
220p
F
C04
0225
V
TP
16
TP
23
R11
50.
5
TP
20
R10
80 D
I
WE
AR
AB
LE S
OLU
TIO
N -
MA
IN B
OA
RD
25
iCE40 Ultra Wearable Development Platform
Appendix B. Sensor Board Schematic DiagramsFigure 16. Block Diagram
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
LPS
25
HP
ress
ure
Se
nso
r
AF
E4
40
3A
na
log
Fro
nt
En
d
LSM
33
0D
LCA
cce
l. &
Gyr
o
BLE
Mo
du
leS
PI
TM
P1
12
Te
mp
era
ture
Se
nso
rI2
C
I2C
I2C
SP
IS
FH
70
50
He
art
Ra
te
&
Oxy
ge
n S
en
sor
So
lde
rab
le
Ba
tte
ry C
on
tact
I2C Header J4
SPI Header J2
SPI/UART CFGHeader J3
Voltage Header J5
3.3
V
GN
D
We
ara
ble
(B
ott
om
) S
en
sor
Bo
ard
So
lde
rab
le
Ba
tte
ry C
on
tact
BT
_3
V3
U4
U7
U3
U2
U6
U5
VR
EG
_A
DJ
Fro
m M
AIN
Bo
ard
1
.8V
or
3.3
V
1X2 2X2
2X3 2X5
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15
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>B
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15
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, Jun
e 02
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5
Titl
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15
Tue
sday
, Jun
e 02
, 201
5
We
ara
ble
_S
en
sor_
Bo
ard
26
iCE40 Ultra Wearable Development Platform
Figure 17. Mechanical Design
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Mic
3.3
Re
g
Ba
tte
ry C
hg
LED
Dri
ve
r
VLE
D
3, 1
.8 R
eg
1.2
Re
g
SP
I J4
Vo
lta
ge
i2c
A. F
ron
t E
nd
Pre
ssu
re
Acc
/G
yro
Osc
To
pB
ott
om
Bo
tto
mT
op
IR L
ED
RG
B L
ED
Fla
sh
Bu
tto
n
Sw
itch
iCE
X0
2
EE
PR
OM
Osc
Osc
Dis
pla
y C
on
n.B
att
ery
Co
nn
. Pa
ds
Mic
i2c
SP
I+U
AR
T
Vo
lta
ge
Se
nso
r B
oar
d
Mai
n B
oar
d
SP
I
SP
I+U
AR
T
J2
J5
J3
Cutout
Cu
tou
t
BLE
Cutout
Bo
ost
Re
gu
lato
r
Cutout
Cutout
PP
G
Te
mp
Cu
tou
t
Fla
sh
Lev
el
Sh
ifte
r
LED
Se
lect
or
FT
DI P
ow
er
FD
TI US
B
Ma
gM
ag
Ma
gM
ag
J5J6J3
J7
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<Doc
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B
25
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e 02
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5
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<Doc
>B
B
25
Tue
sday
, Jun
e 02
, 201
5
Titl
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<Doc
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B
25
Tue
sday
, Jun
e 02
, 201
5
We
ara
ble
_S
en
sor_
Bo
ard
27
iCE40 Ultra Wearable Development Platform
Figure 18. Sensor Connections - 1
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Te
mp
era
ture
Se
nso
r
Acc
ele
rom
ete
r
I2C
Add
ress
: 001
1001
b
Se
ee
d B
LE
Mo
du
le
Pre
ssu
re S
en
sor
Se
nso
r C
on
ne
ctio
ns
- 1
I2C
Add
ress
: 101
1100
b
I2C
So
cke
t
BL
E M
OD
UL
E
Pla
ce t
em
pe
ratu
re s
en
sor
far
aw
ay
fro
m b
att
ery
an
d c
ha
rgin
g c
ircu
it
I2C
Add
ress
: 100
1000
b
UA
RT
_RX
UA
RT
_TX
Sen
sor_
SC
L
Sen
sor_
SD
A
BLE
_MO
D_p
rog
Sen
sor_
SC
L
Sen
sor_
SD
A
BLE
_MO
D_C
DO
NE
Sen
sor_
SC
L
Sen
sor_
SD
A
BLE
_MO
D_F
LAS
H_C
SB
UA
RT
_RX
UA
RT
_TX
BLE
_MO
D_i
CE
40_M
OS
IB
LE_M
OD
_iC
E40
_MIS
O
BLE
_MO
D_F
LAS
H_S
CLK
BLE
_MO
D_F
LAS
H_C
SB
BLE
_MO
D_i
CE
40_M
OS
IB
LE_M
OD
_iC
E40
_MIS
O
BLE
_MO
D_F
LAS
H_S
CLK
BLE
_MO
D_C
RS
Tb
BLE
_MO
D_C
DO
NE
BLE
_MO
D_C
RS
Tb
BLE
_MO
D_p
rog
Sen
sor_
SC
LS
enso
r_S
DA
3V3
3V3
3V3
VR
EG
_AD
J
3V3
VR
EG
_AD
J VR
EG
_AD
J
VR
EG
_AD
J
VR
EG
_AD
JV
RE
G_A
DJ
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35
Tue
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Tue
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B
35
Tue
sday
, Jun
e 02
, 201
5
C1
10uF
16V
C08
05
R10
0 R04
02
R7
0R
0402
C5
0.01
uFC
0402
16V
R17
0 R04
02
C8
4.7u
FC
0603
16V
C4
0.1u
FC
0402
16V
TP
16 1
�������������
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��
��
��
��
�
U4
LSM
330D
LC
Man
ufac
ture
r =
ST
Mic
roel
ectr
onic
sP
AR
T_N
UM
BE
R =
LS
M33
0DLC
TR
GN
D1
1
GN
D2
6
VD
D1
7
VD
D2
8
VD
D3
9
CA
P15
DE
N_G
16
DR
DY
_G/IN
T2_
G17
INT
1_G
18
INT
2_A
19
INT
1_A
20
CS
_G22
CS
_A23
RE
S1
2
RE
S2
3
RE
S3
4
RE
S4
5
RE
S5
10
RE
S6
11
RE
S7
12
RE
S8
13
RE
S9
14
VD
D_I
O1
21
VD
D_I
O2
25
SC
L_A
/G24
SD
O_G
26
SD
O_A
27
SD
A_A
/G28
R4
0R
0402
C7
0.1u
FC
0402
16V
R11
0 R04
02
TP
151
C10
0.1u
FC
0402
16V
BLE
Mic
ro
U5
See
edB
LEM
anuf
actu
rer
= S
eeed
PA
RT
_NU
MB
ER
= 1
1305
0012
GN
D27
SW
CLK
26
SW
DIO
25
VC
C24
p12
22p1
323
p11
21
p919
p818
p717
p616
p515
p414
p313
p212
p111
p010
p10
20
GN
D1
p18
2
p17
3
p23
4
p24
5
p25
6
p28
7
p29
8
p30
9
R13
0R
0402
TP
141
R2
0 R04
02
C2
0.1u
FC
0402
16V
R6
0R
0402
R1
10K
R04
02
LP
S2
5H
U3
LPS
25H
Man
ufac
ture
r =
ST
Mic
roel
ectr
onic
sP
AR
T_N
UM
BE
R =
LP
S25
HT
R
VD
D_I
O1
SC
L_S
PC
2
Res
erve
d3
SD
A_S
DI_
SD
I/SD
O4
SD
O_S
A0
5
CS
6
INT
17
GN
D1
8
GN
D2
9
VD
D10
R16
0 R04
02
��
��
��
U7
TM
P11
2M
anuf
actu
rer
= T
IP
AR
T_N
UM
BE
R =
TM
P11
2AID
RLT
SC
L1
GN
D2
ALE
RT
3
AD
D0
4
V+
5
SD
A6
J4
1X2
Hea
der
PA
RT
_NU
MB
ER
= 0
0159
1010
0M
anuf
actu
rer
= M
olex
Inc
1 2
C3
0.1u
FC
0402
16V
R9
0 R04
02
R8
0R
0402
R15
10K
R04
02
TP
2 1
C9
0.1u
FC
0402
16VR
50
R04
02
TP
31
J3
2X5
SO
CK
ET
Man
ufac
ture
r =
Sul
lins
PA
RT
_NU
MB
ER
= N
PP
C05
2KF
MS
-RC
1 2 3 4 5678910
C6
0.1u
FX
5R16
VC
0402
R3
0 R04
02
R12
10K
R04
02
R14
0R
0402
We
ara
ble
_S
en
sor_
Bo
ard
28
iCE40 Ultra Wearable Development Platform
Figure 19. Sensor Connections - 2
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
LE
D_
DR
V_
SU
P
R
X_
AN
A_
SU
P
RX
_D
IG_
SU
P
T
X_
CT
RL
_S
UP
Se
nso
r C
on
ne
ctio
ns
- 2
SPI pins will go to GPIO pins
on main boards iCE device
SP
I SE
NS
OR
LED
_DR
V_S
UP
TX
_LE
D_N
TX
_LE
D_3
TX
_LE
D_P
TX
_LE
D_3
LED
_DR
V_S
UP
TX
_LE
D_N
AF
E_S
PI_
SC
LKA
FE
_SP
I_M
OS
IA
FE
_SP
I_M
ISO
AF
E_S
PI_
ST
E
AF
E_R
DY
INN
INP
TX
_LE
D_P
AF
E_S
PI_
MO
SI
AF
E_S
PI_
SC
LKA
FE
_SP
I_S
TE
AF
E_S
PI_
MIS
OIN
P
INN
AF
E_R
DY
3V3
3V3
V5P
0_A
FE
V5P
0_A
FE
3V3
V5P
0_A
FE
VC
M_O
UT
3V3
3V3
Titl
e
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eD
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ent N
umbe
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Dat
e:S
heet
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<Doc
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45
Tue
sday
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e 02
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5
Rev
of
BR
ev B
Y1
8MH
z
TP
8 1
TP
61
C16
0.1u
FC
0402
16V
Green LED Red LED Infrared LED
Photodiode
SF
H7
05
0
U6
SF
H70
50M
anuf
actu
rer
= O
SR
AM
PA
RT
_NU
MB
ER
= S
FH
7050
GC
1
GA
2
RA
3
PA
4
PC
5
RC
6
IA7
IC8
R26
10K
R04
02
R22
0.00
1R
1206
J2
2X3
SO
CK
ET
PA
RT
_NU
MB
ER
= N
PP
C03
2KF
MS
-RC
Man
ufac
ture
r =
Sul
lins
1 2
4 5
36
C18
0.1u
FC
0402
16V
TP
9
1 TP
41
R20
DN
LR
0402
TP
111
C15
8pF
C04
02
C20
0.1u
FC
0402
16V
R18
DN
LR
0402
C23
1uF
C04
0216
V
C13
2.2u
F16
VC
0402
R24
1KR
0402
TP
101
TP
51
C17
0.1u
FC
0402
16V
R23
0R
0402
C11
2.2u
FC
0402
16V
R25
10K
R04
02
TP
18T
PO
INT
R
C14
8pF
C04
02
TP
17T
PO
INT
R
C19
0.1u
FC
0402
16V
TP
11
R21
0R
0402
R19
0R
0402
C12
0.01
uFC
0402
16V
AF
E4
40
3
U2
AF
E44
03M
anuf
actu
rer
= T
IP
AR
T_N
UM
BE
R =
AF
E44
03Y
ZP
T
DN
C_A
1A
1
TX
_CT
RL_
SU
PA
2
LED
_DR
V_S
UP
A6
TX
_RE
FB
1
VC
MD
1
VS
SD
2
DN
C_D
3D
3
DN
C_E
3E
3
DN
C_F
5F
5
DN
C_B
5B
5
DN
C_B
6B
6
DN
C_C
1C
1
XIN
F3
XO
UT
F4
RX
_AN
A_S
UP
_E4
E4
RX
_AN
A_S
UP
_F2
F2
RX
_DIG
_SU
PE
5
SC
LKC
6
SP
ISIM
OC
4
SP
ISO
MI
C5
SP
IST
ED
6
INP
E1
INN
F1
DIA
G_E
ND
B4
AD
C_R
DY
D5
AF
E_P
DN
_LC
3
RX
_DIG
_GN
D_B
2B
2
RX
_DIG
_GN
D_F
6F
6
LED
_DR
V_G
ND
A3
RX
_AN
A_G
ND
E2
TX
PA
5
TX
NA
4
TX
3B
3
BG
C2
RE
SE
T_L
D4
CLK
OU
TE
6
TP
71
We
ara
ble
_S
en
sor_
Bo
ard
29
iCE40 Ultra Wearable Development Platform
Figure 20. Boost Regulator
5 5
4 4
3 3
2 2
1 1
DD
CC
BB
AA
Thro
ugh
hole
test
pad
s fo
r bat
tery
sol
derin
g
Re
gu
lato
r C
on
ne
ctio
ns
Po
we
r C
on
ne
cto
r
BT
_3V
3
3V3
V5P
0_A
FE
3V3
BT
_3V
3V
RE
G_A
DJ
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eD
ocum
ent N
umbe
rR
ev
Dat
e:S
heet
of
<Doc
>B
B
55
Tue
sday
, Jun
e 02
, 201
5
Titl
e
of
BB
55
Tue
sday
, Jun
e 02
, 201
5
Titl
e
of
B
We
ara
ble
_S
en
sor_
Bo
ard
B
55
C21
10uF
C06
036.
3V
TP
1280
_MIL
_PA
D1
J5 2X2
SO
CK
ET
PA
RT
_NU
MB
ER
= M
20-7
8702
46M
anuf
actu
rer
= H
arw
in In
c
1 2
3 4
C22
22uF
C06
036.
3V
TP
1380
_MIL
_PA
D1
L1 0.47
uHL2
016
R27
10K
R04
02
��
��
��
��
U1
FA
N48
610
Man
ufac
ture
r =
Fai
rchi
ldP
AR
T_N
UM
BE
R =
FA
N48
610U
C50
X
VO
UT
1A
1
VO
UT
2A
2V
INA
3
SW
1B
1
SW
2B
2
EN
B3
PG
ND
1C
1
PG
ND
2C
2
AG
ND
C3
30
iCE40 Ultra Wearable Development Platform
Appendix C. Main Board Bill of MaterialsFigure 21. Main Board Bill of Materials
Item Reference Qty Part PCB Footprint Comments Part Number Manufacturer Description
1 C1,C5,C55,C71 4 4.7uF C0402 — C1005X5R1A475K050BC TDK CAP CER 4.7 µF 10 V 10% X5R 0402
2 C2,C3,C6,C6269,C6270,C6271,C6272
7 0.1uF C0402 — C1005X5R1C104K050BA TDK CAP CER 0.1 µF 16 V 10% X5R 0402
3 C4 1 1uF C0402 — GRM155R61C105KE01D Murata CAP CER 1 µF 16 V 10% X5R 0402
4 C7 1 4.7uF C0402 — C1005X5R1A475K050BC TDK CAP CER 4.7 µF 10 V 10% X5R 0402
5 C8,C9,C10,C12,C14,C17,C29,C31,C33,C36,C53,C62,C6273
13 0.1uF C0402 — C1005X5R1C104K050BA TDK CAP CER 0.1 µF 16 V 10% X5R 0402
6 C11,C13,C30,C32 4 10uF C0402 — CL05A106MP5NUNC Samsung CAP CER 10 µF 10 V 20% X5R 0402
7 C15,C16 2 27pF C0402 — CL05C270JB5NNNC Samsung CAP CER 27 pF 50 V 5% NP0 0402
8 C18,C21,C23,C34,C41,C43,C46,C51,C54,C60,C61,C63,C67,C68,C69,C6274,C6275
17 1uF C0402 — GRM155R61C105KE01D Murata CAP CER 1 µF 16 V 10% X5R 0402
9 C19,C20,C22,C24,C27,C28,C40,C42,C44,C45,C47,C50
12 0.1uF C0201 — C0603X5R1C104K030BC TDK CAP CER 0.1 µF 16 V 10% X5R 0201
10 C35 1 1uF C1206 — GMK316BJ105KLHT Taiyo Yuden CAP CER 1 µF 35 V 10% X5R 1206
11 C37,C38,C39,C48,C49
5 10nF C0201 — GRM033R61C103KA12D Murata CAP CER 10000 pF 16 V 10% X5R 0201
12 C56 1 220pF C0402 — GRM1555C1E221JA01D Murata CAP CER 220 pF 25 V 5% NP0 0402
13 C70 1 100uF C1206 — F951A107KAAAQ2 AVX CAP TANT 100 µF 10 V 10% 1206
14 C6265,C6266 2 0.1uF C0201 — C0603X5R1E104M030BB TDK Corporation CAP CER 0.1 µF 25 V 20% X5R 0201
15 C6276 1 22uF C0603 — C1608X5R1A226M080AC
TDK CAP CER 22 µF 10 V 20% X5R 0603
16 D1 1 YELLOW LED0603 — LTST-C193KSKT-5A Lite-On Inc LED YELLOW RECT CLEAR 0603
17 D2 1 GREEN LED0603 — LG L29K-G2J1-24-Z Osram LED SMARTLED GREEN 570NM 0603
18 D3,D8 2 GREEN LED0603 — LG L29K-G2J1-24-Z Osram LED SMARTLED GREEN 570NM 0603
19 D4,D5 2 Red LED0603 — LTST-C190KRKT LITE-On INC LED SUPER RED CLEAR 0603 SMD
20 D9 1 TRICOLOUR_LED APTF1616SE_RGB — APTF1616SEEZGQBDC Kingbright LED RED/GREEN/BLUE WTR CLEAR SMD
21 D10 1 IR_LED SFH4645_2SMD — SFH 4645 OSRAM EMITTER 950NM MIDLED SIDELK SMD
22 D11 1 LED XBDAWT_2SMD — XBDAWT-00-0000-00000LCE3
Cree Inc LED HIGH BRIGHT-NESS
23 D12 1 CDBU0520 DIODE_SOD523F — CDBU0520 Comchip DIODE SCHOTTKY 20 V 500 mA 0603
24 J1 1 USB PWR CONN_S5P1RMINIUSBB_MOLEX
— 67503-1020 Molex CONN RECEPT MIN-IUSB R/A 5POS SMD
25 J2 1 503548-1220 2X6HDR_5035481220 — 5035481220 Molex Inc CONN RCPT BTB 12POS DL VERT SMD
26 J3 1 2x5 HEADER 2X5_HDR_SMD BREAKAWAY PART
15910100 Molex Inc CONN HEADER 10POS .100" STR 15AU
27 J5 1 1X2 SOCKET 1X2_SOCKET_SMD — NPPC021KFXC-RC Sullins CONN FEMALE 2POS .1" SMD GOLD
28 J6 1 2X3 HEADER 2X3_HDR_SMD BREAKAWAY PART
15910100 Molex Inc CONN HEADER 10POS .100" STR 15AU
29 J7 1 2X2 HEADER 2X2_HDR_SMD BREAKAWAY PART
15910100 Molex Inc CONN HEADER 10POS .100" STR 15AU
30 J50 1 1X3 R/A HEADER 1X3_HDRRAM22_SMD
— M22-5330305 Harwin Inc 3 WAY SIL HORIZ SMT PIN HDR
31 J51 1 1X2 HEADER_RT_ANGLE
1X2_HDRM22_SMD — M22-5330205 Harwin Inc 2POS SIL HORIZ SMT PIN HEADER
31
iCE40 Ultra Wearable Development Platform
32 L1,L2,L3 3 600ohm, 500mA L0603 — MMZ1608R601A TDK Corp FERRITE CHIP 600 Ohm 500 mA 0603
33 L4 1 22uH L0805 — AIML-0805HC-220M-T Abracon Corporation
HIGH CURRENT CHIP IND 22.0UH 20%
34 R1 1 1K R0402 — ERJ-2GEJ102X Panasonic RES SMD 1K Ohm 5% 1/10W 0402
35 R2 1 2K R0402 — ERJ-2GEJ202X Panasonic RES SMD 2K Ohm 5% 1/10W 0402
36 R3,R116 2 10K R0402 — ERJ-2GEJ103X Panasonic RES SMD 10K Ohm 5% 1/10W 0402
37 R4 1 4.32K R0402 — ERJ-2RKF4321X Panasonic RES SMD 4.32K Ohm 1% 1/10W 0402
38 R5 1 2.94K R0402 — ERJ-2RKF2941X Panasonic RES SMD 2.94K Ohm 1% 1/10W 0402
39 R6 1 3.57K R0402 — ERJ-2RKF3571X Panasonic RES SMD 3.57K Ohm 1% 1/10W 0402
40 R7 1 DNL R0402 DNL — — —
41 R8 1 12k R0402 — ERJ-2RKF1202X Panasonic RES SMD 12K Ohm 1% 1/10W 0402
42 R9,R10,R11 3 4.7K R0402 — ERJ-2GEJ472X Panasonic RES SMD 4.7K Ohm 5% 1/10W 0402
43 R12,R13,R14,R15,R37,R43,R48,R49,R50,R51,R52,R53,R54,R55,R57,R58,R59,R60,R62,R63,R112,R113
22 0 R0402 — ERJ-2GE0R00X Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0402
44 R16,R26,R27,R44 4 1K R0402 — ERJ-2GEJ102X Panasonic RES SMD 1K Ohm 5% 1/10W 0402
45 R17,R18,R19,R40,R45,R46,R61
7 10k R0402 — ERJ-2GEJ103X Panasonic RES SMD 10K Ohm 5% 1/10W 0402
46 R20,R68 2 2.2k R0402 — ERJ-2GEJ222X Panasonic RES SMD 2.2K Ohm 5% 1/10W 0402
47 R24 1 2k2 R0402 — ERJ-2GEJ222X Panasonic RES SMD 2.2K Ohm 5% 1/10W 0402
48 R25,R32,R33,R36 4 30 R0201 — ERJ-1GEJ300C Panasonic RES 30 Ohm 1/20W 5% 0201 SMD
49 R30,R31,R34,R35 4 330 R0201 — CRCW0201330RJNED Vishay RES 330 Ohm 1/20W 5% 0201 SMD
50 R38,R39 2 DNL R0402 DNL — — —
51 R41 1 0 R0402 — ERJ-2GE0R00X Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0402
52 R42 1 12 R0402 — ERJ-2GEJ120X Panasonic RES SMD 12 Ohm 5% 1/10W 0402
53 R47 1 0 R0402 — ERJ-2GE0R00X Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0402
54 R56 1 1K R0201 — ERJ-1GEJ102C Panasonic RES SMD 1K Ohm 5% 1/20W 0201
55 R67 1 33 R0402 — ERJ-2GEJ330X Panasonic RES SMD 33 Ohm 5% 1/10W 0402
56 R94,R95,R97 3 0 R0201 — ERJ-1GN0R00C Panasonic RES SMD 0.0 Ohm JUMPER 1/20W 0201
57 R100,R101,R102,R103,R104,R114,R115
7 0.5 Current_Sens_Res_0603
— RL0603FR-070R5L Yageo RES SMD 0.5 Ohm 1% 1/10W 0603
58 R106,R107 2 10k R0201 — ERJ-1GEJ103C Panasonic RES SMD 10K Ohm 5% 1/20W 0201
59 R108 1 0 R0603 — ERJ-3GEY0R00V Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0603
60 R109 1 0 R0603 DNL ERJ-3GEY0R00V Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0603
61 R110 1 0 R0402 — ERJ-2GE0R00X Panasonic RES SMD 0.0 Ohm JUMPER 1/10W 0402
62 R111 1 DNL R0402 DNL — — —
63 R117 1 1K R0402 — ERJ-2GEJ102X Panasonic RES SMD 1K Ohm 5% 1/10W 0402
64 SW1 1 PB 2psmd_eswitch — TL1015AF160QG E-Switch SWITCH TACTILE SPST-NO 0.05A 12 V
65 SW2 1 ON/OFF SWITCH PCM12SMTR — PCM12SMTR C&K SWITCH SLIDE SPDT 300 mA 6 V
Item Reference Qty Part PCB Footprint Comments Part Number Manufacturer Description
32
iCE40 Ultra Wearable Development Platform
66 TP1,TP2,TP3,TP4,TP5,TP6,TP11,TP12,TP13,TP16,TP17,TP18,TP19,TP20,TP21,TP22,TP23,TP24,TP25,TP32,TP33,TP34,TP35,TP36
24 T POINT R TEST_POINT DNL — — —
67 TP28,TP29,TP30,TP31
4 T POINT R TEST_POINT DNL — — —
68 U1 1 BQ24232 BQ24232_16VQFN — BQ24232RGTT TI IC LI+ CHARGER PWR MGMT 16QFN
69 U2 1 FT2232HQ FT2232HQ_64QFN — FT2232HQ FTDI IC USB HS DUAL UART/FIFO 64-QFN
70 U3 1 93LC56BT 93LC56BT_6SOT23 — 93LC56BT-I/OT Microchip Technology
IC EEPROM 2KBIT 2MHZ SOT23-6
71 U4 1 LCMXO2-2000ZE-1UWG49
XO2_2000ZE_49CSP CUSTOMER SUPPLIED
LCMXO2-2000ZE-1UWG49
Lattice LCMXO2-2000ZE-1UWG49
72 U5 1 NOR Flash N25Q032A_8SOIC — N25Q032A13ESC40G Micron IC FLASH 32MBIT 108MHZ 8SO
73 U6 1 MIC_LEFT MP34DB01_RHLGA — MP34DB01TR STMicroelectronics MIC MEMS DIGITAL PDM OMNI -26DB
74 U7 1 MIC_RIGHT MP34DB01_RHLGA — MP34DB01TR STMicroelectronics MIC MEMS DIGITAL PDM OMNI -26DB
75 U8 1 TPS61061 TPS61061_8QFN — TPS61061DRBR TI IC LED DRIVER WHITE BCKLGT 8SON
76 U9 1 iCE5LP4K iCE5LP4K_SWG36 CUSTOMER SUPPLIED
iCE5LP-4K-SWG36 Lattice iCE40 Ultra family is an ultra-low power FPGA and sensor manager
77 U10 1 NOR-FLASH M25P80_SO8N — M25P80-VMN6TP Micron IC FLASH 8MBIT 75MHZ 8SO
78 U11 1 4-BIT_TRANSLATOR 12DSBGA_TXB0104 — TXB0104YZTR Texas Instruments IC XLATR VOLT-LVL 4B ESD 12DSBGA
79 U12 1 2-BIT_TRANSLATOR 8DSBGA_TXB0102 — TXB0102YZPR Texas Instruments IC 2BIT V-TRANS-LATR W/ESD 8DSBGA
80 U13 1 MIC5320 MIC5320_6MLF — MIC5320-PGYMT TR Micrel Inc IC REG LDO 3 V/1.8 V 0.15A 6TMLF
81 U14 1 TPS7A7200 TPS7A7200_16QFN — TPS7A7200RGTT Texas Instruments IC REG LDO FIX/ADJ 2A 16QFN
82 U15 1 1-BIT_TRANSLATOR 6SON_SN74AUP1T34 — SN74AUP1T34DSFR Texas Instruments IC V-LEVEL XLATR UNIDIR 6SON
83 U16 1 MIC5504 MIC5504_4TDFN — MIC5504-1.2YMT TZ Micrel Inc IC REG LDO 1.2 V 0.3A 4TDFN
84 Y1 1 12MHz 403C35D12M00000_4SMD
— 403C35D12M00000 Abracon Corp CRYSTAL 12MHZ 18 pF SMD
85 Y2 1 27.000MHz OSC_ASCSM — ASCSM-27.000MHZ-LR-T
Abracon OSC XO 27.000MHZ CMOS SMD
86 WEARABLE SOLU-TION MAIN BOARD PCB
1 — — — 305-PD-15-0069 PACTRON —
87 LCD Display 1 www.vcdisplays.com - David Fontano / [email protected]
LH154Q01-TD01 LG http://vcdisplays.com
88 Battery 1 http://www.ebay.com S107-19 or 652030 Syma 3.7 V 240mAh Li-Po Battery for SYMA S026 RC Remote Quadcopter - bag & tag item
89 Magnet 8 http://www.ama-zon.com
??? MyMagnetMan MyMagnetMan® 1/4" x 1/16" (6.35 x 1.58mm) 3M-467 Adhesive Rare Earth Neodymium Disc Magnets for Crafts
Item Reference Qty Part PCB Footprint Comments Part Number Manufacturer Description
33
iCE40 Ultra Wearable Development Platform
Appendix D. Sensor Board Bill of MaterialsFigure 22. Sensor Board Bill of Materials
Item Reference Qty Part PCB Footprint Comments Part Number Manufacturer Description
1 C1 1 10uF C0805 — C2012X5R1C106K085AC TDK CAP CER 10 µF 16 V 10% X5R 0805
2 C2,C3,C4,C6,C7,C9,C10,C16,C17,C18,C19,C20
12 0.1uF C0402 — C1005X5R1C104K050BA TDK CAP CER 0.1 µF 16 V 10% X5R 0402
3 C5,C12 2 0.01uF C0402 — GRM155R61C103KA01D Murata CAP CER 10000 pF 16 V 10% X5R 0402
4 C8 1 4.7uF C0603 — EMK107ABJ475KA-T Taiyo Yuden CAP CER 4.7 µF 16 V 10% X5R 0603
5 C11,C13 2 2.2uF C0402 — C1005X5R1C225K050BC TDK CAP CER 2.2 µF 16 V 10% X5R 0402
6 C14,C15 2 8pF C0402 — GRM1555C1E8R0CA01D Murata CAP CER 8 pF 25 V NP0 0402
7 C21 1 10uF C0603 — C1608X5R0J106K080AB TDK CAP CER 10 µF 6.3 V 10% X5R 0603
8 C22 1 22uF C0603 — C1608X5R0J226M080AC TDK CAP CER 22 µF 6.3 V 20% X5R 0603
9 C23 1 1uF C0402 — C1005X5R1C105K050BC TDK CAP CER 1 µF 16 V 10% X5R 0402
10 J2 1 2X3 SOCKET 2X3_SOCKET_SMD — NPPC032KFMS-RC Sullins CONN FEMALE 6POS DL .1" GOLD SMD
11 J3 1 2X5 SOCKET 2X5_SOCKET_SMD — NPPC052KFMS-RC Sullins CONN FMALE 10POS DL .1" GOLD SMD
12 J4 1 1X2 Header 1X2_HDR_SMD BREAKAWAY PART
15910100 Molex Inc CONN HEADER 10POS .100" STR 15AU
13 J5 1 2X2 SOCKET 2X2_SOCKET_SMD — M20-7870246 Harwin Inc 02+02 DIL SMT SKT
14 L1 1 0.47uH L2016 — 1286AS-H-R47M Toko Inductor 0.47uH DFE201612C series
15 R1,R12,R15,R25,R26,R27
6 10K R0402 — ERJ-2RKF1002X Panasonic RES 10K Ohm 1/10W 1% 0402 SMD
16 R2,R3,R4,R5,R6,R7,R8,R9,R10,R11,R13,R14,R16,R17,R19,R21,R23
17 0 R0402 — ERJ-2GE0R00X Panasonic RES 0.0 Ohm 1/10W 0402 SMD
17 R18,R20 2 DNL R0402 DNL — — —
18 R22 1 0.001 R1206 — CSNL1206FT1L00 Stackpole RES SMD 0.001 Ohm 1% 1W 1206
19 R24 1 1K R0402 — ERJ-2RKF1001X Panasonic RES 1K Ohm 1/10W 1% 0402 SMD
20 TP1,TP2,TP3,TP4,TP5,TP6,TP7,TP8,TP9,TP10,TP11,TP14,TP15,TP16
14 TEST POINT TEST_POINT DNL — — —
21 TP12,TP13 2 80_MIL_PAD TP_80MIL DNL — — —
22 TP17,TP18 2 T POINT R 30_mil_pad DNL — — —
23 U1 1 FAN48610 FAN48610 — FAN48610UC50X Fairchild IC REG BOOST SYNC 5 V 1A 9WLCSP
24 U2 1 AFE4403 AFE4403_36DSBGA — AFE4403YZPT TI IC AFE FRONT END 36DSBGA
25 U3 1 LPS25H LPS25H_10HCLGA — LPS25HTR STMicroelectronics IC MEMS PRESSURE SENSOR 10HCLGA
26 U4 1 LSM330DLC LSM330DLC_28LGA — LSM330DLCTR STMicroelectronics ACCELEROMETER/GYROSCOPE 28LGA
27 U5 1 SeeedBLE SeeedBLE http://www.seeedstu-
dio.com
113050012 Seeed Low cost ARM cortex-m0 based module for Bluetooth module
28 U6 1 SFH7050 SFH7050 — SFH7050 OSRAM Biomonitoring Sensor for heart rate monitor-ing, Pulse oximetry and proximity
29 U7 1 TMP112 TMP112_SOT563 — TMP112AIDRLT TI IC TEMP SENSOR DGTL 5 V SOT563
30 Y1 1 8MHz NX3225GD_8MHZ — NX3225GD-8MHZ-STD-CRA-3
NDK CRYSTAL 8MHZ 8 pF SMD
31 WEARABLE SOLUTION SENSOR BOARD PCB
1 — — — 305-PD-15-0028 PACTRON —
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