Dispensing and Jetting Panel Discussion Bonus MaterialQ&A Plus
and Bonus Guide
Nordson Electronics Solutions 2021
Q&A Plus Responses Question Answer
What is the smallest deposit size achievable with jetting and
dispensing techniques? Does this differ for different materials,
and if so what are the minimum deposit sizes for common
materials?
For needle dispensing, we can dispense down to 200 µm dots. When it
comes to jetting, you need to work with the fluid supplier to make
sure you are using a material that is conducive to jetting. For
jettable materials, we are currently able to jet 1-2 nl
volumes.
Is it possible to jet 100-150 micron solder paste dots? If yes,
what paste type and kind of stand-off from the substrate?
When it comes to dispensing small solder paste dots, you need to
work with your fluid supplier to get the right composition. When
we’re looking at really small shot sizes, we’re using a type 6 or 7
solder paste. The chemistry of the material must lend itself to
small dot dispensing. That’s probably the number one thing you’ll
need to look for, finding the type of paste that will successfully
dispense small dots.
Referring to components, parts, and pads; how can you be sure about
the amount of the solder paste being dispensed? Also, according to
the IPC acceptability please.
In general, customers typically specify the amount of material they
want to be dispensed per pad size to meet their tolerances. If
required, an inspection can be performed after dispense to verify
the correct amount of paste was dispensed. Refer to J-STD-005 –
General Requirements and Test Methods for Soldering Paste.
What about integrated inspection in the dispensing system when it
comes to glue or solder paste dispensing?
Onboard inspection is helpful and cost-effective when you have a
small number of parts to inspect. To minimize the impact on UPH,
onboard inspection should primarily be used to spot check
dispensing results during the process. Nordson offers automated
post-dispense inspection in some of our dispensing and conformal
coating solutions.
Is there a way of measuring cartridge pressure that solder pastes
will be exposed to during jetting and/or dispensing? If so, can
that be adjusted on the fly if separation between the flux and
solder powder occurs within a solder paste cartridge.
It’s not possible to correct the separation of flux and solder
powder on the fly during the dispensing process. These elements are
mixed by the fluid supplier before shipment.
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Q&A Plus Responses Question Answer
How prevalent is jetting of solder paste in today's marketplace.
For example, can 1 out of 10 contract manufacturers jet solder
paste?
We have received requests to jet solder paste, but it has not been
commercialized as much as you might think. Nordson does offer
solder paste jetting solutions through our sister company Nordson
EFD. However, there are many considerations with solder paste
jetting including the type and cost of the paste you’re using. In
general, it’s challenging to achieve a repeatable production-worthy
solder paste jetting process.
How important is bottom-side tooling in dispensing applications?
When it comes to miniaturization, bottom-side tooling is really
important. For example, if you’re using vacuum tooling it allows
the part to be held in place during dispensing to ensure good
placement accuracy. Any slight movement in the part during dispense
will sacrifice accuracy. Tooling, whether it’s heated on not
heated, can help you control the flow out of dispensed material.
Tooling has a significant impact on overall process outcomes.
Is it possible for a jet dispenser to meet Cp, Cpk >1.67 in
terms of volume? To address this question, we need to know the type
of fluid you’re using, your target volume, and the tolerance
specifications. Dependencies include the stability of the material
and whether several shots are needed to achieve the target volume.
After assessing these factors, we can provide the Cp and Cpk values
in terms of volume.
With Factory 4.0, is the plan to have external downstream
dispensers talk with SPI to correct volume inadequacies? How far
away is this?
Nordson currently offers integrated post-dispense inspection in our
precision dispensing systems and will further develop multi-system
closed-loop process controls. Cpk analyses are also available
between the Select Coat® SL-940 conformal coating system and the
inline automated coating inspection system in Panorama Line
Solutions.
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Q&A Plus Responses Question Answer
Do you see jetting and dispensing methods replacing stencil
printing for solder pastes in the near future?
Rework, sealing, line, and dot dispense applications are commonly
used today when stencil printing is not feasible. One major benefit
of dispensing solder paste over stencil printing is that it offers
flexibility. If parts are revised, it’s easy to add or remove
material to accommodate pad changes. And you can avoid the cost and
time involved in creating new stencils.
Are there any techniques to prevent material from flowing away from
a component that is being underfilled?
To prevent underfill flow out, reduce the shot size and dispense
smaller amounts of fluid in a multi-pass approach. This allows
capillary flow to occur gradually and minimizes flow out.
Tip or valve? What to choose? The material will dictate which
direction to take. Look at the rheology of the fluid, the
viscosity, and the dot sizes you want to achieve. That information
will help you determine whether you should go with needle
dispensing or jetting. Lower viscosity materials tend to be easier
to jet and offer higher productivity. For higher viscosity
materials, you might consider needle dispensing with pumps or time
pressure valves.
What are the advantages of jetting vs. pin transfer for sub 150 µm
deposits? Conductive epoxy and non-conductive epoxy without filler
can be dispensed at a 0.15 mm dot size with the Nordson DV-7000
Heli-Flow® auger pump.
It’s possible to dispense type 6 solder paste at a 0.2 mm dot size
and achieve production-worthy reliability.
What is the dispensing time per dot using a jet valve? The valve
open time is 1 ms or less.
Two-Part Dispensing Success
Achieving accurate mix ratios, selecting the right static mixer,
and keeping fluids separate before mix and dispense are critical to
the success of two- part dispensing applications.
If fluids come into contact too soon or mix ratios and times are
inaccurate, fluid properties are affected, and process outcomes are
affected.
Nordson addresses critical concerns with the Vortik® Progressive
Cavity Pump.
1. Our unique, award-winning, patent-pending ARC™ Technology in
Fluidmove® software takes the guesswork out of application setup.
Enter basic information including mix ratio, specific gravity, and
volume target to quickly determine the optimal setup configuration
for your application – eliminating manual calculations and
time-consuming test iterations.
2. All two-component Vortik pumps are equipped with a
patent-pending Quick Disconnect Manifold that prevents contact
between part A and part B materials for easy transition between
calibration, production, and overnight modes. Calibrate the ratio
to ensure a consistent ratio.
3. The suck back feature offers excellent fluid break-off.
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Learn More
Now our unmatched dispensing technologies are available in a
large-volume format. Brimming with functional features, the Helios
SD-960 Series delivers the advanced performance you’ve come to
expect. What’s more, our solutions include everything you need to
initiate your process. Dispense large-volumes of one- (1K) or
two-component (2K) structural, thermal, bonding, sealing or potting
materials with our all-in-one solutions.
Compatible with the large-volume Vortik progressive cavity pump for
single- and two-part applications
The suck back feature offers excellent fluid break-off.
Choose from dual-drawer batch or conveyorized in-line
configurations equipped with Nordson ASYMTEK dispense valves or
fully integrated Nordson SEALANT metering systems.
Options include time-pressure valves, closed-loop process control,
and servo-controlled positive displacement systems.
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Consider needle dispensing with an auger pump to achieve
repeatable, production-ready solder paste dispense results. For
needle dispensing, we can dispense down to 200 µm dots.
Learn More:
Nordson DV-7000
Performance
Repeatable results
Ease of use – maintenance and change over. Designed with fewer
parts!
Controlled by dedicated fluid dispensing software
The most significant jetting challenge is dispensing to
miniaturized geometries with speed and accuracy.
Nordson offers the IntelliJet® Jetting System with patented
ReadiSet® Jet Cartridge for cutting-edge reliability and micro-dot
dispensing.
The IntelliJet jets up to 5000 dots over a 10-second interval with
a maximum 1000 Hz frequency
Jet actuator reliability is up to six times longer than other jets
on the market
The IntelliJet fully-integrates into ASYMTEK's top three precision
dispensing systems – Vantage® Series, Forte™ Series, and Spectrum®
II Premier
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IntelliJet® Jetting System and Easy Change Over with two-piece
ReadiSet® Jet Cartridge
High-Speed Jetting Success Learn More
The Nordson NE Connect™ API integrates into our dispensing and
coating software applications – Fluidmove®, EasyCoat®, and Canvas®
– and with traceability systems and protocols across SMT, PCB,
PCBA, and SEMI industries.
The architecture offers:
Overall equipment efficiency
Support for product and material validation, program and material
changeover, and program mapping
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By helping ensure that fluid is dispensed to parts according to
specific tolerances and quality standards, Nordson’s automated
post-dispense inspection enables you to perform “sample inspection”
to keep your process on track and minimize UPH impact.
The most significant challenge with automated inspection is the
time that it takes to perform the inspection step. It could easily
double your cycle time.
Nordson offers sampled inspection, instead of 100% inspection to
reduce any negative UPH impact.
The system inspects for:
Fluid contamination on top of the die
Keep out zone violation
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