Contents• Capability-PCB• Capability-FPC and RFPC• Capability-Aluminum PCB• Capability-PCBA
Wonderful PCB
Capability –PCB General Capability
Wonderful PCB
• Number of Layer: 2-28Layer• Maximum processing area: 680 x 1000 mm • Min board Thickness: 2 Layer 0.3mm(12mil) ; 4 Layer 0.4mm(16mil) ; 6 Layer 0.8mm(32mil) ; 8 Layer 1.0mm(40mil) ; 10 Layer 1.1mm(44mil) ; 12 Layer 1.3mm(52mil) ; 14 Layer 1.5mm(59mil) ; 16 Layer 1.6mm(63mil) ; 18 Layer 1.8mm(71mil) ; • Finished board thickness tolerance: Thickness < 0.8mm , Tolerance:+/-0.08mm ;0.8mm≤Thickness≤6.5mm , Tolerance+/-10%
Capability -- PCB General Capability• Twisting and bending :≤ 0.75% , Min0.5% 。• Range of TG : 130-215℃• Impedance tolerance+/-10% , Min+/-5% 。• Hi-Pot Test: Max4000V/10MA/60S • Surface treatment:HASL With Lead HASL Free LeadFlash Gold Immersion GoldImmersion Silver Immersion TinGold Finger Osp
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Capability -- PCB Pattern limit
Min width 0.1mm (4 mil)
Min trace 0.1mm (4 mil)
Min width of ring (inner layer) 0.15mm (6 mil)
Min width of ring (out layer) 0.1mm (4 mil)
Min solder bridge 0.1mm (4 mil)
Min height of legend 0.7mm (28mil)
Min width of legend 0.15mm (6 mil)
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Wonderful PCB
Capability -- PCB Holes processing
Final hole size Min 0.2mm
Drilling hole size 0.20~6.5mm
Drilling tolerance +/-0.05mm
Final hole size tolerance (PTH)φ0.20~1.60mm+/-0.075mmφ1.60~6.30mm: +/-0.10mm
Final hole size tolerance (NPTH)φ0.20~1.60mm+/-0.05mmφ1.60~6.50mm: +/-0.05mm
Drilling strip hole Length /width 2:1
Min strip hole width 0.65mm
Length & width tolerance +/-0.05mm
board thickness/hole size ≤ 10:1
Capability -- PCB Cu thickness +plating (1)
• Cu thicknessOut layer Cu thickness:1-6OZInner layer Cu thickness:0.5-4OZCu thickness of PTH: average>=20um,Min.>=18um• HASL with lead: Tin 63% Lead37%• HASL free lead: surface thickness>=0075umThickness in the hole>=5um• Flash Gold Ni thickness:3-5um (120u"-160u")Gold thickness:0.025-0.075um ( 1u"-3u" )
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Capability -- PCB Cu thickness +plating (2)
• Immersion GoldNi thickness:3-5um (120u"-160u")Gold thickness:0.025-0.15um ( 1u"-6u" ) • Immersion TinTin thickness:0.8-1.2um ( 32u"-48u" )• Immersion silverAg thickness:0.15um-0.75um (6u"-30u")• Gold FingerNi thickness:3-5um ( 120u"-160u" )Gold thickness:0.025-1.51um ( 1u"-60u" )
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Capability -- PCB Cover thickness (1) • Solder mask Color: green, matte green,yellow,blue,red,black,matte blackSolder mask thickness:Surface line≥10um ,surface line corner≥6um surface board 10-25umSolder mask bridge width: HOZ≥0.1mm IOZ≥0.12mm• LegendColor: White, yellow, blackMin height of legend 0.70mm (28mil) ;Min width of legend 0.15mm (6 mil)
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Capability -- PCB Cover thickness (2)
• Blue Gel thickness:0.2-1.5mm tolerance+/-0.15mm• Carbon print:Thickness:5-25umMin space : 0.25mmimpedance:200Ω
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Capability -FPC• FPC Layers 1-8 layers• Board Thickness 0.05-0.5mm• Min.line width/space 0.04/0.04mm• in.Through Hole Size 0.2mm• PTH Hole Dia.Tolerance ≤0.1mm 0.05mm ≥0.1mm ∮ ∮
±0.075mm • Solder Mask Registration Tolerance ±0.05mm
Min.Routing Dimension Tolerance ±0.05mm• Hole to edge ( Hard tool/Die Cut) ±0.1/±0.2mm• Eege to Edge ( Hard tool/Die Cut) ±0.05/±0.2mm• Circuit to edge ( Hard tool/Die Cut) ±0.07/±0.2mm
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Capability-Flex Rigid PCB
• 4L1R+2F+1R • 6L2R+2F+2R• 1+HDI 6L1+1R+2F+1R+1 • 2+HDI 6L1+1F+2F+1F+1 • 2+HDI 8L• Thin 4L R-F ( 1+HDI )
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Capability—FPC and RFPC Material-1
Wonderful PCB
1. Base Material 1.1 FCCL ( Flexible Copper Clad laminate)Polyimide: Kapton (12.5 m/20 m/25 m/50 m/75 mHigh flex life, good thermal management, high moisture absorption and good tear resistant
Polyester (25 m/50 m/75 m) Most cost effective, good flex life, low thermal resistivity, low moisture absorption and tear resistant
1.2 Dielectric Substrates : PI, PET.
Capability—FPC and RFPC Material
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2. Coverlay
2.1 Cover Layer from ½ mil to 5 mils (12.7 to 127µm) Polyimide: (12.5 m/15 m/25m/50m/75m/125m)High flex life, high thermal resistivity.
2.2 Flexible Solder Mask Most cost effective, lower flex life, better for registration )2.3 PIC—photo imaging covercoat Lower flex life, better for registration
Capability—FPC and RFPC Material
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3. Adhesive Sheet
4. Conductive Layer4.1 Rolled Annealed Copper (9 m/12 m/17.5 m/35 m/70 m)High flex life, good forming characteristics.
4.2 Electrodeposited Copper (17.5 m/35 m/70 m)More cost effective
4.3 Silver InkMost cost effective, poor electrical characteristics. Most often used as shielding or to make connections between copper layers
5.SF-PC5000 and SF-PC1000 protection film
Capability—FPC and RFPC Material
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6.Additional Material & Stiffeners
FR4——EpoxyPressure Sensitive Adhesive (PSA) Steel, Aluminum stiffeners
7. No / Low Flow PP Applied in Lamination 106(2mil) 1080(3.0mil / 3.5mil) 2116(5.6mil) w/o micro-via Brand: TUC, Panasonic, Arlon, Hitachi, Doosan
Capability –Aluminum PCB
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Capability- PCB Assembly1. PCBA, PCB assembly: SMT & PTH & BGA1.1.SMD :160K points/hour. operation rate :70%( 8 working hours per
day, 20 set equipments)1.2.DIP: 75K points/hour. operation rate :80% ( 8 working hours per
day, 250 persons for DIP)2. PCBA and enclosure design3. Components sourcing and purchasing4. Quick prototyping5. Final assembly6. Test: AOI, In-Circuit Test (ICT), Functional Test (FCT)7. Custom clearance for material importing and product exporting
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Capability –Profiling for all
• cnc : tolerance+/-0.1mm line to cnc ≥0.20mm hole to cnc ≥0.30mm gold finger to cnc ≥0.20mm• Punching: Hole size diameter +/-0.10mm Punching diameter +/-0.15mm• v-cut: corner : 30℃ 、 45℃ 、 60℃ corner tolerance : +/-5° v-cut deepness : 0.6-1.6mm deepness tolerance : +/-0.10mm
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Capability –Test for all
• Equipment:Universal Tester Flying Probe Open/Short TesterHigh power MicroscopeSolderability Testing KitPeel Strength testerHigh Volt Open & Short testerCross Section Molding Kit With Polisher
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