Materials for Automotive Electronic Applications
Automotive
MATERIALS FOR AUTOMOTIVEELECTRONIC APPLICATIONS
Powertrain• Engine• Transmission
interior•Multimedia• SeatingSystems• SafetySystems
• InstrumentPanelSystems
thermal• EngineCooling• HAVC• HeatingSystems
• Battery• Controller• DCtoDCConverter
• ElectronicVehicleChargeSystems
• Inverters
Body• BodyElectronics• ExteriorLighting
•Wheel• SecuritySystems
SenSorS• AmmoniaSensor• PressureSensor• OxygenSensor• TemperatureSensor• DigitalSpeedand
Position Sensor
• FlatResponseKnockSensor
• RainSensor•MassAirFlowSensor• BrakeSensor• AccelerationSensor
• ElectronicCenter
electrical/electronic architecture
Addressingtheneedsoftoday’sadvancedautomotiveindustry,Henkelhasdevelopedabroadrangeofconductivepasteandfilmadhesives,glob-topandunderfillencapsulants,conformalcoatings,sealants,pottingencapsulantsandsolderproducts.Oursolutionsareusedinawiderangeofvehicleelectronicandsensorcomponentsforcommonrailfuelsystems,safetyelectronics,engineandpowertrainmanagement,infotainment,andlightingapplications.
hyBrid & electric Vehicle ProductS
PRINTEDCIRCUITBOARDASSEMBLYMATERIALSHenkelistheworld’sleadingandmostprogressiveproviderofqualifiedmaterialsforsemiconductorpackaging,printedcircuitboard(PCB)assemblyandadvancedsolderingsolutions.
LowPressureMolding
Sealant
Encapsulants(GlobTop)
Surface Mount Adhesives
CSPUnderfills(Cornerbond)
ThermalManagement
Materials
AssemblyFilmAdhesives
SolderMaterials
Encapsulants(Dam&Fill)
PrintedInks
PottingCompound Conformal
Coatings ElectricallyConductive
Pastes
1 | Automotive Electronic Automotive Electronic | 2
circuit Board Protection•LowPressureMolding•Potting•ConformalCoatings•Gasketing&Sealants
Printed inKS•TransparentConductiveInks•SilverInks•BlendableResistiveInks•DielectricInks
thermal manaGement materialS•AdhesivePastes•Phase-ChangeMaterials•ThermalGreases
aSSemBly adheSiVeS•Pastes-ElectronicallyConductive•Films-ElectronicallyConductive
Solder materialS•High-ReliabilityAlloy•High-ReliabilityPastes•LiquidFluxes•CoreWires
chiP on Board (coB) encaPSulantS
underFillS SurFace mount adheSiVeS
henKel electronicS aSSemBly Poroduct lineS
applications Key Solutions
Ammonia Sensor CircuitBoardProtectionSolderMaterialsMaterials
Pressure SensorCircuitBoardProtection AssemblyAdhesivesSolderMaterials
OxygenSensor CircuitBoardProtectionSolderMaterials
Temperature SensorCircuitBoardProtectionAssemblyAdhesivesSolderMaterials
DigitalSpeedandPositionSensor
CircuitBoardProtection PrintedInksAssemblyAdhesivesSolderMaterials
FlatResponseKnockSensorCircuitBoardProtection AssemblyAdhesivesSolderMaterials
Rain Sensor CircuitBoardProtection AssemblyAdhesives
MassAirFlowSensor AssemblyAdhesivesSolderMaterials
BrakeSensorCircuitBoardProtection AssemblyAdhesivesSolderMaterials
Acceleration Sensor
CircuitBoardProtection PrintedInks AssemblyAdhesivesSolderMaterials
Sensors
applications Key Solutions
engine
Electronic Control Units
CircuitBoardProtectionAssemblyAdhesivesSolderMaterials Underfills
transmission
ElectronicIgnitionModulesCircuitBoardProtection ThermalManagementMaterialsSolderMaterials
IgnitionCoils CircuitBoardProtectionSolderMaterials
Electronic Transmission Controllers
CircuitBoardProtectionSolderMaterials
Powertrain
3 | Automotive Electronic
MassAirFlowSensor
BrakeSensor
Electronic Control Units
electrical/electronic architecture
Body applications Key Solutions
Body electronics
BodyControlModulesCircuitBoardProtectionAssemblyAdhesivesSolderMaterials
exterior lighting
LEDSystems
CircuitBoardProtection ThermalInterfaceMaterials DieAttach Encapsulant
wheel
Tire PerssureCircuitBoardProtectionSolderMaterials
Securlty & Safety Systems
PedestrianProtectionCircuitBoardProtectionSolderMaterials
KeylessEntryCircuitBoardProtectionSolderMaterials
applications Key Solutions
electronic center
SealedPrintedCircuitBoardElectrical Centers
CircuitBoardProtectionSolderMaterials
BatteryMonitoringDeviceCircuitBoardProtectionSolderMaterials
PowerFlexívelElectricalCenters CircuitBoardProtection
SolidStateRelaysCircuitBoardProtectionSolderMaterials
SolidStateRelays
LEDSystem
Automotive Electronic | 4
interior
thermal applications Key Solutions
engine cooling
CoolingFanControllers CircuitBoardProtectionThermalManagementMaterials
hVac
ElectronicHeatingSystems PrintedInks
ElectronicAirConditionControllers CircuitBoardProtection
heating Systems
MirrorHeat PrintedInks
applications Key Solutions
multimedia
Multiple Antenna Reception Systems
CircuitBoardProtectionSolderMaterials
Display,Audio&NavigationSystems
CircuitBoardProtectionPrinkedInksThermalManagementMaterials AssemblyAdhesivesUnderfills
Seating Systems
Electronic Seat ControllersCircuitBoardProtectionAssemblyAdhesivesSolderMaterials
SeatBeltSystems CircuitBoardProtectionSolderMaterials
SeatHeaters PrinkedInks
Safety Systems
AirBagSystems CircuitBoardProtectionSolderMaterials
instrument Panel Systems
Instrument Clusters CircuitBoardProtectionPrinkedInksSolderMaterials
Head-upDisplaysCircuitBoardProtectionPrintedInksSolderMaterials
MirrorHeat
Multimedia
hybrid & electric Vehicle Products
applications Key Solutions
Battery
HybridVehicleBatteryPackSystems
CircuitBoardProtectionThermalManagementMaterialsSolderMaterials
BatteryManagementControllerCircuitBoardProtectionSolderMaterialsThermalManagementMaterials
UniversalOn-boardBatteryCharger
CircuitBoardProtectionSolderMaterials
controller
HybridandEVController
CircuitBoardProtectionAssemblyAdhesivesSolderMaterialsUnderfills
dc to dc converter
Universal2.2kWDC/DCConverter
AssemblyAdhesivesSolderMaterials
electronic Vehicle charge Systems
PortableElectricVehicleCharger CircuitBoardProtection
inverters
TractionInverterforHybridElectricVehicles
CircuitBoardProtectionThermalMangementMaterials
Automotive Electronic | 6
Hybrid&ElectricVehicle
5 | Automotive Electronic
CIRCUITBOARDPROTECTION
7 | Automotive Electronic
circuit Board Protection
LOWPRESSUREMOLDING POTTING CONFOMALCOATINGSGASKETING&
SEALANTS
POLYAMIDE POLYOLEFIN URETHANES EPOxIES SILICONESONE-
COMPONENT ACRYLICSURETHANEACRYLATES
URETHANES SILICONES GASKETS SEALANTS
Polyamide AdhesiontoPlastics IncreasedHardness
ExcellentAdhesiontoMetals,Plastics,Tough
Surfaces
Two-Component
Room Temperature
Cure
Two-ComponentHeatCure
Two-ComponentRoom Temperature Cure
Amber Black Amber Black Blaze Orange Amber Black Opaque White HYSOLUS1150
HYSOLES1004
HYSOLES1000
HYSOLES2500
LOCTITE®
5092HYSOL
EO 1058HYSOL PC62 HYSOL
PC40-UMHYSOL PC 18M
HYSOLECCOCOAT
SC 3613
LOCTITE® NUVA-SIL
5089
LOCTITE® 5210
TECHNOMELT®
PA 673TECHNOMELT®
PA 678TECHNOMELT®
PA 633TECHNOMELT®
PA 638TECHNOMELT®
PA 341TECHNOMELT®
PA 641TECHNOMELT®
PA 646TECHNOMELT®
PA 5735HYSOLUS1151
HYSOLES1301
HYSOLES1002
HYSOL STYCAST2651MM
(Catalyst 9 or 23LV)
LOCTITE®
5140HYSOL
EO 7038
HYSO ECCOCOAT
UV 7993
TECHNOMELT®
PA 682TECHNOMELT®
PA 687TECHNOMELT®
PA 652TECHNOMELT®
PA 657HYSOLUS1750
HYSOLES2202
HYSOLES1900
HYSOL STYCAST2850FT
(Catalyst 9 or 23LV)
LOCTITE®
5945
HYSOLUS2050
HYSOLSTYCAST2651-40
HYSOLES1901
HYSOL STYCAST2850KT
(Catalyst 9 or 23LV)
HYSOLUS2350
HYSOL STYCAST2651MM
(Catalyst 11)
HYSOLES2207
HYSOLUS2650
HYSOL STYCAST2850FT
(Catalyst 11)
HYSOLUS2651
HYSOL STYCAST2850KT
(Catalyst 11)
HYSOLSTYCAST
U2500
Automotive Electronic | 8
Henkel’s renowned TECHNOMELT® low pressure molding solution is delivering superior sealing adhesion and excellent temperature and solvent resistance. The simplicity of these materials is their advantage: because the entire TECHNOMELT® operation takes place at low pressure, cycle time is short, and fine or fragile circuitry is not damaged, delivering measurable improvements over that of traditional potting or encapsulating processes. PCB and circuitry protection is essential in modern, challenging applications; and Henkel delivers manufacturers proven, reliable solutions and peace of mind.
what iS technomelt® ?An innovative technology to serve the increasing demands for circuit board protection in the electronics market. Its low pressure and high speeds are suitable for sensitive electronic components in manufacturing environments. The technology allows for unique design beyond the form / fit / function of traditional encapsulating materials.
aPPlicationS• Automotive Sensors
• Switches
• Engine Control Units
• Lighting Display Boards
• Micro-Inverters
• Power Regulators
• Industrial Sensors
• Medical Sensors
9 | Automotive Electronic
low PreSSure moldinG
technomelt® circuit Board Protection ProductS
Polyamide: hiGh temPerature reSiStance
PRODUCTFORMER
NAMEDESCRIPTION COLOR
PERFORMANCE TEMPERATURE
SHOREAHARDNESS
SOFTENINGPOINT
TECHNOMELT® PA 673
MACROMELT OM 673 Moldable polyamide with good adhesion for
higher temperature applications, such as in an automotive under-hood.
Amber
-40°C TO 140°C 90 187°C ± 5°CTECHNOMELT®
PA 678MACROMELT
OM 678Black
TECHNOMELT® PA 682
MACROMELT OM 682
Moldable polyamide for the most demanding high humidity applications, such as on the
inside of an automobile tire. Formulated for very low water vapor transmission.
Amber
-40°C TO 140°C 88 188°C ± 5°CTECHNOMELT®
PA 687MACROMELT
OM 687Black
Polyamide: adheSion to PlaSticS
PRODUCTFORMER
NAMEDESCRIPTION COLOR
PERFORMANCE TEMPERATURE
SHOREAHARDNESS
SOFTENINGPOINT
TECHNOMELT® PA 633
MACROMELT OM 633 Moldable polyamide with service temperature
up to 130°C, such as in an automotive firewall.
Amber
-40°C TO 130°C 90 175°C ± 5°CTECHNOMELT®
PA 638MACROMELT
OM 638Black
TECHNOMELT®
PA 652MACROMELT
OM 652Moldable polyamide, where excellent adhesion and cold temperature flexibility are important, such as in an automotive exterior. Also used extensively in white goods.
Amber
-40°C TO 100°C 77 157°C ± 5°CTECHNOMELT®
PA 657MACROMELT
OM 657Black
Polyamide: increaSed hardneSS
PRODUCTFORMER
NAMEDESCRIPTION COLOR
PERFORMANCE TEMPERATURE
SHOREAHARDNESS
SOFTENINGPOINT
TECHNOMELT® PA 341
MACROMELT OM 341
High performance thermoplastic polyamide designed to offer safety blaze orange color for easy identification of components. Typically used to encapsulate high voltage modules.
Safety Blaze Orange -25°C TO 125°C 92 173°C ± 5°C
TECHNOMELT® PA 641
MACROMELT OM 641 Moldable polyamide, where strength and
hardness are needed, such as in memory sticks and computer connectors.
Amber
-40°C TO 130°C 92 175°C ± 5°C
TECHNOMELT® PA 646
MACROMELT OM 646
Black
PolyoleFin: excellent adheSion to metalS, PlaSticS, touGh SurFaceS
PRODUCTFORMER
NAMEDESCRIPTION COLOR
PERFORMANCE TEMPERATURE
SHOREAHARDNESS
SOFTENINGPOINT
TECHNOMELT® AS 5735
MACROMELT MM Q-5375
Moldable polyolefin for demanding moisture and solvent resistance. Excellent adhesion to the most difficult substrates. Compatible with a secondary overmold with a harder polyamide.
Opaque White -30°C TO 100°C 55 139°C ± 5°C
Automotive Electronic | 10
11 | Automotive Electronic
urethaneS – two-comPonent room temPerature cure
PRODUCT DESCRIPTION MIx RATIO BYWEIGHT COLOR
RECOMMENDEDCURE
SCHEDULE
ALTERNATE CURE CYCLE
VISCOSITY mPa.s(cP)
POT LIFE AT 25°C HARDNESS
THERMALCONDUCTIVITY
W/M*C
FLAMMABILITYRATING
TEMPERATURE RANGE
SHELF LIFE
HYSOL US1150
Extended polybutadiene/MDI base, mineral filled, medium hardness, ambient cure urethane encapsulant/sealant. This material can be used for potting electronics or devices for protection against environmental hazards.
21:100 Black 24 to 48 hours @ 25°C
2 to 4 hours @ 60°C 3,500
40 to 60
minutes60A 0.486 94V-0 -65°C
to 125°C12
months
HYSOL US1151
Low viscosity, reenterable potting and encapsulation compound. It has excellent low temperature properties. It can be used to encapsulate electronics for various applications including under-the-hood automotive and marine.
12.8:100 Black 24 hours @ 25°C
2 to 4 hours @ 60°C 1,000
45 to 60
minutes30A/7800 0.18 None -65°C
to 125°C12
months
HYSOL US1750
Elastomeric polyurethane, is a water white, clear, medical grade, fast gel potting material. It is ideal for blood heat exchanger, dialyzer and oxygenerator units.
50.5:49.5Water white clear
16 hours @ 25°C
1 hour @ 60°C 510 5 minutes 78A 0.19 None -40°C
to 125°C12
months
HYSOL US2050
Quick set, optically clear polyurethane compound that exhibits excellent ultraviolet resistance. The excellent electrical properties also suggest its use for electrical and electronic component encapsulation.
100:55 Clear 48 hours @ 25°C
2 hours @ 60°C 1,200 4 minutes 90A 0.18 None -40°C
to 125°C12
months
HYSOL US2350
Flexible, flame retardant, mineral filled, polyurethane compound. This potting compound has long pot life, and is low viscosity so it flows well and adheres to many substrates.
21.2:100 Black 24 hours @ 25°C
2 hours @ 60°C 2,400 45
minutes 85A 0.51 94V-0 -65°C to 125°C
12 months
HYSOL US2650
Inexpensive, low viscosity, flexible, flame retardant, castor oil/MDI-based urethane potting/encapsulating compound. This material was designed for potting indoor and outdoor telephone connector blocks. It is suitable for potting and encapsulating other electronic or electrical devices or assemblies.
21.2:100 Tan 16 hours @ 25°C
1 hour @ 60°C 3,500 19.5
minutes 83A 0.47 94V-0 -65°C to 125°C
12 months
HYSOL US2651
Unfilled, low viscosity, reenterable potting and encapsulation compound. It can be used to encapsulate electronics for automotive applications including under the hood.
52.3:47.7 Clear amber
16 hours @ 25°C
1 hour @ 65°C 1,000 10 minutes 6000 0.18 None -65°C
to 125°C12
months
HYSOL STYCAST U2500
Encapsulant designed for transformer, PCBs and other insulation applications. Allows complete impregnation of either small slightly wound coils or large castings.
100:7 Amber 24 hours @ 25°C
4 hours @ 60°C 6,000 2 hours 72A 0.5 None -40°C
to 125°C 6 months
PottinG
Automotive Electronic | 12
ePoxieS – two-comPonent heat cure
PRODUCT DESCRIPTIONMIx RATIO BYWEIGHT
COLORRECOMMENDEDCURESCHEDULE
ALTERNATE CURECYCLE
VISCOSITY mPa.s(cP)
POT LIFE AT 25°C
HARDNESSTHERMAL
CONDUCTIVITYW/M*C
FLAMMABILITYRATING
TEMPERATURE RANGE
SHELF LIFE
HYSOL ES1004
Casting compound formulated to meet the needs for flame-out, easily handled casting systems. The cured system is nonburning of self-extinguishing according to ASTM D 635 and meets UL requirements for 94V-0.
100:13 Black2 hours @ 80°C
plus 2 hours @ 150°C
None 26,000 8 hours 88D 0.6 94V-0-40°C
to 150°C12
months
HYSOL ES1301
Silica filled epoxy casting system recommended for coils, transformers, and general purpose casting.
100:38 Black4 hours @ 110°C
2 hours @ 125°C
1,600 > 8 hours 90D 0.42 None-40°C
to 150°C12
months
HYSOL ES2202
Unfilled epoxy system with a high operating temperature and long pot life. Recommended for servo stators, high temperature resistors, transformers, and high temperature cast shapes.
100:25Clear/Amber
2 hours @ 80°C plus 2 hours
@ 150°CNone 8,000 8 hours 85D 0.2 None
-40°C to 180°C
12 months
HYSOL STYCAST 2651-40
Two-component, easy to use, low viscosity, epoxy encapsulant with excellent adhesion to metals, plastics and ceramics.
100:10.5 Black60 minutes
@ 120°C
Gel @ 75°C plus 2 hours @ 105°C
5,000 4 hours 85D 0.5 None-75°C
to 175°C12
months
HYSOL STYCAST 2651MM (Catalyst 11)
Filled, low viscosity, general purpose, epoxy encapsulant which requires low viscosity and low abrasion. It is especially useful for machine dispensing and for parts that require post molding machining.
100:8.5 Black60 minutes
@ 120°C
4 hours @ 100°C or 16 hours
@ 85°C13,000 > 4 hours 89D 0.6 None
-55°C to 155°C
12 months
HYSOL STYCAST 2850FT (Catalyst 11)
Two-component, thermally conductive epoxy encapsulant that can be used with a variety of catalysts. Used in the encapsulation of components which need heat dissipation and thermal shock properties.
100:4.5 Black60 minutes
@ 120°C
4 hours @ 100°C or 16 hours
@ 85°C64,000 > 4 hours 96D 1.28 None
-55°C to 155°C
12 months
HYSOL STYCAST 2850KT (Catalyst 11)
Two-component, thermally conductive epoxy encapsulant designed for replacement for heat sinks in nonintegrated electrical components and assemblies.
100:2.5 Black60 minutes
@ 120°C
4 hours @ 100°C or 16 hours
@ 85°C125,000 > 4 hours 95D 2.78 None
-55°C to 155°C
12 months
13 | Automotive Electronic
PottinG
Automotive Electronic | 14
SiliconeS
PRODUCT DESCRIPTION CURETYPE
LOCTITE® 5092Used for potting, coating and sealing ofvarious automotive, electronic, military and industrialcomponents.
uv
LOCTITE® 5140
Is used for potting, coating and sealing ofvarious automotive, electronic, military and industrialcomponents. LOCTITE® 5140™ resists weathering, moisture,ozone and retains its properities through severe environments.This product is typically used in applications up to 200 °C.
Room temperature vulcanizing
LOCTITE® 5954
Typical applications include stamped sheet metal covers(timing covers and oil sumps) where good oil resistance andthe ability to withstand high joint-movement is required.It withstands on line, low pressure tests carried out beforeproduct begins to cure. In addition, LOCTITE® 5945™ is a slowskinning material to provide for longer “open times”.
Room temperature vulcanizing
one-comPonent
PRODUCT DESCRIPTIONCURE TYPE
RECOMMENDEDCURESCHEDULE
VISCOSITYMPA.S(cP)
CTE(ppm/°C)
TG(°C)%
FILLERPOT LIFEAT25°C
STORAGETEMP
HYSOL EO 1058
Provides excellent environmental and thermalprotection to encapsulated parts. This product is especiallysuited for use in protecting sensors used in harshenvironments such as automotive applications.
Heat cure
2 hours @ 140 °C 3 hours @ 125 °C
50,000 24 140 62 10 days @ 25°C @ -40 °C
HYSOL EO 7038
One component epoxy potting system, formulated toprotect sensors used in harsh environments, such asautomotive applications.
Heat3 hours @ 130°C2 hours @ 140°C
40,000 30 173 75 3 days @ 25°C -20 °C
ePoxieS – two-comPonent room temPerature cure
PRODUCT DESCRIPTION
MIx RATIO BY
WEIGHT
COLOR RECOMMENDEDCURESCHEDULE
ALTERNATE CURECYCLE
VISCOSITY mPa.s(cP)
POT LIFE AT 25°C HARDNESS
THERMALCONDUCTIVITY
W/M*C
FLAMMABILITYRATING
TEMPERATURE RANGE
SHELF LIFE
HYSOL ES1000
Two-component, long pot life, casting system. This low cost, flexible system is filled with a nonabrasive filler for machine metering/dispensing. Good thermal shock resistance and low exotherm, making it suitable for encapsulation of various components and modules.
100:90 Black 36 hours @ 25°C
3 hours @ 60°C 25,000 180
minutes 75D 0.42 94HB -25°C to 105°C
12 months
HYSOL ES1002
Two-component casting system with excellent handling properties. This low cost, flexible system is filled with a nonabrasive filler for machine metering/dispensing or regular hand mixer applications.
100:100 Black 36 hours @ 25°C
3 hours @ 60°C 19,500 60
minutes 88D 0.644 94V-0 -25°C to 105°C
12 months
HYSOL ES1900
Transparent, medium-viscosity epoxy resin formulation recommended for small potting and laminating applications where clarity and excellent structural, mechanical and electrical properties are required.
100:46 Clear 24 hours @ 25°C
2 hours @ 65°C 6,000 10 minutes 90D 0.2 None -60°C
to 125°C12
months
HYSOL ES1901
Fast-setting, toughened, medium viscosity, industrial grade epoxy adhesive. Ideal for bonding plastic, metal, glass, wood, ceramic, rubber, and masonry materials where flexibility is needed. Designed for a variety of applications such as flex circuits, cable boots, and staking fillet bonds.
100:105 Clear 24 hours @ 25°C
1 hour @ 65°C 2,400 3 minutes 55D 0.2 None -40°C
to 105°C12
months
HYSOL ES2207
Filled, resilient, low viscosity, room temperature cure epoxy potting compound. This material has excellent adhesion to many substrates, and has good surface appearance.
100:15.8 Black 24 hours @ 25°C
2 hours @ 65°C 8,800 90
minutes 75D 0.4 94V-0 -40°C to 125°C
12 months
HYSOL ES2500
Resilient, low cost, fast gelling, potting compound. Designed for easy 2 to 1 meter-mix-dispense machinery and low abrasion. This material is ideal for potting and encapsulating high volume parts.
100:29.5 Black 16 hours @ 25°C
1 hour @ 65°C 1,500 10 minutes 70D 0.288 94HB -40°C
to 105°C12
months
HYSOL STYCAST 2651MM (Catalyst 9 or 23LV)
Filled, low viscosity, general purpose, epoxy encapsulant which requires low viscosity and low abrasion. It is especially useful for machine dispensing and for parts that require post molding machining.
100:7 Black 24 hours @ 25°C
2 hours @ 65°C 14,000 45 minutes 88D 0.6 None -40°C
to 130°C12
months
HYSOL STYCAST 2850FT (Catalyst 9 or 23LV)
Two-component, thermally conductive epoxy encapsulant that can be used with a variety of catalysts. Used in the encapsulation of components which need heat dissipation and thermal shock properties.
100:3.5 Black 24 hours @ 25°C
2 hours @ 65°C 58,000 45 minutes 96D 1.25 None -40°C
to 130°C12
months
HYSOL STYCAST 2850KT (Catalyst 9 or 23LV)
Two-component, thermally conductive epoxy encapsulant designed for replacement for heat sinks in nonintegrated electrical components and assemblies.
100:2.0 Black 24 hours @ 25°C
2 hours @ 65°C 174,000 45 minutes 94D 2.68 None -40°C
to 130°C12
months
15 | Automotive Electronic
conFormal coatinGS
acrylicS
PRODUCT DESCRIPTION CURESCHEDULES VISCOSITYmPa.s(cP)OPERATING
TEMPERATURERANGE
HYSOL PC62
Conformal coating that provides environmental and mechanical protection. Toluene-free alternative with superior toughness and abrasion resistance.
45 minutes @ 75°C 50 -40°C to 125°C
urethane acrylateS
PRODUCT DESCRIPTION CURESCHEDULES VISCOSITYmPa.s(cP)OPERATING
TEMPERATURERANGE
HYSOL PC40-UMSolvent-free, low viscosity, rapid gel, UV-moisture cure, one-component conformal coating.
30 seconds UV + 3 days @ RT
500 -40°C to 135°C
urethaneS
PRODUCT DESCRIPTION CURESCHEDULES VISCOSITYmPa.s(cP)OPERATING
TEMPERATURERANGE
HYSOL PC18MFlexible, one-component, solvent-based urethane coating that may be cured at room temperature. Meets MIL-I-46058C.
2 hours @ 60°C 350 -40°C to 110°C
HYSOL ECCOCOAT UV7993
Conformal coating designed to provide rugged protection from moisture and harsh chemicals. It is compatible with industry standard solder masks, no-clean fluxes, metalization, components and substrate materials.
50 hours @ 25°Cat > 70% humidity
120 -40°C to 105°C
SiliconeS
PRODUCT DESCRIPTION CURESCHEDULES VISCOSITYmPa.s(cP)OPERATING
TEMPERATURERANGE
HYSOL ECCOCOAT SC3613
One-component, protective coating engineered to meet high reliability performance requirements for the optoelectronic/semiconductor industry. It minimizes alpha particle interactions with sensitive circuitry.
< 5 minutes @ 175°C 3,500 -40°C to 200°C
GaSKetS
PRODUCT DESCRIPTION CURESCHEDULES CHEMISTRYVISCOSITYmPa.s
(cP)SHOREAHARDNESS
LOCTITE® NUVA-SIL 5089
Used for gasketing and sealing applications. Upon exposure to sufficient UV light and/or atmospheric moisture, this product cures to form a durable, flexible rubber sealant. Typical applications include gasketing/sealing of enclosures that require a rapid curing, post-applied sealant that facilitates immediate on-part inspection.
60 seconds UV + 3 days @ RT
Alkoxy Silicone 100,000 > 25
SealantS
PRODUCT DESCRIPTION CURESCHEDULES CHEMISTRYVISCOSITYmPa.s
(cP)SHOREAHARDNESS
LOCTITE® 5210
One-component, ultra-fast-curing, non-corrosive RTV silicone designed for potting, wire tacking, selective sealing, vibration dampening and repair/rework applications on PCBs. Suited for high-volume manufacturing and is particularly effective for automotive electronics applications or other harsh environments. Fast surface cure allows material to be handled quickly after dispensing.
24 hours @ 25 °C Alkoxy Silicone N/A 48
GaSKetinG & SealantS
Automotive Electronic | 16
PRINTEDINKS
17 | Automotive Electronic
Printed inKS
TRANSPARENT CONDUCTIVEINKS
SILVERINKSBLENDABLERESISTIVE
INKSDIELECTRICINKS
LOCTITE® ECI 5000 E&C SeriesLOCTITE®
M 4100 E&C LOCTITE® M 2010 RS
MOD2 E &CLOCTITE® EDAG
1020A E&C
LOCTITE® EDAG PM 460A E&C
LOCTITE®
M 2012 RS MOD2 E&C
LOCTITE® EDAG PF 455B E&C
LOCTITE® ECI 1004 E&CLOCTITE®
M 2013 RS MOD2 E&C
LOCTITE® M 7000 A BLU E&C
LOCTITE® M 2014 RS MOD2 E&C
LOCTITE® M 2015 RS MOD2 E&C
tranSParent conductiVe inKSPRODUCT DESCRIPTION APPLICATION
VOLUMERESISTIVITY (Ohm/sq/mil)
CHEMISTRY(UV/SOLVENT/WATER-BASED)
LOCTITE® ECI 5000 E&C Series
Highly-conductive, screen-printable ink.Very low resistance with good transparency
Displays - Touch screens <60-200 Solvent
SilVer inKSPRODUCT DESCRIPTION APPLICATION
VOLUMERESISTIVITY (Ohm/sq/mil)
CHEMISTRY(UV/SOLVENT/WATER-BASED)
LOCTITE® M 4100 E&C
Thermoset conductive ink designed for potentiometers or rigid board applications.
Automotive - Rigid circuits, LED attach <0.040 Solvent
LOCTITE® EDAG PM 460A E&C
Fast - drying silver ink for flexographic or rotogravure printing. For fast-speed web printing.
RFID - High-volume silver ink applicationsAutomotive
<0.010 Solvent
LOCTITE® ECI 1004 E&C
Halogen-free, silver-filled, printable ink with fine line printing capabilities.
Displays - Touch screens <0.030 Solvent
BlendaBle reSiStiVe inKSPRODUCT DESCRIPTION APPLICATION
VOLUMERESISTIVITY (Ohm/sq/mil)
CHEMISTRY(UV/SOLVENT/WATER-BASED)
LOCTITE® M 2010 RS MOD2 E&C
Thermoset, screen-printable, rigid-silver/carbon-blended ink, blendable for specific resistance targets.
Automotive - Printed potentiometers, resistors, heaters, tribological application
10 Ohms/sq/mil ± 15% Solvent
LOCTITE® M 2012 RS MOD2 E&C
Screen - printable, thermoset, rigid carbon ink, blendable for specific resistance targets.
Automotive - Printed potentiometers, resistors, heaters, tribological applications
100 Ohms/sq/mil ± 15% Solvent
LOCTITE® M 2013 RS MOD2 E&C
Screen - printable, thermoset, rigid carbon ink, blendable for specific resistance targets.
Automotive - Printed potentiometers, resistors, heaters, tribological applications
1000 Ohms/sq/mil ± 15% Solvent
LOCTITE® M 2014 RS MOD2 E&C
Screen - printable, thermoset, rigid carbon ink, blendable for specific resistance targets.
Automotive - Printed potentiometers, resistors, heaters, tribological applications
10,000 Ohms/sq/mil ± 15% Solvent
LOCTITE® M 2015 RS MOD2 E&C
Screen - printable, thermoset, rigid carbon ink, blendable for specific resistance targets.
Automotive - Printed potentiometers, resistors, heaters, tribological applications
100,000 Ohms/sq/mil ± 15%
Solvent
dielectric inKSPRODUCT DESCRIPTION APPLICATION
VOLUMERESISTIVITY (Ohm/sq/mil)
CHEMISTRY(UV/SOLVENT/WATER-BASED)
LOCTITE® EDAG 1020A E&C
Screen - printable, UV-curable, dielectric ink for plastic film and paper substrates. Good flexibility and humidity resistance.
Consumer - Flexible circuits, desktop keyboards, notebook keyboards Automotive
<2 x 109 UV
LOCTITE® EDAG PF 455B E&C
Screen - printable, UV-curable, dielectric ink For plastic film. Excellent humidity resistance.
RFID - Flexible circuitsConsumer - Printed electronic circuitryAutomotive
<2 x 109 UV
LOCTITE® M 7000 A BLU E&C
Screen - printable, solvent-based dielectric Ink for rigid substrates.
Automotive - Compatible with M 2000 E&C series inks. Rigid circuits, LED attach
<2 x 109 Solvent
Automotive Electronic | 18
THERMALMANAGEMENTMATERIALS
19 | Automotive Electronic
thermal manaGement materialS
ADHESIVEPASTES
PHASE-CHANGE MATERIALS
THERMALGREASES
LOCTITE® ABLESTIK TE3530
LOCTITE® EIF 1000
LOCTITE®
TCP 8175M1
LOCTITE®
5404LOCTITE®
PSX 8LOCTITE®
NSWC 100
LOCTITE® PSX4000 SERIES
(D, PM, PE, LV)
LOCTITE®
TC 4
LOCTITE® ECF 1000
LOCTITE®
TC 8M
LOCTITE® TCF 1000
LOCTITE®
TG 100
adheSiVe PaSteS
PRODUCT DESCRIPTION
MILSTANDARD883,METHOD
5011 APPROVED
NASA OUTGASSINGASTM E 595-77/84/90APPROVED
CURETYPECURE
SCHEDULESVISCOSITY
(cPs)
THERMALCONDUCTIVITY
(W/mK)
VOLUME RESISTIVITY(OHM.CM)
SHELFLIFE
LOCTITE® ABLESTIK TE3530
One-component, low temperature curing, thermally conductive epoxy adhesive.
_ _ Heat 30 min. @ 100°C 60,000 2.3 1.0 x 1015 6 months @ -18°C to -25°C
LOCTITE® 5404
Self-shimming, flexible silicone adhesive for high temperature resistant applications such as ceramic boards.
_ _ Heat 10 min. @ 150°C Paste 1.0 2.9 x 1014 5 months @ 5°C
PhaSe-chanGe materialS
PRODUCT DESCRIPTION
THERMAL IMPEDANCE(°C-in.2/W@80psi)
THERMALIMPEDANCE(°C-IN.2/W@ 550 kPa)
THERMALCONDUCTIVITY
(W/mK)
PHASE CHANGE
TEMP. (°C)
VOLUME RESISTIVITY (OHM.CM)
DIELECTRIC STRENGTH
(V/MIL)THICKNESS (IN.)
LOCTITE® EIF 1000
Industry-standard electrically insulating phase change material.
0.12 0.78 0.45 60 N/A4,500
minimum0.002-0.006
LOCTITE® PSX 8
Unsupported film with superior thermal performance even at low pressure. Direct attach to heat sink at room temperature without adhesive.
0.003 0.022 3.4 45 N/A N/A 0.008
LOCTITE® PSX4000 SERIES(D, PM, PE, LV)
Repeatable phase change thermal interface material. Supplied as a paste that can be stenciled, needle dispensed, screen printed, or applied manually onto a heat sink, baseplate or other surfaces.
0.003 0.022 3.4 45 N/A N/A 0.0005-0.010+
LOCTITE® ECF 1000
Excellent thermal performance particularly at higher pressures. Typically used on RF devices and SCRs where electrical conductivity is required (silver filled).
0.003 0.022 3.14 51 2 N/A 0.004
LOCTITE® TCF 1000
Industry-standard, phase change thermal interface material. Suitable for power IGBTs, semiconductors, DCDC converters and other electrically isolated packages.
0.022 0.143 1 60 1.0 x 1012 N/A 0.0025-0.008
thermal GreaSeS
PRODUCT DESCRIPTIONTHERMAL
CONDUCTIVITY(W/mK)VOLUMERESISTIVITY
(OHM.CM)DIELECTRICSTRENGTH
(V/MIL)THICKNESS (IN.)
LOCTITE® TCP 8175M1High thermal conductivity, high temperature stability, high thixo (or non-sag), electrically insulating, self-shimming silicone thermal grease.
2.3 1.00E+15 480 7 mils spacers
LOCTITE® NSWC 100 Non-silicone, water-cleanable thermal compound. 1.4 1.9 x 1015 250 minimum 0.0005 to 0.010+
LOCTITE® TC 4Thermally conductive, high temperature silicone thermal grease.
1.5 1 x 1013 500 0.0005 to 0.010+
LOCTITE® TC 8M High thermal conductivity, high temperature thermal grease. 2.3 1 x 1013 500 0.0005 to 0.010+
LOCTITE® TG 100 Ultra-high performance thermal grease. 3.4 N/A N/A 0.0005 to 0.010+
Automotive Electronic | 20
ASSEMBLYADHESIVES
21 | Automotive Electronic
aSSemBly adheSiVeS
PaSteS FilmS
ElectricallyConductive ElectricallyConductive
ABLESTIKABLEBOND 84-1 LMISR4
HYSOL ECCOBONDCE3103WLV
HYSOL CF3550
ABLESTIKICP-3535M1
HYSOL ECCOBONDCE3520-3
ABLESTIKICP-4001
HYSOL ECCOBONDCE8500
LOCTITE® 3880
adheSiVeS PaSteS - electrically conductiVe
PRODUCT DESCRIPTION CURETYPE CURESCHEDULESVISCOSITY mPa.s(cP)
VOLUME RESISTIVITY(OHM,CM)
SHELFLIFE POT LIFE
ABLESTIK ABLEBOND 84-1LMISR4
Electrically conductive die attach adhesive has been formulated for use in high throughput, automated die attach equipment. Excellent dispensability, minimal tailing and stringing.
Heat 1 hour @ 175°C 8,000 0.000112 months @ -40°C
–
ABLESTIK ICP-3535M1
Recommended for mounting lower cost tin (Sn) finished components onto the conductive trace terminations of printed circuit boards or co-fired ceramic circuitry. Designed for a pplications with small size components, where no bleeding or wicking is tolerated. Applied by stencil printing.
Heat1 hour @ 150°C or
10 minutes @ 175°C80,000 0.004
6 months @ -40°C
–
ABLESTIK ICP-4001
Silicone paste specifically designed for applications where a high degree of flexibility is required.
Heat 35 minutes @ 140°C 40,000 0.00045 months @ -40°C
24 hours @ 25°C
HYSOL ECCOBOND CE3103WLV
Electrically conductive adhesive for thin film PV assembly with superior contact resistance stability. Low viscosity for fine line dispensing.
Heat10 minutes @
120°C or 3 minutes @ 150°C
15,000 to 25,000
0.000812 months @ -40°C
3 days @ 25°C
HYSOL ECCOBOND CE3520-3
Electrically conductive adhesive combines a high elasticity with a good adhesion on a variety of surfaces, making it suitable for applications with mismatched CTE. Used on substrate attach and heat sink bonding.
Heat60 minutes @
120°C or 30 minutes @ 150°C
73,000 0.026 months @ -18 to
-25°C
3 days @ 18°C to
25°C
HYSOL ECCOBOND CE8500
One-component, solventless, electrically conductive, low stress adhesive for mismatched CTE applications.
Heat
90 minutes @ 120°C or
40 minutes @150°C or
15 minutes @ 175°C
120,000 to 140,000
0.00024 months @ -25°C to
-18°C–
LOCTITE® 3880
Electrically conductive adhesive for bonding of metals, ceramics, rubbers and plastics with superior adhesion, electrical and thermal conductivity.
Heat10 minutes @ 125 °C 6 minutes @ 150°C 3 minutes @ 175°C
50,000 to 130,000
0.0086 months
@ 0°C–
adheSiVeS FilmS - electrically conductiVe
PRODUCT DESCRIPTION
TENSILE STRENGTH,LAPSHEAR
(PSI)
THERMALCONDUCTIVITY
(W/mK)
VOLUME RESISTIVITY (OHM.CM)
PRIMARYCURE CYCLE
STORAGELIFE
FILM THICKNESSAVAILABLE(MILS)
HYSOL CF3350
For electrical, thermal and mechanical assembly applications. The combination of adhesive properties ensures reliable RF ground plane performance.
3,400 7 0.000230 minutes
@ 150°C9 months @
5ºC2 or 4 mils (±0.5 mils)
Automotive Electronic | 22
SOLDERMATERIALS
Solder materialS
HIGH-RELIABILITY
ALLOY
HIGH-RELIABILITYPASTES
LIqUIDFLUxES COREWIRES
90ISCHalogen-
FreeHalide-
FreeVOC-Free
Halogen-Free
No-CleanHalogen
-Free
No-CleanHalide-Free
WaterWash
Halogen-Free
No-CleanWaterWash
LOCTITE® MULTICORE
HF 200
LOCTITE® MULTICORE
LF 318
LOCTITE®
MULTICOREM 300
LOCTITE®
MULTICOREMF 390HR
LOCTITE®
MULTICOREMF 210
LOCTITE®
MULTICOREHydro X20
LOCTITE®
MULTICOREC 400
LOCTITE®
MULTICOREC 502
LOCTITE®
MULTICOREHydro X
LOCTITE® MULTICORE
HF 212
LOCTITE®
MULTICOREMFR 301
LOCTITE®
MULTICOREC 511
LOCTITE® MULTICOREHF 250DP
FAILUREMECHANISMS HIGH-RELIABILITYALLOYSvs.TRADITIONALALLOYS[1][2][3]
Thermal Cycling
• Thermal cycling causes stress to build within the soldered assembly• Stress relief mechanism is crack propagation through the solder joint• 90iSC alloy gives reduced electrical failures in comparison to SnPb in both -40ºC+150ºC and -40ºC+125ºC• Under -40ºC+150ºC, 90iSC has similar electrical failure levels to SnPb at -40ºC+125ºC
Thermal Shock• Thermal shock testing is a more extreme version of thermal cycling• Failure mechanism is the same as thermal cycling, but failure occurs earlier• 90iSC alloy has outperformed SnPb and SAC alloys in thermal shock testing
Vibration• 20% of airborne failures are attributed to vibrational stress[4]
• SAC alloys have been shown to fail more frequently than SnPb alloys• 90iSC alloy returns the failure resistance performance back to SnPb standards
Drop Test
• Drop test resistance should not be compromised • 90iSC has reduced ductility over standard alloys • 90iSC alloy gives similar results to standard SAC with same failure mode• Failure mechanism is crack propagation along the intermetallic
Creep• Creep resistance at a specified temperature is directly linked to thermal cycle failure• 90iSC alloy has a similar plastic strain constant at 150ºC when compared to SnPb at 80ºC
[1] Lead-free Solders for High-Reliability Applications: High-cycle Fatigue Studies, Barry N., University of Birmingham, 2008[2] Live project seminar, Ratchev R., Berlin 2008[3] Fraunhofer[4] Designing Electronics for High Vibration and Shock, Dave S. Steinberg, Steinberg & Associates
hiGh-reliaBility alloyAbreakthroughinsolderalloydevelopment,Henkel’shighlyreliable,lead-freesolderalloy,90iSC,providessuperiorthermalcycling,thermalshock,vibrationandcreepresistancewhilemaintainingsolderabilityandvoidlevelsovertraditionalSACandSnPbsolder.Developedwithandgloballyacceptedbytheautomotiveindustry,90iSCistheworld’sleadinglead-free,RoHS-compliantsolderalloy.
Automotive Electronic | 2423 | Automotive Electronic
hiGh-reliaBility Solder PaSteS90iSChasexceptionalperformanceinhigh-reliabilityapplications.Itiscompatiblewithseverallead-freeandhalogen-freefluxsystems,ensuringadaptabilityforcustomizedmanufacturingrequirements.ThealloyiseasilyintegratedintoLOCTITE®MULTICOREHF200,LOCTITE®MULTICOREHF212,LOCTITE®MULTICOREHF250DPandLOCTITE® MULTICORE LF318fluxtechnologies.
FLUx TECHNOLOGY
ELECTRONICS ASSEMBLY MARKET
ROHSCOMPLIANT APPLICATION
HighReliability Pb-free
SolderAlloy(90iSC)
Industry Pb-freeStandardSolderAlloy(SAC305)
Printing Dispensing
Halogen-Free
LOCTITE® MULTICORE
HF 200
Handheldcomputing • • •
LOCTITE® MULTICORE
HF 212AppliancesAerospace
AutomotiveMedicalLightingDisplays
SolarWireless Datacom
Infrastructure
• • •
LOCTITE® MULTICOREHF 250DP*
• • •
Halide-FreeLOCTITE®
MULTICORE LF 318
• • • •
haloGen-Free
PRODUCT DESCRIPTION ALLOYMETAL
LOADING (%WEIGHT)
PARTICLE SIZE DISTRIBUTION
IPCTACK(g/mm2)
APPLICATIONIPC/J-STD-004B CLASSIFICATION
LOCTITE® MULTICORE HF 200
A halogen-free, no clean, high tack, low voiding Pb-free solder paste. Suitable for high-speed printing demands. Designed for small-medium size boards. Excellent abandon time and stencil work-life. Excellent fine pitch coalescence. Exceptional solderability in both air and nitrogen across a wide range of challenging surface finishes including OSP copper.
90iSC (Hi-Rel)** 96SC (SAC387) 97SC (SAC305)
88.5AGS (type 3)DAP (type 4)
DAP+ (type 4.5)2.7
Printing 50 -140mms-1 ROL0
LOCTITE® MULTICORE HF 212
A halogen-free, no clean, high tack, low voiding Pb-free solder paste. Designed for medium-large size boards. Excellent abandon time and stencil work-life. Excellent fine pitch coalescence. Exceptional solderability in both air and nitrogen across a wide range of challenging surface finishes including OSP copper. Optimized for long soak reflow.
90iSC (Hi-Rel)** 97SC (SAC305)
88.5AGS (type 3)DAP (type 4)
3.0Printing
40 -120mms-1 ROL0
LOCTITE® MULTICORE HF 250DP
A halogen-free, no clean, type 5, low voiding Pb-free solder dispensing paste. A dispensing solution for all halogen-free requirements.
96SC (SAC387) 84 KBP (type 5) 0.8Dispensing Gauge 23-27
ROL0
halide-Free
PRODUCT DESCRIPTION ALLOYMETAL
LOADING (%WEIGHT)
PARTICLE SIZE DISTRIBUTION
IPCTACK(g/mm2)
APPLICATIONIPC/J-STD-004B CLASSIFICATION
LOCTITE® MULTICORE LF 318
A halide-free, no-clean, Pb-free solder paste that has excellent humidity resistance and a broad process window for both reflow and printing. Ability to resist component movement during high-speed placement, long printer abandon times and excellent solderability over a wide range of reflow profiles in air and nitrogen reflow ovens and across a wide range of surface finishes.
90iSC (Hi-Rel)** 96SC (SAC387) 97SC (SAC305)
88.584
AGS (type 3) 1.8
Printing 25-150mms-1 DispensingGauge 23
ROL0
* All Electronics Assembly Market** High Reliability.
25 | Automotive Electronic
liquid FluxeSHenkel’sliquidfluxformulationsdeliversolutionsformultiplewavesolderingprocessesaswellasforreworkandtechnologybuildprocessessuchaslasersoldering.No-clean,low-residue,VOC-freeandhalogen-freefluxesareallpartofacomprehensivefluxportfoliodesignedtoaccommodatevaryingrequirements.
cored wireSHenkel’sLOCTITE®MULTICOREbrandcoredwireutilizesaward-winningmultiplefluxcoretechnologytodeliverevenfluxdistributionthroughoutthesolderwire.Thefast-wettingmaterialoffersexcellentsolderjointreliabilityandisavailableintraditionaltin-lead,lead-freeandhalogen-freeformulations.
PRODUCT DESCRIPTIONSOLID
CONTENT(%)ACIDVALUE (mgKOH/g)
APPLICATIONIPC/J-STD-004BCLASSIFICATION
Voc-Free haloGen-FreeLOCTITE® MULTICORE MF 300
General purpose, VOC-free (water-based), no-clean, halogen-free and resin-free flux with special formulation to minimize solder balling. Compatible with lead-free processes.
4.6 37 Spray/Foam ORM0
no-clean haloGen-FreeLOCTITE® MULTICORE MF 390HR
Halogen-free, liquid flux designed for exceptional through-hole fill and recommended for automotive electronics and general electrical soldering applications.
6.0 20-25 Spray/Foam ROL0
no-clean halide-Free
LOCTITE® MULTICORE MF 210
No clean, resin-free, halide-free liquid flux designed for surfaces with poor solderability. Recommended for consumer electronics and general electrical soldering applications, particularly where high throughput is desirable.
2.9 22.5 Spray/Foam ORM0
LOCTITE® MULTICORE MFR 301
Higher solids, halide-free flux for better wetting on reduced solderability surfaces and to minimize bridging on complex geometries. Fully Pb-free and dual wave compatible. Solvent-based flux may be thinned with IPA.
6.0 40 Spray/Foam ROM0
water waSh
PRODUCT DESCRIPTIONSOLID
CONTENT(%)ACIDVALUE (mgKOH/g)
APPLICATIONIPC/J-STD-004BCLASSIFICATION
LOCTITE® MULTICORE Hydro X20
Water soluble flux is formulated for use on electronic assemblies designe d for water cleaning. Hydro X20 will solder copper, assemblies-designed, nickel and mild steel efficiently.
2.0 24 Spray/Foam ORH1
PRODUCT DESCRIPTIONFLUx CONTENTAPPROxIMATE (%BYWEIGHT)
ALLOY (SnPb)
ALLOY (Pb-Free)
IPC/J-STD-004BCLASSIFICATION
haloGen-FreeLOCTITE® MULTICORE C 400
Halogen-free, no-clean, clear residue, cored solder wire with increased flux content for improved wetting on challenging surfaces.
2.2Sn60Sn62Sn63
96SC (SAC387)97SC (SAC305)
99C (SnCu)ROL0
no-cleanLOCTITE® MULTICORE C 502
No-clean, clear residue, cored solder wire with medium activity flux with good wetting on difficult substrates.
2.7Sn60Sn62Sn63
96SC (SAC387)97SC (SAC305)
99C (SnCu)ROM1
LOCTITE® MULTICORE C 511
No-clean, amber residue, heat stable cored solder wire. Good wetting on difficult substrates.
2.7Sn60Sn62Sn63
96SC (SAC387)97SC (SAC305)
99C (SnCu)ROM1
water waShLOCTITE® MULTICORE Hydro X
High activity, water washable, flux-cored solder wire with excellent wetting on difficult substrates.
2.0Sn60Sn62Sn63
96SC (SAC387)97SC (SAC305)
99C (SnCu)ORH1
Automotive Electronic | 26
27 | Automotive Electronic
CHIPONBOARD(COB)ENCAPSULANTS
GloB toPS - uV cure
PRODUCT DESCRIPTION CURETYPERECOMMENDED CURESCHEDULES
VISCOSITYmPa.s(cP)
Tg(ºC) POT LIFE STORAGETEMP.
UV 9052
One component, dual cure (UV & moisture) adhesive designed as an encapsulant for sensitive electronic components. XUV 9052 has excellent resistance to a variety of chemicals and fluids, making it ideal for encapsulating components that may be exposed to moisture, automotive fluids and/or harsh chemicals.
UV/Moisture
300 W/in, 5-10 ss,
0.5-1 Joules (medium pressure
mercury vapor lamp)
4,1000 6424 hours @ 25°C
-20ºC
UV 9060F
One component, dual cure (UV & moisture) adhesive designed as an encapsulant for sensitive electroniccomponents. UV 9060F has excellent resistance to a variety of chemicals and fluids, and contains a fluorescent tracer for easy identification under UV black light.
UV/moisture300 W/in,
5-25 ss11,000 75 - 5°C
Automotive Electronic | 28
PacKaGe on Board - caPillary FlowS - non-reworKaBle
PRODUCT DESCRIPTIONRECOMMENDEDCURE
SCHEDULEVISCOSITY mPa.s(cP)
CTE (ppm/°C)
Tg POT LIFESTORAGETEMP.
HYSOL E1172A Fast cure at low temp high Tg underfill for temperature stable applications. Qualified for automotive applications.
3 minutes @ 135°C or 3 minutes @ 150°C
17,000 27 13548 hours @ 25°C
-40°C
HYSOL E1216MPartially filled (10 μm filler) non-reworkable, fast flow underfill. Qualified for automotiveapplications.
3.5 minutes @ 150ºC 3,252 40 1154 days @ 25 ºC
-20ºC
HYSOL FP4531
Originally designed as flip-chip underfill, proven workability at high temperature conditions. Qualified for automotive applications.
7 minutes @ 160°C 10,000 28 16124 hours @ 25°C
-40°C
UNDERFILLS
underFillS
CAPILLARYFLOWS
HYSOL E1172A
HYSOL E1216M
HYSOL FP4531
chiP on Board (coB)encaPSulantS
GLOBTOPS
UF 9052
UV 9060F
29 | Automotive Electronic
diSPenSe adheSiVeS
PRODUCT DESCRIPTION COLOR CURESCHEDULES APPLICATIONSTORAGE
TEMP SHELFLIFE
LOCTITE® 3621
For the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited for applications where very high dispense speeds, high dot profile, high wet strength and good electrical characteristics are required. Suited where dispense speeds greater than 35,000 dots/h are required.
Red 90 seconds @ 150°C
3 - 4 minutes @ 125°C
Very high speed syringe dispense
47,000 DPH capable
2°C - 8°C 10 months
Screen Print/Pin tranSFer adheSiVeS
PRODUCT DESCRIPTION COLOR CURESCHEDULES APPLICATIONSTORAGE
TEMP SHELFLIFE
LOCTITE® 3616
Designed for the bonding of surface mounted devices to printed circuit boards prior to wave soldering. Suited to printing a range of dot heights with one stencil thickness and where high wet strength characteristics, and high print speeds are required.
Red90 seconds @ 150°C
2 – 3 minutes @ 125°C
Stencil print (60 - 150 mm/s)
2°C – 8°C 9 months
SURFACE MOUNT ADHESIVES
SurFace mount adheSiVeS
DISPENSEADHESIVESSCREENPRINT/PIN
TRANSFERADHESIVES
LOCTITE® 3621 LOCTITE® 3616
Automotive Electronic | 30
HENKELELECTRONICSMATERIALS
Our worldwide service, manufacturing, sales and product development network delivers the global footprint that enables your company to be competitive – regardless of your requirements or location.
california, uSa Henkel Electronics
Headquarters
Withqualityandreliabilityasthefoundationofeveryformulation,Henkelmaterialsareanintegralpartofmanufacturingoperationsaroundtheglobe,servingcustomersinvariouselectronicsassemblymarkets:
•Handheld
• Appliance
•DigitalPrinting
•Computing
• Aerospace
• Automotive
•Medical
•Opto-electronic
•Lighting
•Displays
• Solar
•WirelessDatacomInfrastructure
americaSheadquarterS:united StateSHenkel Electronic Materials LLC14000 Jamboree RoadIrvine, CA 92606, USATel: +1.714.368.8000Tel: +1.800.562.8483Customer Support: +1.888.943.6535Fax: +1.714.368.2265
Henkel Electronic Materials LLC20021 Susana RoadRancho Dominguez, CA 90221, USATel: +1.310.764.4600Fax: +1.310.605.2274
BraZilHenkel BrazilAv. Prof. Vernon Krieble, 9106690-250 Itapevi,Sao Paulo, BrazilTel: +55.11.4143.7000
euroPeBelGiumHenkel Electronics Materials (Belgium)N.V. Nijverheidsstraat 7 B-2260Westerlo, BelgiumTel: +32.1457.5611Fax: +32.1458.5530
aSia-PaciFicchinaNo. 332 Meigui South RoadWaiGaoQiao Free Trade ZoneShanghai 200131, P.R. ChinaTel:+86.21.3898.4800Fax:+86.21.5048.4169
Henkel Huawei Electronics Co., Ltd.Songtiao Industrial Park LianyungangJiangsu Province 222006, ChinaTel: +86.518.8515.5342Fax: +86.518.8515.3801
JaPanHenkel Japan Ltd.27-7, Shin Isogo-choIsogo-ku Yokohama, 235-0017JapanTel: +81.45.286.0184
KoreaHenkel Technologies (Korea) Ltd.8th FloorDae Ryung Techno Town II569-21 Gasan-dong,Geumcheon-gu, Seoul 153-771KoreaTel: +82.2.6675.8000
malaySiaHenkel (Malaysia) Sdn BhdLot 973, Jalan Kampung Baru HicomPersiaran Tengku Ampuan,Lion Industrial ParkSection 26, 40400 Shah AlamSelangor Darul EhsanTel: +603.5192.6200Fax: +603.5192.6211
SinGaPore 401, Commonwealth Drive #03-01/02, Haw Par Techno Centre, Singapore 149598 Tel: +65.6266.0100
thailand Centralworld, 35th Floor, 999/9 Rama 1 Road, Patumwan, Bangkok, 10330 Thailand Tel: +66.2.209.8000
All marks used above are trademarks and/or registered trademarks of Henkel and/or its affiliates in the U.S., Germany and elsewhere. © Henkel Corporation, 2014. All rights reserved. APH-AE-220 (02/2014)
AcrosstheBoard,AroundtheGlobe.www.henkel.com/electronics
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