A “BTeV” Hybrid Pixel Telescope for MTest
David Christian
May 4, 2007
Outline
• Review of hybrid pixel detectors, status of “BTeV” R&D.
• Conceptual design of pixel telescope.
• MTest assets.
• First crack at task list; items for further discussion.
What is a Hybrid Pixel Detector?
A Pixel
50 µm
200 µm
250 µm 400
µm
A Hybrid - a 2-D array of Pixels
“8-chip” Hybrid
Sensor
The Sensor
+-+-+
-+
-+
-+
-+
-+
-+
-+
-+-+ -+Holes
Electrons
P P P P P P P P P P P P P P P P
N-type bulk
N+ N+ N+ N+
P-spray isolation
SiO2 passivation
Contact metallization
V
+
Flash Latch to BinaryEncoder
Thermometer
Thresholds (Vth1-Vth7)
Sensor
Command Interpreter
00 - 01 - 10 - 11 -
idleresetoutputlisten
HFastORRFastOR Throttle4 pairs of
Command Lines
Kill
ADC
RowAddress
Read ClockRead Reset
Token InToken Reset
Token Out
Threshold (Vth0)Vref
Resets
BusController-
+
Vdda
Test
Inject
Vfb2
Vfb
Iff
Ibp1 Ibb Ibp2
Preamp 2nd stage+disc
ADC Kill/inject
ADCencoder
Digital interface
The readout IC
FPIX2 developed for BTeV
DebuggingOutputs
128x22Pixel array
End-of-ColumnLogic
Data OutputInterface
CommandInterface
Registersand DAC’s
LVDS Driversand I/O pads
Pixel array+ End-of-ColumnLogic + = “Core”
Internal bondpads for Chip ID
Chiphit available for use in trigger
Hybrid Pixel R&D After BTeV
• As of two years ago:– FNAL-designed readout chip had two minor fatal
flaws.– No system demonstration had yet been done.
• An “extended closeout” R&D program was approved– 1 more chip submission.– R&D refocused on ILC.– Two system tests approved:
• Telescope for the forward direction of PHENIX (at RHIC)• Test beam telescope
Sensor & FPIX2.1 wafers
Sensor wafers produced for PHENIX by CiS (LANL has agreed to donate
the x4 sensors for use in MTest)
FPIX2.1 fabricated on wafer with “TripT” for D0; fatal flaws fixed; 11 wafers
purchased by LANL for PHENIX, 11 by FNAL to support R&D - 2 required for
MTest telescope.
Sensors & ROCs probed – yield is high
260945-12 sensor 06 11_06 UNM
0
500
1000
1500
2000
2500
3000
0 50 100 150 200 250 300 350 400
V (volts)
I (n
A)
Series1
Typical FPIX2.1 wafer map
Typical sensor IV curve
Hybridization – solder bump bonding done by VTT (Finland)
X-ray made at FCC
VTT bump-deposition process flow
15 Pre-production PHENIX (x8) hybrids delivered 12 April 2007
First 10 x4 hybrids being assembled at VTT this week.
Half-plane = three 1x4 modulesread out by 1 FPGA
(collaboration with Columbia U.)
Station = two half-planesoffset by active area of sensor
2 stations upstream of DUT & 2-4 downstream
(precision x & precision y)
New test beam telescope
4x HDI
PCB
Interposer
SensorReadout chips
Glue HDI
TPG
Concept for pixel plane
MT6-A1
MT6-A1 Assets
• Climate controlled hut.• Aluminum table on rails allows entire setup to be
removed from beam.• Dark box with feed throughs for signals, power, &
cooling fluid.• Remotely controlled motors determine (x,y) position
of both ends of box.• Local chiller provides closed loop cooling system• CAEN power system can provide LV & sensor bias
(“HV”).• Plenty of quiet power is available.
Climate Controlled Hut
Table on rails
Feed Through Boards
Moveable Pixel Box
Remotely Controlled
x-y Positioners
Chiller
Old picture of pixel box interior
MT6-A1 task list
• Status of CAEN & motor control system?
• Modify box mechanicals– Support 6x4 stations– Stations positioned to minimize MS error at
DUT– Flexible DUT station (CMS upgrade didn’t
really work out)
Pixel telescope task list
• x4 HDI• x4 plane/station design (mechanical and
electrical)• DAQ• Integration of telescope data with:
– DUT in pixel box– data from other MTest detectors (if
necessary)
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