7/29/2019 90nm technology
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7/29/2019 90nm technology
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Session Title p 2
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7/29/2019 90nm technology
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Session Title p 3
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7/29/2019 90nm technology
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Session Title p 4
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7/29/2019 90nm technology
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7/29/2019 90nm technology
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Session Title p 6
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7/29/2019 90nm technology
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Session Title p 7
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7/29/2019 90nm technology
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Session Title p 8
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Steiner tree:minimum length tree
Global routing: Set of steiner treesminimizing total wire length andcongestion.
Global routing computes the topology of each net on a coarse grid(routing bin). The detailed routing (track assignment) is not know.
Primary goal is to compute wire length..
ÎGlobal routing can predict wire length but cannot predict coupling effect.
7/29/2019 90nm technology
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Session Title p 9
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Variation is +/- 30% for 1MMwire and +80%/-60% for 3MMwires.
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Session Title p 10
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– How can we get early access to detail routing.
– How can we iterate fast enough when detailed routing is required.
7/29/2019 90nm technology
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Session Title p 11
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7/29/2019 90nm technology
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Session Title p 12
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7/29/2019 90nm technology
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Session Title p 13
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–
Delay calculator: computes delay between gate output and gateinputs based on extracted RCs.
– Static Timing Analysis engine: propagate the delay in the cells andin the interconnect to check for timing violations.
QP'&VXFKDV6LJQDO6WRUPWDNHVLQWRDFFRXQW
– IR Drop
– Cross talk impact on delay.
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7/29/2019 90nm technology
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Session Title p 14
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7/29/2019 90nm technology
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Session Title p 16
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7/29/2019 90nm technology
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Session Title p 17
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– Gates dominate delay. Wire delay can be estimated using wire load model. Synthesisand place and route are two different steps.
QP– Wire delay starts dominating overall delay. Better accuracy is needed in wire delay
estimation:– Placement and Synthesis merge (Physical Compiler, PKS) at the block level
– Floorplanner to estimate top level wires.
QPDQGEHORZ– Wire delay dominates the design. Wire delay depends on cross couplingÎPerformance is unknown before routing.
– Introduction of tools and flow that generate wires as soon as possible (“time to wire”).
7/29/2019 90nm technology
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Session Title p 18
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Equivalencechecking
Simulation
Simulation
Extraction
R.C
Timing Verification
Wire Load Models
7/29/2019 90nm technology
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Session Title p 21
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Design methodology must minimize time to wire and full chip iteration time: Continuousconvergence methodology.
In nanometer designphysical synthesis isused only on thoseblocks that full chipdetailed routingidentifies as notmeeting timing.
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Session Title p 22
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Session Title p 23
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7/29/2019 90nm technology
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Session Title p 26
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Performance
– Crosstalk
– IR Drop
Reliability
– Hot Electron
– Electromigration
– Wire Self Heat
Manufacturability
– Process Antenna Effect (PAE)
– Metal Density
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7/29/2019 90nm technology
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Session Title p 29
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Aggressor & Victim Relationship
6SDWLDO– Proximity and Width of conductors
(Capacitance and resistance)
– Coupling location distance from drivers
Failures Caused
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–Signal slews and time of switch
7/29/2019 90nm technology
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Session Title p 30
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Analysis Requirements– Driver Strength
–
Routing topology and RC’s– Timing Analysis to identify slew relationship and edge alignment
– Victims’ net receiver noise margin
Avoidance– Separate victim from Aggressor
– Shield Aggressor
– Reduce victim slew, Increase aggressor slew
– Change Temporal relationship
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Session Title p 32
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– IR drop in power grid will create variations in delay across the chip
– Performance of a chip roughly varies by 7-9% when vdd is varied by 10%
– Affect clock skew in the clock network
Simple Definition:
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7/29/2019 90nm technology
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Session Title p 37
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Analysis Requirements
– Characterization of cells’ current consumption
– Power supply network RC’s extraction
– Wire DC and peak current densities based on the current consumption of each
cell and the resistance of the power grid.
– DC current densities are compared to the process limits.
Avoidance
– General estimation of power network using DC or average DC current drawn
per cell and row utilization.
– Network resistance reduction (adding via cuts and increasing or tapering wire
width).
7/29/2019 90nm technology
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Session Title p 41
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Analysis Requirements
– Metal Area to Gate Area ratio
– Metal Side Area to Gate Area ratio– Layer Only Vs Cumulative
Avoidance
– Layer hoping
– Diode insertion during routing
– Diode embedded in cell
– Buffer/Repeater insertion right on the pin inside the block
–
Force pin assignment to last metal on critical nets.
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