7/27/2019 1199 James Knight
1/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Knigh ts Techno logy
Shrinking the Design for Manufacturing Gap-A Semiconductor Yield Management Perspective
Jim Kramer
7/27/2019 1199 James Knight
2/41
7/27/2019 1199 James Knight
3/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
FEI Serves a Broad Range of Markets
4%
42%
Semiconductor
Data Storage
Research & Ind
($ Millions)
2004 Revenue
$465.7 Mill ion
2003 Revenue
$360.1 Mill ion
A proven business model:
Growth in the upturns, buoyancy in the downturns
49%
9%
42%
45%51%
jc6
7/27/2019 1199 James Knight
4/41
Slide 3
jc6 need pie chart for 6 months of 2003jchiafery, 8/1/2003
7/27/2019 1199 James Knight
5/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
The Leader in Tools for Nanotechnology
Focused Ion Beams (FIB), Scanning Electron Microscopes (SEM), Transmission ElectronMicroscopes (TEM), Laboratory, In-Fab DualBeams, Merlin , YieldManager
7/27/2019 1199 James Knight
6/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
FEI Tools Improve Customer Yields
Defect Analysis inDefect Analysis inlaboratories and inlaboratories and in fabsfabs
InIn--fab metrologyfab metrology
7/27/2019 1199 James Knight
7/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Knights History
1987: Knights Technology founded
Excalibur (Microprobe station with CAD Navigation)
Merlin CAD Navigation and MegaLab
1994: New Products
YieldManager (in cooperation with Sematech)
1997: Knights Technology bought by Electroglas
New Products: YM-LCD, YM-Mask, LogicMap, Bondtool,
Interactive Schematic
July 16, 2003: Knights/EGsoft division acquired by FEI
New division Knights Technology
7/27/2019 1199 James Knight
8/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Leader in Design-For-Manufacturing Solutions
As technology nodes shrink(130nm->90nm->65nm->45nm)
System defectswill have a larger affect thanrandom defects
Examples of system defects: Process variation Signal integrity issues Design integrity issues
This is driving the Design, Mfg and FA closer together Key design constraints fed-forward into
manufacturing and test processes Feed system defect issues back to design
Yield learning
FABFAB EDAEDA
LABLAB
7/27/2019 1199 James Knight
9/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Knights Market Position/Overview
CAD - Navigation
Merlins Framework
MegaLab
LogicMap
Product Engineering WB
Failure Analysis Tools
YieldManager
SPAR
DataMining
APC
Predictive Yield
Chip Traceability
Factory
Host
IC Design
Schematic &Netlist
Layout &Verification
ATPG &Simulation
IC Manufacturing
ProcessData
Defect Data &Wafer Maps
Test &Assembly
FIB SEM DB TEM EMMI
FAB Analysis Tools
Metrology. Test, Inspection
7/27/2019 1199 James Knight
10/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
What is Yield Management?
Yield Management within the semiconductor industry is the
practice of collecting, managing, and analyzing all relevantprocess, equipment, metrology, defect, final test, parametric, and
bitmap data at batch, lot, wafer, die, and subdie levels to find the
source(s) contributing to a random and/or systematic relatedproblems.
Random Yield Loss- Die loss associated with particles andsurface level defects. Usually unpredictable and random in nature.
Systematic Yield Loss- Die loss associated with process and designIndused problems such as over etched, partially filled vias, exposed
contacts, etc. Usually predictable in nature (once detected).
YE = 1- ( YS + YR )
7/27/2019 1199 James Knight
11/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Implementing YMS solutions to shift the Yield Curve- different strategies for dif ferent phases
Time
Yield
Phase 1Pilot
Phase 2Ramp
Phase 3Maturity
YE Product A
Product B
YE = 1- ( YS + YR )
Incremental Yield
YI
Shif t ing the Yield Curve
YS Focus YRFocus
7/27/2019 1199 James Knight
12/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Why is YMS Important?
Improves Yield Ramp time
Improves Profitability
Reduces Time to Market
Improves Design for Manufacturability
Provides a metric to measure fab to fab performance
A true YMS Initiative Forces a fab to work as a Cohesive Unitand improve efficiencies
7/27/2019 1199 James Knight
13/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Cummulative Revenue Gained by Increasing
Learning Rates from Current LR (0%)
0
2040
60
80
100
120
140
160
180
1 2 3 4 5 6 7 8 9 10 11 12 13
Months
Revenue($Millions
)
3% LR
5% LR
($60/die, 200 die/wafer, 20K wafers/month)
Logic
Learning Rate LR= 1 (Dn / D0) x (1/n)
YMS ROI Model- Logic
7/27/2019 1199 James Knight
14/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Cummulative Revenue Gained by Increasing Learning
Rates from Current LR (0%)
0
20
40
60
80
100
120
140
160
1 2 3 4 5 6 7 8 9 10 11 12 13
Months
Revenue($Million
s)
1% LR
3% LR
($30/die, 300 die/wafer, 40,000 wafers/month)
Memory
Learning Rate LR= 1 (Dn / D0) x (1/n)
YMS ROI Model- Memory
7/27/2019 1199 James Knight
15/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Equipment and Application Interfaces
SPC Process MonitoringSupervisory Control
Cell Control APC YMS
Manuf Execution Systems
Enterprise
CIM Triangle- Semiconductor
Jim Kramer, 12/28/01
Grapheq Stationworks FAbuilder Autoshell FactoryLink
Data Acquisition HSMS SECS GEM Other
SAS Cornerstone
RS1
Interlution FactoryLink
Wonderware
Cellworks
Triant
Adventa
KLA
YieldDynamics
Applied Materials PRI Brooks
Cellworks KLA
IDS HPL
Yield Dynamics
FactoryLink
Honeywell
SEMY
LabView
Knights
Data Collaboration (Running a Business)
MES (Running a Fab)
Running a Tool/Process
Monitoring
Data
7/27/2019 1199 James Knight
16/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
On Line SPCIdentify and Select
FABWorks/
MBX Bus
Defect Density
(Yield Manager,
Knights)Identify and Select
Off Line SPC
SystemIdentify and Select
Optional Review
StationIdentify and Select
Defect Data
EDA DatabaseIdentify and Select
APC Run 2 RunIdentify and Select
Defec
tData
Stationworks/
Kernel/EI/Tools
ToolData/MetrologyData
ToolandRecipe
ParameterChanges
APC Fault Detection(Regensburg Fault
Detection System,FDC, Oracle)
Identify and Select
Tool&MetrologyData
FaultEventMessages
FDCD
atafor
Stora
geand
Future
analy
sis
Resultsofcalulations
DefectData
ToolandM
etrologyD
ata
LotEquipmentand
MetrologyData
Outofcontrole
ventdata
FaultD
etectio
nandDefectD
ata
Fault
Dete
ctionN
otifi
catio
nandClassifi
catio
n
HistoricalToolandMetrologyDataforanalysis
APCDataforStorageandFutureanalysis
ToolandMetrologyData(maybethroughEDA
DB)
Wafer MapIdentify and Select
Param
etric
,Bin
,an
dlim
it
data
Metrology ToolsDefect
Data
New Vision APCfor Lithography
Controldata
LithoData
Fab Wide YMS Complex Data Flow Diagram
7/27/2019 1199 James Knight
17/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Typical Defect Data Flow Diagram
3-
Orobot
1-
KLA
2125
KNIGHTSDB
HP 2000
Oracle
1-VIPER
4- Leica
Review
1-
Hitachi
SEM
1-
JEOL
SEM
Data
Warehouse
Oracle-HP
MES System
Test
Archive
Viewer
VMS
TAS DB
VMS
Advantest
Testers
Image DB
Oracle
SEIKO
SEM
1-Inspec8510
Klarity
Seiko Format
KLARF
Format
TCPIP
Extracts
Notes:
Orbot to KLARF conversion ScriptSeiko to KLARF conversion Script
Temp script to copy data to PAM DB
Tester file loads XY coordinate data . Knights to
normalize data during load time
Images on File Server
40 Concurrent User license-Knights
Unlimited users for images
Plan to implement Leica offline ADC
DMS System
Lot and Wafer Level
and Equipment data
TCPIP
KLARF
KLARF
KLARF
KLARF
7/27/2019 1199 James Knight
18/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Automated,Intelligent,Open-Architecture,Yield Management software
System.
Enables Fab Engineers to Collect, Correlate and Analyze
Defect, Images, Review, Bitmap, and Binsort Data
YieldManager
7/27/2019 1199 James Knight
19/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Wafer Map
A wafer map gives the stacked view of wafer(s) across inspectionstep(s) for defect analysis.
Features
Legend Settings
Select By Box/Die
Zoom
Chart Correlation
Image Correlation
Export To KLA / Export ForReview
Reclassify defect(s)
Repartition
Sampling Defects
Grid for Multiple Products
Defect Density Map
7/27/2019 1199 James Knight
20/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Die Map
Allows the user to view the defects on wafer(s) stacked on single die / vertical / horizontal.Enables Chip zone analysis
Features
Legend
Chip Zone AnalysisCustomized DieMap
Zoom In/Out
Image Correlation
7/27/2019 1199 James Knight
21/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Image Zoom In / Out
Zoom In on a Image
7/27/2019 1199 James Knight
22/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Bin Map
This type of mapping offers a way of looking at a spatial distribution of
wafer sort data by bin across wafer(s) and can be used to get a graphicalview of the weight of defectivity occurrences at different wafer location.
Features
Legend Settings
Summary
Defect Overlay
Show Counts OnStacked Map
Zoom
Color Settings
Stacked Bin
Map
Single Bin Map
7/27/2019 1199 James Knight
23/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
- Next Generation in CAD Navigation Software Solutions.
Camelot
7/27/2019 1199 James Knight
24/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
The Industry Standard in CAD
Navigation
Netlist
CircuitSchematic
Layout
MicroscopeImage
Failure Analysis, DesignVerification, Low YieldAnalysis
Central Databaselinks chipdesign & FA
Layout, netlist, schematic Images with thelayout
Equipment-independentsolutions
Interfaces to variousEDA
systems (incl. Cadence,Mentor, Synopsis, Avant!)
7/27/2019 1199 James Knight
25/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Multiple Traces and Crossmap
Every trace gets added as a Trace Layerin the legend window
Each trace can be assigned individualcolors & patterns
Trace property dialog displays layername with clipboard support for easycopy/paste between applications
Polygons present tab lists polygons for
the trace sorted by layer name
Trace can be filtered by layer visibility &other filter criteria set in options
Signal Name displayed as a tool tip inlegend & also the status bar when signalis traced
Option to display trace in Birds view for
quick navigation
Trace/Crossmap in context menus forquick access without changingapplication mode
7/27/2019 1199 James Knight
26/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Multiple Image Overlay
Supports popular image
formats (tiff, bmp, gif,jpg,)
Overlay of multipleimages simultaneously.
Per image 3 point
alignment.
Possibility to show/hide
images
Layout transformations
(Rotate/Mirror) apply toImages also.
Replace Image retaining
alignment of previousimage.
7/27/2019 1199 James Knight
27/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Interactive Schematic & Netview
7/27/2019 1199 James Knight
28/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
LogicMap Software Solut ion
-First Commercial ly avai lable defect correlat ion too lfor Logic Devices
7/27/2019 1199 James Knight
29/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
LogicMap integrates in-line defect inspection data
with a set of suspected signals and gates generated
by the scan diagnostics flow.
It is similar to memorybitmapping, but forlogicdevices.
Electrical failures are localized into a relatively small
physical trace on the die.
What is Logic Map?
7/27/2019 1199 James Knight
30/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Identifies the precise circuit trace on failing chips
Overlays failing trace with in-line defect inspection data
Facilitates FA without the need for packaging or probing
Quickly determines systematic fail modes
Provides real time and statistically meaningful yield
fallout and design sensitivity data
LogicMap Features
7/27/2019 1199 James Knight
31/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
KLA
ESDA
1
Testers generate datalogs
for each die tested. Some
fraction of these die arefunctional enough for scan test.
Tester Generated Files Prior to simulating the failure of the dielevel datalogs in question, the datalogs
are be translated into FastScan or TetraMaxformat.
Knights
DesignDatabase
Oracle system loading
defect data and LogicMapdata for physical overlay.
LogicMap
UNIX DB
WinNT PCKnightsDefect
Overlay
2
4
3
LogicMap File Translation Process
FastScan UNIX Server
Knights
Merlin
The Knights Merlin LogicMap translatorwill convert incoming FastScan data intostandard defect data format. This is
a logical to physical translation. (Net toPoly, Poly to Klarf)
If desired custom file
exports are availablefrom each client PC.
Knights YieldManager client visualization
include wafermaps, charts, layout.
5 Data Sharing
Design Netlist
And Layout (GDS2)
Inpection
Tool
Klarf
Klarf
7/27/2019 1199 James Knight
32/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Defects with product correlated hits can then be exportedback to the Merlin software for FIB navigation and de-processing.
7/27/2019 1199 James Knight
33/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Legend represents# of failed die
in grid
Hot spots or areasof high fail intensity
are located.These can then besent to Merlin for
analysis
Intensity Map
LogicMap Facilitates FA
7/27/2019 1199 James Knight
34/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Why we are working together?Synergy of technolog ies measurably increases
value To improve both the efficiency and accuracy of the FA flow
Utilize each companys unique strengths; Cadence diagnostic
technology in conjunction with Knights can effectively drive SEM orFIB equipment
Shorten the time to identify yield limiters
Utilize each companys unique strengths; take inline data from
Knights Yield Manager to seed the diagnostic engine to improvefault modeling accuracy and lessen runtime
Better determine sources of yield loss
Utilize each companys unique strengths; Correlate volumediagnostic data to bin-sort yield loss contributors
7/27/2019 1199 James Knight
35/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Significant synergy existsHigh value in in tegrated f lows
Merlin
Defect
RevBin SortImage
BitmapParametricMES
ReviewTool
ATPGScan Vectors
Netlist
FIB , SemEquipment
Other Synergistic
Applications
Failed Nets
Encounter Diagnostics Volume
Encounter Diagnostics Precision
Diagnostics
Database
X Y
locations
Yield
Manager
FIB , SemEquipment
CadenceKnights TechnologyFEIOther companiesSynergistic opportunities
Key ToolsEquipment
ATPGScan Vectors
LogicMap
ATEData
Netlist Layout
7/27/2019 1199 James Knight
36/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Potential Application #1Improv e ef f ic iency & accu racy of the FA f low
Encounter Diagnostics -PrecisionCallout of failing nets
LogicMap
Conversion to X-Y
Silicon Wafer
Merlin
Database
Equipment control
Sem & FIB
Callouts typically 80% accurate so FAprocess will be more efficient
7/27/2019 1199 James Knight
37/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Potential Application #2Improve ident i f icat ion & resolut ion of y ield
l imiters
LogicMap
Failed Nets
Encounter Diagnostics - Volume
YieldManager
KLARF
Diagnostics
Database
Defect
Matches
Silicon Wafer
Sem & FIB
Low correlated X Y
Merlin
1
Pass inline data to diagnosticsengine
Inline data improvesefficiency of diagnosticsengine by limiting faultsimulationInline data can help buildmore accurate fault models(opens, bridges)
Utilize inline and
diagnostic dataCallout and inline can beanalyzed to eliminate FA incase of high correlation2
7/27/2019 1199 James Knight
38/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Potential Application #3In tensi ty map high l ights d efects to d r ive FA
Failed Nets
Encounter Diagnostics
Diagnostics
Database
Silicon Wafer
Sem & FIB
Correlated X Y
LogicMapIntensity map
Merlin
Legend represents# of failed die in grid
Callouts map can guide FA processwill be more accurate
7/27/2019 1199 James Knight
39/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
DetailsDiagno st ic c allout l ink age
BLK T1ET
Callouts ultimately mappedto net to FA image
Callouts ultimately mappedto net to inline image
7/27/2019 1199 James Knight
40/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Potential Application #4Determine top yield l imiters
Top Yield loss ComponentsCellNetInstance
Encounter Diagnostics - Volume YieldManager
Diagnostics
Database
Bin Sort data
What components are themajor source of yield loss
7/27/2019 1199 James Knight
41/41
CADENCE AND KNIGHTS TECHNOLOGY CONFIDENTIAL
Summary of Benefits
An integrated Design to Fab to FA Yield Management
initiative provides for:
Improves Design for Manufacturability thus:
Improving Yield Ramp time Reduces Time to Market
Improves Profitability
Provides a metric to measure Fab to Fab performance
A true integrated YMS Initiative Forces a Fab to work withDesign and FA as a Cohesive Unit thus improving efficiencies
Top Related