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NOVOLACRESINS
EPOXYDOW
RESINSNOVOLAC
DOW
HIGH-TEMPERATURE, HIGH-PERFORMANCE
EPOXY RESINS
EPOXY
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INTRODUCTION . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
APPLICATIONS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 3
TYPICAL PROPERTIES . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Viscosity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Specific Gravity . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
FILLERS AND MODIFIERS . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 7
CURING AGENTS AND CURE SCHEDULES . . . . . . . . . . . . . . . . . 8
CURED RESIN PERFORMANCE DATA . . . . . . . . . . . . . . . . . . . . 11
Test Methods . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
Therm al Proper ties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 12
Physical Proper ties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 14
Electr ical Proper ties . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Chem ical Resistance . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 18
Mechanical Properties at Elevated Temperaturesand When Wet . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 20
Accelerated Moisture Resistance . . . . . . . . . . . . . . . . . . . . . . . . 22
SAFETY, HAZARDS AND HANDLING CONSIDERATIONS . . . . 23
ABBREVIATION INDEX . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 24
PRODUCT STEWARDSHIP . . . . . . . . . . . . . . . . . Inside Back Cover
CONTENTS
TABLE OF
CONTENTS
TABLE OF
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INTRODUCTIOND.E.N.* epoxy novolac resins are
thermosetting plastic materials that
provide good strength and chem ical
resistance at high temperatures.
Because of this, these products offer
formulators and fabricators excellent
value as an alternative to bisphenol-A
based epoxies and phenolic res ins.
Figure 1 illustrates how D.E.R.*354 epoxy resin and D.E.N. 431,
D.E.N. 438* and D.E.N. 439 resins
combine the reactivity and versatility
of an epoxy resin with the therm al
stability of a phenol-formaldehyde
based backbone. This unique struc-
ture results in mu lti-epoxy function-
ality and additional reactive s ites,
producing tightly crosslinked sys-
tems that offer the following advan-
tages over bisphenol-A type resins:
• Improved resistance to acids,
bases and solvents• Retention of mechanical proper-
ties at high temper atures and
under wet conditions
• Minimal shrinkage
• Acceptance of a wide range of modi-
fiers, fillers and pigments
• Improved high temperature adhesive
properties
Note: Although D.E.R. 354 is a
bisphenol-F based resin, it is generally
grouped with the D.E.N. resins due its
highly similar molecular structure and
performance in cured systems.
DOWDOW
* Trademark of The Dow Chemical Company.
NOVOLACRESIN
SRESIN
S
NOVOLACEPOXYEPOXY
CH2CH2
O — CH2 — CH — CH2
O
O — CH2 — CH — CH2
O
O — CH2 — CH — CH2
O
n
n = Number of repeating units
Average value for n:
D.E.R. 354 = 0.2
D.E.N. 431 = 0.7
D.E.N. 438 = 1.6
D.E.N. 439 = 1.8
Figure 1 – Molecular Structure of D.E.R. 354, D.E.N. 431, D.E.N. 438
and D.E.N. 4 39 Resins
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The thermal stability of DOW
Epoxy Novolac resins allows the ir
application as adhesives, structural
and e lectrical laminates, coatings
and castings in e levated temperatur e
service.
For example, ease of processing –
coupled with resistance to heat of fric-
tion – makes epoxy novolac adhesives
ideal for use as binders in abrasivesfor grinding and polishing products.
The liquid forms of D.E.R. 354 and
D.E.N. 431 resins and the semi-solid
form of D.E.N. 438 resin facilitate the
prepar ation of pliable pre-pregs for
vacuum bag lamination. In electrical
laminates, the use of epoxy novolacs
improves resistance to hot solder, as
well as providing elevated tem pera-
ture service. (Electrical grade lami-
nates have been m ade using mica,
glass flake and glass fiber reinforce-
ment.) Plus, coatings formulated withepoxy novolacs provide excellent
chemical resistance associated with
an increased crosslink density when
used in a solvent or waterborne
formulation.
APPLICATIONSAPPLICATIONS
In addition, the h igh viscosity of
D.E.N. 439 resin ( semi-solid state at
room temperature) offers a m eans of
obtaining good drape and limited tack,
once the solvent has been r emoved
from the pre-impregnated web. Pre-
pregs made with little or no “B” stage
advancement provide good flow prop-
er ties for press lamination. The inher-
ently heat-res istant epoxy novolacresins can also be used to improve
halogenated resins or hardeners in
applications such as structural lami-
nates for the aer ospace and electronic
circuit board industries. And epoxy
novolacs can be combined with car-
bon, glass and Kevlar 1 fibers to create
many types of engineering composites.
Electrical varnishes, encapsulants,
semiconductors and general molding
powders are other applications where
common operating temperatures sug-
gest the use of epoxy novolac resins.Filament wound pipe and storage
tanks, liners for pumps and other
chemical process equipment and cor-
rosion-resistant coatings are typical
applications that take advantage of the
chemical-resistant properties of DOW
Epoxy Novolac resins.
1 Trademark of E.I. du Pont de Nemours & Company.
3
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PropertyD.E.R. D.E.R. D.E.N. D.E.N. D.E.N. D.E.N. D.E.N. D.E.N. D.E.N.
354LV2 3 5 4 4 31 4 3 8 4 38 -MK7 5 4 3 8-EK8 5 4 38 -A8 5 4 39 4 39 -EK8 5
Epoxide Equivalent
Weight ( EEW)3 160-170 158-175 172-179 176-181 176-181 176-181 176-181 191-210 191-210
Viscosity at 2,000- 3,000- 200- 600- 500- 4,000-
77°F (25°C), cP 3,000 5,500— —
600 1,600 1,200—
10,000
Viscosity at 1,100- 22,500- 15,000-
125°F (52°C), cP— —
1,700 50,000— — —
35,0004 —
Specific Gravity
at 25/ 39°F (4°C)1.19 1.19 1.21 1.22 1.09 1.14 1.14 1.22 1.15
Mettler Softening 118-136
Point, °F (° C)— — — — — — —
(48-58)—
Flash Point
(Pensky-Mar ten 495 (257) 495 (257) 424 (218) 424 (218) 55 (13) 16 (-9) -4 (-20) 424 (218) 16 ( -9)
Closed Cup), °F (° C)
Gardner Color, Max. 3 4 3 2 2 2 2 3 3
Methyl Methyl Methyl
Isobutyl Ethyl Acetone, EthylSolvent, %Weight — — — —
Ketone, Ketone, 15±1—
Ketone,
25±1 15±1 15±1Lbs./ Gallon 9.9 9.9 10.1 10.2 9.2 9.5 9.5 10.2 9.6
(kg/ liter) (1.19) (1.19) (1.21) (1.22) (1.10) (1.14) (1.14) (1.22) (1.15)
1 Typical property values, not to be construed as specifications.2 Low Viscosity.3 Determined using base resin.4 Measured at 160°F (71°C).
TYPICAL
Table 1 – Typical Properties of Selected D. E.N. Res ins 1
PROPERTIES
4
PROPERTIESTYPICAL
Table 1 lists typical proper ties of
several DOW Epoxy Novolac resins.
VISCOSITYThe high viscosity of D.E.N. 438
and D.E.N. 439 resins at room tem-
perature r equire reduction for some
applications. Th is can be accomplished
in a number of ways. For pre-preg
applications, these resins are offered
in solvent s olutions of methyl ethyl
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resins (i.e., D.E.R. 331*, D.E.R. 383 or
D.E.R. 332 resin), or the d iglycidyl
ether of bisphenol-F based resins
(i.e., D.E.R. 354).
The use of heat to lower viscosity
is ver y satisfactor y. At 176-194°F
(80-90°C), the resins are fluid enough
for easy mixing with most epoxy curing
agents. Figure 2 illustrates the typical
viscosity/ temperature relationships of
selected neat resins.
5
ketone (EK). D.E.N. 438 resin is also
offered in acetone (A) or methyl
isobutyl ketone (MK) solutions. Other
special solutions can be made available
for special customer requirements, if
quantities justify meeting the need.
In cases where solvents cannot be
tolerated, viscosity may be reduced by
heating, the use of diluents, or blend-
ing with oth er low viscosity resins –
including epoxy novolac resins, the
diglycidyl ether of bisphenol-A based
1
10
100
1,000
10,000
100,000
1,000,000
Figure 2 – Viscosity versus Temperature of
Neat Res ins 1
V i s c o s i t y , c P
Temperature, °F (°C)
1 Laboratory test data, not to be constr ued as specifications.
32 50 68 86 104 122 140 158 176 194 212(0 ) (1 0) (2 0) (3 0) (4 0) (5 0) (6 0) (7 0) (8 0) (9 0) (1 00 )
= D.E.R. 354
= D.E.R. 383
= D.E.N. 431
= D.E.N. 438
= D.E.N. 439
= D.E.N. 438/
D.E.R. 332 (75:25)
0
1,000
2,000
3,000
4,000
5,000
6,000
7,000
Figure 3 – Viscos ity of Neat Resin B lends
at 1 2 5 °F (52 °C)1
V i s c o s i t y , c P
Ratio of Blend (D.E.N.:D.E.R.)
1:1 2:1 3:1
= D.E.N. 438/D.E.R. 3
= D.E.N. 438/D.E.R. 3
= D.E.N. 438/D.E.R. 3
Viscosity of 100% D.E.N. 438 = 23,200 cP
Figure 3 shows the s ubstantial
reductions that can be achieved by
blending D.E.N. 438 res in with
lower viscosity resins, as well as the
near proportional increase in viscosit
that occurs as the epoxy novolac
resin content is increased. It sh ould
be noted, however, that blending
with low viscosity res ins or diluentsusually results in some reduction of
elevated temperature per formance
and chemical resistance.
*Trade mark of The Dow Chemical Company.
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SPECIFIC GRAVITYThe volume of product used is
greater at elevated temperatures due
to the increase in specific gr avity.
The specific gravity of bisphenol-A
based epoxy is lower than that of
epoxy novolac resin independent of
temperature. Figure 4 demonstrates
the relationship between specificgravity and temperature, with a
bisphenol-A based resin (D.E.R. 331)
included for comparison.
6
Figure 4 – Spec ific Gravity versu s Tem perature 1
S p e c i f i c G r a v i t y
Temperature, °F (°C)
1 Laboratory test data, not to b e constr ued as specifications.
32 68 104 140 176 212 248(0) (20) (40) (60) (80) (100) (120)
1.08
1.10
1.12
1.14
1.16
1.18
1.20
1.22
1.24
= D.E.R. 331
= D.E.N. 431
= D.E.N. 438
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MODIFIERS
FILLERS
AND
The fillers and modifiers normally
used with liquid epoxy resins can also
be used with epoxy novolac resins.
For example, polysulfide resins have
been used in the formulation of amine
cured adhesives and silicone res ins
are frequently used to improve flow
and wetting. Polyols, polyesters and
phenolics are among other r esins sug-
gested for use as modifiers.
Fillers can also be used to modify
specific formulation pr oper ties. In
applications that require the protec-
tion of delicate encapsulated parts, the
incorporation of fillers can provide
additional reduction of shrinkage
along with improved adhesion. Like-
wise, metallic fillers can be used to
improve heat transfer, and soft metal
MODIFIERS
FILLERS
AND
fillers, such as aluminum powder, are
added to improve mach inability.
Fibrous fillers improve mechanical
strength , while graphite or m olybde-
num disulfide can r educe friction in
bearings or seals. Abrasive pigments
can be u sed to improve the wear
resistance of sur faces.
The high viscosities of D.E.N. 438
and D.E.N. 439 resins require that
they be heated to 167-212°F (75-100°C)
for filler addition. However, when
viscosity reducing modifiers are also
being used, fillers can be added to the
mix at lower res in temperatures. In
any case, fillers are usually preheated
to 302-392°F (150-200°C) to drive
off moisture.
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MethylTetrahydrophthalicAnhydride (MTHPA)
Dicyandiamide (Dicy)
Nadic MethylAnhydr ide (NMA)
Diethyltoluene-Diamine(DETDA)
Diamino Diphen yl Sulfone(DDS)
Boron TrifluorideMonoethylamine (BF3• MEA)
Diaminocyclohexane (DACH)
Catalyzed with 1.0 phr of 1- (2-hydroxy-propyl) imidazole. Epoxy novolac re sinsheated to 140°F (60°C) before additionof curing agen t. Molds preheated to122°F (50°C).
Testing for thermal properties only. Testsamples made in small aluminum pans.Hardener dissolved by first warmingresin/ hardener blend on hot plate at410°F (210°C). 5.0 phr mix ratio of Dicy.
Catalyzed with 1.0 phr of 1- (2-hydroxy-propyl) imidazole or 1.5 phr benzyl-dimethylamine (BDMA) as accelerator.
Epoxy novolac resins heated to 176°F(80°C) before addition of curing agent.Molds preheated to 122°F (50°C).
Resin, curing agent and molds heated to302°F (150°C) before blending.
Resin preheated to 176-212°F (80-100°C)to dissolve catalyst. Molds preheated to212°F (100°C).
Molds preheated to 122°F (50°C).
Table 2 – Cure Schedules of Common Curing Agents (Used with Neat Resins)
Initial P os t CureCuring Agent Gel Time,
TemperatureTime,
TemperatureComments
Hours°F (°C)
Hours°F (°C)
2
2
2
2
3
4
1
185 (85)
356 (180)
185 (85)
248 (120)
351 (177)
212 (100)
176 (80)
2
+2
2
2
+2
2
+2
2
16
2
302 (150)
392 (200)
392 (200)
302 (150)
446 (230)
347 (175)
437 (225)
482 (250)
302 (150)
350 (177)
CURESCHEDULES
CURING
AGENTS AND
When selecting a curing agent for
use with epoxy novolac resins, the
effect on cured resin proper ties mus t
be considered. Modified amines,
catalytic curing agents and some
anhydrides provide optimum elevated
temperature properties. In add ition,
epoxy novolacs cured with polyamide
hardeners, or aliphatic polyaminesand their adducts, show improve-
ment over similar systems using
bisphenol-A based epoxies. However,
the elevated temperature per formance
is still limited by the performance of
the curing agent itself.
CURESCHEDULES
CURING
AGENTS AND
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9
Other factors to be considered
when selecting a curing agent include
the pot life and viscosity desired for
the application. If heat is used to
reduce viscosity, then polyamides and
aliphatic polyamines and their adducts
will react extremely fast, re sulting in
too short a pot life to permit batch
mixing. Such systems may, however,be adapted to production operations
by using automatic metering and dis-
pensing equipment.
Modified am ines, latent catalytic
curing agents and most anhydrides
offer sufficient pot life at modestly
elevated temperatures to allow batch
mixing. The liquid anhydrides, such
as Nadic Methyl Anhydride (NMA)
and Methyl Tetrahydrophthalic
Anhydride (MTHPA) are par ticularly
useful because they reduce the viscosity
of the solution as well as pr ovidingexcellent elevated tem perature per-
formance in the cur ed system.
Table 2 lists cure schedules for
some of the more common curing
agents, along with comments on
formulating procedures. Curing
agents and cure schedules were
selected to allow comparison with
other Dow epoxy resin data, not
because they are optimum for use
with epoxy novolac resins.
Figures 5 through 10 show the
relationship between viscosity andcure time for selected epoxy resins
cured with Methyl Tetrahydrophthalic
Anhydride (MTHPA), Dicyandiamide
(Dicy), Diethyltoluene -Diamine
(DETDA) and Diamino Diphenyl
Sulfone ( DDS).
Figure 5 – Viscos ity versus Time at 1 8 5 °F
(8 5 °C) for Resins Cured with MTHPA1
V i s c o s i t y , c P
Time, minutes
0 20 40 60 80 100 1201
10
100
1,000
10,000
100,000
1,000,000
10,000,000
= D.E.R. 354
= D.E.N. 438/D.E.R. 332 (75:25)
= D.E.N. 438
= D.E.R. 383
Figure 6 – Viscos ity versus Time at 3 2 0 °F
( 160 °C) for Resins Cured with Dicy1
V i s c o s i t y , c P
Time, minutes
1 Laboratory test data, not to be constr ued as specifications.
0 10 20 30 40 50 60 70111
10
100
1,000
10,000
100,000
1,000,000
10,000,000
= D.E.R. 354
= D.E.N. 438
= D.E.R. 383
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1 0
Figure 8 – Viscos ity versus Time at 3 0 2 °F
( 150 °C) for Resins Cured with DDS1
V i s c o s i t y , c P
Time, minutes
1 Laboratory test data, not to be constr ued as s pecifications.
0 20 40 60 80 1001
10
100
1,000
10,000
100,000
1,000,000
10,000,000
= D.E.N. 438
= D.E.N. 439
= D.E.R. 354
= D.E.R. 383
A general discussion of the cur ing
mechanisms and polymer forma-
tions obtained with various curing
agents can be found in the Dow
publication “Formulating with DOW
Epoxy Resin” (Form No. 296-00346).
In addition, this publication includes
formulating guidelines; procedures
for determining equivalent weights
and calculating stoichiometric
ratios; and information on the types
of epoxy products available, along
with suitable applications and th e
reasons behind successful system
performance.
Figure 7 – Viscos ity versus Time at 2 5 0 °F
( 121 °C) for Resins Cured with DETDA1
V i s c o s i t y , c P
Time, minutes
0 20 40 60 80 1001
10
100
1,000
10,000
100,000
1,000,000
10,000,000
= D.E.R. 354
= D.E.R. 383
= D.E.N. 438/D.E.R. 332 (75:25)
= D.E.N. 438
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Table 3 – Tes t Methods
Property
Rheology of neat resins and formulations
Cure Kinetics (∆ H, onset temperature,
maximum exotherm temperature)
Glass Transition Temperature (Tg)
Therm al Degradation
Coefficient of Linear Thermal Expans ion
(CLTE)
Storage (E') and Loss (E'') M odulus, tan
delta
Flexural Strength, Modulus, Strain
Tensile Strength, Modulus, %Elongation
Liquid Density
Solid Density
Water Absorption
Ther mogravimetr ic Analysis
Dielectric Constant and Dissipation
Factor
Test Method
—
ASTM D 3418
ASTM D 3418
—
ASTM E 831
ASTM D 4065
ASTM D 790
ASTM D 638
ASTM D 1475
ASTM D 792
—
ASTM D 3850
ASTM D 150
Comments
Cup and Bob Rheometer. 12g samples.
Differential Scanning Calorimeter (DSC).
Differential Scanning Calorimeter (DSC). Wet testing
performed on samples after two-week water boil.
2' ' diameter x 1 / 8'' T round coupons exposed to air
convection oven at specified temperature.
Thermomechanical Analyzer (TMA). 1 / 8'' thick samples
Dynamic Mech anical Analyzer (DMA). 1 / 8'' thick
samples. Wet testing performed on samples after two-
week water boil.
1 / 2'' W x 1 / 8'' T x 3'' L samples, 2'' span.
3 / 4'' W x 1 / 8'' T x 81 / 2'' L samples, routed to 1 / 2'' neck
width.
Density Cup.
Cured Castings – Liquid displacement method.
1'' W x 1 / 8'' D x 3'' L samples, two-week water boil.
Ther mal Gravimetric Analyzer (TGA).
3'' x 3'' samples.
TEST METHODSThis section provides per forman
data for a wide range of properties i
cured DOW Epoxy Novolac resin sy
tems. Due to the large volume of da
involved, all test methods used have
been listed in Table 3. Unless other
wise noted, all testing was performe
according to the ASTM standar d temethods indicated. In cases where
ASTM method was not used, a brie
description of the procedure is give
Test samples were cured according
the schedules shown in Table 2
(page 8).
PERFORMANCEDATA
CURED
RESINPERFORMANCEDATA
CURED
RESIN
1 1
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THERMALPROPERTIES
With Glass Transition Temp-
eratures (Tg) ranging from 259-491°F
(126-255°C), DOW Epoxy Novolac
resins offer excellent heat resistance
in cured systems. Table 4 lists the
representative glass transition tem-
peratures for various resin/ curingagent formulations, with data for
D.E.R. 383 (a liquid bisphenol-A
based epoxy resin) provided for
comparison. In addition, Figure 9
graph ically illustrates the wide
range of glass transition tempera-
tures available.
Generally speaking, the higher
the functionality of an epoxy re sin
formulation, the higher the crosslink
density of the cured product. In
turn, cr osslink density and several
other factors (i.e., cure schedule, cat-
alyst concentration and type, curing
agent type, and stoichiometric ratio
of curing agent and r esin) help
determine the glass transition tem-
perature of a particular formulation.
The h igher glass transition tempera-
tures obtained with epoxy novolacs
suggest the m aintenance of cured
product integrity at elevated temper-
atures. Long-term therm al perform-
ance is also dictated by environmen-
tal exposure. Therefore, environmen-tal conditioning should be used to
determine the long-term thermal
performance of a cured product.
1 2
Table 4 – Repres entative Glass Transition Tem peratures
(Tg) of Formulated Resin Systems 1
Resin Curing Agent Tg, °F (°C)
MTHPA 264 (129)
Dicy 259 (126)
D.E.R. 354NMA 315 (157)
DETDA 273 (134)
DDS 351 (177)
DACH 270 (132)
MTHPA 300 (149)
Dicy 327 (164)
D.E.N. 431NMA 361 (183)
DETDA 360 (182)
DDS 414 (212)
BF3• MEA 361 (183)
MTHPA 300 (149)
Dicy 374 (190)
D.E.N. 438NMA 417 (214)
DETDA 428 (220)
DDS 491 (255)
BF3• MEA 365 (185)
MTHPA 298 (148)
Dicy 383 (195)
D.E.N. 439 NMA 432 (222)
DETDA 410 (210)
DDS 450 (232)
MTHPA 298 (148)
Dicy 316 (158)
D.E.R. 383NMA 354 (179)
DETDA 360 (182)
DDS 428 (220)
BF3• MEA 342 (172)
1 Laboratory test data, not to be constr ued as s pecifications.
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Table 5 lists percent weight loss
under isother mal conditions and
heat d istor tion temperature for
various DOW Epoxy Novolac resin
and bisphenol-A based D.E.R. 331
resin after standard cur es. The data
sugges t that the D.E.N. resins are
better suited to withstand elevated
ser vice temperatures over long
periods of time.
Table 5 – Typical Thermal Degradation (Pe rcent Weight Los s)
and Heat Distortion Temperatures 1
Figure 9 – Comparative Glass Transition Tem peratures
(Tg) of Formulated Resin Systems 1
Tg, °F (°C)
R e s i n / C u r i n g A g e n t F o r m u l a t i o n
32(0)
122(50)
212(100)
302(150)
392(200)
482(250)
572(300)
MTHPA
DicyNM A
DETDA
DDSDACH
MTHPA
DicyNM ADETDA
DDSBF3•M EA
MTHPADicy
NM ADETDA
DDS
BF3•M EA
MTHPA
DicyNM A
DETDADDS
MTHPA
DicyNM A
DETDADDSBF3•M EA
D.E.R. 354
D.E.N. 431
D.E.N. 438
D.E.N. 439
D.E.R. 383
Resin
Curing Agent
Temperature
320°F (160°C)
100 Hours
200 Hours
300 Hours
500 Hours
410°F (210°C)
100 Hours
200 Hours
300 Hours
500 Hours
500°F (260°C)
100 Hours
200 Hours
Heat Distortion
Temp., °F ( °C)
1 Laboratory test data, not to be cons trued as specifications.2 Plus 1.5 Parts BDMA.
D=Decomposed
%Weight Loss
D.E.N.
4 3 1
NMA2
0.21
0.00
0.00
0.00
0.67
1.04
1.30
1.55
—
—
324 (162)
D.E.N.
4 3 8
NMA2
0.05
0.00
0.01
0.00
0.63
1.07
1.46
2.07
5.20
9.20
378 (192)
D.E.N.
4 3 9
NMA2
0.32
0.34
0.61
1.04
0.35
0.39
0.60
1.20
4.80
9.00
356 (180)
D.E.R.
3 3 1
NMA2
0.12
0.07
0.10
0.10
0.66
1.10
1.50
1.80
5.60
10.20
313 (156)
D.E.N.
4 3 8
DDS
—
—
—
—
—
—
—
—
—
—
496 (258)
D.E.R.
3 3 1
DDS
—
—
—
—
—
—
—
—
—
—
387 (197)
D.E.N.
4 3 8
BF3• MEA
0.11
0.08
0.10
0.05
1.73
2.97
3.82
5.02
11.30
13.15
473 (245)
D.E.N.
4 3 9
BF3• MEA
0.42
0.26
0.26
0.26
1.23
2.55
3.25
3.95
10.50
12.40
493 (256)
D.E.R.
3 3 1
BF3• ME
0.36
0.48
0.71
0.86
2.60
4.00
4.90
5.50
19.60
D
334 (168
1 3
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D.E.R.
3 5 4
158-175
MTHPA/
Imidazole
85:1
2/ 185 (85)
2/ 302 (150)
2/ 392 (200)
284 (140)
126 (70)
259 (126)
270 (132)
282 (139)
1.63
18.6 (128)
481 (3,316)
6.0
1.225
D.E.N.
4 3 1
172-179
MTHPA/
Imidazole
85:1
2/ 185 (85)
2/ 302 (150)
2/ 392 (200)
300 (149)
124 (69)
293 (145)
302 (150)
313 (156)
1.43
21.0 (145)
502 (3,461)
6.6
1.225
D.E.N.
4 3 8
176-181
MTHPA/
Imidazole
85:1
2/ 185 (85)
2/ 302 (150)
2/ 392 (200)
300 (149)
124 (66)
320 (160)
340 (171)
351 (177)
1.49
20.0 (138)
509 (3,509)
6.7
1.224
D.E.N. 438/
D.E.R. 3 3 2
(75:25)
175-180
MTHPA/
Imidazole
85:1
2/ 185 (85)
2/ 302 (150)
2/ 392 (200)
300 (149)
131 (73)
—
—
327 (164)
1.40
20.2 (139)
520 (3,585)
6.1
—
D.E.N.
4 3 9
191-210
MTHPA/
Imidazole
85:1
2/ 185 (85)
2/ 302 (150)
2/ 392 (200)
298 (148)
126 (70)
282 (139)
298 (148)
316 (158)
2.37
21.0 (145)
565 (3,896)
6.3
1.225
D.E.R.
3 8 3
176-185
MTHPA/
Imidazole
85:1
2/ 185 (85)
3/ 302 (150)
—
298 (148)
126 (70)
300 (149)
311 (155)
318 (159)
1.45
18.5 (128)
474 (3,268)
6.7
1.190
PHYSICALPROPERTIES
Tables 6 through 10 indicate
typical physical proper ties of cured
epoxy novolac resin systems formu-
lated with DOW Epoxy Novolac
resins and se lected curing agents.
Data from samples of bisphenol-A
based D.E.R. 383, cured with thesame curing agents, has also been
provided for comparison.
1 4
Table 6 – Typical Physical Properties of Res in Systems Cured with MTHPA/ Imidazole1
Resin
Epoxide Equivalent Weight
(EEW) Range
Curing Agent/ Catalyst
Mix Ratio of Curing Agent:
Catalyst, ph r
Cure Schedule, hours at
°F ( °C)
Glass Transition Temp. (Tg),
°F ( °C)
Coefficient of Linear Thermal
Expansion (CLTE), ppm/ °F
(ppm/ °C)
Dynamic M echanical Analysis
(DMA)
E' onset, °F (°C)
E'' onset, °F (°C)
Tan delta, °F (°C)
Water Absorption, two-week
water boil, %
Flexural Strength, ksi (MPa)
Flexural Modulus, ksi (MPa)
Flexural Strain at Yield, %
Cured Density, g/ ml
1 Typical proper ty values, not to be construed as specifications.
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D.E.R.
3 5 4
158-175
NMA/
Imidazole
85:1
2/ 185 (85)
2/ 302 (150)
2/ 446 (230)
315 (157)
D.E.N.
4 3 1
172-179
NMA/
Imidazole
85:1
2/ 185 (85)
2/ 302 (150)
2/ 446 (230)
361 (183)
D.E.N.
4 3 8
176-181
NMA/
Imidazole
85:1
2/ 185 (85)
2/ 302 (150)
2/ 446 (230)
417 (214)
D.E.N.
4 3 9
191-210
NMA/
Imidazole
85:1
2/ 185 (85)
2/ 302 (150)
2/ 446 (230)
432 (222)
D.E.R.
3 8 3
176-185
NMA/
Imidazole
85:1
2/ 185 (85)
2/ 302 (150)
2/ 446 (230)
354 (179)
1 5
Table 7 – Typical Physical Properties of Resin Systems Cured
with N MA/ Imidazole1
Resin
Epoxide Equivalent Weight
(EEW) Range
Curing Agent/ Catalyst
Mix Ratio of Curing Agent:
Catalyst, ph r
Cure Schedule, hours at
°F (°C)
Glass Transition Temp. (Tg),
°F (°C)
Table 8 – Typical Physical Properties of Resin Systems Cured with DETDA1
Resin
Epoxide Equivalent Weight
(EEW) Range
Curing Agent
Mix Ratio of Curing Agent, phr
Cure Schedule, hours at°F (°C)
Glass Transition Temp. (Tg),
°F (°C)
Coefficient of Linear Th erm al
Expansion (CLTE), ppm/ °F
(ppm/ °C)
Dynamic M echanical Analysis
(DMA)
E' onset, °F (°C)
E'' onset, °F (°C)
Tan delta, °F (°C)
Water Absorption, two-week water boil, %
Flexural Strength, ksi (MPa)
Flexural Modulus, ksi (MPa)
Flexural Strain at Yield, %
Cured Density, g/ ml
1 Typical property values, not to be construed as specifications.
D.E.R.
3 5 4
158-175
DETDA
27.4
2/ 248 (120)
2/ 350 (177)
—
273 (134)
137 (76)
280 (138)
297 (147)
311 (155)
2.40
15.9 (110)
438 (3,020)
6.8
1.172
D.E.N.
4 3 1
172-179
DETDA
26.6
2/ 248 (120)
2/ 350 (177)
2/ 437 (225)
360 (182)
131 (73)
351 (177)
365 (185)
379 (193)
2.24
15.6 (108)
431 (2,972)
7.1
1.199
D.E.N.
4 3 8
176-181
DETDA
26.3
2/ 248 (120)
2/ 350 (177)
2/ 437 (225)
428 (220)
124 (69)
417 (214)
451 (233)
477 (247)
2.47
16.0 (110)
444 (3,061)
6.1
1.210
D.E.N. 438/
D.E.R. 3 32
(75:25)
175-180
DETDA
25.3
2/ 248 (120)
2/ 350 (177)
2/ 437 (225)
421 (216)
149 (83)
—
—
484 (251)
2.10
13.0 (90)
420 (2,896)
4.1
—
D.E.N.
4 3 9
191-210
DETDA
23.3
2/ 248 (120)
2/ 350 (177)
2/ 437 (225)
410 (210)
131 (73)
406 (208)
433 (223)
239 (239)
2.44
16.6 (114)
451 (3,110)
6.9
1.198
D.E.R.
3 8 3
176-185
DETDA
26.0
2/ 248 (120)
2/ 350 (177)
—
360 (182)
133 (74)
360 (182)
374 (190)
387 (197)
2.35
15.7 (108)
383 (2,641)
6.9
1.140
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Table 9 – Typical Physical Properties o f Resin Systems
Cured with DDS1
Resin
Epoxide Equivalent Weight
(EEW) Range
Curing Agent
Mix Ratio of Curing Agent, phr
Cure Schedule, hours at
°F (°C)
Glass Transition Temp. (Tg),
°F (°C)
Coefficient of Linear Th erm al
Expansion (CLTE), ppm/ °F
(ppm/ °C)
Dynamic M echanical Analysis
(DMA)
E' onset, °F (°C)
E'' onset, °F (°C)
Tan delta, °F (°C)
Water Absorption, two-week water
boil, %
Flexural Strength, ksi (MPa)
Flexural Modulus, ksi (MPa)
Flexural Strain at Yield, %
1 Typical property values, not to be construed as specifications.
1 6
D.E.N.
4 3 1
172-179
DDS
35.5
3/ 350 (177)
2/ 482 (250)
414 (212)
—
361 (183)
390 (199)
432 (222)
3.40
20.6 (142)
470 (3,241)
7.1
D.E.N.
4 3 8
176-181
DDS35.5
3/ 350 (177)
2/ 482 (250)
491 (255)
124 (69)
433 (223)
455 (235)
523 (273)
4.10
19.6 (135)
480 (3,310)
7.0
D.E.N.
4 3 9
191-210
DDS
31.5
3/ 350 (177)
2/ 482 (250)
450 (232)
140 (78)
—
—
527 (275)
—
17.9 (123)
490 (3,378)
7.0
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D.E.R.
3 5 4
158-175
DACH
17.6
1/ 176 (80)
2/ 350 (177)
270 (132)
128 (71)
262 (128)
275 (135)
297 (147)
1.83
18.7 (129)
494 (3,406)
7.1
1.193
D.E.R. 3 3 2 /
D.E.R. 3 5 4
(75:25)
168-176
DACH
17.2
1/ 176 (80)
2/ 350 (177)
356 (180)
133 (74)
360 (182)
369 (187)
379 (193)
2.04
17.3 (119)
436 (3,006)
7.1
1.142
D.E.R.
3 8 3
176-185
DACH
17.2
1/ 176 (80)
2/ 350 (177)
352 (178)
119 (66)
342 (172)
369 (187)
378 (192)
1.93
17.7 (122)
420 (2,896)
7.7
1.172
Table 1 0 – Typical Physical Properties of Res in Systems
Cured with DACH 1
Resin
Epoxide Equivalent Weight
(EEW) Range
Curing Agent
Mix Ratio of Curing Agent, phr
Cure Schedule, hours at
°F ( °C)
Glass Transition Temp. (Tg),
°F (°C)
Coefficient of Linear Th ermal
Expansion (CLTE), ppm/ °F
(ppm/ °C)
Dynamic Mechanical Analysis
(DMA)
E' onset, °F (°C)
E'' onset, °F (°C)
Tan delta, °F (°C)
Water Absorption, two-week water
boil, %
Flexural Strength, ksi (MPa)
Flexural Modulus, ksi (MPa)
Flexural Strain at Yield, %
Cured Density, g/ ml
1 Typical property values, not to be construed as specifications.
1 7
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D.E.R.
3 5 4
MTHPA
3.37
3.34
3.303.29
0.0052
0.0092
0.0135
0.0154
D.E.N.
4 3 1
MTHPA
3.40
3.36
3.323.30
0.0064
0.0109
0.0155
0.0171
D.E.N.
4 3 8
MTHPA
3.45
3.40
3.353.34
0.0076
0.0125
0.0172
0.0189
D.E.N.
4 3 9
MTHPA
3.46
3.42
3.363.35
0.0076
0.0129
0.0176
0.0193
D.E.R.
3 5 4
DETDA
4.38
4.29
4.174.12
0.0093
0.0221
0.0323
0.0349
D.E.N.
4 3 1
DETDA
4.38
4.27
4.134.08
0.0120
0.0261
0.0350
0.0369
D.E.N.
4 3 8
DETDA
4.50
4.38
4.234.17
0.0128
0.0272
0.0361
0.0380
D.E.N.
4 3 9
DETDA
4.50
4.40
4.254.20
0.0114
0.0254
0.0348
0.0369
D.E.N.
4 3 1
DDS
4.50
4.36
4.234.18
0.0167
0.0259
0.0289
0.0289
D.E.N.
4 3 8
DDS
4.86
4.68
4.514.44
0.0207
0.0310
0.0365
0.0370
ELECTRICALPROPERTIES
Table 11 lists typical electrical
properties of cured epoxy novolac
resin systems formulated with DOW
Epoxy Novolac resins and appropri-
ate curing agents.
CHEMICALRESISTANCE
Tables 12 and 13 show the results
of chemical resistance testing con-
ducted on various cured formulations
of both DOW Epoxy Novolac resins
and bisphenol-A based D.E.R. 331
liquid epoxy resins. Test specimens
(3'' x 1'' x 0.125'') were submerged inacids, bases and organic solvents for
120 days at 73°F (23°C) ± 2. The spec-
imens were weighed at inter vals of 7,
28 and 120 days with any changes in
weight re corded.
The high functionality of D.E.N.
438 resin results in a cured system
with a highly crosslinked three-
dimensional structure that is resistant
to chemical and solvent attack. With a
few exceptions, epoxy novolacs sh ow
similar chemical resistance results to
bisphenol-A based resins in aqueous
solutions. In addition, epoxy novolacs
are generally superior in resistance to
organic solvents.
Catalytic cures, which promote the
epoxy-to-epoxy reaction and its resul-
tant stab le ethe r linkage, typically
provide the best all around chemical
and solvent resistance. If conditions of
cure, formulation or performance dic-
tate the use of other curing agents, the
preferred alternatives are anhydrides
for acid conditions and amines for
alkaline exposure.
Resin
Curing Agent
Dielectric Constant
Frequency, Hz
1.00E+03
1.00E+04
5.00E+041.00E+05
Dissipation Factor
Frequency, Hz
1.00E+03
1.00E+04
5.00E+04
1.00E+05
1 Typical proper ties; not to be constr ued as specifications.
Table 11 – Typical Electrical Properties of Cured Resin Systems 1
1 8
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Resin
Curing Agent
Days
Sulfuric Acid, 30%
Hydrochloric Acid, 36%
Nitric Acid, 40%
Ammonium Hydroxide, 28%
Acet ic Acid, 25%
Acetone
Toluene
Sodium Hydroxide, 10%
JP4 Fuel
Distilled Water
7
0.32
—
—
—
—
1.10
—
—
0.02
0.44
28
0.52
—
—
—
—
3.77
—
—
0.04
0.79
120
0.80
—
—
—
—
9.00
—
—
0.14
1.15
Table 1 2 – Typical Chemical and Solvent Res istance of Res in Systems Cured with NMA1
D.E.N. 431
NMA
%Weight Change
7
0.44
0.24
0.59
0.77
0.57
0.24
0.07
0.42
0.00
0.55
28
0.68
0.60
1.37
1.31
0.93
1.15
0.14
0.64
0.01
0.97
120
0.77
1.50
3.11
1.92
1.12
5.07
0.32
0.64
0.12
1.13
D.E.N. 438
NMA
%Weight Change
7
0.33
0.26
0.38
0.72
0.58
0.17
0.00
0.45
0.01
0.52
28
0.62
0.49
1.00
1.46
0.91
0.66
0.02
0.82
0.04
0.96
120
0.80
1.09
2.05
2.40
1.28
3.43
0.28
1.13
0.15
1.38
D.E.N. 439
NMA
%Weight Change
7
0.33
0.32
0.40
0.67
0.46
4.80
0.06
0.37
0.02
0.52
28
0.83
0.56
1.10
1.24
0.73
13.00
0.09
0.51
0.02
0.82
120
0.55
1.36
1.70
1.84
0.90
22.30
0.28
0.50
0.16
0.87
D.E.R. 3 31
NMA
%Weight Change
7
0.40
0.26
0.450.57
0.53
0.43
0.09
0.50
0.02
0.62
28
1.10
0.49
1.201.22
1.03
1.20
0.17
0.94
0.06
1.20
120
1.20
1.17
1.502.17
1.65
3.20
0.26
1.46
0.23
1.80
D.E.R. 3 3 1
BF3• MEA
%Weight Change
7
0.40
—
——
—
0.05
—
—
0.03
0.57
28
0.82
—
——
—
0.14
—
—
0.08
1.18
120
1.53
—
——
—
0.64
—
—
0.31
2.25
D.E.N. 439
BF3• MEA
%Weight Change
Resin
Curing Agent
Days
Sulfuric Acid, 30%
Hydrochloric Acid, 36%
Nitric Acid, 40%Ammonium Hydroxide, 28%
Acetic Acid, 25%
Acetone
Toluene
Sodium Hydroxide, 10%
JP4 Fuel
Distilled Water
1 Laboratory test data, not to be constr ued as s pecifications.
7
0.40
0.15
0.120.64
0.63
-0.04
0.10
0.53
0.02
0.60
28
0.91
0.45
1.011.35
1.32
0.00
0.20
1.13
0.05
1.43
120
1.58
1.07
2.222.57
2.10
0.20
0.62
1.93
0.26
2.24
Table 13 – Typical Chemical and Solvent Resistance of Resin Systems
Cured with BF3• MEA1
D.E.N. 438
BF3• MEA
%Weight Change
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MECHANICALPROPERTIESAT ELEVATEDTEMPERATURESAND WHEN WET
Epoxy novolac resins retain good
overall mechanical properties at ele-
vated temperatures and when wet.Figure 10 shows flexural strengths
ranging from room tem perature to
the glass transition temperature for
selected resin systems. Figures 11
through 13 illustrate flexural modulus,
tensile str ength and tensile modulus
per formance unde r both wet and
dry conditions at room and elevated
temperatures.
Figure 10 – Flexural Strength at Elevated
Temperatures 1
F l e x u r a l S t r e n g t h ,
k s i
Temperature, °F (°C)
32 77 122 167 212 257 302 347 392 437 482 527(0) (25) (50) (75) (100) (125) (150) (175) (200) (225) (250) (275)
0.0
2.5
5.0
7.5
10.0
12.5
15.0
17.5
20.0
22.5
25.0
0
17
34
52
69
86
103
121
138
155
172
MP a
= D.E.R. 331/DDS
= D.E.N. 438/DDS
= D.E.N. 438/NMA/BDMA
Figure 11 – Flexural Modulus Under Various
Tem perature/ Moisture Conditions 1
Resin/ Curing Agent Formulation1 Laboratory test data, not to be constr ued as specifications.2 Wet = Two-week wate r bo il.3 Hot = 300°F (149°C).
F l e x u r a l M o d u l u s ,
k s i
MP a
D.E.N.
431/DDS
D.E.N.
438/DDS
= Room Temperature/Dry
= Room Temperature/Wet2
= Hot/Dry3
= Hot/Wet2, 3
0
100
200
300
400
500
600
0
690
1,379
2,069
2,759
3,449
4,138
D.E.N.
438/D.E.R
332/MTHPA
D.E.N.
438/D.E.R.
332/DETDA
2 0
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2 1
Figure 12 – Tens ile Strength Under Various
Tem perature/ Moisture Conditions 1
Resin/ Curing Agent Formulation
T e n s i l e S t r e n g t h , p s i
MP a
D.E.N.431/DDS
D.E.N.438/DDS
0
2,000
4,000
6,000
8,000
10,000
12,000
14,000
0
14
28
41
55
69
83
97
= Room Temperature/Dry
= Room Temperature/Wet2
= Hot/Dry3
= Hot/Wet2, 3
Figure 13 – Tensile Modulus Unde r Various
Tem perature/ Moisture Conditions 1
Resin/ Curing Agent Formulation1 Laboratory test data, not to be constr ued as specifications.2 Wet = Two-week wate r b oil.3 Hot = 300°F (149°C).
T e
n s i l e M o d u l u s ,
k s i
MP a
D.E.N.431/DDS
D.E.N.438/DDS
0
100
200
300
400
500
0
690
1,379
2,069
2,759
3,449
345
1,035
1,724
2,414
3,104
50
150
250
350
450
= Room Temperature/Dry
= Room Temperature/Wet2
= Hot/Dry3
= Hot/Wet2, 3
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ACCELERATEDMOISTURERESISTANCE
Table 14 shows the effects of
exposure to high temperature and
pressur e on coupons formulated
from D.E.N. 438 and D.E.R. 331
resins cured with various curing
agents. The test specimens were sub-
jected to 250°F (121° C) and 15 ps i
(0.103 MPa) for 500 hours in a steam
generating autoclave.
In vir tually all cases , the D.E.N.
438 epoxy novolac res in maintained
highe r post-test values for flexural
strength, flexural modulus and glass
transition tem perature. For example,
in coupons cured with BF3• MEA,
D.E.N. 438 resin retained nearly 90
percent of its pre -test flexural strength,
while th e b isphenol-A based D.E.R.
331 resin retained only 18 percent
due to some stres s cracking in the
samples. The one exception was the
flexural strength of coupons cured
with DDS.
Table 14 – Moisture Resistance, 50 0 Hours Exposure at 2 5 0 °F (12 1 °C)
and 15 psi (0.103 MPa) 1
Resin
Curing Agent
%Weight Increase @ 500 Hours
Flexural Strength, ksi (MPa)
Pre-exposure
Post-exposure
%Retention
Flexural Modulus, ksi (MPa)
Pre-exposure
Post-exposure
%Retention
Glass Transition Temp. (Tg),
via DSC
Pre-exposure, ° F ( °C)
Post-exposure, °F (°C)
%Retention
D.E.N. 43 8
NMA2
2.21
20.7 (143)
13.7 (95)
66
542 (3,738)
491 (3,386)
91
383 (195)
322 (161)
82
D.E.R. 3 3 1
NMA2
3.68
23.1 (159)
16.9 (48)3
30
504 (3,476)
477 (3,290)3
95
316 (158)
226 (108)
68
D.E.N. 438
DDS
4.19
21.2 (146)
13.5 (93)
64
549 (3,786)
461 (3,179)
84
417 (214)
318 (159)
74
D.E.R. 3 31
DDS
4.34
23.4 (161)
16.4 (113)
70
493 (3,400)
437 (3,014)
89
340 (171)
277 (136)
80
D.E.N. 43 8
BF3• MEA
3.37
16.4 (113)
14.5 (100)
88
559 (3,855)
506 (3,490)
90
415 (213)
318 (159)
75
D.E.R. 3 3 1
BF3• MEA
2.70
18.1 (125)
3.3 (23)3
18
490 (3,380)
405 (2,793)3
83
327 (164)
261 (127)
77
2 2
1 Laboratory test data, not to be constr ued as s pecifications.2
Plus 1.5 parts BDMA.3 Sample exhibited some cracking.
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For Environm ental, Health, Safety
and Handling Considerations of Dow
Products, consult the technical
brochur es “Storage and Hand ling
of DOW Epoxy Resins” (For m No.
296-00312) and “Storage and Handling
of DOW Epoxy Curing Agents”
(Form No. 296-01331), as well as the
respective product Material Safety
Data Sheets ( MSDS). For Dow and
non-Dow products always request,
read and understand s afety, health,
environmental and handling informa-
tion before handling any of these
mater ials. Safety information on sol-
vents, diluents, modifiers, cur ing
agents and other additives for epoxy
formulations are equally important.
Contact your s uppliers for information
on these materials along with specific
safe handling recommendations.
For more information on DOWEpoxy Novolac resins, contact your
Dow sales representative, or call
1-800-441-4369 or 1-517-832-1426.
In Mexico, call 95-800-441-4369.
2 3
SAFETY,
HAZARDS AND
CONSIDERATIONS
SAFETY,
HAZARDS ANDHANDLINGHANDLINGCONSIDERATIONS
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A – Acetone
BDMA – Benzyldimethylamine
BF3• MEA – Boron Trifluoride• Monoethylamine
DACH – Diaminocyclohexane
DDS – Diamino Diphenyl Sulfone
DETDA – Diethyltoluene-Diamine
DSC – Differential Scanning Calorimeter
EEW – Epoxide Equivalent Weight
EK – Methyl Ethyl Ketone
HDT – Heat Distortion Temperature
MK – Methyl Isobutyl Ketone
MTHPA – Methyl Tetrahydrophthalic Anhydride
NMA – Nadic Methyl Anhydride
phr – Parts Per Hundred Parts Resin
PMCC – Pensky-Marten Closed Cup
TGA – Ther mogravimetric Analysis
TMA – Thermomechanical Analysis
Tg – Glass Transition Temperature
2 4
INDEXINDEXABBREVIATIONABBREVIATION
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Dow encourages its customers to
review their applications of Dow prod-
ucts from the standpoint of human
health and environmental quality. To
help ensure that Dow products are not
used in ways for which they are not
intended or tested, Dow personnel
will assist customer s in dealing with
ecological and product safety considera-
tions. Your Dow sales repres entative
STEWARDSHIP
can arrange th e proper contacts. Dow
product literature, including Material
Safety Data Sheets (MSDS), should
be consulted prior to use of Dow
products. These may be obtained
from your Dow sales representative,
or by calling 1-800-441-4369 or
1-517-832-1426. In Mexico,
call 95-800-441-4369.
PRODUCTPRODUCTSTEWARDSHIP
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NOTICE: No freedom from any patent owned by Seller or others is to be inferred. Because use conditions and applicable laws may differ from one location toanother and may change with time, Customer is responsible for determining whether products and the information in this document are appropriate forCustomer’s use and for ensuring that Customer’s workplace and disposal practices are in compliance with applicable laws and other governmental enactments.Seller assumes no obligation or liability for the information in this document. NO WARRANTIES ARE GIVEN; ALL IMPLIED WARRANTIES OFMERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE ARE EXPRESSLY EXCLUDED.
Published October 1998
For additional informationin the U.S. and Canada, call
1-800-441-4369 or 1-517-832-1426.
In Mexico,call 95-800-441-4369.
The Dow Chemical Company, 2040 Dow Center, Midland, MI 48674
Dow Chemical Canada Inc., 1086 Modeland Rd., P.O. Box 1012, Sarnia, Ontario, N7T 7K7, Canada
Dow Quimica Mexicana, S.A. de C.V., Torre Optima - Mezzanine, Av. Paseo de Las Palmas No. 405, Col. Lomas de
Chapultepec, 11000 Mexico, D.F., Mexico
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