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    SJTU J. Chen 103/06/13

    Physical Operation of Diodes

    Chapter 3 DiodesChapter 3 Diodes

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    Part 1. Physical operation of diodesPart 2. Analysis of diode circuits and

    applications of diodes

    Content

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    Linear and Nonlinear Devices

    So far, almost all the devices we have learnt arelinear

    Many signal-processing functions, however, are

    implemented by nonlineardevices

    Linear amplifier Nonlinear amplifier

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    Diode and its physical structure

    The diode is the simplest and most fundamentalnonlinearcircuit element

    The most important region is the boundary

    between n-type andp-type semiconductor, whichis calledpn junction

    pn junction

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    Symbol and characteristic for the ideal diode

    (a) diode circuit symbol

    + v -

    iAnode Cathode

    (b) iv characteristic

    ---Reverse bias--- ---Forward bias---

    i

    0 v

    (c) equivalent circuit

    in the reverse direction

    v < 0i=0

    i

    + v -

    i

    (d) equivalent circuit

    in the forward direction

    i > 0v =0

    + v -

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    How does it happen?

    To answer the question, we need to know: Material, structure and the related features

    (crystal and semiconductor in particular)

    New particles to carry charge in addition toelectrons

    New mechanism(s) of conduction in addition to

    what we have known

    Techniques to manufacture the devices (not

    included in this course)

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    Basic semiconductor concepts

    Intrinsic Semiconductor ( )Doped Semiconductor ( )

    Carriers ( )

    Diffusion ( ), Drift ( )

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    Elements and material

    Periodic table

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    Material and structure

    Structure is another important factor to determine thephysical and chemical characteristics of the material allotrope( ), e.g.

    graphite diamond

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    Different features and different applications

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    Material structure: crystal and noncrystal

    Crystal Regular shape, fixed freezing temperature, fixed boiling

    point, etc.

    Why? Regular lattice structure Atoms can not tell from each other: they behave uniquely

    In noncrystal, however, the atoms of the same element

    usually play different roles, e.g. Polymer

    aromatic hydrogen bondsaromatic hydrogen bonds

    ((

    ))

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    Energy band

    Energy band also reflects the material

    property

    Energy

    level

    11 =ns

    s

    p

    2

    2 } 1n

    (a) Singular atom

    Energy

    level

    s1

    s

    p

    2

    2

    distance

    (b) Splitting of energy levels for 8 atoms

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    Transition

    The movement of electrons between the energy

    bands is call transition.

    Transition is always accompanied with energy

    change (absorption or emission of photons

    and/or phonons, temperature change, etc.)

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    e.g.

    Ev( )

    Ec( )

    Eg = Ec - Ev

    Photon energy h=Eg(h: Planck const. : Freq.)

    Absorption of a photon

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    Silicon and Germanium

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    Silicon /

    IV element

    Each atom is bound with four neighbors via Covalent

    Bond

    Its atomic structure is tetrahedron( )

    Monocrystalline silicon polycrystalline silicon

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    Atomic structure of silicon

    Tetrahedron( )

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    2-D representation of the silicon crystal

    +4

    +4

    +4

    +4

    +4

    +4

    +4

    +4

    ValenceValence

    electronselectronsSiliconSilicon

    atomsatomsCovalentCovalent

    bondbond

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    Carriers

    Free electron ---produced by thermal

    ionization. It can move freely in the lattice

    structure so as to form current

    Hole---empty position in broken covalent

    bond. It can also move freely to form

    current

    http://var/www/apps/conversion/tmp/scratch_1/?????????.exehttp://var/www/apps/conversion/tmp/scratch_1/?????????.exe
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    Carrier concentration in thermalequilibrium

    where

    (k: Boltzmann constant)

    At room temperature (T=300K) for Si,

    inpn ==

    kTE

    iGeBTn

    =

    32

    10 31.5 10 ( )in cm

    Carrier concentration

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    strongly depends on temperature. The

    high the temperature is, the dramatically

    great the carrier concentration is

    At room temperature only one of everybillion atoms is ionized

    Silicons conductivity is between that of

    conductors and insulators. Actually thecharacteristic of intrinsic silicon approaches

    to insulators

    in

    Important notes

    31

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    Conductivity of the semiconductor can besignificantly changed by doping.

    There are two types of doped semiconductors: n type

    andp type.

    They are used to formpn junction.

    Doped semiconductor

    32

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    Doped semiconductorn type

    P

    Si

    Si Si Si Si Si Si Si

    Si Si Si Si Si Si Si

    Si Si Si Si Si Si Si

    Si Si Si Si Si Si Si

    Si Si Si Si SiSi+

    Free E

    DonorDonor

    bound chargebound charge

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    Carrier concentration forn type

    In a n type Si, the following relationships hold (atroom temperature):

    and

    0 0

    0 0

    n i n

    n n i

    n n p

    n p n

    >> >>

    + >>

    0

    2

    0 /

    n D

    n i D

    n Np n N

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    Acceptor--- trivalent impurity provides holes (usuallyentirely ionized)

    Negative bound charge--- impurity atom accepting hole

    give rise to negative bound charge

    Majority carriers---holes (mostly generated by ionized

    acceptor and a tiny small portion by thermal ionization)

    Minority carriers--- free electrons (only generated by

    thermal ionization.)

    p type semiconductor

    38

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    Thermal equilibrium equation

    Electric neutral equation

    2

    0 0p p ip n n =

    0 0p p Ap n N= +

    Carrier concentration forp type

    whereNA is the acceptor concentration

    39

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    Carrier concentration forp type

    In ap type Si, the following relationships hold (atroom temperature):

    and

    0 0

    0 0

    p i p

    p p i

    p n n

    p n n

    >> >>

    + >>

    0

    2

    0 /

    p A

    p i A

    p Nn n N

    40

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    Majority carrier is only determined by the

    impurity. It is independent of temperature.

    Minority carrier is strongly affected by

    temperature.

    If the temperature is high enough, the

    characteristic of doped semiconductor will

    decline to that of intrinsic semiconductor

    Conclusion on the doped semiconductor

    41

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    Onp type semiconductor (substrate), n type

    semiconductor can be formed by injecting

    donors with into the specific area.

    or reversely.

    AD NN >>

    Doping compensation

    NA

    ND+

    ND

    NA+

    42

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    The boundary between n andp typesemiconductor is thepn junction.

    This is the basic step for VLSI fabrication

    technology.

    Doping compensation

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    Semiconductor materials

    III-V:

    Gallium arsenide (GaAs)---used

    for microwave circuits

    InP---used for optoelectronics

    II-VI: used for luminescence, IF, etc.

    IV:

    Silicon---todays IC technology is based entirely on silicon

    Germanium---early used

    45

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    There are two mechanisms for holes and freeelectrons to move in the silicon crystal.

    Drift The carrier motion is generated by the electrical field

    across a piece of silicon. This motion will produce driftcurrent.

    Diffusion The carrier motion is generated by the different

    concentration of carrier in a piece of silicon. The diffused

    motion of carriers from higher concentration to lower onewill give rise to diffusion current

    Carriers movement

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    iff i d diff i

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    diffusion

    A bar of intrinsic silicon (a) in which the hole concentration profile

    shown in (b) has been created along thex-axis by some unspecified

    mechanism.

    Diffusion and diffusion current

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    Einstein relationship exists between thecarrier diffusivity and mobility:

    where VT is thermal voltage( ), At

    room temperature

    q

    kTV

    DDT

    p

    p

    n

    n ===

    25TV mv;

    Einstein relationship

    53

    J i

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    Thepn junction under open-circuit

    condition

    I-V characteristic ofpn junction

    Terminal characteristic of junction diode.

    Physical operation of diode.

    Junction capacitance

    pn Junction

    54

    J i

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    Usually thepn junction is asymmetric,p+

    n orpn+

    The superscript + denotes the region of

    more heavily doped in comparison with theother region

    pn Junction

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    i d i i di i

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    (a) thepn junction without

    applied voltage (open-

    circuited terminals)

    (b) the potential distribution alongan axis perpendicular to the

    junction.

    pn Junction under open-circuit condition

    57

    P d f f i j i

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    The procedure of formingpn: the dynamic equilibrium of

    drift and diffusion movements for carriers in the silicon:

    Procedure of formingpn junction

    Diffusion

    Space charge

    Drift

    Equilibrium

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    P d f f i j ti

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    Space charge region Recombining of electrons and holes results in thedisappearance of carriers (depletion)

    Bound charges are no longer neutralized by majority

    carriers and are then uncovered.

    There is a region close to the junction where majority

    carriers on both side are depleted and there are

    uncovered bound charges of different polarity

    This region is called carrier-depletion region( ) or space charge region( ). It acts asa barrier( ) preventing the majority carriersfrom further diffusion

    Procedure of formingpn junction

    60

    P d f f i j ti

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    Drift Electric field is established across the space

    charge region.

    Direction of electronic field is from n side top

    side. It helps minority carriers drift through the

    junction. The direction of drift current is from n

    side top side.

    Procedure of formingpn junction

    61

    P d f f i j ti

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    Equilibrium Two opposite currents across the junction is equal

    in magnitude.

    No net current flows across thepn junction.

    Equilibrium condition is maintained by the

    barrier voltage.

    Procedure of formingpn junction

    62

    J ti b ilt i lt

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    The junction built-in voltage( )

    It depends on doping concentration and

    temperature

    Its TC is negative.

    2ln

    i

    DATo

    n

    NNVV =

    Junction built-in voltage

    63

    Width of the depletion region

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    Width of the Depletion Region:

    Depletion region exists almost entirely on the slightlydoped side.

    Width depends on the voltage across the junction.

    o

    DA

    depo VNNq

    W )11

    (2

    +=

    ))11(2 VVNNq

    W oDA

    dep +=

    Width of the depletion region

    64

    I V Characteristics

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    The diode iv relationship with some scales expanded

    and others compressed in order to reveal details

    I-V Characteristics

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    Th j ti d f d bi

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    Thepnjunctionexcited by a constant-

    current source

    supplying a currentIin

    the forward direction.

    The depletion layer

    narrows and the barrier

    voltage decreases by V

    volts, which appears as

    an external voltage in

    the forward direction.

    Thepn junction under forward-bias

    http://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/??/2007?PPT/Chapter%201/PN???????????.exehttp://var/www/apps/conversion/??/2007?PPT/Chapter%201/PN???????????.exehttp://var/www/apps/conversion/??/2007?PPT/Chapter%201/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exe
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    Total current under forward bias

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    0 0 2

    ( ) (( ) ( )

    ( )( 1) ( )( 1)

    ( 1)

    n p

    T T

    T

    pD nD pD nD

    x x x x

    V Vp n n p pV Vn

    i

    p n p D n A

    VV

    s

    dp x dn xI I I A J J A q qdx dx

    D p D n D DqA e qAn e

    L L L n L n

    I e

    = =

    = + = + = +

    = + = +

    =

    Total current under forward-bias

    where

    Is---saturation current

    A---junction cross-sectional area

    70

    I V characteristic equation

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    Nonlinear (exponential relationship)

    Is (saturation current) strongly depends on temperature

    n=1 or 2, in general n=1

    1)Tv nVs

    i I e

    I-V characteristic equation

    e.g. assuming V1atI1 and V2 atI2, then:

    For a decade changes in current, the diode voltage drop changes by

    60mv (for n=1) or 120mv (for n=2)

    2 2

    2 1 1 1

    ln 2.3 lgT T

    I IV V nV nV

    I I= =

    71

    Turn on voltage

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    A conduction diode has approximately a constant voltage

    drop across it. Its called turn-on voltage.

    Diodes with different current rating will exhibit the turn-onvoltage at different currents.

    Negative TC,

    VV

    VV

    onD

    onD

    25.0

    7.0

    )(

    )(

    =

    = For silicon

    For germanium

    CmvTC /2=

    Turn-on voltage

    72

    The pn junction under reverse bias

    http://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exe
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    Thepn junction excited by aconstant-current sourceI in the

    reverse direction.

    To avoid breakdown,I is kept

    smaller thanIS.

    Note that the depletion layer

    widens and the barrier voltage

    increases by VRvolts, which

    appearsbetween the terminals

    as a reverse voltage.

    Thepn junction under reverse-bias

    73

    Carrier distribution under reverse bias

    http://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/??/2007?PPT/Chapter%201/PN???????????.exehttp://var/www/apps/conversion/??/2007?PPT/Chapter%201/PN???????????.exehttp://var/www/apps/conversion/??/2007?PPT/Chapter%201/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exe
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    Carrier distribution under reverse-bias

    UR

    pn0

    nn0pp0

    np0 x

    p-typearea

    n-type

    area

    74

    I-V characteristic equation

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    whereIsis the saturation current. It is proportional to ni2,

    which is a strong function of temperature.

    sIi=

    )(

    )(

    2

    00

    An

    n

    Dp

    p

    i

    n

    pn

    p

    np

    s

    nL

    D

    nL

    D

    qAn

    L

    nD

    L

    pDqAI

    +=

    +=

    Independent of voltage

    I-V characteristic equation

    75

    The pn junction in the breakdown region

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    Thepnjunction excited by a reverse-current sourceI,whereI> IS

    Thepn junction in the breakdown region

    The junction breaks down, and a voltage VZ, with the

    polarity indicated, develops across the junction.

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    Breakdown mechanisms

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    Remember:pn junction breakdown is not a destructive

    process, provided that the maximum specified

    power dissipation is not exceeded.

    Breakdown mechanisms

    78

    Zener Diode

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    Circuit symbol

    The diode ivcharacteristic

    with the breakdown region

    shown in some detail.

    Zener Diode

    79

    Junction Capacitance

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    Diffusion Capacitance Charge stored in bulk region changes with the change of

    voltage acrosspn junction gives rise to capacitive effect

    Small-signal diffusion capacitance

    Junction Capacitance

    CCdd,,

    80

    Junction Capacitance

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    Depletion capacitance Charge stored in depletion layer

    changes with the change of voltage

    acrosspn junction, which gives rise

    to capacitive effect. Small-signal depletion capacitance

    Junction Capacitance

    UURR

    UURR++UU

    CCbb

    PNPN

    81

    Diffusion Capacitance

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    Diffusion Capacitance

    According to the definition:

    The charge stored in bulk region is obtained from the following

    equations:

    Qd dV

    dQC =

    pp

    pnonn

    xnonp

    I

    LpxpAq

    dxpxpAqQn

    =

    =

    =

    ])([

    ])([

    nnn IQ =

    82

    Diffusion Capacitance

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    The expression for diffusion capacitance:

    Forward-bias, linear relationship

    Reverse-bias, almost inexistence

    =

    =

    0

    )(

    )(

    ][

    Q

    T

    T

    Q

    T

    T

    VV

    sTd

    IV

    IV

    eIdV

    dC T

    Diffusion Capacitance

    83

    Depletion Capacitance

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    According to the definition:

    Actually this capacitance is similar to parallel plate

    capacitance.

    QR VVR

    j dVdQC

    =

    =

    )1(

    ))(11

    (2

    [

    0

    0

    o

    R

    j

    R

    BA

    dep

    j

    VV

    C

    vVNNq

    A

    W

    AC

    +

    =

    ++

    =

    Depletion Capacitance

    84

    Depletion Capacitance

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    A more general formula for depletion capacitanceis :

    where m is called grading coefficient.

    If the concentration changes sharply,

    mR

    j

    j V

    CC

    )V

    1(0

    0

    +

    =

    2

    1~3

    1=m

    2

    1=m

    Depletion Capacitance

    85

    Junction Capacitance

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    Remember:

    a) Diffusion and depletion capacitances are

    incremental capacitances, only are applied under the

    small-signal circuit condition.

    b) They are not constants, they have relationship withthe voltage across the pn junction.

    Junction Capacitance

    86

    Summary

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    Summary

    Si and Ge are IV elements with tetrahedronatomic structure

    They can be used to manufacture various

    devicesSi is dominant because

    better thermal stability due to large bandgap

    abundant (27 % in the Earth) and cheap

    87

    Summary

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    When you find yourself competingwith silicon, dont.

    Arno Penzias, joined Bell Lab in 1961 best known for his work in radio astronomy,

    winning a Nobel Prize in 1978 for research thatenabled a better understanding of the origins of theuniverse.

    Tingye Li, joined Bell Lab in 1957 a world-renowned scientist in the fields of microwaves,

    lasers and optical communications. His innovational work

    on lightwave communications has had a far-reaching

    impact on information technology for decades

    Summary

    88

    Homework

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    Homework

    February 21 1.3 1.10 1.14 1.27

    February 28

    3.33 3.35 3.36 3.39 3.42

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    Part 2. Analysis of diode circuitsand applications of diodes

    90

    Analysis of Diode Circuit

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    Models Mathematic model

    Circuit model

    Methods of analysis Graphical analysis

    Iterative analysis

    Modeling analysis

    y

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    92

    The Diode Models

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    Mathematic Model

    The circuit models are derived by approximating

    the curve into piecewise-line.

    =

    s

    nVv

    s

    nVv

    s

    I

    eI

    eIi

    T

    T )1(

    Forward biased

    Reverse biased

    93

    The Diode Models

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    Circuit Modela) Simplified diode model

    b) The constant-voltage-drop model

    c) Small-signal model

    d) High-frequency model

    e) Zener Diode Model

    94

    Ideal Diode Model

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    Forward bias

    short circuitReverse biasopen circuit

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    96

    Simplified Diode Model

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    Piecewise-linear model of the diode forward characteristic and its

    equivalent circuit representation.

    p

    97

    Constant-Voltage-Drop Model

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    The constant-voltage-drop model of the diode forward characteristics

    and its equivalent-circuit representation.

    g p

    98

    Small-Signal Model

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    Development of the diode small-signal

    model. Note that the numerical values shown

    are for a diode with n = 2.

    g

    rd

    99

    Small-Signal Model

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    Incremental resistance:

    *The signal amplitude sufficiently small such

    that the excursion at Q along the i-v curve is

    limited to a short, almost linear segment.

    )2,1(, == nI

    nVr

    DQ

    Td

    g

    100

    High-Frequency Model

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    High frequency model

    Related to the bias

    Unable to be simply substitute by ideal ones.

    g q y

    101

    Zener Diode Model

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    ZZZZrIVV +=

    0

    102

    Method of Analysis

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    Graphical Analysis Load line

    Diode characteristic

    Q operating pointVisualization

    103

    Load line

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    RL

    i

    v

    i

    v

    VDD/R

    VDD

    Slope= -1/RL

    104

    Method of Analysis

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    Iterative analysis

    Refer to example 3.4 (p.158)

    Model Analysis

    Refer to example 3.6 (p.167) and 3.7

    (p.169)

    105

    The Application of Diode Circuits

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    Rectifier circuits Half-wave rectifier

    Full-wave rectifier

    The peak rectifier

    Voltage regulatorLimiter

    106

    Half-Wave Rectifier

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    (a) Half-wave rectifier.

    (b) Equivalent circuit of the half-wave rectifier with the diode replaced byits battery-plus-resistance model.

    107

    Half-Wave Rectifier

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    (c)Transfer characteristic of the rectifier circuit.

    (d) Input and output waveforms, assuming that RrD

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    In selecting diodes for rectifier design, two

    important parameters must be specified:

    The current-handling capability

    The peak inverse voltage (PIV)

    It is usually prudent, however, to select a

    diode that has a reverse breakdown voltage at

    least 50% greater than the expected PIV.

    109

    Full-Wave Rectifier

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    Transformer with a center-tapped secondary

    winding

    Bridge rectifier

    110

    Full-Wave Rectifier

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    (a) circuit

    (b) transfer characteristic assuming a constant-voltage-drop model for

    the diodes

    111

    Full-Wave Rectifier

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    (c) input and output waveforms.

    112

    The Bridge Rectifier

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    (a) circuit

    113

    The Bridge Rectifier

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    (b) input and output waveforms

    114

    Peak Rectifier

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    The pulsating nature of the output voltage

    produced by the rectifier circuits discussed

    above makes it unsuitable as a dc supply for

    electronic circuits.

    A simple way to reduce the variation of the

    output voltage is to place a capacitor across

    the load resistor.

    115

    Peak Rectifier

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    TCR >>

    Thefilter capacitorserves to reduce substantially the

    variations in the rectifier output

    116

    Peak Rectifier

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    Voltage and current

    waveforms in the peak

    rectifier circuit with .

    The diode is assumed ideal.

    TCR >>

    117

    Peak Rectifier

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    Waveforms in the full-wave peak rectifier.

    118

    Self-study

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    3.8 Limiting and clamping circuits

    3.9 Special diode types

    3.10 The SPICE diode model and simulation

    examples

    119

    SUMMARY

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    The silicon junction diode is basically apn junction. Such a

    junction is formed in a single silicon crystal.

    The unidirectional-current-flow property makes the diode

    useful

    A silicon diode conducts a negligible current until the

    forward voltage is at least 0.5 V. Then the current increasesrapidly, with the voltage drop increasing by 60 mV to 120 mV

    (depending on the value ofn) for every decade of current

    change.

    120

    SUMMARY

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    The forward conduction of practical silicon diodes

    is accurately characterized by the relationship:

    T

    vnV

    si I e=

    121

    SUMMARY

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    In the reverse direction, a silicon diode

    conducts a current on the order of 10-9A.

    This current is much greater thanIs and

    increases with the magnitude of reverse

    voltage.

    122

    SUMMARY

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    Beyond a certain value of reverse voltage

    (that depends on the diode) breakdown

    occurs, and current increases rapidly with a

    small corresponding increase in voltage.

    123

    SUMMARY

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    A hierarchy of diode models exists, with the

    selection of an appropriate model dictated by

    the application.

    In many applications, a conducting diode is

    modeled as having a constant voltage drop,

    usually about 0.7V.

    124

    Homework

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    March 7, 2011

    3.4 3.9 3 .22 3.74 3.84