Zener Diodes Working
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Transcript of Zener Diodes Working
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SJTU J. Chen 103/06/13
Physical Operation of Diodes
Chapter 3 DiodesChapter 3 Diodes
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Part 1. Physical operation of diodesPart 2. Analysis of diode circuits and
applications of diodes
Content
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Linear and Nonlinear Devices
So far, almost all the devices we have learnt arelinear
Many signal-processing functions, however, are
implemented by nonlineardevices
Linear amplifier Nonlinear amplifier
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Diode and its physical structure
The diode is the simplest and most fundamentalnonlinearcircuit element
The most important region is the boundary
between n-type andp-type semiconductor, whichis calledpn junction
pn junction
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Symbol and characteristic for the ideal diode
(a) diode circuit symbol
+ v -
iAnode Cathode
(b) iv characteristic
---Reverse bias--- ---Forward bias---
i
0 v
(c) equivalent circuit
in the reverse direction
v < 0i=0
i
+ v -
i
(d) equivalent circuit
in the forward direction
i > 0v =0
+ v -
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How does it happen?
To answer the question, we need to know: Material, structure and the related features
(crystal and semiconductor in particular)
New particles to carry charge in addition toelectrons
New mechanism(s) of conduction in addition to
what we have known
Techniques to manufacture the devices (not
included in this course)
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Basic semiconductor concepts
Intrinsic Semiconductor ( )Doped Semiconductor ( )
Carriers ( )
Diffusion ( ), Drift ( )
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Elements and material
Periodic table
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Material and structure
Structure is another important factor to determine thephysical and chemical characteristics of the material allotrope( ), e.g.
graphite diamond
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Different features and different applications
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Material structure: crystal and noncrystal
Crystal Regular shape, fixed freezing temperature, fixed boiling
point, etc.
Why? Regular lattice structure Atoms can not tell from each other: they behave uniquely
In noncrystal, however, the atoms of the same element
usually play different roles, e.g. Polymer
aromatic hydrogen bondsaromatic hydrogen bonds
((
))
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Energy band
Energy band also reflects the material
property
Energy
level
11 =ns
s
p
2
2 } 1n
(a) Singular atom
Energy
level
s1
s
p
2
2
distance
(b) Splitting of energy levels for 8 atoms
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Transition
The movement of electrons between the energy
bands is call transition.
Transition is always accompanied with energy
change (absorption or emission of photons
and/or phonons, temperature change, etc.)
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e.g.
Ev( )
Ec( )
Eg = Ec - Ev
Photon energy h=Eg(h: Planck const. : Freq.)
Absorption of a photon
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Silicon and Germanium
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Silicon /
IV element
Each atom is bound with four neighbors via Covalent
Bond
Its atomic structure is tetrahedron( )
Monocrystalline silicon polycrystalline silicon
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Atomic structure of silicon
Tetrahedron( )
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2-D representation of the silicon crystal
+4
+4
+4
+4
+4
+4
+4
+4
ValenceValence
electronselectronsSiliconSilicon
atomsatomsCovalentCovalent
bondbond
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Carriers
Free electron ---produced by thermal
ionization. It can move freely in the lattice
structure so as to form current
Hole---empty position in broken covalent
bond. It can also move freely to form
current
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Carrier concentration in thermalequilibrium
where
(k: Boltzmann constant)
At room temperature (T=300K) for Si,
inpn ==
kTE
iGeBTn
=
32
10 31.5 10 ( )in cm
Carrier concentration
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strongly depends on temperature. The
high the temperature is, the dramatically
great the carrier concentration is
At room temperature only one of everybillion atoms is ionized
Silicons conductivity is between that of
conductors and insulators. Actually thecharacteristic of intrinsic silicon approaches
to insulators
in
Important notes
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Conductivity of the semiconductor can besignificantly changed by doping.
There are two types of doped semiconductors: n type
andp type.
They are used to formpn junction.
Doped semiconductor
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Doped semiconductorn type
P
Si
Si Si Si Si Si Si Si
Si Si Si Si Si Si Si
Si Si Si Si Si Si Si
Si Si Si Si Si Si Si
Si Si Si Si SiSi+
Free E
DonorDonor
bound chargebound charge
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Carrier concentration forn type
In a n type Si, the following relationships hold (atroom temperature):
and
0 0
0 0
n i n
n n i
n n p
n p n
>> >>
+ >>
0
2
0 /
n D
n i D
n Np n N
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Acceptor--- trivalent impurity provides holes (usuallyentirely ionized)
Negative bound charge--- impurity atom accepting hole
give rise to negative bound charge
Majority carriers---holes (mostly generated by ionized
acceptor and a tiny small portion by thermal ionization)
Minority carriers--- free electrons (only generated by
thermal ionization.)
p type semiconductor
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Thermal equilibrium equation
Electric neutral equation
2
0 0p p ip n n =
0 0p p Ap n N= +
Carrier concentration forp type
whereNA is the acceptor concentration
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Carrier concentration forp type
In ap type Si, the following relationships hold (atroom temperature):
and
0 0
0 0
p i p
p p i
p n n
p n n
>> >>
+ >>
0
2
0 /
p A
p i A
p Nn n N
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Majority carrier is only determined by the
impurity. It is independent of temperature.
Minority carrier is strongly affected by
temperature.
If the temperature is high enough, the
characteristic of doped semiconductor will
decline to that of intrinsic semiconductor
Conclusion on the doped semiconductor
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Onp type semiconductor (substrate), n type
semiconductor can be formed by injecting
donors with into the specific area.
or reversely.
AD NN >>
Doping compensation
NA
ND+
ND
NA+
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The boundary between n andp typesemiconductor is thepn junction.
This is the basic step for VLSI fabrication
technology.
Doping compensation
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Semiconductor materials
III-V:
Gallium arsenide (GaAs)---used
for microwave circuits
InP---used for optoelectronics
II-VI: used for luminescence, IF, etc.
IV:
Silicon---todays IC technology is based entirely on silicon
Germanium---early used
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There are two mechanisms for holes and freeelectrons to move in the silicon crystal.
Drift The carrier motion is generated by the electrical field
across a piece of silicon. This motion will produce driftcurrent.
Diffusion The carrier motion is generated by the different
concentration of carrier in a piece of silicon. The diffused
motion of carriers from higher concentration to lower onewill give rise to diffusion current
Carriers movement
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iff i d diff i
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diffusion
A bar of intrinsic silicon (a) in which the hole concentration profile
shown in (b) has been created along thex-axis by some unspecified
mechanism.
Diffusion and diffusion current
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Einstein relationship exists between thecarrier diffusivity and mobility:
where VT is thermal voltage( ), At
room temperature
q
kTV
DDT
p
p
n
n ===
25TV mv;
Einstein relationship
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J i
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Thepn junction under open-circuit
condition
I-V characteristic ofpn junction
Terminal characteristic of junction diode.
Physical operation of diode.
Junction capacitance
pn Junction
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J i
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Usually thepn junction is asymmetric,p+
n orpn+
The superscript + denotes the region of
more heavily doped in comparison with theother region
pn Junction
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i d i i di i
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(a) thepn junction without
applied voltage (open-
circuited terminals)
(b) the potential distribution alongan axis perpendicular to the
junction.
pn Junction under open-circuit condition
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P d f f i j i
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The procedure of formingpn: the dynamic equilibrium of
drift and diffusion movements for carriers in the silicon:
Procedure of formingpn junction
Diffusion
Space charge
Drift
Equilibrium
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P d f f i j ti
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Space charge region Recombining of electrons and holes results in thedisappearance of carriers (depletion)
Bound charges are no longer neutralized by majority
carriers and are then uncovered.
There is a region close to the junction where majority
carriers on both side are depleted and there are
uncovered bound charges of different polarity
This region is called carrier-depletion region( ) or space charge region( ). It acts asa barrier( ) preventing the majority carriersfrom further diffusion
Procedure of formingpn junction
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P d f f i j ti
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Drift Electric field is established across the space
charge region.
Direction of electronic field is from n side top
side. It helps minority carriers drift through the
junction. The direction of drift current is from n
side top side.
Procedure of formingpn junction
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P d f f i j ti
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Equilibrium Two opposite currents across the junction is equal
in magnitude.
No net current flows across thepn junction.
Equilibrium condition is maintained by the
barrier voltage.
Procedure of formingpn junction
62
J ti b ilt i lt
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The junction built-in voltage( )
It depends on doping concentration and
temperature
Its TC is negative.
2ln
i
DATo
n
NNVV =
Junction built-in voltage
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Width of the depletion region
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Width of the Depletion Region:
Depletion region exists almost entirely on the slightlydoped side.
Width depends on the voltage across the junction.
o
DA
depo VNNq
W )11
(2
+=
))11(2 VVNNq
W oDA
dep +=
Width of the depletion region
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I V Characteristics
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The diode iv relationship with some scales expanded
and others compressed in order to reveal details
I-V Characteristics
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Th j ti d f d bi
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Thepnjunctionexcited by a constant-
current source
supplying a currentIin
the forward direction.
The depletion layer
narrows and the barrier
voltage decreases by V
volts, which appears as
an external voltage in
the forward direction.
Thepn junction under forward-bias
http://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/??/2007?PPT/Chapter%201/PN???????????.exehttp://var/www/apps/conversion/??/2007?PPT/Chapter%201/PN???????????.exehttp://var/www/apps/conversion/??/2007?PPT/Chapter%201/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exe -
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Total current under forward bias
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0 0 2
( ) (( ) ( )
( )( 1) ( )( 1)
( 1)
n p
T T
T
pD nD pD nD
x x x x
V Vp n n p pV Vn
i
p n p D n A
VV
s
dp x dn xI I I A J J A q qdx dx
D p D n D DqA e qAn e
L L L n L n
I e
= =
= + = + = +
= + = +
=
Total current under forward-bias
where
Is---saturation current
A---junction cross-sectional area
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I V characteristic equation
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Nonlinear (exponential relationship)
Is (saturation current) strongly depends on temperature
n=1 or 2, in general n=1
1)Tv nVs
i I e
I-V characteristic equation
e.g. assuming V1atI1 and V2 atI2, then:
For a decade changes in current, the diode voltage drop changes by
60mv (for n=1) or 120mv (for n=2)
2 2
2 1 1 1
ln 2.3 lgT T
I IV V nV nV
I I= =
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Turn on voltage
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A conduction diode has approximately a constant voltage
drop across it. Its called turn-on voltage.
Diodes with different current rating will exhibit the turn-onvoltage at different currents.
Negative TC,
VV
VV
onD
onD
25.0
7.0
)(
)(
=
= For silicon
For germanium
CmvTC /2=
Turn-on voltage
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The pn junction under reverse bias
http://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exe -
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Thepn junction excited by aconstant-current sourceI in the
reverse direction.
To avoid breakdown,I is kept
smaller thanIS.
Note that the depletion layer
widens and the barrier voltage
increases by VRvolts, which
appearsbetween the terminals
as a reverse voltage.
Thepn junction under reverse-bias
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Carrier distribution under reverse bias
http://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exehttp://var/www/apps/conversion/??/2007?PPT/Chapter%201/PN???????????.exehttp://var/www/apps/conversion/??/2007?PPT/Chapter%201/PN???????????.exehttp://var/www/apps/conversion/??/2007?PPT/Chapter%201/PN???????????.exehttp://var/www/apps/conversion/tmp/scratch_1/PN???????????.exe -
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Carrier distribution under reverse-bias
UR
pn0
nn0pp0
np0 x
p-typearea
n-type
area
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I-V characteristic equation
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whereIsis the saturation current. It is proportional to ni2,
which is a strong function of temperature.
sIi=
)(
)(
2
00
An
n
Dp
p
i
n
pn
p
np
s
nL
D
nL
D
qAn
L
nD
L
pDqAI
+=
+=
Independent of voltage
I-V characteristic equation
75
The pn junction in the breakdown region
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Thepnjunction excited by a reverse-current sourceI,whereI> IS
Thepn junction in the breakdown region
The junction breaks down, and a voltage VZ, with the
polarity indicated, develops across the junction.
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Breakdown mechanisms
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Remember:pn junction breakdown is not a destructive
process, provided that the maximum specified
power dissipation is not exceeded.
Breakdown mechanisms
78
Zener Diode
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Circuit symbol
The diode ivcharacteristic
with the breakdown region
shown in some detail.
Zener Diode
79
Junction Capacitance
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Diffusion Capacitance Charge stored in bulk region changes with the change of
voltage acrosspn junction gives rise to capacitive effect
Small-signal diffusion capacitance
Junction Capacitance
CCdd,,
80
Junction Capacitance
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Depletion capacitance Charge stored in depletion layer
changes with the change of voltage
acrosspn junction, which gives rise
to capacitive effect. Small-signal depletion capacitance
Junction Capacitance
UURR
UURR++UU
CCbb
PNPN
81
Diffusion Capacitance
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Diffusion Capacitance
According to the definition:
The charge stored in bulk region is obtained from the following
equations:
Qd dV
dQC =
pp
pnonn
xnonp
I
LpxpAq
dxpxpAqQn
=
=
=
])([
])([
nnn IQ =
82
Diffusion Capacitance
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The expression for diffusion capacitance:
Forward-bias, linear relationship
Reverse-bias, almost inexistence
=
=
0
)(
)(
][
Q
T
T
Q
T
T
VV
sTd
IV
IV
eIdV
dC T
Diffusion Capacitance
83
Depletion Capacitance
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According to the definition:
Actually this capacitance is similar to parallel plate
capacitance.
QR VVR
j dVdQC
=
=
)1(
))(11
(2
[
0
0
o
R
j
R
BA
dep
j
VV
C
vVNNq
A
W
AC
+
=
++
=
Depletion Capacitance
84
Depletion Capacitance
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A more general formula for depletion capacitanceis :
where m is called grading coefficient.
If the concentration changes sharply,
mR
j
j V
CC
)V
1(0
0
+
=
2
1~3
1=m
2
1=m
Depletion Capacitance
85
Junction Capacitance
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Remember:
a) Diffusion and depletion capacitances are
incremental capacitances, only are applied under the
small-signal circuit condition.
b) They are not constants, they have relationship withthe voltage across the pn junction.
Junction Capacitance
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Summary
Si and Ge are IV elements with tetrahedronatomic structure
They can be used to manufacture various
devicesSi is dominant because
better thermal stability due to large bandgap
abundant (27 % in the Earth) and cheap
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When you find yourself competingwith silicon, dont.
Arno Penzias, joined Bell Lab in 1961 best known for his work in radio astronomy,
winning a Nobel Prize in 1978 for research thatenabled a better understanding of the origins of theuniverse.
Tingye Li, joined Bell Lab in 1957 a world-renowned scientist in the fields of microwaves,
lasers and optical communications. His innovational work
on lightwave communications has had a far-reaching
impact on information technology for decades
Summary
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Homework
February 21 1.3 1.10 1.14 1.27
February 28
3.33 3.35 3.36 3.39 3.42
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SJTU J. Chen 8903/06/13
Part 2. Analysis of diode circuitsand applications of diodes
90
Analysis of Diode Circuit
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Models Mathematic model
Circuit model
Methods of analysis Graphical analysis
Iterative analysis
Modeling analysis
y
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92
The Diode Models
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Mathematic Model
The circuit models are derived by approximating
the curve into piecewise-line.
=
s
nVv
s
nVv
s
I
eI
eIi
T
T )1(
Forward biased
Reverse biased
93
The Diode Models
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Circuit Modela) Simplified diode model
b) The constant-voltage-drop model
c) Small-signal model
d) High-frequency model
e) Zener Diode Model
94
Ideal Diode Model
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Forward bias
short circuitReverse biasopen circuit
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96
Simplified Diode Model
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Piecewise-linear model of the diode forward characteristic and its
equivalent circuit representation.
p
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Constant-Voltage-Drop Model
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The constant-voltage-drop model of the diode forward characteristics
and its equivalent-circuit representation.
g p
98
Small-Signal Model
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Development of the diode small-signal
model. Note that the numerical values shown
are for a diode with n = 2.
g
rd
99
Small-Signal Model
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Incremental resistance:
*The signal amplitude sufficiently small such
that the excursion at Q along the i-v curve is
limited to a short, almost linear segment.
)2,1(, == nI
nVr
DQ
Td
g
100
High-Frequency Model
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High frequency model
Related to the bias
Unable to be simply substitute by ideal ones.
g q y
101
Zener Diode Model
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ZZZZrIVV +=
0
102
Method of Analysis
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Graphical Analysis Load line
Diode characteristic
Q operating pointVisualization
103
Load line
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RL
i
v
i
v
VDD/R
VDD
Slope= -1/RL
104
Method of Analysis
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Iterative analysis
Refer to example 3.4 (p.158)
Model Analysis
Refer to example 3.6 (p.167) and 3.7
(p.169)
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The Application of Diode Circuits
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Rectifier circuits Half-wave rectifier
Full-wave rectifier
The peak rectifier
Voltage regulatorLimiter
106
Half-Wave Rectifier
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(a) Half-wave rectifier.
(b) Equivalent circuit of the half-wave rectifier with the diode replaced byits battery-plus-resistance model.
107
Half-Wave Rectifier
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(c)Transfer characteristic of the rectifier circuit.
(d) Input and output waveforms, assuming that RrD
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In selecting diodes for rectifier design, two
important parameters must be specified:
The current-handling capability
The peak inverse voltage (PIV)
It is usually prudent, however, to select a
diode that has a reverse breakdown voltage at
least 50% greater than the expected PIV.
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Full-Wave Rectifier
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Transformer with a center-tapped secondary
winding
Bridge rectifier
110
Full-Wave Rectifier
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(a) circuit
(b) transfer characteristic assuming a constant-voltage-drop model for
the diodes
111
Full-Wave Rectifier
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(c) input and output waveforms.
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The Bridge Rectifier
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(a) circuit
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The Bridge Rectifier
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(b) input and output waveforms
114
Peak Rectifier
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The pulsating nature of the output voltage
produced by the rectifier circuits discussed
above makes it unsuitable as a dc supply for
electronic circuits.
A simple way to reduce the variation of the
output voltage is to place a capacitor across
the load resistor.
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Peak Rectifier
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TCR >>
Thefilter capacitorserves to reduce substantially the
variations in the rectifier output
116
Peak Rectifier
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Voltage and current
waveforms in the peak
rectifier circuit with .
The diode is assumed ideal.
TCR >>
117
Peak Rectifier
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Waveforms in the full-wave peak rectifier.
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Self-study
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3.8 Limiting and clamping circuits
3.9 Special diode types
3.10 The SPICE diode model and simulation
examples
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The silicon junction diode is basically apn junction. Such a
junction is formed in a single silicon crystal.
The unidirectional-current-flow property makes the diode
useful
A silicon diode conducts a negligible current until the
forward voltage is at least 0.5 V. Then the current increasesrapidly, with the voltage drop increasing by 60 mV to 120 mV
(depending on the value ofn) for every decade of current
change.
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The forward conduction of practical silicon diodes
is accurately characterized by the relationship:
T
vnV
si I e=
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In the reverse direction, a silicon diode
conducts a current on the order of 10-9A.
This current is much greater thanIs and
increases with the magnitude of reverse
voltage.
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Beyond a certain value of reverse voltage
(that depends on the diode) breakdown
occurs, and current increases rapidly with a
small corresponding increase in voltage.
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A hierarchy of diode models exists, with the
selection of an appropriate model dictated by
the application.
In many applications, a conducting diode is
modeled as having a constant voltage drop,
usually about 0.7V.
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March 7, 2011
3.4 3.9 3 .22 3.74 3.84