YINTR21196 Status of the Power Module Packaging Industry ...
21
© 2021 From Technologies to Markets Status of the Power Module Packaging Industry 2021 Market and Technology Report 2021 Courtesy: Danfoss Sample
Transcript of YINTR21196 Status of the Power Module Packaging Industry ...
© 2021
From Technologies to Markets
Status of the Power Module
Packaging Industry 2021
Market and Technology
Report 2021
Courtesy: Danfoss
Sample
2
Dr. Shalu AGARWAL
Shalu Agarwal, Ph.D., is an analyst specializing in power electronics and materials at Yole Développement (Yole). Shalu is engaged in the development of
technology and market reports as well as the production of custom consulting studies within the Power and Wireless division. She has more than ten
years’ experience in electronic material chemistry. Before joining Yole, Shalu worked as a project manager and research professor in the fields of
electronic materials, batteries, and inorganic chemistry. Shalu received her master’s and Ph.D. in Chemistry from the Indian Institute of Technology (IIT)
Roorkee, India.
E-mail: [email protected]
ABOUT THE AUTHOR
Biography and contact
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
333
• Glossary 2
• Table of contents 3
• Definitions 6
• Report objectives 7
• Scope of the report 8
• Report methodology 9
• About the author 10
• Companies cited in this report 11
• What we got right and what we got wrong 12
• Who should be interested by this report? 13
• Yole Group of companies related reports 14
• Three-page summary 15
• Executive summary 19
o Why this report?
o Market figures
o Market trends
o Supply chain
o Technology trends
• Introduction 61
• Market forecasts 65
o Power modules: what and why?
o Power module market size, in $M
o Comparison between 2020 and 2021 forecast
o Power module market shares ($M) (EV/HEV vs. other applications
o Global power module packaging market
o Power module packaging material market in 2020
o 2020 -2026 power module packaging market evolution –
split by packaging solution
TABLE OF CONTENTS
Part 1/3o Power module packaging market – interconnections
o Power module packaging market – encapsulation
o Power module packaging market – die attach
o Power module packaging market – substrate attach
o Power module packaging market – substrates
o Power module packaging market – baseplates
o Power module packaging market - thermal interface materials
o Takeaways
• Market trends 110
o What is described in this report?
o Driving applications - Historical perspective
o Megatrends in power electronics
o Power electronics and 21st century challenges
o Which power converters are using power modules?
o Power electronics - history, use, and trends
o EVs/HEVs - main trends
o Renewable energy
o Photovoltaics
o Wind
o UPS, motor drives, energy transfer and storage
o Takeaways
• Business model and supply chains analysis 121
o Main power module manufacturers by region
o Packaging players – overview
o Main power module suppliers for photovoltaic applications
o Main power module suppliers for wind applications
o Main power module suppliers for UPS application
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
444
TABLE OF CONTENTS
Part 2/3
o Main power module suppliers for motor drives application
o Main power module suppliers for rail application
o EV/HEV ecosystem
o Power module components suppliers
o Interconnection manufacturers
o Encapsulation manufacturers
o Die and substrate attach manufacturers
o Thermal interface material manufacturers
o Baseplate manufacturers
o Ceramic substrate manufacturers
o Insulated metal substrate (IMS) manufacturers
o Intelligent power module manufacturers
o Equipment manufacturers
o Power module packaging process flow
o Top power module components manufacturers
o Trends towards power module standardization and its impact on the supply
chain
o Examples of innovative power module packaging solutions
o Supply chain movement
o Diversification of reduction by manufacturing in countries with a low
cost of production
o Geographical expansion
o Supply chain reshaping
o Takeaways – supply chain
• Impact of the COVID-19 crisis on the power electronics industry 169
• Focus on China 172
o What does the future hold for China?
o Everything you need to know before going to China
o Chinese players are expanding their capabilities
o Si-IGBT power semiconductor players in China
o Takeaways – focus on China
• Technology trends 178
o Packaging as a crucial system element
o Packaging type by inverter power range
o Power module packaging trends
o Global trends in power module packaging
o Technology trends - electrical interconnections
o Technology trends - encapsulation
o Technology trends – die and substrate attach
o Technology trends – substrates
o Technology trends – baseplates
o Technology trends – thermal interface materials
o Global trends for power module packaging - overview
o Takeaways – technology trends
• Power module packaging requirements for various applications 204
o The same module for all applications or dedicated modules?
o Package type and requirements, depending on voltage/current range
o Voltage summary - split by application
o Power packaging
o EV/HEV
o UPS, motor drives
o Photovoltaic
o Wind
o Rail
o Power module packaging for various applications – Summary
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
555
• Power module packaging - focus on EV/HEV 219
o EV/HEV – power modules
o How to reach a longer driving range?
o Different approaches to increase car driving range
o Power modules for EV/HEV traction inverters- a few examples
o Technology roadmap for EV/HEV power device packaging
o EV/HEV - main trends
o SiC in main inverter
o Trends toward power module standardization in EV/HEV
o Cost
• Power module packaging - 800V battery pack 230
o Battery pack voltage and energy capacity, by application
o Why 800V battery?
o 800V and SiC adoption in EV/HEV
o 800V and SiC
o 800V battery and power module packaging
o 800V battery and power module packaging
o What future for 800V?
• Power module packaging 239
o Structure of a conventional power moduleo Main factors that determine packaging solution choice
o Power module material and process choice
o Power packaging and integrationo Power module material and process choice
o Thermomechanical issues in power modules• Packaging module packaging solutions 248
o Composition of a conventional power module
o Interconnectiono
o Encapsulation
o Die and substrate attach
o Substrates
o Baseplates
o Thermal interface materials
• Wide-band gap power module packaging 318
• Intelligent power module 348
• Takeaways and outlook 352
o Conclusions
o Takeaways: applications and technology trends
o Takeaways: market figures
o Takeaways: power packaging technologies
o Takeaways: supply chain
o Outlook – things to watch closely in the future
• Yole Développement - Corporate presentation 362
TABLE OF CONTENTS
Part 3/3
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
666
SCOPE OF THE REPORTAre your needs outside
the scope of this
report?
Contact us for a custom report:
Semiconductor
devices
Chips
(Dies)
One single device in the package.
Discrete packaging exists in
different forms.
Many devices in
the package.
Module packaging
also exists in
different forms.
Discrete
components
Power
modulesWith additional
functions such
as drivers and
controls ➔ IPM
Intelligent power modules (IPM)
Electrical interconnections
Encapsulation
Die attach
Substrate attach Thermal interface material
Substrate
Baseplate
Power module packaging solutions
Case
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
777
POWER MODULE PACKAGING SOLUTIONS
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
888
GLOBAL TRENDS FOR POWER MODULE PACKAGING
Both materials and designs in power modules are evolving toward greater device reliability and higher power density.
Copper flat-
plate
baseplate
BaseplateStructured baseplate
for direct cooling. No baseplate - chip on heatsink
TIMThermal
grease
Direct cooling
with no TIM
Substrate
DBC Leadframe
AlN AMB
Si3N4 AMBDouble-side cooling with
two ceramics/leadframes
Die attachSoldering Silver sintering
Encapsulation
Silicone gel or epoxy Epoxy resin
Silicone gel or epoxy resin - high temperatures or
combination of epoxy and silicone gel
Interconnections
Aluminum wire
bonding
Ribbon
bonding
Copper wire
bonding
Substrate attachTin
soldering
Silver paste or
film sintering
Solder with
metal mesh
No substrate attach (no
baseplate-based power
modules
Pre-applied
TIM
Direct-cooled
baseplatePhase change
materials
TIM
pads
Other direct-
cooled baseplates
Integrated
substrates
Embedded die
Copper
sintering
Copper alloys → AlSiC for
some applications only.
2021 2025 and beyond2023
Copper clip
No baseplate (direct bonding to
heatsink
Pre-applied silver paste on
ceramic substrate
Copper ribon
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
999
2020-2026 POWER MODULE PACKAGING FORECAST
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
10
2020-2026 POWER MODULE PACKAGING MARKET DEVELOPMENT
Split by packaging solution
Power module packaging materials represented a market value of $1.7B in 2020 and will reach $3.5B by 2026.
Die attach
Baseplate
Substrate attach
Substrate
Encapsulation
Interconnection
Case
TIM
CAGR2020-2026:
+12.5%
$934M
CAGR:
14.7%$410M
$615M
CAGR:
12.0%
$887M
CAGR:
15.6%
$141M
$181M
$71M
$211M
$312M
$214M
CAGR:
7.2%
$310M
CAGR:
9.4%
$84M
CAGR:
2.9%
2020
$1.7B
2026
$3.5B
$30M
$61M
CAGR:
12.9%
$387M
CAGR:
10.7%
$372M
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
111111
POWER MODULE PACKAGING - SUPPLY CHAIN
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
12
SUPPLY CHAIN RESHAPING
EV/HEV - Focus on power modules
The rapidly growing power electronics device market is attracting the interest of different players in the power electronics supply chain, especially within the EV/HEV supply chain.
With a strong focus on power modules, changes in business models and supply chain reshaping are expected.
• Power module manufacturing is an area of tough competition; module-only manufacturers must develop high performance products to stay competitive.
• Additionally, more and more car makers are willing to venture into the market at inverter level to differentiate themselves from competitors.
Automotive OEMPower module
manufacturer
Inverter manufacturer
(Tier-1)
Semiconductor
manufacturer
Competition
area
New step
to master
for car
makers
Strong trend Trend
New
players
New
technologies
New
materials
SiC
MOSFETs
Module design
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
131313
POWER MODULE PACKAGING FOR VARIOUS APPLICATIONS
Summary
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
141414
POWER MODULE PACKAGING TRENDS FOR EV/HEV
The safety and reliability standards for power modules for electric vehicles are more stringent than for industrial applications.
Therefore, both materials and design in EVs/HEVs power modules need to evolve.
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
BaseplateStructured baseplate
for direct cooling
TIM
Substrate
DBC
AlN AMB
Si3N4 AMB Double-side cooling with
two ceramic substrates
Die attach
Soldering
Silver paste or film
sintering
Encapsulation
Silicone gel or epoxy
Silicone gel or epoxy resin - high
temperatures or combination of
epoxy and silicone gel
InterconnectionsAluminum wire
bonding
Copper wire
bonding
Substrate attach
Tin soldering
Silver paste or
film sinteringNo baseplate
Direct-cooled
baseplate (no
TIM)
Integrated
substrates
Copper
sintering
2021 2025 and beyond2022
Leadframe
No baseplate
Silver sintering module
attached to heat sink
15
800V AND SiC ADOPTION IN EV/HEV
The 800V vehicle trend facilitates SiC adoption in traction inverters
Three main approaches exist today.
SiCtechnology could be the ultimate solution.
Porsche Taycan
Tesla Model 3 inverter
Battery voltage: 400V → 800V
Traction inverter: Silicon→ SiC
SiC
Battery voltage boost converter → 600V
Toyota Prius FuturePresent
400V battery
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
161616
DOUBLE SIDE COOLING APPROACHES – A FEW EXAMPLES
Double side cooling of high-power modules brings considerable advantages in thermal management and miniaturization. Therefore, many power module makers are making these types of modules. However, different power module manufacturer has a different approach to make it.
Hitachi Double-Side heat sink
approach
Heat sink
Heat sink
Machining trace
Aluminum metal case
DENSO/Toyota’s double side
bare substrate approach
Power module and
bare ceramic sheets
Cooling plate
OnSemi’s double side metallized
ceramic substrate (DBC)
approach
Heatsinks are attached
to each DCB substrate
on the bottom and on
the top of the module.
Infineon’s double side metallized
ceramic substrate (DBC)
approach
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
171717
POWER MODULE PACKAGING
Technology maturity, pain points and main suppliers
Electrical
interconnections
Substrate
Die attach and
substrate attach
Baseplate
Encapsulation
Module design
Pain points
• Reduction of inductance
• Enhanced thermal dissipation
• Reliability
• Additional thermal barrier,
weight, volume and cost
Main suppliers
Mature
Mature
excepting
solutions for
extreme
temperatures
Soldering: MatureAg sintering: Pretty matureCu sintering: not mature
MatureHigh TC ceramics and thicker
copper substrates still
improving
MatureCopper wires,
coated-wires still
improving
Strong cost
decrease potential
via Design for
manufacturing
Maturity
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
18
Contact our
Sales Team
for more
information
18
Contact our
Sales Team
for more
information
18
Contact our
Sales Team
for more
information
DC Charging for Plug-In Electric Vehicles 2021
Status of the Rechargeable Li-ion Battery Industry 2021
GaN Power 2021: Epitaxy, Devices, Applications and Technology Trends
Status of the Power Electronics Industry 2020
YOLE GROUP OF COMPANIES RELATED REPORTS
Yole Développement
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
19
Contact our
Sales Team
for more
information
19
Contact our
Sales Team
for more
information
19
Contact our
Sales Team
for more
information
Discrete Power Device Packaging Comparison 2021
Vitesco Technologies Power Module in Jaguar I-PACE Inverter
YOLE GROUP OF COMPANIES RELATED REPORTS
System Plus Consulting
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
2020
The Yole Group of Companies, including Yole Développement,
System Plus Consulting, and PISEO are pleased to provide you a
glimpse of our accumulated knowledge.
Feel free to share our data with your own network, within your
presentations, press releases, dedicated articles, and more. But
before doing so, contact our Public Relations department
to make sure you get up-to-date,licensed materials.
We will be more than happy to give you our latest results and
appropriate formats of our approved content.
Your contact: Sandrine Leroy, Dir. Public Relations
Email: [email protected]
HOW TO USE OUR DATA?
Status of the Power Module Packaging Industry 2021 | Sample | www.yole.fr | ©2021
21About Yole Développement | www.yole.fr | ©2020
CONTACTS
Western US & Canada
Hal Levy - [email protected]
+ 1 408 334-0554
Eastern US & Canada
Chris Youman - [email protected]
+1 919 607 9839
Europe and RoW
Lizzie Levenez - [email protected]
+49 151 23 54 41 82
DACH (North Germany, Austria, Switzerland)
Neha CHAUDHURY - [email protected]
+49 172 97 47 248
Benelux, UK & Scandinavia
Marine Wybranietz - [email protected]
+49 69 96 21 76 78
South Germany & France
Martine Komono - [email protected]
+49 173 69 43 31
India and RoA
Takashi Onozawa - [email protected]
+81 80 4371 4887
Greater China
Mavis Wang - [email protected]
+886 979 336 809 +86 136 6156 6824
Korea
Peter Ok - [email protected]
+82 10 4089 0233
Japan
Miho Ohtake - [email protected]
+81 34 4059 204
Toru Hosaka – [email protected]
+81 90 1775 3866
Japan and Singapore
Itsuyo Oshiba - [email protected]
+81 80 3577 3042
FINANCIAL SERVICES
› Jean-Christophe Eloy - [email protected]
+33 4 72 83 01 80
› Ivan Donaldson - [email protected]
+1 208 850 3914
CUSTOM PROJECT SERVICES
› Jérome Azémar, Yole Développement -
[email protected] - +33 6 27 68 69 33
› Julie Coulon, System Plus Consulting -
[email protected] - +33 2 72 17 89 85
GENERAL
› Brice Le Gouic, Marketing & Sales
[email protected] - +81 80 8131 7837
› Sandrine Leroy, Public Relations
[email protected] - +33 4 72 83 01 89
› General inquiries: [email protected] - +33 4 72 83 01 80
REPORTS, MONITORS & TRACKS
Follow us on
About Yole Développement | www.yole.fr | ©2021
