WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu...

26
WLP Probing Technology Opportunity and Challenge Clark Liu

Transcript of WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu...

Page 1: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

WLP Probing Technology Opportunity and Challenge

Clark Liu

Page 2: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

PTI Group Overview Founded : May/15/97’

Capital : USD 246 Millions

Total Assets : USD 2.2B

Employees : 11,100 (Greatek included)

Major Services : Chip Probing, Bumping,

Packaging, Final Test & Module Assembly

IPO : 4/3/03’ in Taiwan

PTI HQ

Page 3: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Group Overview- Global Network

Payton in China

Suzhou Plant

15 min drive

BHuKou Industrial Park

Headquarter

Hsinpu Plant

4 hrs by air

ChinaHSIP Plant

Greatek Electronic

30 min

drive

Chung-Li Plant

Customer Success !!

Singapore Plant Southeast Asia

Xi’an Plant

Page 4: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Put more resource for next technology!

4Clark Liu

2012 SWTW ASE_SV 50um Pitch Array 2014 SWTW FFI 80um Pitch CPB

Page 5: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Probing at 2G Wide I/O Bump Pad

5Clark Liu

Source : 2011 IEEE _ Samsung

Page 6: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

WLP(Wafer Level Packages)

6Clark Liu

Source : 2013 SEMI _ Yole

Wafer-level-packages have emerged in many different varieties that can be categorized into different advanced packaging technology platforms

Page 7: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Map of WLP manufacturing companies

7Clark Liu

Source : 2015 Yole

7 Companies

27 Companies

7 Companies

Page 8: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

WLP Key Connection Technology

8Clark Liu

Wafer Level Package

Bump RDL TSV CPB

Page 9: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

From Kid View!

9Clark Liu

Wafer Level Package

Bump like

RDLlike

TSV like

CPB like

Page 10: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Electrical Tests for WLP Connectivity Fault Model

10Clark Liu

Source : 2010 IEEE 3D IC Workshop _TSMC

Page 11: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Fault Model for different test items

11Clark LiuSource : 2010 IEEE 3D IC Workshop _TSMC

Supplier A or C

Supplier B or D

Supplier A

Supplier B

WLP Probing

Page 12: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

WoW !

12Clark LiuSource : Taipei 101

Page 13: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

13Clark Liu

Opportunity?Challenge?

Technology?

Cost? New Model?

Cooperation?

Source : NTHU

Page 14: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Case1: Tools Short Delivery Cycle Time?

14Clark Liu

DesignType Out Wafer Process Wafer Test

4~10 Weeks

DesignType Out

WLP Process WLP Test

2~3 Weeks

MP card

MP card??

Early Plan??

Eng Card??

Gap

Page 15: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

[Ex] WLCSP 256DUT Probe card

15Clark Liu

• Bump Type: WLCSP – a. Diameter: 300um– b. Height: 170um ± 10%.– c. Pitch: 500um– d. TD : 10– f. Total Pin Count 2560 Pins

Delivery Time 8 Weeks

Page 16: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Case2: Process Change for more Chip Probing?

16Clark Liu

Exist Process

Wafer Process

Wafer Test Assembly Finial Test

Process X Wafer Process

Wafer Test(KGD) WLP WLP Test

Process Y Wafer Process WLP WLP Test

(KGD)

Assembly

Assembly

Page 17: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

More WLP Test or More Finial Test?

• WLP Test • Finial Test

17Clark Liu

Pictures Source : Mitsubishi

Pitch Limit

Clean/10K Cleanness

Package Base

Fine Pitch

Contact Force

Silicon Baseum mm

Page 18: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Wafer Test or Finial Test Vender @ WLP Testing?

• Wafer Test Vender

• Cycle Time Challenge• Cost Challenge• New Process Challenge

• Finial Test Vender

• Cooperation Model Challenge• Wafer Level Requirement and

Quality

18Clark Liu

Gap

Page 19: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

<500 Mhz

<3G Mhz

>3G Mhz

Speed

WLCSP / WLCPB Probe Card

Source : SWTW

Page 20: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Bump Process & WLP Probing Roadmap

20Clark Liu

400um 200um 100um 80um 60um 40um 20um

Mature Production

Production / Pilot Run

R&D

Bum

p Pr

oces

sW

LP

Te

st

Mature Production

Gap

Page 21: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Ideal Probe Force v.s Over Drive @ WLP Probing

21Clark Liu

Probe ForceDepend on

Material

Over Drive SlopeDepend on

Material

Electrical All Pass

Point

Low Force Keep No Damage

Page 22: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Case 3: Probe mark analysis Technology

22Clark Liu

AOI Probe Mark Analysis Challenge

Bump RDL CPBD

iffer

ent

Laye

r

Page 23: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

What Expect data from those Probe mark?

23Clark Liu

AOI Probe mark Analysis

User ExpectData

Data Mining:

(1) ProberPerformance(2)Probe cardPerformance

[Keep Under Development]

Page 24: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Chip Design Wafer Process

Case 4: Business or Process Change?

24Clark Liu

Chip Design Wafer Process

WLP Design

WLP Process

WL Test A.P Finial Test

WLP Test

Customer Foundry OSAT

Cost

Tech

Yield

Page 25: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Probe card Vender B

Same Issue but different site?

25Clark Liu

ATE Vender

ProberVender A

Probe card Vender A

Customer

Foundry COSAT C

Recipe

Cont act

Alignment

Foundry B OSAT B

Foundry AOSAT A

CooperationProber

Vender B

Gap

AOI Vender

Clean Vender

Page 26: WLP Probing Technology Opportunity and Challengedrive. B. HuKou Industrial Park. Headquarter. Hsinpu Plant . 4 hrs by air. China. HSIP Plant. Greatek ... Probing at 2G Wide I/O Bump

Conclusion

26Clark Liu

• Cooperation from Customer to Supplier (Design House /Foundry/OSAT/Vender).

• New opportunity for Wafer/Finial Test I/F vender.

• The Evolution Business Model will start change something.