Why Power Matters Packaging costs Power supply rail design Chip and system cooling costs Noise...
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Transcript of Why Power Matters Packaging costs Power supply rail design Chip and system cooling costs Noise...
![Page 1: Why Power Matters Packaging costs Power supply rail design Chip and system cooling costs Noise immunity and system reliability Battery life (in.](https://reader030.fdocuments.us/reader030/viewer/2022032415/56649f085503460f94c1d4a8/html5/thumbnails/1.jpg)
Why Power Matters
Packaging costs
Power supply rail design
Chip and system cooling costs
Noise immunity and system reliability
Battery life (in portable systems)
Environmental concerns Office equipment accounted for 5% of total US commercial energy
usage in 1993 Energy Star compliant systems
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Why worry about power? -- Power Dissipation
P6Pentium ®
486
3862868086
80858080
80084004
0.1
1
10
100
1971 1974 1978 1985 1992 2000Year
Po
wer
(W
atts
)Lead microprocessors power continues to increaseLead microprocessors power continues to increase
Power delivery and dissipation will be prohibitivePower delivery and dissipation will be prohibitiveSource: Borkar, De Intel
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Why worry about power? -- Chip Power Density
40048008
80808085
8086
286386
486Pentium®
P6
1
10
100
1000
10000
1970 1980 1990 2000 2010
Year
Po
wer
Den
sity
(W
/cm
2)
Hot Plate
NuclearReactor
RocketNozzle
Sun’sSurface
…chips might become hot…
Source: Borkar, De Intel
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Chip Power Density Distribution
Power density is not uniformly distributed across the chip
Silicon is not a good heat conductor
Max junction temperature is determined by hot-spots Impact on packaging, w.r.t. cooling
Power Map On-Die Temperature
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Why worry about power? -- Standby Power
Drain leakage will increase as VT decreases to maintain noise margins and meet frequency demands, leading to excessive battery draining standby power consumption.
8KW
1.7KW
400W
88W 12W
0%
10%
20%
30%
40%
50%
2000 2002 2004 2006 2008
Sta
nd
by
Po
wer
Source: Borkar, De Intel
Year 2002 2005 2008 2011 2014
Power supply Vdd (V) 1.5 1.2 0.9 0.7 0.6
Threshold VT (V) 0.4 0.4 0.35 0.3 0.25
…and phones leaky!
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Power and Energy Figures of Merit
Power consumption in Watts determines battery life in hours
Peak power determines power ground wiring designs sets packaging limits impacts signal noise margin and reliability analysis
Energy efficiency in Joules rate at which power is consumed over time
Energy = power * delay Joules = Watts * seconds lower energy number means less power to perform a computation at
the same frequency
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Power versus Energy
Watts
time
Power is height of curve
Watts
time
Approach 1
Approach 2
Approach 2
Approach 1
Energy is area under curve
Lower power design could simply be slower
Two approaches require the same energy
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PDP and EDP Power-delay product (PDP) = Pav * tp = (CLVDD
2)/2 PDP is the average energy consumed per switching event (Watts *
sec = Joule) lower power design could simply be a slower design
allows one to understand tradeoffs better
0
5
10
15
0.5 1 1.5 2 2.5
Vdd (V)
Energ
y-Dela
y (no
rmali
zed)
energy-delay
energy
delay
Energy-delay product (EDP) = PDP * tp = Pav * tp2
EDP is the average energy consumed multiplied by the computation time required
takes into account that one can trade increased delay for lower energy/operation (e.g., via supply voltage scaling that increases delay, but decreases energy consumption)
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Understanding Tradeoffs
Ene
rgy
1/Delay
a
b
c
d
Lower EDP
Which design is the “best” (fastest, coolest, both) ?
bett
er
better
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CMOS Energy & Power Equations
E = CL VDD2 P01 + tsc VDD Ipeak P01 + VDD Ileakage
P = CL VDD2 f01 + tscVDD Ipeak f01 + VDD Ileakage
Dynamic power
Short-circuit power
Leakage power
f01 = P01 * fclock
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Dynamic Power Consumption
Energy/transition = CL * VDD2 * P01
Pdyn = Energy/transition * f = CL * VDD2 * P01 * f
Pdyn = CEFF * VDD2 * f where CEFF = P01 CL
Not a function of transistor sizes!Data dependent - a function of switching activity!
Vin Vout
CL
Vdd
f01
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Lowering Dynamic Power
Pdyn = CL VDD2 P01 f
Capacitance:Function of fan-out, wire length, transistor sizes
Supply Voltage:Has been dropping with successive generations
Clock frequency:Increasing…
Activity factor:How often, on average, do wires switch?
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Short Circuit Power Consumption
Finite slope of the input signal causes a direct current path between VDD and GND for a short period of time during switching when both the NMOS and PMOS transistors are conducting.
Vin Vout
CL
Isc
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Short Circuit Currents Determinates
Duration and slope of the input signal, tsc
Ipeak determined by the saturation current of the P and N transistors which depend on
their sizes, process technology, temperature, etc. strong function of the ratio between input and output slopes
- a function of CL
Esc = tsc VDD Ipeak P01
Psc = tsc VDD Ipeak f01
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Impact of CL on Psc
Vin Vout
CL
Isc 0
Vin Vout
CL
Isc Imax
Large capacitive load
Output fall time significantly larger than input rise time.
Small capacitive load
Output fall time substantially smaller than the input rise
time.
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Ipeak as a Function of CL
-0.5
0
0.5
1
1.5
2
2.5
0 2 4 6
I pea
k (A
)
time (sec)
x 10-10
x 10-4
CL = 20 fF
CL = 100 fF
CL = 500 fF
500 psec input slope
Short circuit dissipation is minimized by matching the rise/fall times of the input and output signals - slope engineering.
When load capacitance is small, Ipeak is large.
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Psc as a Function of Rise/Fall Times
0
1
2
3
4
5
6
7
8
0 2 4
P n
orm
aliz
ed
tsin/tsout
VDD= 3.3 V
VDD = 2.5 V
VDD = 1.5V
normalized wrt zero input rise-time dissipation
When load capacitance is small (tsin/tsout > 2 for VDD > 2V) the power is dominated by Psc
If VDD < VTn + |VTp| then Psc is eliminated since both devices are never on at the same time.
W/Lp = 1.125 m/0.25 mW/Ln = 0.375 m/0.25 mCL = 30 fF
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Leakage (Static) Power Consumption
Sub-threshold current is the dominant factor.
All increase exponentially with temperature!
VDD Ileakage
Vout
Drain junction leakage
Sub-threshold currentGate leakage
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Leakage as a Function of VT
0 0.2 0.4 0.6 0.8 1
VGS (V)
ID (A
)
VT=0.4VVT=0.1V
10-2
10-12
10-7
Continued scaling of supply voltage and the subsequent scaling of threshold voltage will make subthreshold conduction a dominate component of power dissipation.
An 90mV/decade VT roll-off - so each 255mV increase in VT gives 3 orders of magnitude reduction in leakage (but adversely affects performance)
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TSMC Processes Leakage and VT
80
0.25 V
13,000
920/400
0.08 m
24 Å
1.2 V
CL013 HS
52
0.29 V
1,800
860/370
0.11 m
29 Å
1.5 V
CL015 HS
42 Å42 Å42 Å42 ÅTox (effective)
43142230FET Perf. (GHz)
0.40 V0.73 V0.63 V0.42 VVTn
3000.151.6020Ioff (leakage) (A/m)
780/360320/130500/180600/260IDSat (n/p) (A/m)
0.13 m 0.18 m 0.16 m 0.16 m Lgate
2 V1.8 V1.8 V1.8 VVdd
CL018 HS
CL018 ULP
CL018 LP
CL018 G
From MPR, 2000
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Exponential Increase in Leakage Currents
1
10
100
1000
10000
30 40 50 60 70 80 90 100 110
0.25
0.18
0.13
0.1
Temp(C)
I leak
age(n
A/
m)
From De,1999
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Review: Energy & Power Equations
E = CL VDD2 P01 + tsc VDD Ipeak P01 + VDD Ileakage
P = CL VDD2 f01 + tscVDD Ipeak f01 + VDD Ileakage
Dynamic power(~90% today and
decreasing relatively)
Short-circuit power
(~8% today and decreasing absolutely)
Leakage power(~2% today and
increasing)
f01 = P01 * fclock
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Power and Energy Design Space
Constant Throughput/Latency
Variable Throughput/Latency
Energy Design Time Non-active Modules Run Time
Active
Logic Design
Reduced Vdd
Sizing
Multi-Vdd
Clock Gating
DFS, DVS
(Dynamic Freq, Voltage
Scaling)
Leakage + Multi-VT
Sleep Transistors
Multi-Vdd
Variable VT
+ Variable VT
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Dynamic Power as a Function of Device Size Device sizing affects dynamic energy consumption
gain is largest for networks with large overall effective fan-outs (F = CL/Cg,1)
The optimal gate sizing factor (f) for dynamic energy is smaller than the one for performance, especially for large F’s
e.g., for F=20, fopt(energy) = 3.53 while fopt(performance) = 4.47
If energy is a concern avoid oversizing beyond the optimal
1 2 3 4 5 6 70
0.5
1
1.5
f
norm
aliz
ed e
nerg
y
F=1
F=2
F=5
F=10
F=20
From Nikolic, UCB
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Dynamic Power Consumption is Data Dependent
A B Out
0 0 1
0 1 0
1 0 0
1 1 0
2-input NOR Gate
With input signal probabilities PA=1 = 1/2 PB=1 = 1/2
Static transition probability P01 = Pout=0 x Pout=1
= P0 x (1-P0)
Switching activity, P01, has two components A static component – function of the logic topology A dynamic component – function of the timing behavior (glitching)
NOR static transition probability = 3/4 x 1/4 = 3/16
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NOR Gate Transition Probabilities
CL
A
B
BA
P01 = P0 x P1 = (1-(1-PA)(1-PB)) (1-PA)(1-PB)
PA
PB
0
1 0 1
Switching activity is a strong function of the input signal statistics PA and PB are the probabilities that inputs A and B are one
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Transition Probabilities for Some Basic Gates
P01 = Pout=0 x Pout=1
NOR (1 - (1 - PA)(1 - PB)) x (1 - PA)(1 - PB)
OR (1 - PA)(1 - PB) x (1 - (1 - PA)(1 - PB))
NAND PAPB x (1 - PAPB)
AND (1 - PAPB) x PAPB
XOR (1 - (PA + PB- 2PAPB)) x (PA + PB- 2PAPB)
B
AZ
X0.5
0.5
For Z: P01 = P0 x P1 = (1-PXPB) PXPB
For X: P01 = P0 x P1 = (1-PA) PA
= 0.5 x 0.5 = 0.25
= (1 – (0.5 x 0.5)) x (0.5 x 0.5) = 3/16
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Inter-signal Correlations
B
A
Z
X
P(Z=1) = P(B=1) & P(A=1 | B=1)
0.5
0.5
(1-0.5)(1-0.5)x(1-(1-0.5)(1-0.5)) = 3/16
(1- 3/16 x 0.5) x (3/16 x 0.5) = 0.085Reconvergent
Determining switching activity is complicated by the fact that signals exhibit correlation in space and time reconvergent fan-out
Have to use conditional probabilities
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Logic Restructuring
Chain implementation has a lower overall switching activity than the tree implementation for random inputs
Ignores glitching effects
Logic restructuring: changing the topology of a logic network to reduce transitions
A
BC
D F
AB
CD Z
FW
X
Y0.5
0.5
(1-0.25)*0.25 = 3/16
0.50.5
0.5
0.5
0.5
0.5
7/64
15/256
3/16
3/16
15/256
AND: P01 = P0 x P1 = (1 - PAPB) x PAPB
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Input Ordering
Beneficial to postpone the introduction of signals with a high transition rate (signals with signal probability close to 0.5)
A
BC
X
F
0.5
0.20.1
B
CA
X
F
0.2
0.10.5
(1-0.5x0.2)x(0.5x0.2)=0.09 (1-0.2x0.1)x(0.2x0.1)=0.0196
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Glitching in Static CMOS Networks
ABC
X
Z
101 000
Unit Delay
AB
X
ZC
Gates have a nonzero propagation delay resulting in spurious transitions or glitches (dynamic hazards) glitch: node exhibits multiple transitions in a single cycle before settling
to the correct logic value
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Glitching in an RCA
S0S1S2S14S15
Cin
0
1
2
3
0 2 4 6 8 10 12
Time (ps)
S O
utp
ut
Vo
ltag
e (
V)
Cin
S0
S1
S2
S3
S4
S5S10
S15
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Balanced Delay Paths to Reduce Glitching
So equalize the lengths of timing paths through logic
F1
F2
F3
0
0
0
0
1
2
F1
F2
F3
0
0
0
0
1
1
Glitching is due to a mismatch in the path lengths in the logic network; if all input signals of a gate change simultaneously, no glitching occurs
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Power and Energy Design Space
Constant Throughput/Latency
Variable Throughput/Latency
Energy Design Time Non-active Modules Run Time
Active
Logic Design
Reduced Vdd
Sizing
Multi-Vdd
Clock Gating
DFS, DVS
(Dynamic Freq, Voltage
Scaling)
Leakage + Multi-VT
Sleep Transistors
Multi-Vdd
Variable VT
+ Variable VT
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Dynamic Power as a Function of VDD
Decreasing the VDD
decreases dynamic energy consumption (quadratically)
But, increases gate delay (decreases performance)
1
1.5
2
2.5
3
3.5
4
4.5
5
5.5
0.8 1 1.2 1.4 1.6 1.8 2 2.2 2.4
VDD (V) t p
( no
r ma
l ize
d)
Determine the critical path(s) at design time and use high VDD for the transistors on those paths for speed. Use a lower VDD on the other gates, especially those that drive large capacitances (as this yields the largest energy benefits).
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Multiple VDD Considerations How many VDD? – Two is becoming common
Many chips already have two supplies (one for core and one for I/O)
When combining multiple supplies, level converters are required whenever a module at the lower supply drives a gate at the higher supply (step-up)
If a gate supplied with VDDL drives a gate at VDDH, the PMOS never turns off
- The cross-coupled PMOS transistors do the level conversion
- The NMOS transistor operate on a reduced supply
Level converters are not needed for a step-down change in voltage
Overhead of level converters can be mitigated by doing conversions at register boundaries and embedding the level conversion inside the flipflop (see Figure 11.47)
VDDH
Vin
VoutVDDL
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Dual-Supply Inside a Logic Block Minimum energy consumption is achieved if all logic paths are
critical (have the same delay)
Clustered voltage-scaling Each path starts with VDDH and switches to VDDL (gray logic gates)
when delay slack is available Level conversion is done in the flipflops at the end of the paths
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Power and Energy Design Space
Constant Throughput/Latency
Variable Throughput/Latency
Energy Design Time Non-active Modules Run Time
Active
Logic Design
Reduced Vdd
Sizing
Multi-Vdd
Clock Gating
DFS, DVS
(Dynamic Freq, Voltage
Scaling)
Leakage + Multi-VT
Sleep Transistors
Multi-Vdd
Variable VT
+ Variable VT
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Stack Effect Leakage is a function of the circuit topology and the value of
the inputs
VT = VT0 + (|-2F + VSB| - |-2F|)
where VT0 is the threshold voltage at VSB = 0; VSB is the source- bulk (substrate) voltage; is the body-effect coefficient
A B
B
A
Out
VX
A B VX ISUB
0 0 VT ln(1+n) VGS=VBS= -VX
0 1 0 VGS=VBS=0
1 0 VDD-VT VGS=VBS=0
1 1 0 VSG=VSB=0
Leakage is least when A = B = 0
Leakage reduction due to stacked transistors is called the stack effect
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Short Channel Factors and Stack Effect In short-channel devices, the subthreshold leakage current
depends on VGS,VBS and VDS. The VT of a short-channel device decreases with increasing VDS due to DIBL (drain-induced barrier loading).
Typical values for DIBL are 20 to 150mV change in VT per voltage change in VDS so the stack effect is even more significant for short-channel devices.
VX reduces the drain-source voltage of the top nfet, increasing its VT and lowering its leakage
For our 0.25 micron technology, VX settles to ~100mV in steady state so VBS = -100mV and VDS = VDD -100mV which is 20 times smaller than the leakage of a device with VBS = 0mV and VDS = VDD
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Leakage as a Function of Design Time VT
Reducing the VT increases the sub-threshold leakage current (exponentially)
90mV reduction in VT increases leakage by an order of magnitude
But, reducing VT decreases gate delay (increases performance) 0 0.2 0.4 0.6 0.8 1
VGS (V)ID
(A)
VT=0.4VVT=0.1V
Determine the critical path(s) at design time and use low VT devices on the transistors on those paths for speed. Use a high VT on the other logic for leakage control.
A careful assignment of VT’s can reduce the leakage by as much as 80%
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Dual-Thresholds Inside a Logic Block Minimum energy consumption is achieved if all logic paths are
critical (have the same delay)
Use lower threshold on timing-critical paths Assignment can be done on a per gate or transistor basis; no clustering
of the logic is needed No level converters are needed
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Variable VT (ABB) at Run Time VT = VT0 + (|-2F + VSB| - |-2F|)
0.4
0.45
0.5
0.55
0.6
0.65
0.7
0.75
0.8
0.85
0.9
-2.5 -2 -1.5 -1 -0.5 0
VSB (V)
VT (
V)
A negative bias on VSB causes VT to increase
Adjusting the substrate bias at run time is called adaptive body-biasing (ABB)
Requires a dual well fab process
For an n-channel device, the substrate is normally tied to ground (VSB = 0)