What’s New in the Fab World

SESHA North Texas Chapter MeetingPlano, Texas

December 3, 2008

Discussion Topics

• 450mm Wafer Progress

• Electronics Supply Chain

• Codes/Standards Changes

• Growth of the Photovoltaics (Solar Cell) Industry

• Recent Testing by FM Research

• Open Discussion

Consulting

Protection/Hazard

Guidance

Training

TechnicalDirection

Certification

CompanyRepresent

FM GlobalOperations

UnderwritingResearch

Principal Engineer Role

Semiconductor & Telecommunications

Vinnie DeGiorgio

450mm Update

450mm UpdateWhy ?• Surface area & number of die is more than twice that of

a 300mm wafer

• More efficient use of energy, water and other resources– Reduction in resources per chip

• 300mm 450mm easier than 200mm 300mm– Fab automation standards, handling systems & other

technologies

• “If we don’t keep investing, we won’t keep growing”

450mm UpdateWhy Not ?

• $10 billion or more to build a new Fab– $100 million/toolset– $100 million for EUV scanner– $5000 per raw wafer initially

• Only a handful of companies can afford it – Intel, Samsung & TSMC– Will cause further consolidation

• Equipment suppliers are “lukewarm” at best– Burden they bore for 300mm tool development is still fresh– R&D funding shortfall

450mm Update• Wafer processing demonstration line planned for 2010

– International Sematech (ISMI)– DRAM - 32nm half-pitch technology

• Pilot lines by 2012– Intel, Samsung & TSMC– 22nm half-pitch patterns

• IMEC – Leuven, Belgium– If approved, will build 450mm development Fab

• Aim is not to create finished devices

450mm UpdateFactory Integration Interoperability Test Bed (ITB)• ITB occupies 2,500 sq.ft. in Silicon Valley Technology Corp.’s

(former ATDF) facility in Austin, Texas

• Aimed at developing standards for wafer handling, wafer and metrology vendors

• 7 companies participating– Asyst, Brooks, Entegris, Fixeon, Genmark, Gudeng P & H-

Square

• Prototype FOUP created– 25 wafer carrier expected to weigh 45 lbs.

450mm UpdateITB 2009• Create a wafer bank of single-crystal silicon wafers

• Work with metrology vendors to develop inspection tools

• Expects to receive early blanket thin-film deposition equipment

• Priority tools sought for early stages of the test bed– Oxide vertical furnace, PECVD dielectric, dielectric dry etch,

dielectric CMP, PVD metal, LPCVD nitride, wet cleans, dry strip asher, particle detection metrology, film thickness metrology and CD measurement

Electronics Supply Chain

ELECTRONIC PRODUCTSPC, MP3, Cell Phones, HDTV, Memory Sticks, Games, Digital Cameras, Camcorders, GPS etc.

PRODUCT ASSEMBLY Foxconn, Jabil, Flextronics,

Celestica, etc.Circuit Boards

CasesDisplays Wiring/Connectors

Semiconductors

Semiconductor Fabrication

(IDM, Foundries)

Raw Materials Suppliers

Raw Materials Suppliers

Raw Materials Suppliers

Raw Materials Suppliers

Chemicals

Wafers

Process Tools

Component Suppliers

Fabless Company Designs

Electronics Supply Chain

Raw Materials Suppliers

Raw Materials Suppliers

Raw Materials Suppliers

Assembly & Test (Backend)

Electronics Distributors

(Arrow)

Taiwan

#1 Provider of chip foundry services, with 70% of the market worth $8.9 billion

#1 Provider of notebook PCs, with 72% of the marketworth $22 billion

#1 Provider of LCD monitors, with 68% of the marketworth $14 billion

#2 Provider of servers, with 33% of the market worth $1.8 billion

#2 Provider of digital still cameras, with 34% of the market worth $2 billion

#1 Provider of PDAs, with 79% of the market worth $1.8 billion

Supply Chain Management

• Business Continuity Plans

• Quality of Risk at Key Suppliers

Codes / Standards Update

NFPA 318 “Standard for the Protection of Semiconductor Fabrication Facilities” 2009 Edition

SDS

Subatmospheric Gas Systems (SAGS)

Type 1 – A gas source package that stores and delivers gas at subatmospheric pressure and includes a container (e.g., gas cylinder and outlet valve) that stores and delivers gas at a pressure of less than 14.7 psia at NTP.

NFPA 318 “Standard for the Protection of Semiconductor Fabrication Facilities” 2009 Edition

VAC

Type 2 – A gas source package that stores that stores compressed gas and delivers gas subatmospherically and includes a container (e.g., gas cylinder and outlet valve) that stores gas at a pressure greater than 14.7 psia at NTP and delivers gas at a pressure of less than 14.7 psia at NTP

NFPA 318 “Standard for the Protection of Semiconductor Fabrication Facilities” 2009 Edition• 8.6.2.1.1 SAGS cylinders with incompatible gases shall

be permitted to occupy the same gas cabinet or exhausted enclosure

• 8.6.2.1.2 Ventilation in the enclosure or gas cabinet shall be sufficient to maintain vapors below 25% of LFL and below IDLH

• 8.6.2.1.3 Purge gas shall be allowed to be supplied from a house system or from dedicated cylinders

NFPA 318 “Standard for the Protection of Semiconductor Fabrication Facilities” 2009 Edition

• 8.6.2.1.4 The requirements for automatic shutoff valves under 8.1.2 shall not be required for Type 1 or Type 2 SAGS containing pyrophoric gases

• 8.6.2.1.5 Treatment systems for SAGS containers containing highly toxic or toxic gases as specified by Section 8.9 shall not be required

• 8.6.2.1.6 The gas distribution system to which SAGS are connected shall be equipped with a method to protect system components from pressures exceeding their rating in the event of a failure in the a SAGS

NFPA 318 “Standard for the Protection of Semiconductor Fabrication Facilities” 2009 Edition• 8.6.2.2.2 – The requirements for an RFO under 8.1.2

shall not apply to SAGS Type 1 cylinders containing pyrophoric gases

• 8.6.2.2.3 – Gas distribution systems for SAGS Type 1 cylinders shall be subject to a pressure test at a minimum pressure of 20 percent over the maximum pressure available to the system but not less than 173 kPa (25 psi) for 2 hours with no discernible pressure drop

CGA G-13-2006 “Storage and Handling of Silane and Silane Mixtures• Practical methods applicable for silane manufacturers,

suppliers and end users– Does not address usage & handling within clean room

• Cylinder & bulk silane delivery systems– Storage & handling– Distribution piping– Setback distances

• Heat radiation & overpressure produced by blast effects

• Experimental testing by CGA and FM & Sematech

Revision to CGA G-13• Work on distance to exposure

– Tables 3 & 4• Primary concern is Table 4

– Distances are difficult or impossible to meet at most sites

• Evaluate data that distances are based on & recommend any changes to the tables– Determine if further studies and/or testing are required

• Work to be completed during 2009

Silane Safety Seminars• Taiwan – September 2006• Seoul – January 2007• Shanghai – March 2007• Singapore – November 2007• Portland, OR – March 2008 • Leuven, Belgium – November 2008

Approximately 1100 attendees

SEMI S-14 “Safety Guidelines for Fire Risk Assessment & Mitigation for Semiconductor Manufacturing Equipment”

• Working to align S14 and S10 risk ranking matrices – Possibly add “harm to personnel” to fire risk

assessment

• Working to define quantity and location of horn strobe & manual activation devices into S2

• Trying to harmonize SEMI fire standards internationally

FM Global 7-7 “Semiconductor Fabrication Facilities”

• Under revision – 2009 release

• Will take into account what has been learned in the last 10 years

• Silane protection similar to CGA G-13– High rate of ventilation currently recommended

• Add guidance on pyrophoric liquids

Photovoltaics (solar cell) Manufacturing

Applied Materials (AMAT) - SunFab

They may do their own crystal growing

Chemical Vapor Deposition (CVD)

Silane – It’s used like water

I’m Back – Combustible wet benches

Wet Etching

Me To

Combustible Fume Exhaust Ductwork

Recent Testing by FM Research

Combustible Foam InsulationHouse chill water piping Make-up air ductwork

Tool chill water piping Scanner air handling ducts

Existing Combustible Foam Insulation

• Polyurethane– Rapid flame spread & significant smoke

generation

• FM Approved Armaflex– Limited fire spread, but considerable

smoke generation

Zotefoam –Zotefoam “T-Tubes”First FM4910 Listed Foam

www.t-tubes.com

The Pursuit of the Fire Safe (FM4911) Front Opening Unified Pod (FOUP)

“The Last Major Fab Fire Safety Challenge”

FOUPs

Where are the FOUPs staged ?Stockers

Under Track

Polycarbonate FM4911 FOUP Test (2001)

~ 6 minutes test aborted

FM4911 test method 1 ~ 3-1/2

minutes

~ 4-1/2 minutes

Prototype 1 vs. Prototype 2 FM4911 FOUP Tests

FOUP Test Setup

~ 2 minutes 30 secondsPrototype 1 Prototype 2

~ 8 minutes 50 secondsPrototype 1 Prototype 2

~ 10 minutes – Burner OffPrototype 1 Prototype 2

~ 11 minutesPrototype 1 Prototype 2

~ 13 minutesPrototype 1

Prototype 2

Post Test DamagePrototype 1 Prototype 2

Activated Carbon Filters (ACF)• Chip design rules below 100nm

• Absorbs vapors & binds them to the surface of activated carbon grain molecules

• Needed to filter molecular level contamination (MLC)– Ammonia, NMP, acids,

bases, organics and dopants

Applications

Cleanroom Ceiling

Fan Filter UnitsPre-Filters on RAH

Pre-Filters on Fan Towers

Filters for Tools

Pre Filters

ACF Parallel Panel Testing

Combustible vs. Non-Fire Propagating Plastics

Two – 2 ft. wide by 8 ft. sheets of plastic spaced 1 ft. apart

60 kW Propane Burner

THE END

Questions / Comments