ELAN Microelectronics Corp. ELAN Microelectronics Corporation
Welwyn Components Ltd Microelectronics -...
Transcript of Welwyn Components Ltd Microelectronics -...
Welwyn Components LtdMicroelectronics
Why Use Microelectronics?
High Power
High FrequencyHigh Density & Reliability
Power & Control Braking resistors/Heaters
Thick Film Ink Systems
Printing – Firing - Lasering
Gold, Silver, High and low Temperature Copper.
Resistor Printing directly in circuit.
Aspect ratio to 0.1mm track and gap width, +/- 0.03mm registration.
Automatic printing machines cassette to cassette process.
Automatic Laser trimming and continuity testing.
Clean-room facility operating on 3 shifts.
Thick Film Circuit
Substrates
Thick film on 96% alumina or aluminium nitride
Directly bonded copper (DBC)
Active metal braise on aluminium nitride & silicon nitride
High/Low temperature co-fired ceramic (HTCC/LTCC)
Steel
Aluminium
Thin film
FR4
Technologies
Component Attach
Solder Surface Mount
Polymer Component and die attach
Vacuum soldering (Power Die Attach) upto 400oC
Wire Bonding
Fine wire Au 17um to 33um
Fine wire Al 25um to 33um
Large diameter Al >125um
Packaging
Hermetic sealing
Projection weld & Seam Seal
Ceramic lidding
Glob-top / Silicon conformal coat
Technologies
Clean-room assembly operations.
Automated die bonding and wire bonding by pattern recognition.
Re-flow soldering and real time x-ray for void detection.
Aluminium fine wire bonding for high density signal and control circuits.
Large diameter Aluminium wire bonding for power circuits.
Hermetic sealing in inert atmosphere.
Leak detection.
Automatic test facilities.
Microelectronics Assembly
Test, Burn-In and Screening Facilities.Test• Two General Purpose ATEs in Chip&Wire Clean Room.• One reduced capability, DC only, ATE.• One General Purpose ATE for one high volume product.• Two ATEs for surface mount hybrids.• One tray pack system – measure, accept/reject, pack.• One PIC program/test XYZ system.Screening:• Temperature cycling• Constant acceleration• Burnin• Fine & Gross Leak Test• Pin D• Bump• Limited range vibration
Characteristics
High Temperature Co-fired Ceramic (HTCC)
Chip and Wire (>1000 bonds)
High Density – Reduced size and Weight
Hermetically sealed
Engine mounted
Qualified –55oC to +150oC
Extended high temperature approval testing –55oC to +205 oC.
Completed 1000 hours +205oC
Completed 100 cycles –55oC to 205 oC
Function
• Engine management (FADEC)
• Custom ASIC - CPU, SRAM, EPROM, Oscillator
• Hi Reliability >20yrs life
MCM Engine Management
MCM (Linear) Engine Management – Civil AviationFunction• 3 Precision instrumentation
amplifiers• High common mode rejection• Precision gain• 3 Precision voltage references• General purpose comparator
Characteristics• High operating temperature -55oC to +150oC• Engine mounted• Thin Film provides high accuracy and stability.• Active Trimming to <0.01% tolerance.• High precision and accuracy achieved with low cost Commercial Off
The Shelf Components.• Easily redesigned if amplifiers or reference become obsolete
DC/DC Converter – Civil AviationFunction:• 3 Fixed DC Outputs from 14 to
36VDC• 28 Watts• Flight computer System• Self Monitoring• Self Diagnostics
Characteristics:• Mixed power and control circuits.• High reliability >20 years life proven through extreme temperature
cycling (>3,000 cycles) and HALT testing.• Operating temperature -40oC to +95oC• High packing density.• Relatively low cost.
Safety Critical FuseFunction:• 10 amps continuous current carrying capacity• Fuse activation by external contol• Fusing time <5 second @ -40oC to +110oC
Current applications:• Wing ice protections system, heater circuit protection (787
Dreamliner)• Engine de-icing (Joint Strike Fighter) heater protection
Power MCM – Civil Aviation
Function• Part of Wing Ice Protection System• Switching controls power to wing tip
or engine heaters (up to 5 amps continuous without heatsinking).
• Used in conjunction with thick film solder fuse protection device
Characteristics• Each module contains 8 MOSFETs with low Rdson (<138m Ohm)• High packing density and low assembly cost (35mm x 20mm)• Good thermal management• High reliability
Sonar Transducer Power Driver – Naval Systems
Function• H Bridge MOSFET Switch to
control power to sonar antenna• Intelligent switch with ASIC control
and MOSFET drivers.
Characteristics• Each module contains 4
MOSFETs with low Rdson, drivers and control ASIC
• Uses mixed technologies• Good thermal management• High reliability
Flight Controls
Steel Dynamic Braking Resistors
For Aileron, Elevator and Rudder Actuation
Increased power dissipation by the use of bottom and top heatsinking
Low profile, Low Weight
Design-ins on:
Airbus A400M
A330 MRTT
Boeing 787 EBACS
Power Resistor – Motor Speed Control
l
Design for high temperature environment
l
Design for high reliabilityl
Low Profile, fits in motor housing l
0.7 Ohm Resistancel
Curved shape to fit in housing
l
Test requirement
Duty Cycle NumberPower On Off Cycles300W 3 10 100100W 10 10 50,000
AlN Heater – Toner Fusing
Function:• Instantaneous heating with individual
control of 3 discrete segements• 210°C in 2 seconds (1kW)• Precision Temperature Control
Characteristics:• Large size printing• AlN
• Hi thermal Conductivity• Resistance to thermal shock
• Developed Inks with Fraunhofer Institute
Hi Frequency Telecommunications
Function:• Frequencies up to 38GHz• Hi Reliability• Direct feed to antenna• Small Package size
Characteristics:• Low loss at high frequency
• Gold based ink• 0.38mm thick substrate down to 0.1% tolerance• Good thermal management• Precise track definition
Automotive – Mass air-flow sensor
Industrial – Ink jet print head
Military & Avionics
Industrial – Power module