Welcome to EE249: Embedded System Design The Real...
Transcript of Welcome to EE249: Embedded System Design The Real...
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Welcome to EE249: Embedded System DesignThe Real Story
Alberto Sangiovanni-VincentelliDepartment of EECS, University of California at Berkeley
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Administration
�Office hours: Alberto’s : Tu-Th 12:30pm-2pm or by
appointment (2-4882)
�Teaching Assistant:
�Claudio Pinello, [email protected]
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Grading
�Grading will be assigned on:
�Homeworks (~30%)
�Project (~50%)
�Reading assignments (~20%)
�There will be approx. 7 homeworks (due 2 weeks after
assignment) and 6 reading assignments
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Discussion sections
�Discussion section:�tool presentation
�students’ presentation of selected papers� Each student will have
to turn in a one-paragraph report for each paper handed out
� Each student (in groups of 2-3 people) will have to make an oral presentation once during the class
Auditors are OK but please register as P-NP
Week Discussion Sections Homeworks1 - - - - - -2 Tool presentation HW13 Discussion4 Tool presentation HW25 Discussion6 Tool presentation HW37 Discussion8 Tool presentation HW49 Discussion10 Tool presentation HW511 Discussion12 Tool presentation HW613 Discussion14 HW715
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Plan
� We are on the edge of a revolution in the way electronics products are designed
� System design is the key
�Start with the highest possible level of abstraction (e.g. control algorithms)
�Establish properties at the right level
�Use formal models
�Leverage multiple “scientific” disciplines
� Establish horizontal and vertical “supplier-chain” like partnerships
� Need change in education
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Course overview
Managing Complexity
Orthogonalizingconcerns
Behavior Vs.
Architecture
Computation Vs.
Communication
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Behavior Vs. Architecture
SystemBehavior
SystemArchitecture
Mapping
Flow To Implementation
CommunicationRefinement
BehaviorSimulation
PerformanceSimulation
1
3
4
2
Models of Computation
Performance models: Emb. SW, comm. and
comp. resources
HW/SW partitioning,Scheduling
SynthesisSW estimation
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Behavior Vs. Communication
�Clear separation between functionality and interaction
model
�Maximize reuse in different environments, change only
interaction model
ETROPOLIS
PIG: Protocol interface generation
PEARLS: Latency insensitive protocols
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Outline of the course
� Part 1: Introduction: Future of Information Technology, System Design, IP-based Design, System-on-Chip and Industrial Trends
� Part 2: Design Methodology
� Part 3: Models of Computation
� Part 4: The Ptolemy, POLIS and VCC Systems
� Part 5: Verification and Synthesis, Hardware and Software
� Part 6: Communication-based Design
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Introduction Outline
�Scenario and Characteristics of Future Information Technology
�Embedded Systems : Automotive, Home Networks, Smart Dusts, Universal Radios
�What is Needed at the Infrastructure Level
�High-Leverage System Design Paradigms:�Communication-based Design
�Architecture-Function Co-design
�Platform-based Design as Implementation Technology
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Electronics and the Car
•More than 30% of the cost of a car is now in Electronics•90% of all innovations will be based on electronic systems
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Information Technology Scenario
�According to the International Data Corporation
�96% of all Internet-access devices shipped in the United States in 1997 were PCs.
�By 2002, nearly 50% will not be PCs. Instead, they will be digital set-top boxes, Web-enabled phones, and personal digital assistants, to name just a few.
�By 2004, the unit shipments of such appliances will exceed those of the PC.
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Historic Perspective
�Technology discontinuities drive new computing
paradigms and applications
�E.g., Xerox Alto
�3Ms--1 mips, 1 megapixel, 1 mbps
�Fourth M: 1 megabyte of memory
�From time sharing to client-server with display intensive applications
�What will drive the next discontinuity? What are the new
metrics of system capability?
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What’s Important: Shifts in Technology Metrics
� Display (human-computer interface)� More ubiquitous I/Os (e.g., MEMS sensors & actuators) and modalities
(speech, vision, image)
� How to Quantify?
� Connectivity (computer-computer interface)� Not bandwidth but “scaled ubiquity”
� Million accesses (wired and wireless) per day
� Computing (processing capacity)� Unbounded capacity & utility functionality (very high mean time to
unavailable, gracefully degraded capability acceptable)
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What’s Important: Shifts in User/Applications Metrics
�Cost: Human Effort
�Save time
�Reduce effort
�The Next Power Tools
�Leveraging other peoples’ effort/expertise� e.g., “What did Dave read about disk prices?”� e.g., “What did people who buy this book also buy?”
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Outline
�Scenario and Characteristics of Future Information
Technology
�Embedded Systems : Automotive, Home Networks, Smart
Dusts, Universal Radios
�What is Needed at the Infrastructure Level
�High-Leverage System Design Paradigms:
�Communication-based Design
�Architecture-Function Co-design
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Chips Everywhere!
CMOS Camera
SmartPen
Source: Dr. K. Pister, UC Berkeley
Chips that Fly?
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Smart Dust
�Sensor
�Interface
�Power: battery, solar, cap.
�Comm: LOS Optical (CCR, Laser)
Goal:
• Distributed sensor networks
• Sensor nodes:
•Autonomous
•1mm3
Challenges:
•1 Joule
•1 kilometer
•1 piece
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Smart Dust ComponentsLaser diodeIII-V process
Passive CCR comm.MEMS/polysilicon
Active beam steering laser comm.MEMS/optical quality polysilicon
SensorMEMS/bulk, surface, ...
Analog I/O, DSP, ControlCOTS CMOS
Solar cellCMOS or III-V
Thick film batterySol/gel V2O5
Power capacitorMulti-layer ceramic
1-2 mm
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Airborne Dust
Mapleseed solar cellMEMS/Hexsil/SOI
1-5 cm
Controlled auto-rotatorMEMS/Hexsil/SOIRocket dust
MEMS/Hexsil/SOI
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Synthetic InsectsR. Yeh, K. Pister, UCB/BSAC
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Computing Revolution: Devices in the eXtreme
Evolution
Information Appliances:Scaled down desktops,e.g., CarPC, PdaPC, etc.
Evolved Desktops
Servers:Scaled-up Desktops,
Revolution
Information Appliances:Many computers per person,
MEMs, CCDs, LCDs, connectivity
Servers: Integrated withcomms infrastructure;Lots of computing in
small footprint
Display
Keyboard Disk
Mem
µProc
PC Evolution
Display Display
Camera
Smart
Sensors
Camera
Smart Spaces
ComputingRevolution
WAN
Server, Mem, Disk
InformationUtility
BANG!
Display
Mem
Disk
µProc
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Modern Vehicles, an Electronic System
Electronic Toll CollectionCollision AvoidanceVehicle ID Tracking
Multiplexed Systems
VehicleCAN Bus
BodyControl
ECU ABS
Suspension Transmission
IVHS Infrastructure
Wireless Communications/DataGlobal Positioning
Info/Comms/AV Bus
CellularPhone
GPS Display
Navigation Stereo/CD
SW Architecture
Network Design/Analysis Function / Protocol Validation
Performance Modelling
Supplier Chain Integration
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Vehicles, a Consumer Electronic System
CommsGSM/PCS
CDMA, PagingCompression
S/W ShellWindows CE,
NT, MAC, BIOS
S/W AppsBrowser,
Comms, User Apps
ProcessorRISC, PowerPC
X86, Hitachi RISC
DisplayHeads Up,Flat PanelGraphics
User I/FVoice SynthesisVoice ControlStylus, ETC
Output & I/FSerial, Ethernet
Diagnostics
Info/Comms/AV Bus
CellularPhone
GPS Display
Navigation Stereo/CD
• Minimum Technology to Satisfy User Requirement
• Usability• Integrate with Other Vehicle
Systems• Add the Function Without
Adding the Cost
Challenges
Vehicle Web SiteTechnology
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When Will Dick Tracy’s Watch Be Available?
Ultimate Nomadic Tool in Broadband Age
� Two-way Communication
� Language Translation & Interpretation
� e-Secretary
� Camera
� Music
� Electronic Money
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Smart Buildings
•Task/ambient conditioning systems allow thermal conditioning in small, localized zones, to be individually controlled by building occupants , creating “micro-climates within a building”
• Other functions: security, identification and personalization, object tagging, seismic monitoring
Dense wireless network of sensor, monitor, and actuator nodes
•Disaster mitigation, traffic management and control• Integrated patient monitoring, diagnostics, and drug administration• Automated manufacturing and intelligent assembly• Toys, Interactive Musea
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PC/DataBased
PC-1laptop
InternetAccess
PC-2
Printer
TelecomBased
VideoPhone
VoicePhone
PDA
Intercom
ApplianceBased
Sprinklers
Toasters
Ovens
Clocks
ClimateControl
UtilityCustomization
SecurityBased
DoorSensorsMotion
Detectors WindowSensors
LightControl
AudioAlarms
Video surveillance
SmokeDetectors
EntertainmentBased
Stereo
TV
Cam Corder
StillCamera
VideoGame
VCR
DVDPlayer
Web-TVSTB
Home Networking:Application (Subnet) Clusters
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Silicon-Processed Micro-needles
Lin and Pisano, IEEE/ASME J. of MEMS, Vol. 8, pp 78-84, 1999
• Neural probe with fluidchannel for bio-medical appl.
• Two micro-needles penetratingporterhouse (New-York) steak
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Industrial Structure Shift
0
20
40
60
80
100
120
’98 ’99 ’00 ’01 ’02 ’03
[M units]
PC
Game MachineCellular DC0
50
100
1 2 3 4 5 6
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(%)
PC
DC
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LSI Market SizeB$
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Market Structure Shift SOC Era has come.
•PC •Wintel Non-Wintel•Shift of Technology Driver
•Current Percentage of SoC Ratio is under 10%.40 in 2005, 70 80 in 2010
•SoC is “single-seat constituency “, “take or not”.•Key Factor is the Synergy between Semiconductor & Set Divisions.
90‘s•PC
00‘s•High Performance Game Machine•Low Power Cellular
-Personal/Internet/Terminal
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Productivity Gap
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The Berkeley Wireless Research Center (BWRC)
�Brodersen, Rabaey, Gray, Meyer, Katz, ASV, Tse and
students
�Cadence, Ericsson, HP, Intel, Lucent, ST, TI, Qualcomm
�Next Generation Wireless systems:
�Circuits
�Architectures
�Protocols
�Design Methodologies
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The “Universal” Radio
Fourth-generation radio providing following features
� Focus on the wireless services with minimal constraints on how the link is provided
� Allows for uncoordinated co-existence of service providers (assuming they provide compatible services)
� Provides evolving functionality
� Adapts to provide requested service given type of service, location, and dynamic variations in environment (i.e. number of users)
� Allows for to continuously upgrade to support new services as well as advances in communication engineering and implementation technologies
Presents an architectural vision to the multi-user, multi-service problem!
� This is in contrast with current approach where standards are the input and architecture the result - leading to spectral wasteland
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Ultra Low-Power PicoRadio
� Dedicated radio’s for ubiquitous wireless data acquisition and display.
Energy dissipation and footprint are of uttermost importance
� Goal: P < 1 mW enabling energy scavenging and self-powering
� Challenges:�System architecture: self-configuring and fool-proof
�Ultra-low-power design
�Automated generation of application-specific radio modules making extensive use of parameterizable module generators and reusable components
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Integrated CMOS Radio
AD
Analog RF
Timingrecovery
phone
book
Java VM
ARQKeypad,Display
Control
FiltersAdaptive AntennaAlgorithms
Equalizers MUD
Accelerators(bit level)
analog digital
DSP core
uC core
(ARM)
Logic
Dedicated Logicand Memory
Integrate within the same chip very diverse system functions like:wireless channel control, signal processing, codec algorithms,
radio modems, RF transceivers… and implement them using a heterogeneous architecture
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Communication versus Computation
� Computation cost (2004): 60 pJ/operation (assuming continued scaling)
� Communication cost (minimum):� 100 m distance: 20 nJ/bit @ 1.5 GHz
� 10 m distance: 2 pJ/bit @ 1.5 GHz
� Computation versus Communications� 100 m distance: 300 operations == 1bit
� 10 m distance: 0.03 operation == 1bit
Computation/Communication requirements vary with distance, data type, and environment
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Energy-efficient Programmable Implementation Platform
EmbeddedMicroprocessor/
DSP System
ProgrammableLogic
DedicatedModules
ConfigurableArithmetic and Logic
Processors
Communication ChannelProtocol Processing
Analog R
F“Software-defined Radio”
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Outline
�Scenario and Characteristics of Future Information Technology
�Embedded Systems : Automotive, Home Networks, Smart Dusts, Universal Radios
�What is Needed at the Infrastructure Level
�High-Leverage System Design Paradigms:�Communication-based Design
�Architecture-Function Co-design
�Platform-based Design as Implementation Technology
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What is Needed? (Endeavor Expedition,BerkeleyOxygen, MIT)
� Automatic Self-Configuration� Personalization on a Vast Scale
� Plug-and-Play
� The OS of the Planet� New management concerns: protection, information utility, not scheduling
the processor
� What is the OS of the Internet? TCP plus queue scheduling in routers
� Adapts to You� Protection, Organization, Preferences by Example
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Technology Changes & Architectural Implications
�Zillions of Tiny Devices� Proliferation of information
appliances, MEMS, etc.
�“Of course it’s connected!”� Cheap, ample bandwidth
� “Always on” networking
�Vast (Technical) Capacity� Scalable computing in the
infrastructure
� Rapid decline in processing, memory, & storage cost
�Adaptive Self-Configuration
�Loosely Organized
�“Good Enough” Reliability and Availability
�Any-to-Any Transducers (dealing with heterogeneity, over time--legacy--and space)
�Communities (sharing)
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Adaptive Self-Configuration
� Plug-and-Play Networking� No single protocol/API: standardization processes too slow and stifle
innovation
� Devices probe local environment and configure to inter-operate in that environment
� “Computer” not defined by the physical box: portals and ensembles
� Local Storage is a Cache� Invoke software and apps migrate to local disk
� System Learns Preferences by Observation� E.g., “Privacy by Example:” owner intervention on first access, observe
and learn classification, reduce explicit intervention over time
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Loose Organization
�Loosely Structured Information
�Large volume, easily shared: supports communities
�Self-Organized
�Too time consuming to do yourself: Organize by example
� Individualized & context-dependent filtering
� Incremental Access, Eventually exact
�Query by concept: “What did Dave read about storage prices?”� “A close answer quickly is better than a precise answer in the far future”; � Probabilistic access is often “good enough”
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Any-to-Any Transducers
� No need for agreed upon/standardized APIs (though
standard data types are useful)� If applications cannot adapt, then generate transducers in the
infrastructure automatically
� Exploits compiler technology
� Enhance plug-and-play to the application level
� Legacy Support� Old file types and applications retained in the infrastructure
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Next-Generation Operating Environments
� Advances in hardware and networking will enable an entirely new kind of operating system, which will raise the level of abstraction significantly for users and developers.
� Such systems will enforce extreme location transparency� Any code fragment runs anywhere
� Any data object might live anywhere
� System manages locality, replication, and migration of computation and data
� Self-configuring, self-monitoring, self-tuning, scaleable and secure
Adapted from Microsoft “Millenium” White Paperhttp://www.research.microsoft.com
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Outline
�Scenario and Characteristics of Future Information Technology
�Embedded Systems : Automotive, Home Networks, Smart Dusts, Universal Radios
�What is Needed at the Infrastructure Level
�High-Leverage System Design Paradigms:�Communication-based Design
�Architecture-Function Co-design
�Platform-based Design as Implementation Technology
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• Economics• Productivity• Process • IP Delivery & Reuse•Tools & Methodology•Manufacturing
How do we move SoC Design from the pilot line to production ?
Source:M.Pinto, CTO, Lucent MT
Issues Limiting SOC Ramp
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SoC Landscape 2000+
• Total Cost Ownership• Average cost of a high end ASSP >$5M• Cost of fabrication and mask making has
increased significantly ($500k+ for masks alone)• SoC/ASIC companies look for a 5-10x return on development costs (~ $10M revenue)
• Shorter and more uncertain product life cycles
• Compounding Complexities limiting Time-to-Market • Chip design complexity • Silicon process complexity • Context complexity • End-to-end verification
• New “System to Silicon” methodologies are required that recognized 80% of the system development issoftware
Source:M.Pinto, CTO, Lucent MT
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Productivity 2000+ Challenge
System Architecture• Hardware• Software
Logic DesignVerification
Physical Design
Silicon Processing
Will the design team deliver on time and within budget?
15x - Productivity GAP
15M Tran
s./Staff-M
on
th
1.0M
100M
10M
Lo
gic
Tra
ns .
/Ch
ip
(Ave
rag
e o
f T
op
10%
of
Co
des
)
Source:M.Pinto, CTO, Lucent MT
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Process ChallengeCan you integrate what you need ?
Lucent Modular Process Strategy• Communications focus• IP re-use across businesses• Flexible system partitioning• Only pay for what you need• Leverage high volume platform• Manufacture at fabs worldwide
Memory
ASICDSP
Baseband
Processing
High Frequency
(RF)
Filters
Mixers/VCOLNA/PA
High performance(speed, power, density)
core CMOS+SRAM platform
Efficient (performance/cost)mix-and-match modules
+
Linear(to 4 masks)
RF(to 3 masks)
BiCMOS(3-4 masks)
FLASH(<4 masks)
FPGA/FPSC(1 mask)
eSRAM(1 mask)
“Fast Gate”(3 masks)
Copper(0 masks)
SiGe(4 masks)
Source:M.Pinto, CTO, Lucent MT
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12/09/1999 49
Manufacturing Paradigm ChallengeInterconnection Dominates Fabrication Throughput
% of Fab of Interconnection vs. % of Fab Up-to-Contact
% o
f Fa
b Pr
oces
s
2LM 09µm
2LM 0.5 µm
3LM 0.35 µm
4LM0.25 µm
Fab % up to contactFab % of interconnect
01020304050
60708090
100
• Drives the need for new rapid prototype and production techniques• Impacts industry spare gate methodology for quick fixes
• All metal programmable option lose their time to market advantage
6LM0.16 µm
Source:M.Pinto, CTO, Lucent MT
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Deep Submicron Paradigm Shift
40M Transistors2,000M Metal600 MHzWire RC 6 ns/cm
2M Transistors100M Metal100 MHzWire RC 1 ns/cm
20011991 1996
Cell Based Design- Minimize Area- Maximize Performance- Optimize Gate Level
90%New
Design
Virtual Component Based Design- Minimize Design Time- Maximize IP Reuse- Optimize System Level 90%
ReusedDesign
2 2
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Deep Sub-Micron: Impact on Semicon Industry
“Real”Component
System on Board
“Virtual” Component
System on Silicon
� Today, several IC companies have a chance of selling their devices on a board.
� With the possibility of integrating an entire system on a single chip, there will be room only for one manufacturer!!!
� However, nobody can possibly know all these areas in depth.
Deep Sub-Micron
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Virtual Components and System Design
“Real”Component
System on Board
“Virtual” Component
System on Silicon
� Select the best components from several different internal and external vendors
� Integrate the system using standard interfaces
� Validate the design functionality, performance and reliability.
Componentbased design
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Industry Structure: Tomorrow
Manufacturing
IP Providers
System Product DefinitionMarketing
Implementation,IP Selection and Certification
Chip,Substrate,BoardAssembly
Architectural Design and
Assembly
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SoC Economic Challenge “2000+”
SoC Development Costand Tiime
Custom
Structured Custom
Platform Technology
Process Technology
IP IntegrationSilicon Verification
Integrated (HW/SW/IP)Application FocusRapid Low Cost CustomizationNew Methodologies
$Millions(Years)
$Thousands(Months)
Time009590
Design Focus
Platform Technology lowers the cost of entry and accelerates time-to-market
Source:M.Pinto, CTO, Lucent MT
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Implementation Design Trends
Flat ASIC+
Platform BasedConsumerWirelessAutomotive
HierarchicalMicroprocessorsHigh end servers& W/S
Flat LayoutNet & Compute ServersBase stations
EDA
Flat ASIC
MicroP
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ASIC in Computers & Servers, still flat today
�ASIC in 1999: 3.7 Million Gates high end, some mid range
�“Most of Sun’s ASIC have outgrown the capabilities of flat timing free layout design methodologies”
Source: Sun Microsystems-DS99
ASIC in 2000: 5 M gates + 1.5-2M Memory, 300-500 MHz•“hierarchy the norm and not the exception”•“trial layout giving way to iterative physical chip integration”
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Digital Wireless Platform
AD
Analog RF
Timingrecovery
phone
book
Java VM
ARQ
Keypad,Display
Control
FiltersAdaptive AntennaAlgorith
ms
Equalizers MUD
Accelerators(bit level)
analog digital
DSP core
uC core
(ARM)
Logic
Dedicated Logicand Memory
Source: Berkeley Wireless Research Center
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Will the system solution match the original system spec?
Software Hardware?
TxOptics
Synth/MUX
CDR/DeMUX
RxOptics
VCXO
mP
ClockSelect
LineI/F
OHPSTSPP
STSXC SPE
MapData
Framer
Cell/Packet
I/F
STMI/F
• IP Selection• Design• Verification
• Development• Verification• System Test
Concept• Limited synergies between HW & SWteams
• Long complex flows in which teamsdo not reconcile efforts until the end
• High degree of risk that devices willbe fully functional
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Historical EDA Focus
EDA Challenge to Close the Gap (SIA MARCO GSRC Project, Berkeley Center)
Lev
el o
f A
bstr
acti
on
Behavior
SW/HW
RTL
Silicon
Concept to Reality
Gap
Design Entry Level
Gate Level “Platform”
Impact of Design Change(Effort/Cost)
Source: GSRC
• Industry averaging 2-3 iterations SoC design
• Need to identify design issues earlier
• Gap between concept and logical / Physical implementation
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What is a System Anyway?
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System (for us)
�Environment to environment
�Sensors + Information Processing + Actuators�Computer is a system
�Micro-processor is not
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Embedded Systems
�Non User-Programmable
�Based on programmable components (e.g. Micro-
controllers, DSPs….)
�Reactive Real-Time Systems:
�“React” to external environment
�Maintain permanent interaction
� Ideally never terminate
�Are subject to external timing constraints (real-time)
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� Assembly of “prefabricated component” often purchased from external vendors (“IP”)– “black box” hierarchy
� Design & Verification at the System level– rather than the logic level– Interface and communication
� Great Importance of Software
µP
DSPCom
s
Video Unit
custom
Graphics
software
The New IC Micro-system
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Design Methodology Progression
TechnologyIndependent
Technology Dependent
HDLs
Micro-architecture
s
System on a Chip
synthesis
SmartLibs
++
MPEG
++
Block-based design
++
MPEG
MPEG
RAMµC
schematics
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Integrate
Arch.Integrate
Arch.
Integrate
Arch.
Block Based Design
Integrate
RTL
Synth
P&R
FP
Arch
Arch.
Integrate
Arch.
IP Providers
IP Users
hard
Arch.
Synth
P&R
FP
Integrate
soft
Arch
Integrate
Verify
FP
Route
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Types of Virtual Components
Hard VC- Polygon level data- Technology Specific- Fixed Form & Function- Well characterized
Soft VC- RT Level or above- Technology Portable- Flexible Form & Function- Estimated size and speed
Firm VC- Gate level or Synthesizable RT level data- Some Technology and/or Physical constraints- Some flexibility on Form and Function- Predictable size and speed
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12/09/1999 67
Alliance Vision... Intra- and Inter-Company World Wide IP Networks
IndependentIP Provider
System HouseCorporate Headquarters
OverseasAffiliate withProprietary IP
Semiconductor& IP Provider
Rapid IPIdentification,Business Transaction, & Design-in