Webinar Wire Bonding 2016 - WE Home€¦ · Your Speaker Dipl.-Ing. (FH), MBA Philipp Conrad At...
Transcript of Webinar Wire Bonding 2016 - WE Home€¦ · Your Speaker Dipl.-Ing. (FH), MBA Philipp Conrad At...
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Webinar Wire Bonding 2016
Würth Elektronik Circuit Board Technology
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Your Speaker
Dipl.-Ing. (FH), MBA Philipp Conrad
At Würth Elektronik CBT since 2008
Product Manager Wire Bonding
Cooperation with B&F Bonding since 2010
www.we-online.de/wirebondingSeite 204.05.2016
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Agenda
Wirebonding
Quality Control
Applications
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WirebondingProcess
Bare Die Pickup
Bare Die Placement
Wirebonding (25µm Diameter)
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WirebondingDesign Rules
Cu
Ni
Pd
0,04 – 0,08 µm
0,1– 0,2 µm
4 – 7 µm
Au
ENEPIG
Cu
Ni
Au 0,05 – 0,1 µm
4 – 7 µm
ENIG
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Gold Wire Bonding
Source: B&F Bonding
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Substrate
Protection of Die and Wire Bonds
Substrate
Globtop
Lensholder
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WirebondingAdvantages of „wirebonded“ components?
Miniaturization
Performance/Function
Reliability
• Thermal Management• Short signal paths (HF)
• Wirebond Tester• Over 25 years Experience• WE know HOW
• Package replacement• Space savings • High Precision Positioning
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Agenda
Wirebonding
Quality Control
Applications
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Quality ControlWirebond Tester
Advantages XYZTec Wirebond-Tester (since 02/2016)
Automated Process
Standardized Test Process
Continuous Surface Quality Control
Online Test
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Agenda
Wirebonding
Quality Control
Applications
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ApplicationsInternal Study: “WE LED”
Replacement for E1O Socket
PCB: Double Sided FR4, 2,4mm Core, Edge Plating
Bare die is glued to the edge of the PCB, wire bonded and encapsulated
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SMD LED or Bare die LED?
Source: OSRAM
Decision made on thermal considerations:
Use of bare dies(Thermal resistance casing eliminated)
SMD LEDs
Advantages:
� Good availability� Large range of various types and
manufacturers available � Tried and tested standard assembly process
But:
Thermal resistanceJunction layer� Solder pad 6,5 - 11 K/W (Datasheet OSRAM Golden DRAGON Plus)
ApplicationsLED High Power Module
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� PCB production� Thermal management� Sourcing bare die LED diodes in small
quantities� Placement and wire bonding of the diodes� Encapsulation and protection of the diodes� System solution
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ApplicationsLED High Power Module
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How will the assembly and connection technologybe realised
� Double sided PCB or multilayer with individual bare die assembled and wire bonded
� Individual heatsinks glued
� Miniaturisation through reduction of the overall height
� Optimized thermal management
� Adjustment of the projection angle
Heatsink
Bare Die
ApplicationsLED High Power Module
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Referencen
Testboard
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www.we-online.com/thermal_management04/05/2016
� 4-Layer Flex with bare die directly wire
bonded on a copper
Heatsink 0.8 mm with ENIG-surface
� 2 Chips in Cavity
� AlSi-wire bonding
Source: UNI Heidelberg/CERN
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Applications
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Summary
High accuracy placement compared to SMD solder process
High accuracy placement of the bare die in following sectors:
• Optoelectronics (3D Camera Systems)
• Sensor Applications
• Medical Applications
Flexible design
Advantages of Wire Bonding
• Miniaturisation
• Very good electrical connection
• Good mechanical and thermal stabilty
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Now it’s your turn!
www.we-online.de/wirebondingSeite 1904.05.2016
Philipp Conrad Dipl.-Ing.(FH), MBA
Productmanager Wirebonding
Würth Elektronik GmbH & Co. KGCircuit Board Technology
Standort Schopfheim
An der Wiese 179650 Schopfheim
Germany