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i WBSR12 IEEE 802.11 b/g/n 1T1R SDIO+ BT 2.1/3.0/4.0 UART Module Product Specification 1.0 Approved: Approved: Prepared by: ________________________ _________________________ _________________________ Zeke Wu Matt Lin Mark Hsu Manager Supervisor Engineer

Transcript of WBSR12 - SOCLE Tech Channel Product/Foxconn... · security, and 802.11 for enhanced MAC protocol...

Page 1: WBSR12 - SOCLE Tech Channel Product/Foxconn... · security, and 802.11 for enhanced MAC protocol efficiency. Using packet aggregation tech-niques such as A-MPDU with BA and A-MSDU,

i

WBSR12

IEEE 802.11 b/g/n 1T1R SDIO+ BT 2.1/3.0/4.0 UART Module

Product Specification 1.0

Approved: Approved: Prepared by:

________________________

_________________________

_________________________

Zeke Wu Matt Lin Mark Hsu Manager Supervisor Engineer

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FOXCONN CONFIDENTIAL 1 This preliminary specification is subject to change without notice.

Copyright © 2014 Hon Hai Precision Ind Co., Ltd. All rights reserved

Revision History

Date Number Approver Comments

Nov. 11, 2014 1.0 Mark Hsu Initial Draft

Feb.09,2017 1.1 Mark Hsu Add module photo and pin1

RESTRICTED AND CONFIDENTIAL INFORMATION STATEMENT

All information contained in this document is the exclusive property of Foxconn Technology Inc. and its

development partners. Any reproduction or disclosure of all or part of this document without the

expressed written consent of Foxconn Technology Inc. is strictly prohibited.

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FOXCONN CONFIDENTIAL 2 This preliminary specification is subject to change without notice.

Copyright © 2014 Hon Hai Precision Ind Co., Ltd. All rights reserved

TABLE OF CONTENTS

Chapter 1. Module Overview ............................................................................. 3

1-1 Key Characteristic.................................................................................................................. 3

1-2 Certification ........................................................................................................................... 4

1-3 Block Diagram ....................................................................................................................... 4

1-4 Interface ................................................................................................................................ 4

Chapter 2. Electrical and RF Specificaiton .......................................................... 7

2-1 Recommended Operation Rating ......................................................................................... 7

2-2 Power Consumption.............................................................................................................. 7

2-3 WiFi RF Specification – TX ..................................................................................................... 7

2-4 WiFi RF Specification – RX ..................................................................................................... 8

2-5 Bluetooth RF Specification .................................................................................................... 9

2-6 Bluetooth Low Energy RF Specification .............................................................................. 11

Chapter 3. MECHANICAL SPECIFICATION ......................................................... 12

3-1 Module Assembly Dimension ............................................................................................. 12

3-2 Label Specification .............................................................................................................. 12

Chapter 4. Additional Information ................................................................... 13

4-1 Module Photo ..................................................................................................................... 13

4-2 Environment Specifications ................................................................................................ 13

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FOXCONN CONFIDENTIAL 3 This preliminary specification is subject to change without notice.

Copyright © 2014 Hon Hai Precision Ind Co., Ltd. All rights reserved

CHAPTER 1. MODULE OVERVIEW

The Foxconn WBSR12 wireless module contains the Realtek RTL8723BS-VD single chip

which is a highly integrated single-chip 802.11b/g/n Wireless LAN with SDIO interface and

integrated Bluetooth 2.1/3.0 /4.0 with UART interface. It combines a WALN MAC, a 1T1R

capable WLAN based-band, and RF in a single chip. The RTL8723BS provides a complete

solutionor for a high performance intergrated wireless LAN and Bluetooth device. The

integration provides good coordination and with sophisticated dynamic power control and

packet traffic arbitration to achieve good coexistence perofrmance between 802.11 and

Bluetooth.

The RTL8723BS-VD WLAN MAC supports 802.11e for multimedia application, 802.11i for

security, and 802.11 for enhanced MAC protocol efficiency. Using packet aggregation tech-

niques such as A-MPDU with BA and A-MSDU, protocol efficiency is significantly improved.

Power saving mechanisms such as Legacy Power Save, and U-APSD, reduce the wasted during

idle time, and compensate for the extra power required to transmit OFDM.

The RTL8723BS-VD Bluetooth controller complies with Bluetooth core v4.0, and support

dual mode (BR/EDR + AMP +Low Energy Controllers). It is compatible with previous versions

including v2.1 + EDR and v3.0 + HS. For BR/EDR, it can support scatternet topology up to four

active links in slave mode, and seven active links is master mode. For Low Energy, it supports

multiple states and allows eight active lins in master mode. Both BR/EDR and LE can operate

simultaneously.

1-1 Key Characteristic

CMOS MAC, Baseband PHY, and RF in a single chip 802.11b/g/n compatible WLAN

72.2Mbps receive PHY rate and 72.2Mbps transmit PHY rate using 20MHz bandwidth

150Mbps receive PHY rate and 150Mbps transmit PHY rate using 40MHz bandwidth

802.11e QoS Enhancement(WMM)

802.11i(WPA,WPA2). Open, shared key, and pair-wise key authentication services

Compatible with Bluetooth v2.1 and v3.0 Systems

Support Bluetooth 4.0 Low Energy(BLE)

Integrated MCU to execute Bluetooth protocol stack

Enhanced BT/WiFi Coexistence Control to improve transmission quality in different profiles

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FOXCONN CONFIDENTIAL 4 This preliminary specification is subject to change without notice.

Copyright © 2014 Hon Hai Precision Ind Co., Ltd. All rights reserved

1-2 Certification

TBD

1-3 Block Diagram

The general HW architecture is shown below Figure:

1-4 Interface

BACK VIEW

1

2

3

4

5

6

7

8

9

10

11

33

32

31

30

29

28

27

26

25

24

23

22 21 20 19 18 17 16 15 14 13 12

34 35 36 37 38 39 40 41 42 43 44

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Pin Number Symbol Name Type Pin Description

1 GND GND Ground

2 WL_BT_ANT Signal WiFi+BT RF Signal

3 GND GND Ground

4 NC - Keep floating

5 NC - Keep floating

6 BT_WAKE Signal Host wake BT device

7 BT_HOST_WAKE Signal BT device wake HOST

8 NC - Keep floating

9 VBAT VBUS +3.3V

10 WL_XTAL_IN - Keep floating

11 WL_XTAL_OUT - Keep floating

12 WL_REG_ON Signal WiFi disable

13 WL_HOST_WAKE Signal WiFi device wake HOST

14 SDIO_DATA_2 Signal SDIO_DATA_2

15 SDIO_DATA_3 Signal SDIO_DATA_3

16 SDIO_DATA_CMD Signal SDIO_DATA_CMD

17 SDIO_DATA_CLK Signal SDIO_DATA_CLK

18 SDIO_DATA_0 Signal SDIO_DATA_0

19 SDIO_DATA_1 Signal SDIO_DATA_1

20 GND GND Ground

21 VIN_LDO_OUT VBUS Keep floating

22 VDDIO VBUS 3.3V

23 VIN_LDO VBUS Keep floating

24 LPO Signal SUSCLK_IN

25 PCM_OUT Signal PCM_OUT

26 PCM_CLK Signal PCM_CLK

27 PCM_IN Signal PCM_IN

28 PCM_SYNC Signal PCM_SYNC

29 WL_VDD_TXCO Signal Keep floating

30 TCXO_IN Signal External 26Mhz CLK

31 GND GND Ground

32 NC - Keep floating

33 GND GND Ground

34 BT_RST_N Signal BT disable

35 NC - Keep floating

36 GND GND Ground

37 BT_XTAL_IN Signal Keep floating

38 BT_XTAL_OUT Signal Keep floating

39 NC - Keep floating

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40 NC - Keep floating

41 UART_RTS_N GND Ground

42 UART_TXD Signal HOST UART_IN

43 UART_RXD Signal HOST UART_OUT

44 UART_CTS_N Signal HOST UART_RTS_OUT

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CHAPTER 2. ELECTRICAL AND RF SPECIFICAITON

2-1 Recommended Operation Rating

Parameter Condition Min Typ. Max. Unit

VBUS 3.3V 3.0V 3.3V 3.6V V

RF Interface Zo 50 Ohm

2-2 Power Consumption

Power consumption is measured using current probe loop on the Power rails of the USB interface (Pins).

De scription

Typical Unit

Disable TBD mA

2.4G/1T- N mode HT 40MHz MCS 7 (14dBm) TBD mA

2.4G/1T- N mode HT 20MHz MCS 7 (14dBm) TBD mA

2.4G/1T- G mode OFDM54M (15dBm) TBD mA

2.4G/1T- B mode CCK11M (16dBm) TBD mA

2.4G/1R- N mode HT 40MHz MCS 7 (-60dBm) TBD mA

2.4G/1R- N mode HT 20MHz MCS 7 (-60dBm) TBD mA

2.4G/1R- G mode OFDM54M (-60dBm) TBD mA

2.4G/1R- B mode CCK11M (-60dBm) TBD mA

2-3 WiFi RF Specification – TX

Data Rate

(Mbps) Modulation

Tx Typical

Power (dBm)

Data Rate

(Mbps) Modulation

Tx Typical Power

(dBm)

1 DBPSK 16 HT20-7.22 BPSK 14

2 DQPSK 16 HT20-14.44 BPSK 14

5.5 CCK 16 HT20-21.67 QPSK 14

11 CCK 16 HT20-28.89 QPSK 14

6 OFDM 16 HT20-43.33 16-QAM 14

9 OFDM 15 HT20-57.78 16-QAM 14

12 OFDM 15 HT20-65 64-QAM 14

18 OFDM 15 HT20-72.22 64-QAM 14

24 OFDM 15 HT40-15 BPSK 14

36 OFDM 15 HT40-30 QPSK 14

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48 OFDM 15 HT40-45 QPSK 14

54 OFDM 15 HT40-60 16-QAM 14

HT40-90 16-QAM 14

HT40-120 64-QAM 14

HT40-135 64-QAM 14

HT40-150 64-QAM 14

2-4 WiFi RF Specification – RX

Data

Rate

(Mbps)

Modulation

Rx Sensitivity

(dBm) Data Rate

(Mbps) Modulation

Rx Sensitivity

(dBm)

Max. Typ. Max. Typ.

1 DBPSK -83 -92 HT20-7.22 BPSK -82 -86

2 DQPSK -80 -90 HT20-14.44 QPSK -79 -83

5.5 CCK -79 -89 HT20-21.67 QPSK -77 -81

11 CCK -76 -84 HT20-28.89 16-QAM -74 -79

6 OFDM -82 -87 HT20-43.33 16-QAM -70 -76

9 OFDM -81 -86 HT20-57.78 64-QAM -66 -71

12 OFDM -79 -85 HT20-65 64-QAM -65 -70

18 OFDM -77 -83 HT20-72.22 64-QAM -64 -68

24 OFDM -74 -80 HT40-15 BPSK -79 -84

36 OFDM -70 -77 HT40-30 QPSK -76 -81

48 OFDM -66 -73 HT40-45 QPSK -74 -79

54 OFDM -65 -71 HT40-60 16-QAM -71 -75

HT40-90 16-QAM -67 -72

HT40-120 64-QAM -63 -68

HT40-135 64-QAM -62 -66

HT40-150 64-QAM -61 -64

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2-5 Bluetooth RF Specification

Parameter Condition Min. Typ. Max. Unit

Basic Data Rate – Transmit Performance

RF Transmit Power (TRM01) -6 7 20 dBm

Power Density (TRM02) Per 100kHz ≤20 dBm

Power Control (TRM03) 2≤ step size ≤ 8 dB

TX Output Spectrum – Freq. Range (TRM04)

F(low)- CH0 > 2400 MHz

F(high)-CH78 < 2483.5

TX Output Spectrum – 20dB BW (TRM05) ∣fH-fL∣< 1000 MHz

TX Output Spectrum – Adjacent Channel Power (TRM06)

∣f-f0∣= 2MHz ≤ -20 dBm

∣f-f0∣≥ 3MHz ≤ -40

TX Output Spectrum – Out of Band Spurious Emission

30MHz – 1GHz ≤ -36 dBm

1GHz -12.75GHz ≤ -30

5.15GHz -5.35GHz ≤ -47

5.725GHz-5.825GHz ≤ -47

Modulation Characteristic (TRM07) Delta f1 avg 140 ≤ ∆f1avg≤ 175 kHz

Delta f2 max ≥ 115 at 99.9%

Delta f2 avg/Delta f1 avg ≥ 0.8

Initial Carrier Frequency Tolerance (TRM08) ≤± 75 kHz

Carrier Frequency Drift (TRM09) DH1 ≤± 25 kHz

DH3 ≤± 40

DH5 ≤± 40

Maximum Drift Rate (TRM09) 20 kHz/50 us

Enhanced Data Rate – Transmit Performance

RF Transmit Power π/4 DQPSK -1.5 1 3.5 dBm

8DPSK -1.5 1 3.5

Relative Transmit Power (TRM10) All pairs (PGFSK-4 dB)<PDPSK<(PGFSK+1 dB)

Carrier Frequency Stability (TRM11) All packets -75 ≤ wi≤ 75 kHz

All blocks -75 ≤ (w0+wi) ≤ 75

All blocks -10 ≤ w0 ≤ 10

Modulation Accuracy – RMS DEVM (TRM11)

π/4 DQPSK ≤ 20 %

8DPSK ≤ 13

Modulation Accuracy – Peak DEVM (TRM11)

π/4 DQPSK ≤ 35

8DPSK ≤ 25

Modulation Accuracy – 99% DEVM (TRM11)

π/4 DQPSK ≤ 30

8DPSK ≤ 20

EDR Differential Phase Emissions (TRM12) ≥ 99 %

In-band Spurious Emission (TRM13) ∣f-f0∣= 1MHz ≤ -26 dB

∣f-f0∣= 2MHz ≤ -20 dBm

∣f-f0∣≥ 3MHz ≤ -40

TX Output Spectrum – Out of Band Spurious Emission

30MHz – 1GHz ≤ -36 dBm

1GHz -12.75GHz ≤ -30

5.15GHz -5.35GHz ≤ -47

5.725GHz-5.825GHz ≤ -47

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Enhanced power control (TRM14) Step Size 2 ≤ Step Size ≤ 8 dB

Difference. Btw. GFSK, π/4 DQPSK,&8DPSK

≤ 10

Basic Data Rate – Receiver Performance

Sensitivity at 0.1% BER (RCV01-02) ≤ -81 dBm

C/I Co-Channel interference (RCV03) ≤ 11 dB

C/I Adjacent CH interference (RCV03) ∣f-f0∣= 1MHz ≤ 0

∣f-f0∣= 2MHz ≤ -30

∣f-f0∣≥ 3MHz ≤ -40

C/I Image CH interference (RCV03) C/Iimage ≤ -9

C/Iimage±1MHz ≤ -20

Out of band Blocking (RCV04) 30MHz – 2000 MHz -10 dBm

2003MHz – 2399MHz -27

2484MHz – 2997MHz -27

3000MHz – 12750MHz -10

Intermodulation Performance at ≤ 0.1% BER (RCV05) -64 dBm

Maximum input power level ≥ -20 dBm

Spurious Emission 30MHz – 12.75GHz ≤ -57 dBm

Enhanced Data Rate – Receiver Performance

Sensitivity at 0.1% BER (RCV07) π/4 DQPSK ≤ -85 dBm

8DPSK ≤ -77

EDR BER Floor Performance at ≤ 0.0007% BER (RCV08) -60 dBm

C/I Co-Channel interference (RCV09) π/4 DQPSK ≤ +13 dB

8DPSK ≤ +21

C/I Adjacent Channel C/I ∣f-f0∣= 1MHz (RCV09)

π/4 DQPSK ≤ 0

8DPSK ≤ +5

C/I Adjacent Channel C/I ∣f-f0∣= 2MHz (RCV09)

π/4 DQPSK ≤ -30

8DPSK ≤ -25

C/I Adjacent Channel C/I ∣f-f0∣≥3MHz (RCV09)

π/4 DQPSK ≤ -40

8DPSK ≤ -33

C/I Image Channel C/Iimage (RCV09) π/4 DQPSK ≤ -7

8DPSK ≤ 0

C/I Image Channel C/Iimage±1MHz (RCV09) π/4 DQPSK ≤ -20

8DPSK ≤ -13

Maximum input power level (RCV10) ≥ -20 dBm

Spurious Emission 30MHz – 12.75GHz ≤ -57 Pass

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2-6 Bluetooth Low Energy RF Specification

Parameter Condition Min. Typ. Max. Unit

Transmit Performance

RF Transmit Power (TRM-LE01,02) -6 4 20 dBm

In-Band Emission (TRM-LE03,04) ∣f-f0∣= 2MHz ≤ -20 dBm

∣f-f0∣≥ 3MHz ≤ -30

TX Output Spectrum – Out of Band Spurious Emission

30MHz – 1GHz ≤ -36 dBm

1GHz -12.75GHz ≤ -30

5.15GHz -5.35GHz ≤ -47

5.725GHz-5.825GHz ≤ -47

Modulation Characteristic (TRM-LE05) Delta f1 avg 225 ≤ ∆f1avg≤ 275 kHz

Delta f2 max ≥ 185 at 99.9%

Delta f2 avg/Delta f1 avg ≥ 0.8

Carrier Frequency Drift (TRM-LE06,07) Center frequency ≤± 150 kHz

During any packet ≤± 50

Maximum Drift Rate (TRM-LE06,07) 20 Hz/50 us

Receiver Performance

Sensitivity at 30.8% PER(0.1%BER) (RCV-LE01,02) ≤ -81 dBm

C/I Co-Channel interference (RCV-LE03) Co-channel ≤ 21 dB

C/I Adjacent CH interference (RCV-LE03)

∣f-f0∣= 1MHz ≤ 15

∣f-f0∣= 2MHz ≤ -17

∣f-f0∣≥ 3MHz ≤ -27

C/I Image CH interference (RCV-LE03) C/Iimage ≤ -9

C/Iimage±1MHz ≤ -15

Out of band Blocking (RCV-LE04) 30MHz – 2000 MHz -30 dBm

2003MHz – 2399MHz -35

2484MHz – 2997MHz -35

3000MHz – 12750MHz -30

Intermodulation Performance at ≤30.8% (≤ 0.1% BER) (RCV-LE05) -64 dBm

Maximum input power level (RCV-LE06) ≥ -10 dBm

PER Report Integrity 50% ≤ PER ≤ 65.4% (RCV-LE07) -30 dBm

Spurious Emission 30MHz – 12.75GHz ≤ -57 dBm

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CHAPTER 3. MECHANICAL SPECIFICATION

3-1 Module Assembly Dimension

FRONT VIEW

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SIDE VIEW

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BACK VIEW

3-2 Label Specification

TBD

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CHAPTER 4. ADDITIONAL INFORMATION

4-1 Module Photo

FRONT VIEW

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BACK VIEW

4-2 Environment Specifications

Operation

Operation Temperature : 0 ~ 55 degree

Relevant Humidity: 5 ~ 90% (non-condensing)

Storage

Operation Temperature : 0~55 degree

Relevant Humidity: 5 ~ 90% (non-condensing)

i