Wafer probe technology & application overview ira feldman 101108

OSCILLOSCOPEDesign file: MSFT DIFF CLOCK WITH TERMINATORREV2.FFS Designer: Microsoft

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Wafer Probe Technology & Application Overview

Date: Wednesday Mar. 3, 2010 Time: 14:16:09

Application Overview

Ira Feldmana e d a650‐472‐1192iradave@gmail.comwww.hightechbizdev.comwww.hightechbizdev.com

1Silicon Valley Test Conference 2010© 2010 Ira Feldman

AgendaAgenda

• IntroductionIntroduction

• Application Examples

C h l i / b• Contact Technologies / Probe Types

• Top Vendors

• Hot Topics

• SummarySummary

• Resources

Silicon Valley Test Conference 2010 2

Devices & Packages –Have Evolved!


UV EPROM circa 1974http://www.cpushack.com/EPROM.html

Peripheral Pads ‐ LogicPeripheral Pads Logic

SWTW 2009: MEMS Technology – Enabling Design


http://www.chipworks.com/uploadedImages/Blog/blogimagessq310/AKM8975_6210_cal_branded.JPG

Flexibility for Fine Pitch ProbingBahadir Tunaboylu, SV Probe

Fine Pitch LogicFine Pitch Logic


Kulicke & Soffa: http://www.imaps.org/imaps2005/keynote.pdf

SWTW 2009: MEMS Technology – Enabling Design Flexibility for Fine Pitch ProbingBahadir Tunaboylu, SV Probe

Area Array – Logic, µP, etc.Area Array Logic, µP, etc.

Silicon Valley Test Conference 2010 6http://www.tradekorea.com/product-detail/P00032217/Solder_Bump.html

Marketing Version of a CPU…Marketing Version of a CPU…

Intel Core i7-980X Extreme 6-Core Processor (32nm Q1 ’10)


( )http://hothardware.com/News/Intel-Core-i7980X-Extreme-6Core-

Processor-Review/

…What Probe Really Sees…What Probe Really Sees


Intel Technology Journal (6/2008):45 nm process ~50 µm tall Cu bumps

No One Solution Fits AllNo One Solution Fits All10

0nt

(K)

DRAM&

050

robe

Cou

& NOR FLASH

Memory

510

xim

ate

Pr

Microprocessor&

Logic

SOC&

Logic LCD /

NAND FLASH

1App

rox

TSV

g(Area Array)

g LCD /DisplayMemory


150 100 6080 2040Approximate Pitch (µm)

Many Other ParametersMany Other Parameters

• “Pad” type – bond pad, BGA, column, bumpyp p , , , p

• Pad Configuration – peripheral, LOC, DLOC, array

• Die Size

• Pad Size ‐ passivation opening & keep away

• Pad Metal – Al, Cu, Au, solder, etc.

• Force Requirements

• Scrub Depth

• Frequency / Bandwidth• Frequency / Bandwidth

• Pad Density (probes / mm2)

• Active Area (size of probe array)Active Area (size of probe array)

• TemperatureSilicon Valley Test Conference 2010 10

Contact Technologies / Probe Types

• CantileverCantilever

• Blade

• VerticalVertical

• MEMS– VerticalVertical

– Micro Cantilever

– Torsional

• Spring

• Membrane


CantileverCantilever

Technoprobe

K&S: http://www.imaps.org/imaps2005/keynote.pdf

Technoprobe


BladeBlade

Silicon Valley Test Conference 2010 13SV Probe

Vertical ‐ Buckling BeamVertical Buckling Beam

M SWTW T t i l 2004

FormFactor: “MEMS for ProbeCard Applications” Chong Chan Pin – Semicon Singapore 2010

Mann: SWTW Tutorial 2004


SV Probe “Trio”JEM “VC”

Vertical ‐ Buckling BeamVertical Buckling Beam

MicroProbe: Apollo Vertical

JEM: VC

Silicon Valley Test Conference 2010 15SV Probe: Trio

MEMS ‐ VerticalMEMS Vertical

Microfabrica MicroProbeMicrofabrica MicroProbeFormFactor (T1)

Silicon Valley Test Conference 2010 16MicroProbe (Vx-MP)

MEMS ‐Micro CantileverMEMS Micro Cantilever

Microfabrica

FormFactor (T3)

MJC (U P b )


http://www.mjc.co.jp/eng/ir/pdf/MJC070226-s.pdf

MJC (U Probe)JEM

MEMS ‐ TorsionalMEMS Torsional

Touchdown Technologies (ACCU-TORQ)Touchdown Technologies (ACCU TORQ)

SWTW 2010: “Low-Force MEMS Probe Solution for Full Wafer Single Touch Test” Matt Losey


Spring PinsSpring Pins

http://www.nhkspg.co.jp/eng/mc/products/wlt.html


http://www.ksdk.co.jp/eng/spring-probes.htmlJEM VS

MembraneMembrane


Cascade Microtech Pyramid Probe

Top Vendors ‐ TechnologyTop Vendors Technology

Revenue per VLSI Research press release


Revenue per VLSI Research press releasehttps://vlsiwebserver.vlsiresearch.com/public/cms_pdf_upload/458310.pdf

Based upon website and company responses to marketing inquires.

Top Vendors ‐ ApplicationsTop Vendors Applications

Based upon website and company responses to marketing inquires


Based upon website and company responses to marketing inquires.

Hot Topics (1)Hot Topics (1)

B / b ll dMost

I i ti l • Bump / ball damage

• Cu probing

Inspirational

• High currentMost Inspirational



• High Frequency / high bandwidthHigh Frequency / high bandwidth– Advanced space transformers

Modeling– Modeling

– Direct Dock



• Operational – lower cost quicker cycle timeOperational lower cost, quicker cycle time


SummarySummary

• Device product requirements drive bothDevice product requirements drive both packaging and test complexity– Essential to partner with suppliers from day one– Essential to partner with suppliers from day one

C f l l ti f b d d• Careful selection of probe card vendors– Know strengths & weaknesses for your devices

– Technology may limit performance & impact cost

– No one solution fits all


ResourcesResources

• IEEE Semiconductor Wafer Test WorkshopIEEE Semiconductor Wafer Test Workshopwww.swtest.org

• International Test Conferencewww.itctestweek.org

• My blogswww.hightechbizdev.com

www.ateforum.com/tothepoint


CreditsCredits

Thank you to the vendors who provided photos!Thank you to the vendors who provided photos!

• FormFactor

h b• Technoprobe

• MicroProbe

• JEM

• SV ProbeSV Probe

• Cascade Microtech

V i• VerigySilicon Valley Test Conference 2010 28

Wafer probe technology & application overview ira feldman 101108

Technology

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