Wafer Level Packaging & Bumping – A view from a European ... · PDF fileCertified ISO...
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Certified ISO 9001:2000 & ISO TS 16949
9th International IEEE CPMT Symposium on High Density Design,Packaging and Microsystem Integration (HDP’07)
26th-28th June 2007Shanghai, China
Wafer Level Packaging & Bumping– A view from a European Service Provider
Thomas OppertVP Marketing & Sales
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• Overview on Semiconductor Markets– 1970 to 2010– Applications and usage/implementation of eless NiAu
• ENIG UBM – History & Now– The early days of eless NiAu– Licenses & worldwide wafer bumping capacity– Pac Tech and eless NiAu now– Equipment for eless NiAu
• Soldering– Paste Printing– Single Ball Placement– Gang (Micro) Ball Placement
• Summary
Content
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Certified ISO 9001:2000 & ISO TS 16949
Overview on Overview on Semiconductor MarketsSemiconductor Markets
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Certified ISO 9001:2000 & ISO TS 16949
Evolution Semiconductor Market 1970 - 2010
Military/ Aerospace
Government
Enterprise
Internet
Consumer/Wireless
Source: SIA
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Semiconductor Market 2006
PC/ Computer 43,70%
Cell Phone/ mobil 17,00%
Wired Comm 7,00%
Industrial/ Military 7,30%
Automotive 8,70%Consummer
17,20%
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Products using electroless Ni/Au
• …First for products under very high price pressure (RFID)
• Meanwhile wide range of applications- ASIC (Sensors)- LCD Drivers- PowerMOS (Automotive)- Protection devices (Passives) CSP‘s, WLCSP‘s- Memories and memory modules- Consumer electronics- Mobile Phone- Medical (Ear phone)
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Worldwide use of Pac Tech eless Ni & solder printing
Mobile Phone; 40,00%
MOSFET; 20,00%
RFID; 20,00%
Memory; 5,00%
LCD Driver/ ASIC; 5,00%
Medical; 10,00%
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Electroless Electroless NiAuNiAuHistory & NowHistory & Now
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Certified ISO 9001:2000 & ISO TS 16949
A Crazy Idea?• Technically impossible• Wrong concept• Not reliable• No infrastructure• Economically not feasible• hard to control dangerous / critical• Will be never accepted by customer
Electroless Ni/Au for Semiconductor Devices
Sounds familiar?
19901990
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Certified ISO 9001:2000 & ISO TS 16949
A Crazy Idea?• Technically impossible• Wrong concept• Not reliable• No infrastructure• Economically not feasible• hard to control dangerous / critical• Will be never accepted by customer
Remember:
18861886
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History of electroless Ni/Au @ Pac Tech
• Basic studies & publications in 1985• First active electroless bumped wafer in 1989• Formation of Pac Tech in 1995• Further developments of the eless Ni UBM• Pilot production line in 1997• Start of customer qualification & production in 1998
2007…Pac Tech Wafer Bumping facilities in Germany, USA, Japan, Malaysia
…10x Pac Tech eless NiAu Bumping processlicensed and equipment installed worldwide
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1st Ni Bumps1st Ni Bumps 19901990
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Certified ISO 9001:2000 & ISO TS 16949
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…more electroless Ni/Au
• ENIG NOT only for Al, also for Cu pads• ENIG UBM for FC and Wire Bonding• Eless Ni/Pd/Au for Wire Bond of Power
Devices
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2000 2001 2002 2003 2005 2006 2007 2008 Year
Gro
wth Japan
(ABT)
Subcon
Korea(STW)
LCD-Driver
USA
Memory
USA
(PacTech)
SubCon
USAPower Dev.
Business Development – Installed Equipment for ENIG UBM & Technology Transfer/Licenses of Pac Tech
Philippines
Telecom.
France
Telecom.
Germany
Telecom.
FranceQ2/07
Taiwan
Q4/07
Malaysia
Q3/07
Japan
Nagase
300 mm
300 mm
300 mm
300 mm
300 mm300 mm
300 mm
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150k600kPac Tech Asia
150k600kABT ("Pac Tech Japan")
150k600kPac Tech USA
100k600kPac Tech GmbH
<12" Wafer><4-8" Wafer>2008
100k300kPac Tech Asia
-600kABT ("Pac Tech Japan")
150k600kPac Tech USA
100k600kPac Tech GmbH
<12" Wafer><4-8" Wafer>2007
-450kABT ("Pac Tech Japan")
150k600kPac Tech USA
100k600kPac Tech GmbH
<12" Wafer><4-8" Wafer>2006
Pac Tech Group Worldwide Wafer Bumping CapacityPac Tech Group Worldwide Wafer Bumping Capacity
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Wafer Level UBMWafer Level UBMElectroless Electroless NiAuNiAu
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Process Flow - Electroless Ni/Au Bumping
Al Pad Cu Pad
Zinkating Pd Seed
Ni Plating
Flash Au Flash Au
Thick AuFlash Au
Pd Barrier
FCB Wire Bonding Wire Bonding
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Backside Coating
Pad Cleaning
Pad Activation
Electroless Nickel
Flash Gold
Coating Removal
Under Bump Metal Process
Electroless Plating of Ni/Au Bumps on Al pad 1/2
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Backside Coating
Aluminum Cleaning
Zincate Pretreatment
Electroless Nickel
Immersion Gold
Coating Removal
Under Bump Metal Process
Electroless Plating of Ni/Au Bumps on Al pad 2/2
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Electroless Electroless Ni/Au on Copper Pad
Backside Coating
Pad Cleaning
Pd Treatment
Electroless Nickel
Flash Gold
Coating Removal
300 mm Capability !
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Backside Coating
Aluminum Cleaning
Zincate Pretreatment
Electroless Nickel
Electroless Palladium
Immersion Gold
Coating Removal
Electroless Ni/Pd/Au Bumping on Al Electroless Ni/Pd/Au Bumping on Al
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Flip Chip Modules for contactless Smart Cards
Interconnection: Electroless NiAu with ACF
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Pacline 300 - A50
10 Plating Systems in the Field
300 mm
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- Capability for parallel processing of 3 carriers with 50 wafers 8“ or 3 carrierswith 26 wafers 12”- UPH: max. 150 Wafers 8"/hour or max. 78 wafers 12”/hour (5µm Ni/Au UBM)- Thick Au ability for wire bonding reliability- Ni bath control with ConPac 2.0 (bath conditioner) and ConPac control set- Central Computer Control Unit (CCCU)- PLC with Profi Bus system- Additional security tanks for each module and pump system- Design will be adapted to customer’s facility- SECS GEM Interfacing- The system fulfils the fire safety standard FM 4910
Pacline 300 - A50
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Wafer Level Solder PrintingWafer Level Solder Printing
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Comparison of Solder Bumping Technologies
Evaporated SolderBump
Sputtered UBM + Plating
Sputtered UBM + Print (FCT)
Electroless UBM (+) Print or Ball Attach
C4 Solder Solder
Au
Solder Solder
Ni/Au
Electroless UBM (+) Print or Ball Attach
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PbSn
Electroless Ni/Au Bumping
Solder Paste Printing
Reflow
Wafer Cleaning
Wafer Inspection
Pack & Ship
Stencil Solder Printing Process FlowStencil Solder Printing Process FlowSnPb37, LeadSnPb37, Lead--free: free: SnAgCuSnAgCu
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Applications for mobile phone
GSM Phone: Battery ControlWafer: Si-Ge Technology
Protection Devices
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Solder Printing on 300mm Wafer
• 740.000 I/O per Wafer• 680 I/O per Chip• 225µm pitch• 100µm pad size• 70µm solder ball height
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Solder Ball PlacementSolder Ball Placement&&
Laser ReflowLaser Reflow
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Laser Soldering SB2-Jet
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SB2 – Equipment
SB²-Jet LF
Semiautomatic SB²-SM
Automatic SB²-Jet
300 mmESD version of SB²-JetFor HGA & HSA Assembly
SB²-Jet LF with R2R Machines sold > 200 pcs
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SB2-Jet Advantages
• No tooling• Solder ball diameters from 80(60)µm - 760µm• Solder alloys: SnPb, SnAg, SnAgCu, AuSn• No flux• No mechanical stress/contact• No thermal stress• No additional reflow• No cleaning of flux residues• Fine pitch applications (110µm/100µm)
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SB2-Applications
• Wafer Bumping• BGA/ CSP Bumping• Wafer Level CSP Bumping• Rework/ Repair• Optoelectronic Packaging• SAW, BAW• MEMS & 3-D Packaging• Hard Disk Drive (HGA, HSA)• Camera Modules
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A
B
C
3D – AssemblyDesign Considerations
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Source: Seagate
Fluxless 3D-Ball Placement & Laser Reflow on FlexSuspension for HDD (HGA)
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Silicon stator(non-moving, attached to suspension)
Silicon rotor(moving, holds magnet and slider
Magnet/ buttom keeper
Narrow beam flexure(connects rotor to stator)
Read / write transducer
Electrical connections to read / write sliderElectrical connections to drive coil
Suspension
369
Fluxless 3D-Ball Placement & Laser Reflow on FlexSuspension for HDD (HGA)
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Gang (Micro) Ball Placement
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Automatic Gang Ball Placer for Micro Ball Placement 1/2
• Cassette to Cassette robot handling f. wafer up to 12“
• Integrated rework capability• 100% yield
• 2x optical inspection• 1st after ball transfer• 2nd after repair
• min ball size 100µm• pre- fluxing by printing/spraying• UPH 5min/Wafer (8“)
1st fully auto machine already installed in Japan
300 mm Capability !
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Gang Ball Placer for Micro Ball Placement 2/2
• 8“ Wafer• Pitch 200µm• 400.000 I/O‘S• 100µm solder balls SnAgCu
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Wafer Level CSP Application
• eutectic SnPb or lead-free• pitches: 180µm – 1mm
• wafer sizes: 4” – 8”• solder ball diameter: 100 - 760 µm
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Solder Ball Transfer by GBP - Ball Pickup
MaskSolder Ball Bond Tool
Vibration
Vacuum
1
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Solder Ball Transfer by GBP – Ball Placement
2
3
Mask
Wafer
Solder Ball
UBM
Flux
Bond Tool
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Placement Force
Gravity only
Ball Drop vs. Ball Transfer
Ball Drop Process
• Weak solder bump adhesion to UBMdue to insufficient flux wetting of solder ball
• “Ball Escape” out of dispense unit possible
Ball Transfer Process
• much better fluxing process due to application of additional placement force
• “Ball Escape” not possible
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• Overview on Semiconductor Markets
• Electroless NiAu UBM – History & Now– Eless NiAu for Al and Cu– Eless NiPdAu
• Soldering Processes– Paste Printing– Single Ball Placement– Gang (Micro) Ball Placement
Summary
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Certified ISO 9001:2000 & ISO TS 16949
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