Waclaw Karpinski General meeting 13.06.021 CMS TRACKER SYSTEM TEST Outer Barrel –TOB Inner Barrel...
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Transcript of Waclaw Karpinski General meeting 13.06.021 CMS TRACKER SYSTEM TEST Outer Barrel –TOB Inner Barrel...
Waclaw Karpinski General meeting 13.06.02
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CMS TRACKER SYSTEM TEST
Outer Barrel –TOB
Inner Barrel –TIB
End cap –TEC
•TIB•TOB•TEC
Different GeometriesOne Readout ArchitectureOne Powering Schema
Waclaw Karpinski General meeting 13.06.02
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Waclaw Karpinski General meeting 13.06.02
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Power supplies
o Situated in counting room
o Implement a unipolar scheme o PS modules power groups of ~60APV
[email protected] =10A, [email protected] =4A I@0V =14A
o Each PS module equipped with 2 HV channels for detector bias
o Floating LV, HV power supplies of each power group, their Return Lines connected inside the detector to the Common Detector Ground
Power Cables 140 m longo Voltage drop = 5Vo Use of sens wires to compensate the voltage dropo Multipolar cable with low inductance , high capacitance to minimize
voltage overshoots due to current variations
Power Supplies and Cables
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Definition of the System Test
The tracker has to enter its production phaseNeed to validate a complete subset of it
o Validate designso Tune design detailso Verify/optimize integration of components
Focus is not on component characterization, but on
overall system performance
The subsets: (for TIB/TOB/TEC)
A number of final modules (sensors +frontend hybrid) integrated on the final mechanical support structure equipped with:
o interconnect boards o optical digital links and electronics for control o optical analogue links for readout o power supplies + 100m MSCable o cooling
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What is necessary to prove it works
Moduleso Noiseo Physics signals (ß-source, Laser), SNRo APV settingso Detector leakage currents
Compare with corresponding measurements taken with individual modules in the “single module setup” (i.e. electrical readout)
Analogue readout chaino Optical link gain and bias point o timing alignment of modulso Noise contributions, Crosstalk, Common mode effects o Operation margin
Control chaino Noise immunity ( Grounding, cabling, shielding)o Operation margino Redundancy
Long Term Stability and Temperature stability of the system
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Interconnect boards, mother boards
Signal Integrity
o the distribution of the fast control signals: clock, reset and back plane pulses,
Power distribution
o voltage drops; uniformity of supply voltage distribution
o Behaviour of full loaded system due to sudden variation in
current consumption in correlation with:
o large inductance of the long cables
o slow reaction time of PSU
Protection against over-voltage?
What is necessary to prove it works
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Mechanics
o mechanical compatibility of the various components with the mechanical support structure
o mechanical stress of the modules due to their fixation on cooling system and interconnect boards
o Deformation upon cooldown due to different CTE´s
Ambient parameters
o temperatures of the modules
o temp. of various elements
o humidity in several spots
What is necessary to prove it works
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Tracker Inner Barrel System Test
Phase 1 (April-July): Readout of 1 to 6 modules with a complete (analog & digital) optical link; test with prototype PSUs with long cables.
- Phase 2 (July-December): mechanical and electrical integration and tests of a small part of TIB:
- 6 double sided modules on Layer #1 cylinder - 12 single sided modules on Layer #3 cylinder
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Tracker Inner Barrel System Test
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LAB set-up in Florencecopper readout : UTRI+FEDoptical readout: Opto Hybrid + Fiber + Opto Receiver + Diff. Buffer +FED
PC withFED, FEC and TSC CCU
Detector andOpto Hybrid
Interface Board
(UTRI)
Tracker Inner Barrel System Test
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T(ns)
Optical Readout57 ADC
60 ADC
Copper Readout
T(ns) AD counts
NC
h/b
in
AD
co
un
tsA
D c
ou
nts
AD counts
NC
h/b
in
Optical Readout
Noise 1.47 ADC
Noise1.18 ADC
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Signal to noise
Signal equivalent to roughly 2 MIPs
Copper readout: S/N =42
Optical readout: S/N =48
Tracker Inner Barrel System Test
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The rod componentsThe rod components
InterConnect Bus
InterConnect Cards
Module frame
Cooling pipe
Patch panel
Module support blocks
15 cm
110 cm
Tracker Outer Barrel System Test
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Detailed electrical test of IC bus + IC cards, with 12FE- Hybrids and
8 OptoHybrids (almost full load)
o Check of the signal integrityo Optimization of the impedance matchingo Measurement of the voltage drop along the buso Test of I2C communication
Tracker Outer Barrel System Test
ResultsResults
The design of IC Bus and IC Cards is correct – signals are very clean A few details have been fixed/optimized
Optical link commissioned on a single channel setup
Nominal gain of the link verified
Optimization of the bias point
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Next step:Integrate a rod with electrical components and real modules
Build an Alu box, gas tight, with patch panel for pipes (cooling and dry air) and other services (It can house 2 rods)
Add external temperature and humidity probes
Commission a cooling system with C6F14
Tracker Outer Barrel System Test
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Current status:
All modules working properly and read out under bias
External temperatures probes also read out
Cooling running smoothly
Grounding scheme similar to the “final” one implemented
Now ready to start quantitative measurements
Study sensitivity to noise on the power lines / groundingGo to the tracker operating temperatureInstall 12 detectors in the second rod (DS rod)Add a second rod
Further steps
Tracker Outer Barrel System Test
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•28 Si-detectors•28 FE hybrids•28 Optohybrids•2 CCUM•4 IC Boards
Tracker Endcap System Test
Front petal
front petal back petal3 power groups : 1. Ring #1, #2 48 APVs 24 APVs 2. Ring #3, #4, #6 44 APVs 32 APVs 3. Ring #5, #7 44 APVs 56 APVs
A-side B-side
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Design verification of petals
o mechanics, doneo electrical performance of the interconnect board, doneo deformation after cooldown tested
System test in 4 steps:
1. Test of the 2nd detector group (rings #3, #4, #6)
2. Test of the 3rd detector group (rings #5, #7)
Fully equipped but without Si-Sensors,
3. Test of the 1st detector group (rings #1, #2) Fully equipped but without Si-Sensors,
Results expected by the end of this year
4. Full System Test for Front and Back petal
o fully equipped with Sensors and front end electronics
o with final cables and power supplies
Final results expected in spring 2003
Tracker Endcap System Test
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Tracker Endcap System Test
Test of the mechanical compatibility
Digital Optical Hybrid
Interconnect Board
Analogue Optical Hybrid
Frontend Hybrid
R#1
R#3
R#5
R#7
R#2
R#4
R#6
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First optical readout of TEC Module: Lyon
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Signal Integrity
Reset Pulse Differential Bunch Clock Pulse
Tracker Endcap System Test
Over-voltage measurements
Behaviour of full loaded system due to sudden variation in current
consumption (switching off the frontend hybrids)
over-voltage swing due to inductance of the long cables
over-voltage gradient due to slow reaction time of the PSU
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Setup for the Measurements of the Over-voltage
Tracker Endcap System Test
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I250 = 1.2 AI125 = 0.52A
Over-voltage swing due to cable inductance
o Commercial power supplies o Sense wires not connected o Cable Length = 100mo Different dumping capacitances
I250 = 2.75 AI125 = 0.84 A
I250 = 1.0 AI125 = 0.52 A
Overvoltage measurementsC250 = 60 µF, C125 = 40 µF
C250 = 330 µF, C125 = 330 µF C250 = 740 µF, C125 = 740 µF
V2.50
V1.25
V2.50
V1.25
V2.50
V1.25
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Over voltage is a potential problem.
o Overvoltage gradient requires : special power supply design or radhard voltage limiter located close to detector could be reduced by proper system architecture
o Overvoltage swing could be fixed by: reasonable damping capacitance on the interconnect boards
Over-voltage measurements
Overvoltage gradientdue to slow regulation time of PSU
o senses wires connectedo commercial power supplyo dumping capacitance 700µFo cable 100m, U = 0.8Vo 4 frontend hybrids toggled; I = 2A
Overvoltage .4 V above the limit
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Conclusions and Remarks
o System test is underway for TIB/TOB/TEC
o The goal is to test an overall performance of a complete subsystem:
Si-Modules + FE-electronics / analogue optical links / digital control links /long cables / power supplies /monitoring
o It´s intended to be a step by step process All sub-components will be integrated as soon as they are made available
o First TOB Rod is integrated, ready to start quantitative measurements
o Final results for all detectors are expected by the beginning of 2003