VI Chip High Voltage BCM Bus Converter 6123 Evaluation ...

UG:015 vicorpower.com Applications Engineering: 800 927.9474

IMPORTANT NOTICE:

Hazardous voltages are present on the HV BCM Evaluation Board under power.

PERSONAL CONTACT WITH LINE VOLTAGE MAY RESULT IN SEVERE INJURY, DISABILITY, OR DEATH. IMPROPER OR UNSAFE HANDLING OF THIS BOARD MAY RESULT IN SERIOUS INJURY OR DEATH.

Read the precautions below entirely BEFORE using the HV BCM Evaluation Board. Do not operate the evaluation board unless you have the appropriate safety precautions in place on your bench to guarantee safety.

The list below is not comprehensive and is not a substitute for common sense and good practice.

n During operation, the power devices and surrounding structures can be operated safely at high temperatures.

n Remove power and use caution when connecting and disconnecting test probes and interface lines to avoid inadvertent short circuits and contact with hot surfaces.

n When testing electronic products always use approved safety glasses. Follow good laboratory practice and procedures.

n Avoid creating ground loops when making measurements of the isolated input or output voltage.

n Care should be taken to protect the user from accidental contact when under power.

n Care should be taken to avoid reversing polarities if connecting to the opposite (solder) side of the board.

n The Customer Evaluation Board described in this document is intended to acquaint the reader with the benefits and features of high voltage distribution. They are not designed to be installed in end-use equipment.

n Refer to the specific HV BCM module data sheet for electrical details.

Introduction

This evaluation board offers a convenient means to evaluate the performance of Vicor’s HV BCM Bus Converter 6123 and has been optimized for user convenience. Refer to the appropriate data sheet for performance and operating limits. Data sheets are available at vicorpower.com.

VI Chip® High Voltage BCM® Bus Converter 6123Evaluation Board User Guide

user Guide | uG:015

Written by: Peter Makrum Applications EngineerNovember 2013

Contents Page

Important Notice 1

Introduction 1

Features 2

Using the High Voltage 3BCM Bus Converter 6123Evaluation Board +IN, -IN 5

+OUT, -OUT 5

Output Voltage 5 Measurement Jack (J104)

Input Current 5 Measurement

Output Current 5 Measurement

Temperature Monitor (TM) 5

Enable Control (EN) 5

Auxiliary Voltage 5 Source (VAUX)

Input Filter Details 6

Thermal Considerations 7

Bill of Materials 9

Ordering Information 10

http://vicorpower.com


Features

1. Underbelly cooling planes in addition to surface mounted heat sink

2. Input and output accommodation for a current probe wire loops

3. Input, output and signals Kelvin test point

4. Oscilloscope output voltage probe jack for voltage and ripple measurements

5. Input and output board-to-board connector footprint reserved for future use

6. Ring lug or solder connections


Using the High Voltage BCM® Bus Converter 6123 Evaluation Board

+VIN

-VIN

H10

0

H10

1TP1

00

TP1

01

J105

+VIN J1

06

-VIN

3027

6FU

SE 5

A 4

00V

DC

F100

BC

M38

0P47

5T1K

2A30

DA

CL

+IN

-IN

+OU

T

-OU

T

ADH

V B

CM

612

3

PS10

0

6123

+V

OU

T

H10

5 TP1

06

TP1

07

J107

+VO

UT

J108

-VO

UT

Pin

2

Pin

3

Pin

1TM EN VA

UX

i

SEC

ON

DA

RY

i

SEC

ON

DA

RY

i

PRIM

AR

Y

i

PRIM

AR

Y

-VO

UT

H10

6

4014

5

GN

D

HS

BO

M, H

EA

TSI

NK

, PU

SH P

IN, L

F 61

23, 1

1MM

-VIN

0603

1469

5-75

00

750

R10

7

SIG

NA

L C

ON

NE

CT

OR

S

4005

8

0805

D10

1

LE

D S

ML

-211

UT

T86

Pin

3

BC

M O

N/O

FF C

ON

TR

OL

2 13

3778

3J1

00

CO

NN

3 P

OS

WIR

E T

O B

OA

RD

SM

D

Pin

2

Pin

3

Pin

1

TP1

05

TP1

03

0603

1469

5-00

R0

0R

106

0603

1469

5-00

R0

0R

105

0603

1469

5-00

R0

0R

104

TP1

04

VA

UX E

N TM

3591

9

231

SW10

0SW

TO

GG

LE

SPD

T 1

PO

S SM

D

4016

5-27

52.

7

C10

4C

AP_

AL

EL

3883

0-47

4

2220

0.47

C10

033

292

J104

-VIN

1206

0320

3-3R

65

3.65

R10

0

NP

D10

0

NP

R10

3

13 14 15 1617181920

Pow

erPi

ns

3957

1

J103

B

CO

NN

8+1

2 PO

S R

IGH

T A

NG

LE

TE

RM

INA

L T

H

+VO

UT

-VO

UT

+VIN

-VIN

LE

D I

ND

ICA

TO

RPO

WE

R C

ON

NE

CT

OR

TO

MA

IN B

OA

RD

HSGND

3883

0-47

422

200.

47

C10

938

830-

474

2220

0.47

C11

038

830-

474

2220

0.47

C11

138

830-

474

0.47

2220

C11

2

+VIN

_EM

I

+VIN_EMI

-VIN

+VOUT_EMI

-VOUT

EM

I G

ND

/ PC

B B

OT

TO

M H

EA

TSI

NK

2512

3472

7-00

R0

0R10

2

Plat

ed la

rge

Via

bot

h en

ds o

f re

sist

or

allo

win

g th

e us

e of

a c

urre

nt p

robe

.

2512

3472

7-00

R0

0R11

1

+VO

UT

-VO

UT

2518

5-10

512

061u

FC

105

3883

0-47

422

200.

47

C10

138

830-

474

2220

0.47

C10

238

830-

474

2220

0.47

C10

3

2 13

3778

3J1

01

CO

NN

3 P

OS

WIR

E T

O B

OA

RD

SM

D

13 14 15 1617181920

Pow

erPi

ns

3957

1

J102

B

CO

NN

8+1

2 PO

S R

IGH

T A

NG

LE

TE

RM

INA

L T

H

3333

6-2R

2L

100

IND

2.2

uH 2

0% 1

4A20

1021

571-

0R00

0R10

1

0603

1546

2-10

01

1KR11

2

2940

0-10

306

030.

01uF

C11

3

-VIN

2518

5-10

512

061u

FC

106

2518

5-10

512

061u

FC

107

2518

5-10

512

061u

FC

108

2512

3472

7-00

R0

0R11

0

+VO

UT

_EM

I

+VIN

-VIN

J109

EM

I GN

D /

PCB

BO

TT

OM

HE

AT

SIN

K

H10

2

H10

4 H10

3

FID01

FID02

Plat

ed la

rge

Via

bot

h en

ds o

f re

sist

or

allo

win

g th

e us

e of

a c

urre

nt p

robe

.

Figure 1.

Eval Board Schematic


Using the High Voltage BCM® Bus Converter 6123 Evaluation Board (Cont.)

Figure 2.

Eval Board Assembly Drawing


Using the High Voltage BCM® Bus Converter 6123 Evaluation Board (Cont.)

+ IN, –INConnect a high-quality, low-noise power supply to the +IN and –IN terminals of the evaluation board. The interconnect leads should be capable of the rated DC current and as short as possible. Additional capacitance may be required on the evaluation board to compensate for impedances in the interconnect leads and source supply. It is important to remember that noise from the source and voltage drops, will appear at the output of the bus converter multiplied by its K factor. Test points +IN and –IN can be used to monitor the input and are located on the PCB top left corner.

+ OUT, –OUTAn electronic or passive load could be connected to +OUT and –OUT terminals. Most commercially available electronic loads do not have current slew rates capable of fully exercising the BCM module. Test points +OUT and –OUT can be used to monitor the output and are located on the PCB top right corner.

Output Voltage Measurement Jack (J104)This connector is kelvin connected to the module output pins providing accurate measurements of the output voltage ripple of the BCM module. Many types of scope probes may be directly connected to this point.

Input Current MeasurementA current probe can be used when adding a wire loop to R102 side VIAs and removing R102 resistor. Input bulk capacitor C104 is downstream of this measurement point.

Output Current MeasurementA current probe can be used when adding a wire loop to R110 and R111 side VIAs and removing both R110 and R111 resistors.

Temperature Monitor (TM)The BCM TM pin outputs a 250 kHz PWM signal. A 1 kΩ and a 10 nF low pass filter precedes the TM test point for measurement simplicity.

Enable Control (EN)Connecting the BCM EN pin to –IN will disable the module. SW100 can be used to disable for convenience. During normal operation or while VIN is applied this pin will be high if read using a DMM through the EN test point.

Auxiliary Voltage Source (VAUX)The BCM VAUX can be used as a fault flag as well as an auxiliary 3.3 V up to 4 mA current capability. An LED is placed on this pin indicating operation. A test point isalso provided.


Input Filter Details

It is important to remember the fast response of most BCM® modules can readily show the limitations of the source, load, and associated wiring connected to the evaluation board. Care should be exercised to minimize stray source and load impedances in order to fully exercise the module. The evaluation board is equipped with an input filter as simulated in Figure 3.

Figure 3.

Eval Board Assembly Drawing


Thermal Considerations

A fan blowing across the evaluation board and heat sink assembly is required during operation. It is recommended to use a typical (4 x 4) inches fan (similar to an EBM-PAPST 3212). It is recommended to place the evaluation board using the supplied rubber feet about 0.4 inches off a flat surface. As per the example below, the board was tested using a fan about 4 inches from the board. The maximum internal temperatures of the BCM® at full rated power should remain below 80°C at 25°C ambient air.

Top airflow was measured above the edge of the midpoint of the output side of the PCB, over the oscilloscope probe terminal. Bottom airflow was measured under the edge of the midpoint of the output side of the PCB.

IR images were taken while evaluating several fans to guarantee full power operation within data sheet thermal specification. Figure 6 shows one case where an off-the-shelf fan “EBM-PAPSTJH3” was set to 12 VIN. The measured top airflow is 1,500 LFM and bottom is 2,250 LFM. The internal temperature is estimated to be 66°C. Figure 7 shows a top surface IR image max of 40°C. Figure 8 shows another case using the same fan where VIN is set 6 V. In this case, the measured top airflow is 1,000 LFM and bottom is 1,750 LFM. The internal temperature is estimated to be 64°C. Figure 8 a top IR image max of 44°C.

Figure 4.

Double Side Cooling and Leads Thermal Model

Figure 5.

Example Setup

+–

+–

+–

MAX INTERNAL TEMP1.24°C / W

1.33°C / W 7°C / W

TCASE_BOTTOM

(°C) TCASE_LEADS

(°C) TCASE_TOP

(°C)Power Dissipation (W)

Thermal Resistance Top

Thermal Resistance Bottom Thermal Resistance Leads


Figure 6.

IR with EBM-PAPSTJH3 FanFan Input 12 V, Top 1,500 LFM,

Bottom 2,250 LFM

Figure 7.

IR image with EBM-PAPSTJH3 Fan Fan Input 6 V, Top 1,000 LFM,

Bottom 1,750 LFM

Thermal Considerations (Cont.)


Bill of Materials

Table 1.ReferenceDesignator

Description Vicor Part Number

+IN, -IN, TM, EN, VAUX,

+OUT, -OUTTEST POINT, SURFACE MOUNT 27995

C100, C101, C102, C103, C109,

C110, C111, C112CAP X7T 0.47 µF 10% 630 V 2,220 38830-474

C104 CAP ALEL 2.7 µF 20% 500 V 8 x 10 40165-275

C105, C106, C107, C108 CAP X7R 1.0 µF 10% 100 V 1,206 25185-105

C113 CAP X7R 0.010 µF 10% 50 V 0603 29400-103

D101 LED SML-211UTT86 0805 40058

HARDWARE BOM CONN KIT ARRAY EVAL BRD 26647

HS BOM, ASSEMBLY, 6123 LF PUSH PIN HEAT SINK 40145

F100 FUSE 5 A 125 V PCD-5-R 30276

J100, J101 CONN 3 POS WIRE TO BOARD SMD 37783

J104 JACK VERTICAL MECH THRU HOLE 33292

L100 IND 2.2 µH 20% 14 A 2,525 0.095HT 33336-2R2

PAD1, PAD2, PAD3, PAD4 BUMPER, ADHESIVE-BACKED, RECESSED 38269

PCB SNGLTD PCB 6123 CHIP HV BCM EVAL BRD 40059

R100 RES 3.65 Ω 1/4 W 1% 1,206 03203-3R65

R101 RES 0 Ω 3/4 W 5% 2,010 21571-0R00

R102, R110, R111 RES 0 Ω 2 W 2,512 34727-00R0

R104, R105, R106 RES 0 Ω JUMPER 1 A 0603 14695-00R0

R107 RES 750 Ω 1/10 W 5% 0603 14695-7500

R112 RES 1 kΩ 1/10 W 1% 0603 15462-1001

SW100 SW TOGGLE SPDT 1 POS SMD 35919

The Power Behind Performance

Rev 1.1 12/2013 vicorpower.com Applications Engineering: 800 927.9474

Ordering Information

To order evaluation boards, substitute BCM with BCD in part number.

For any questions, comments or further design support, please contact your localField Applications Engineer.

Go to: http://www.vicorpower.com/contact-us for ordering information and application support.

http://www.vicorpower.com/contact-us

VI Chip High Voltage BCM Bus Converter 6123 Evaluation ...

Documents

Transcript of VI Chip High Voltage BCM Bus Converter 6123 Evaluation ...