“Vertical Probing Experiences” - Vertical Probing Experiences ... Decision 2nd...
Transcript of “Vertical Probing Experiences” - Vertical Probing Experiences ... Decision 2nd...
International SEMATECHWafer Probe Council
“Vertical Probing Experiences”Fred Taber
IBM MicroelectronicsProbe Council General Chair
Gavin GibsonInfineon Technologies AG
Probe Council Topics Chair
2003 Southwest Test Workshop
June 3, 2003 2003 Southwest Test Workshop 2
Vertical Probing Experiences
Outline
Probe Council OverviewWhat is ‘Vertical’ Probe Technology
Member Company ExperiencesKey Challenges
Wrap-up
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Vertical Probing Experiences
Probe Council Overview: Mission• International SEMATECH Mission
– The members of International SEMATECH cooperatively set global industry direction and accelerate technology solutions in infrastructure, lithography, materials, and manufacturing to ensure a strong and vibrant semiconductor industry.
• Probe Council Mission– Provide the means to improve member company
technology in wafer probing technology & methods by sharing best practices, employing benchmarking techniques, observing member company operations and guiding the supplier community.
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Vertical Probing Experiences
Probe Council Overview: Roles• Custom Funded Project
– SEMATECH: Legal, Technical & Administrative Support
– Members: Technical Data & Information, Know-how & Direction…..and Dues
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Vertical Probing Experiences
Probe Council Overview: Members
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Vertical Probing Experiences
Vertical Probe Technology: Definition
• “Vertical probes…..deliver a tangential force at the top of solder pads…..”– From ref. 1: Area Array Interconnect Handbook
• Alternatively:– Electrical path and mechanical structure is
essentially vertical from the contact with the chip I/O to the interface with the Spacetransformer
• Your Definition?
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Experiences: Data Sources • Member Company Topic Presentations• Special Vertical Probe Survey for SWTW
1 2 3
Type/Technology
ManufacturerProduct NameProduct Type
I/O Type1st
SubsequentMinimumMaximum
PitchType
Typ. Lifetime # TouchdownsFrequencyTechniqueIn-houseSupplier
Why?2nd Sourcing
Required (Y/|N) / If Yes name Supplier
TypeSourcingStrengths
Weaknesses
Probe Card
I/O Layout
Cleaning
Repair
Selection
Spacetransformer
Other
Application
Leadtime
I/O Count
Enter D
ata
Enter D
ata
Enter D
ata
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Vertical Probing Experiences
Experiences: Probe Technologies• Buckling Beam & Hybrid Buckling Beam
– Wire Through Guide Plates– Sourced From
Feinmetall (ViProbe®)
IBM (COBRA)Int’l Contact Tech. (VCT)K & S (CobraProbe™)MicroProbe (Apollo™)Wentworth Labs (COBRA®)
Courtesy of Feinmetall
Illustration Courtesy of SWTW/Intel (ref. 3)
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Vertical Probing Experiences
Experiences: Probe Technologies• Membrane…..MEMS
– Photo-lithographically Defined; Metallurgy on Polyimide Film or Silicon
– Sourced FromCascade Microtech (Pyramid Probe™)
IBM (TFI™)
SCS Hightech (MEMS VPC)
POLYIMIDE
COPPER
AUTO-SCULPTING
PROTECTIVEMETALLURGY
Illustration Courtesy of SWTW/IBM (ref. 2)
Courtesy of Cascade Microtech
Courtesy of SCS Hightech
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Vertical Probing Experiences
Experiences: Probe Technologies• Hybrid Cantilever
– Cantilever w. Wire Through Guide Plates
– Sourced FromK&S (VertaProbe™)
Illustration Courtesy of Motorola
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Vertical Probing Experiences
Experiences: Probe Technologies• Spring
– Spring Probe Through Guide Plates
Sourced From– JEM (VSC – Vertical Spring
Contact)
– Wire Bonded to a Substrate & Formed; Tip Geometry
Sourced From– Formfactor (MicroSpring™)
Illustration Courtesy of JEM
Courtesy of Formfactor
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Vertical Probing Experiences
Experiences: Applications• Buckling Beam
I/O’s
Peripheral / Inline
32 - ~5K
Area Array5 - ~5K
Config.#
Al Pad80 - 250
µcontrollers, DRAM, Smart Cards, Flash (emb), Test Chip
PbSn Bump160 - 500
Discrete IC’s, power, ASICs, µprocessors, µcontrollers, RF, Mixed Signal, Chip Sets, Test Chip
MetallurgyPitch (µm)
Products
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Vertical Probing Experiences
Experiences: Applications• Membrane…..MEMS
I/O’s
Peripheral / Inline
40 - >300
Area Array~25 - ~3K
Config.#
Al Pad80
Mixed Signal, RF
PbSn Bump200 – 225
ASICs, µprocessors, RF
MetallurgyPitch (µm)
Products
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Vertical Probing Experiences
Experiences: Applications• Hybrid Cantilever
I/O’s
Staggered100 - 300
Area Array400 - 800
Config.#
Al Pad35/50
Logic Chip Sets
PbSn Bump200 - 250
ASICs, µcontrollers
MetallurgyPitch (µm)
Products
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Vertical Probing Experiences
Experiences: Applications• Spring
I/O’s
Inline20x – 100x
Area Array800 - 3100
Config.#
Al Pad100
Flash
PbSn Bump180 - 225
ASICs, µprocessors, Chip Sets
MetallurgyPitch (µm)
Products
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Experiences: Pad damage v. Technology
Cantilever
VerticalMembrane
Pad Surface
2000-2500
1000
500 SCRUB HEIGHT
- 400 SCRUB DEPTH- 500
- 600/800- 1200 Metal Thickness
nm
Courtesy of Infineon
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Vertical Probing Experiences
Experiences: Maintenance• Buckling Beam
Al Pad
PbSn
MetallurgyMethodFrequency
Brush, Abrasive Pad, Gel Pad
Brush, Abrasive Pad, Gel Pad
Repair
---
100K –1M
Lifetime
Some In-
house200 - 1000
Some In-
house50 - 2000
Cleaning
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Vertical Probing Experiences
Experiences: Maintenance• Membrane…..MEMS
Al Pad
PbSn
MetallurgyMethodFrequency
Abrasive Pad, Chemical
Brush, Abrasive Pad
Repair
---
500K - >1M
Lifetime
None In-house---
Mostly External150 – 500
Cleaning
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Vertical Probing Experiences
Experiences: Maintenance• Hybrid Cantilever
Al Pad
PbSn
MetallurgyMethodFrequency
Abrasive Pad
Abrasive Pad
Repair
1M
100K – 1M
Lifetime
Non-repairable200
Non-repairable50 – 150
Cleaning
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Vertical Probing Experiences
Experiences: Maintenance• Spring
Al Pad
PbSn
MetallurgyMethodFrequency
---
Abrasive Pad, Gel Pad
Repair
>500K
>500K
Lifetime
None In-house---
None In-house100
Cleaning
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Vertical Probing Experiences
Experiences: Spacetransformers
Courtesy of NTK
• Wired– Buckling Beam– Provided by Probe Card Supplier
• Multi-Layer Ceramic– Buckling Beam, Membrane, Spring– Most are Provided to Probe Card
Supplier; Some 3rd Party Sourcing• Multi-Layer Organic
– Buckling Beam– Most are Provided to Probe Card Supplier
• None– Hybrid Cantilever, Some Membrane
More Spacetransformer Info: “C4 Probe Card Space Transformer Technology Overview”; By Grace Chan & Justin Leung of Intel Corporation; 2000 SWTW
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Vertical Probing Experiences
Experiences: Selection• Buckling Beam
WeaknessesStrengths2ndDecision
SomePitch &
Frequency Limitations
Mature, Repairable,
Robust, Multi-DUT, Tip Shape
Price, Performance, Support
Sourcing
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Vertical Probing Experiences
Experiences: Selection• Membrane…..MEMS
WeaknessesStrengths2ndDecision
None Cost, Leadtime, Single-Sourcing
High Frequency, Planarity,
Alignment, Fine Pitch
Performance
Sourcing
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Experiences: Selection• Hybrid Cantilever
WeaknessesStrengths2ndDecision
NoneHigh Frequency, Non-repairable, Single-Sourcing
Leadtime, Cost, PrototypingLeadtime, Cost
Sourcing
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Vertical Probing Experiences
Experiences: Selection• Spring
WeaknessesStrengths2ndDecision
None Cost, Leadtime, Single-Sourcing
Performance, Quality, MaturePerformance
Sourcing
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Key Challenges
+
+ +
+ Pitch (µm)Peripheral:80,60,50..Array:150,130,100...
Temperature (oC)-40 +150.....
Al,Au,Cu,PbSn,SnAg
Current per pinmA x 100‘s
Pincount x 10k Multi DUT x 10‘s
Leadtimes = Cantilever
Cost effective solutions required
NOW
Please !
+ +
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Wrap-Up
• Buckling Beam is Predominant Technology– Mature, Robust, Multiple Sources
• Vertical Probes– Accelerating Usage Across Application
Spectrum– Proliferation of Suppliers / Technologies– Growing Multi-DUT Use
• Technical & Business Challenges to Meet Future Needs
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Acknowledgements
• Thanks to Jim Ammenheuser of SEMATECH for the guidance he has provided in supporting all of the Wafer Probe Council’s activities and projects
• Thanks to the Member company principals. Their spirit of cooperation has been essential to the success of the Wafer Probe Council
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References• Ref. 1:
– “Area Array Interconnection Handbook”; edited by Karl Puttlitz & Paul Totta; Chapter 3 – Wafer-Level Test; Section 3.5.10.2; P.146. ©2001
• Ref. 2:– “A High Performance C4 Probe: TFITM”; by G. Das & F.
Taber of IBM Microelectronics; Presented at 2001 SWTW; P. 8
• Ref. 3:– “Overview of C4 Array Probing”; by Justin Leung of Intel
Corporation; Presented at 1999 SWTW; P.4
SEMATECH, the SEMATECH logo, International SEMATECH, and the International SEMATECH logo are registered servicemarks of SEMATECH, Inc. All other servicemarks and trademarks are the property of their respective owners.