Vertex Detector Options and R&D Requirements
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Vertex Detector Options and Vertex Detector Options and R&D Requirements R&D Requirements RHIC DAC Meeting December 19, 2002 Yuji Goto (RIKEN/RBRC)
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Vertex Detector Options and R&D Requirements. RHIC DAC Meeting December 19, 2002 Yuji Goto (RIKEN/RBRC). Outline – R&D items. Barrel strip detector strip sensor strip sensor readout / interface with PHENIX Barrel pixel detector hybrid pixel / readout /interface with PHENIX - PowerPoint PPT Presentation
Transcript of Vertex Detector Options and R&D Requirements
Vertex Detector Options and Vertex Detector Options and R&D RequirementsR&D Requirements
RHIC DAC Meeting
December 19, 2002
Yuji Goto (RIKEN/RBRC)
December 19, 2002 Yuji Goto (RIKEN/RBRC) 2
Outline – R&D itemsOutline – R&D items• Barrel strip detector
– strip sensor– strip sensor readout / interface with PHENIX
• Barrel pixel detector– hybrid pixel / readout /interface with PHENIX– bump bonding / thinning– monolithic pixel
• Endcap pixel detector• Support frame
December 19, 2002 Yuji Goto (RIKEN/RBRC) 3
x
u
x
u
Strip sensorStrip sensor
• Technical options– Zheng Li’s sensor or other
sensors
• R&D– telescope with VA2 readout chip
and its beam test ongoing
– cooling study
• Manpower– institutional contribution
• BNL instrumentation• RIKEN / Kyoto U.
December 19, 2002 Yuji Goto (RIKEN/RBRC) 4
Strip sensorStrip sensor
X-cell contacts
Y Contacts 16 m Lines for X
X-cell contactsY-Cells 7 m Lines
X-Cells 7 m Lines
Z. Li, Inst. Div., BNL
telescope with VA2 readout
December 19, 2002 Yuji Goto (RIKEN/RBRC) 5
Strip sensor readout / Interface with PHENIXStrip sensor readout / Interface with PHENIX• Technical options
– readout chip• SVX4 (preamp + digitized pipeline)• MVD-TGV+AMU/ADC recut
• R&D– mismatch of Zheng Li’s sensor (DC coupling) and SVX4 (AC coupling)
• accumulation of leakage current – frequent reset of the SVX4• cooling (lower than the room temperature) to decrease leakage current
– data management method / ladder structure• local processing or driving signals on kapton cables• buffering capability• low power data transmission
• Manpower– R&D proposal
• ORNL / BNL physics– 1 FTE electronic engineer in FY03
– institutional contribution• ORNL• RIKEN / Kyoto U.
December 19, 2002 Yuji Goto (RIKEN/RBRC) 6
Barrel strip detectorBarrel strip detector
• R&D issues– readout chip decision– interface with PHENIX– ladder
• Technical options– SVX4 or MVD-TGV+AMU/ADC recut– other sensors
Run-2 Run-6Run-5Run-3
2002 2006200520042003sensor prototype
telescopeprototype test
sensor production or further R&Dreadout chip R&D and decision
readout chip production or further R&Dreadout/interface prototype
ladder prototypeprototype test
ladder productionassembly / installation
Strip sensorBNL instrumentation / RIKEN / Kyoto U.
Strip readout / Interface with PHENIXBNL physics / ORNL / RIKEN / Kyoto U.
Run-4
2001
with SVX4
with MVD-TGV+ AMU/ADC recut
December 19, 2002 Yuji Goto (RIKEN/RBRC) 7
Hybrid pixel / Readout / Interface with PHENIXHybrid pixel / Readout / Interface with PHENIX
• Technical options– ALICE1 hybrid or other hybrids– BTeV FPIX2 readout chip– ALICE pilot chip or our own pilot chip
• R&D– parallelization of readout– development of FEM or FEM+CCB (Central Control Board)
• Manpower– R&D proposal
• Stony Brook– 0.5 FTE post-doc and 0.25 FTE electronic engineer in FY03-04
– institutional contribution• Stony Brook
– 2 FTE students or post-docs and 0.25 FTE electronic engineer in FY03-04
• RIKEN– 2 FTE post-docs at CERN (and 1-2 more will be added)– collaboration is starting with KEK instrumentation
• collaboration with NA60 / ALICE
December 19, 2002 Yuji Goto (RIKEN/RBRC) 8
Hybrid pixelHybrid pixel
• NA60 pixel detector
1.0 cm
The first 4-chip pixel plane
Hit map
December 19, 2002 Yuji Goto (RIKEN/RBRC) 9
Bump bonding / ThinningBump bonding / Thinning
• Technical options– Fermilab-led efforts
• PHENIX involvement by ISU• McNC North Carolina/Unitive• AIT Hong-Kong
– CERN-led efforts• PHENIX involvement by RIKEN
• R&D– alternative options for bump bonding / thining
• evaluation of bump-bonding samples made by McNC and AIT
• Manpower– R&D proposal
• ISU– 0.5 FTE post-doc and 0.5 FTE electronic engineer in FY03-05
– institutional contribution• RIKEN• collaboration with NA60 / ALICE
December 19, 2002 Yuji Goto (RIKEN/RBRC) 10
Monolithic pixelMonolithic pixel
• Technical options– epitaxial monolithic detectors by
LEPSI– float-zone monolithic detectors by
Bonn/Munich
• R&D– increased speed of readout
• R&D started• readout time halved to 110
nsec/pixel or 5 sec/chip• next steps, event buffering
– thick, high-quality silicon• partner with Munich/Bonn groups
to build readout on top of detector-grade silicon
• Manpower– R&D proposal
• ISU
December 19, 2002 Yuji Goto (RIKEN/RBRC) 11
Barrel pixel detectorBarrel pixel detector
• R&D issues– readout / interface with PHENIX– bump bonding / thinning
• Technical options– monolithic pixel– other hybrids
Run-3 Run-6Run-5
2002 2006200520042003hybrid R&D with NA60
hybrid R&D with ALICEbump bonding / thinning R&D
hybrid production
readout/interface R&Dreadout/interface prototype
ladder prototypeprototype test
ladder productionassembly / installation
monolithic pixel R&Dmonolithic prototype & production
Hybrid pixel / Readout / Interface with PHENIXStony Brook / RIKEN
Bump bonding / ThinningISU / RIKEN
Monolithic pixelISU
Run-2
2001
Run-4
with ALICE1
with monolithicpixel
December 19, 2002 Yuji Goto (RIKEN/RBRC) 12
Endcap pixel detectorEndcap pixel detectorRun-3 Run-4 Run-6Run-5Run-2
2002 2006200520042003
modification to match the endcapendcap prototype
prototype testendcap production
assembly / installation
2001
Run-7
barrel pixel R&D (shown previously)
• Technical options– ALICE1 or LHCb hybrid– BTeV FPIX2 readout chip– monolithic pixel
• R&D– increased capacitance load on the readout chip– sensor pad topology– routing of control lines– location of the pilot chip
• Manpower– R&D proposal
• LANL– electronic engineer (1 FTE in FY04, 0.5 FTE in FY05)
December 19, 2002 Yuji Goto (RIKEN/RBRC) 13
Support frameSupport frame
• Technical options– conceptual design by the engineering team that designed the ATLAS support
frame (HYTEC)– recommendation as to the best technical appoach and the areas that need
further study and prototype• R&D
– prototype end cap disk sector – test cooling and stiffness– prototype barrel ladder – test cooling and stiffness– prototype outer support structure
• Manpower– R&D proposal
• LANL– mechanic engineer (0.5 FTE in FY03, 1 FTE in FY04, 0.5 FTE in FY05)– mechanic designer (0.25 FTE in FY03, 0.5 FTE in FY04)
– institutional contribution• LANL / HYTEC• RIKEN
Run-3 Run-4 Run-6Run-5Run-2
2002 2006200520042003
frame conceptual designframe R&D and prototype
assembly / installation
2001
Run-7
mockup study
December 19, 2002 Yuji Goto (RIKEN/RBRC) 14
Support frameSupport frame
conceptual design of the support frameby LANL/HYTEC
mockup by RIKEN
December 19, 2002 Yuji Goto (RIKEN/RBRC) 15
R&D budget requestR&D budget request
• PHENIX institutional involvement– barrel strip detector
• BNL (physics, instrumentation), RIKEN, Kyoto U., ORNL
– barrel pixel detector• Stony Brook, RIKEN, ISU
– endcap pixel detector• LANL
– support frame• LANL, RIKEN
• Related R&D efforts– hybrid pixel
• NA60, ALICE
– monolithic pixel• STAR
– support frame• HYTEC
Category Description FY03 ($K) FY04($K) FY05($K)Salaries (incl. fringe) Post doc 60 60 30
Electrical engineer 175 175 100Mechanical engineer 50 100 50Mechanical designer 20 40
Supplies & electronics Wafer fabrication 20 40 40Prototype fabrication 40 60Equipment 20
Total 385 475 220Total (incl. 40% overhead) 539 665 308
