Vernie Everett, Andrew Blakers, Klaus Weber, Evan Franklin Handling, Assembly, and Electrical...
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Transcript of Vernie Everett, Andrew Blakers, Klaus Weber, Evan Franklin Handling, Assembly, and Electrical...
Vernie Everett, Andrew Blakers, Klaus Weber, Evan Franklin
Handling, Assembly, and Electrical Interconnection of 2nd Generation
SLIVER Solar Cells
3D
2D
Silicon wafer • single crystal• 150mm Ø• 1-3mm thick
100mm
Grooves formed through the wafer
Following grooving, wafer processing proceeds:Diffusions, oxidations, depositions, metallisation.
0.04 to 0.1mm pitch
0.1mm
2mm
100mm
Illu
min
atio
nIll
um
ina
tion
~1,000 completed bifacial SLIVER solar cells, each ~ 2 cm2
Cuts
Sliver Solar Cell
Cross-Section
Illumination
Illum
inat
ion
Perfectly bifacial
Metal (n-electrode)
Metal (p-electrode)
Boron diffusion
Phosphorus diffusion
Surface texturing Phosphorus diffusion AR coating
20-50m 1-2mm
A 2nd Generation SLIVER Technology
Reduce Grooving Pitch and SLIVER Thickness• Strong cost driver• Major challenges• Advantage: with 40 micron pitch, 2.5X surface area increase over 100 micron
pitch, at near-zero cost increase.
Reduce SLIVER Cell Fabrication Complexity• 1st Generation SLIVER cell fabrication required 59 steps• 2nd Generation SLIVER cell fabrication requires only 32 steps• Simplify texturing, improve light-trapping and AR-coating
Broaden Process Windows and Improve Yield and Efficiency• Robust processes with broad process windows• Improve yield: essential for simplified handling and assembly• Improve efficiency. Long term, efficiency will be the deciding factor
1. SLIVER cell fabrication
A 2nd Generation SLIVER Technology
A fundamental change in handling philosophy• Abandoned individual, sequential linear processes.• Moved to group handling modular parallel processes.• Improved yield through simplified separation, “bulk” handling, and a simplified
structure.• Improved throughput with modular process line, with input and output buffers.
Modular sub-assemblies• Conventional cell “analogues”• Avoid individual testing and binning
Versatility through modularity• Two main sub-assembly types: “Rafts”, and “Sheets”.• Separation and handling processes are common for both.• Applications are common for both: cost and efficiency are the only differences.• Rafts and Sheets can be the building blocks of all SLIVER applications.
2. SLIVER handling and assembly
A SLIVER Raft
A Flexible SLIVER Raft
Flexible SLIVER Raft Assembly
SLIVER cells
Soldered electrical interconnections
Simplified process• Eliminated stencilling • Eliminated dispensing• Eliminated cleaning and waste• Eliminated machine vision• Eliminated complex automation Robust process• Simplified alignment requirements• “Automatic” solder volume and location and distribution Conventional materials• reliability, durability, warranty
A 2nd Generation SLIVER Technology 3. SLIVER electrical interconnections
Equipment: low-cost, low-tech, industry-standard. Process: robust, modular, buffered. Materials: conventional, low-cost, reliable. Throughput: 500 – 1,000 connections per second.
Advantages:
A 2nd Generation SLIVER Technology 3. SLIVER electrical interconnections (ctd.)
A 2nd Generation SLIVER Technology
A SLIVER module constructed using Raft Sub-module Technology
A 2nd Generation SLIVER Technology
Reduces silicon consumption by a factor of 10 - 20 Reduces wafer starts by a factor of 20 – 40 Reduces cell fabrication steps from 59 to 32 Simplifies cell fabrication equipment requirements Exceeds 20% cell efficiency [world first for thin production
cells] Reduces assembly equipment cost by a factor of 10 Increases assembly line throughput by a factor of 10 Increases rate of electrical connection by factor of 100 Modularises the entire assembly process Establishes an entire assembly process using only conventional
materials
A 2nd Generation SLIVER Technology Conclusion
Reduce present PV costs by two-thirds Rapidly grow market share Play a significant role in ameliorating
climate change
Mature SLIVER Technology can:
Thank You!