Ventec International Group

03/07/2019

Option Technologies

03/07/2019

Manufacturing CapabilitiesItem Capability

1 layers 4, 6, 8,10,12, 14 (layers)

2 Cu 1/3 OZ 、 HOZ、1OZ、 2OZ 、3OZ

3 maximum panel (PNL) size 20” x 30”

4 minimum panel (PNL) size 10” x 12”

5 minimum core thickness 3 mil H/H

6 minimum L/S 3/ 3mil

7 minimum thickness of different layers 11 mil (4L) 、49mil (12L)、79mil (14L)

8 inter-layer alignment ± 3 mil

9 tolerance of forming size ± 1mm

10 warp ＜0.75%

11 minimum hole size 0.15mm / 6mil

12 maximum hole size Up to 10mm / 0.254”

Copper Plating (bonding panels only)

13 maximum panel (PNL) size 24” x 24”

14 minimum panel (PNL) size 14.6” x 13”

15 copper thickness as per request (typically 20μ)

16 Drill aspect ratio 6:1

• working to IPC Standards

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Quality and Approvals

• ISO-9001• ISO-14001• QA reports generated with all jobs• All inner-layers are 100% AOI• Individual processes demonstrate detailed QA procedures• A detailed “Skills Matrix” is displayed in all departments

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CAM Department

• Genesis software • 24/7 operation • average throughputs: 10 new parts

per day

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Photography

• Orbotech LP-7008 photoplotter • maximum size of photographic film: 26*32” • minimum line width and line spacing 2/2mil• cleanroom garments are worn in this

department

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Cutting

• diamond cutting saws• maximum cutting size: 1092*1245

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Chemical Clean

• sulfuric peroxide based cleaning process.

• four stage cascade rinsing, followed by drying

• etching rate is controlled to 0.6μm• Process control etch rate sampling is

carried out on a per shift basis.• Loading and unloading is fully

automated.

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Photomech - Dry Film Lamination

• automatic cut sheet laminator with thin core capability

• pre-heat & hold station• eternal dry film 20μm

thickness• class 10000 cleanroom

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Photomech - lmaging

• fully automated exposure units• throughput: 100 panels per hour• camera alignment accuracy: <15μm

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Develop Etch Strip

• Cupric based etch media• minimum line width: 3.0mil• minimum line spacing: 3.5mil • minimum panel thickness: 3.0mil

(excluding copper)• maximum size: 21.5” x 24.5”

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AOl Process

• two AOI machines• three offline verification stations• the inner layer is scanned, barcoded,

interleaved, and then sent to fault verification

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Alternative Oxide

• line speed: 3.5 meters/min• Etch rate: 1.5 +/- 0.3 μm• maximum size: 21.5” x 24.5”

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Build Up

• all inner-layers are visually inspected at build up

• layers are built up with small rivets and flattened

• all multilayers are then 100% inspected by X-Ray

• any panels showing mis-registration will be rejected

• all operators wear cleanroom garments

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Lay Up Stations

• all panels are built on large format stainless steel panels

• panels are built free with oversize foil -for example, a 24” x 21” panel would be built four panels per page

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Presses & Press Capacity

• large format presses with auto-load &unload facility

• four presses all with 10 - openings• capacity: 5000 panels per day based on

a 24*18” 1.6mm panel• 320 panels per press load

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Press Control

• all presses have chart recorders for each individual press and platen

• the data is available from each press cycle recording both platen & product temperature

• buffering is 160gsm Kraft Paper• kraft paper is not reused

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X-ray Drilling

• four ADT-900 X-ray drill machines• all four machines optimized in both X & Y• all panels are interleaved before and after

drilling

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Routing

• two route machines with four spindles each• programs all ensure radius corners • typical height is 5 high for a 1.6 mm panel

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Edge Milling

• all panels are edge milled• four individual “v” blades for cutting each

edge • maximum panel thickness for edge milling

is 3.2mm

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Bonding Inspection

• all panels are checked for 100% surface defects, including pits, dents, resin spots or creases

• a thickness check is also performed using deep throat micrometer

• tooling hole diameters are verified using a plug gauge

• outer copper is verified using a copper scope

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Drilling

• 240 drill spindles• capacity: 8000 panels per day• process runs 24/7 • mechanical drilling • minimum hole size 0.15 mm

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Drilling

• a first off x-ray inspection is carried out prior to batch processing

• for batch inspection the bottom panel of each stack is x-ray inspected

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Spindle Accuracy

• all spindles are checked for accuracy twice per week

• reports are available for drill accuracy• hole positional checks are verified by AOI

inspection

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Hole Checking

• after drilling all panels are processed through a high pressure rinse and then inspected through the automatic hole for missing/blocked holes

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Copper Plating

• bonded panels only • copper thickness typically 20μ• max panel size: 24” x 24”• min panel size: 14.6” x 13”• aspect Ratio: 6:1

Ventec International Group

03/07/2019