Variable Angle Spectroscopic Ellipsometry of Anodically Oxidized Tantalum Films Jovan Trujillo...
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Transcript of Variable Angle Spectroscopic Ellipsometry of Anodically Oxidized Tantalum Films Jovan Trujillo...
Variable Angle Spectroscopic Ellipsometry of Anodically Oxidized
Tantalum Films
Jovan TrujilloFlexible Display Center
10/06/06
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Current state of development
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Current Problems with Dielectric Materials
Voltages approaching 60 V are needed to drive display. Dielectric materials break down at such high voltages. High voltages due to mobility of a-Si:H and dielectric constant of a-Si:N:H. Breakdown due to low breakdown voltage of a-Si:N:H. Anodically oxidized tantalum can be grown withstand 100 V.
Color displays will require smaller pixels. Design engineers report that a-Si:N:H will not have enough capacitance for smaller pixels. Anodically oxidized tantalum has a dielectric constant 4x of a-Si:N:H.
Step coverage. Low temperatures reduce surface diffusion of deposited materials, causing “breadloafing” Poor adhesion to steps and edges cause open and short circuits. Anodic oxidation grows from steps and edges, eliminating the “breadloafing” problem.
Organic transistors need high-k materials. Current organic transistors have very low drive current, possibly due to silicon oxide
dielectric. Literature has reported successful application of tantalum oxide to pentacene based
transistors.
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Anatomy of a Field Effect Transistor
Substrate
Gate Metal
Gate Dielectric
a-Si:H
IMD
n+ a-Si contactSource metal Drain metal
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Anatomy of a Pixel
transistor
capacitor
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Why Tantalum Oxide?
Material ProcessDielectric Constant
Problems
Silicon Nitride PE-CVD ~7
Step coverage, low-k,
low breakdown voltage.
Hafnium SilicateReactive sputtering
~12
worse step coverage,
stoichiometry problems,
slow deposition rate
Aluminum Oxide Reactive sputtering
~ 9 same as hafnium silicate
Tantalum Oxide Anodic oxidation ~ 28 etch selectivity,
mask changes
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Anodic oxidation process( a self limiting reaction )
Platinum CathodeTantalum Anode
Current change over time
0
10
20
30
40
50
60
70
80
0 10 20 30 40 50 60 70 80
time (min)
Cu
rren
t (m
A)
60 mA ramp to 100 V
0.05% vol acetic acid
5.5 L water
room temp.
Hydrogen bubbles
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Things we need to know …
What is the effect of starting current? Does a high initial current cause interface roughness? Does it create a porous film?
What is the thickness of the oxide? Needed to study etch chemistries. Needed to study growth mechanism. Needed to calculate metal consumption.
What is the index of refraction? Index of refraction is related to film stoichiometry, crystallinity. Changes in this parameter give qualitative information about
changes in film. Currently used to catch changes in silicon nitride film.
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Spectroscopic Ellipsometry ( SE )
No papers have been published on SE for anodically oxidized tantalum. All previous work has been with reactively sputtered tantalum oxide.
Need SE model to track changes in thickness, interfaces, and material quality. A simple Cauchy model does not work near band gap.
Provides qualitative information on changing stoichiometry and crystallinity.
Provides information on interface formation.
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How it works…
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How it works…
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The Data
Franke, E.; M. Schubert; C.L. Trimble; M.J. DeVries; J.A. Woollam. Optical properties of amorphous and polycrystalline tantalum oxide thinFilms measured by spectroscopic ellipsometry from 0.03 to 8.5 eV. Thin Solid Films 2001, 388, 283-289.
Experimental Data
Photon Energy (eV)0.0 1.0 2.0 3.0 4.0 5.0 6.0
< 1
>
-20
0
20
40
60
80
100
Exp E 65°Exp E 67°Exp E 69°Exp E 71°Exp E 73°Exp E 75°
Anodic oxidation
Reactive sputtering
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The Data
Experimental Data
Photon Energy (eV)0.0 1.0 2.0 3.0 4.0 5.0 6.0
< 2
>
-60
-40
-20
0
20
40
60
Exp E 65°Exp E 67°Exp E 69°Exp E 71°Exp E 73°Exp E 75°
Franke, E.; M. Schubert; C.L. Trimble; M.J. DeVries; J.A. Woollam. Optical properties of amorphous and polycrystalline tantalum oxide thinFilms measured by spectroscopic ellipsometry from 0.03 to 8.5 eV. Thin Solid Films 2001, 388, 283-289.
Anodic oxidation
Reactive sputtering
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Find optical functions for tantalum metal using data transform model. Fit transparent region (600 – 1700 nm) of oxide to Cauchy function to
find thickness.
Fit entire spectra with Cauchy function to find optical functions on a point by point basis. Film thickness is now a constant. This is only an approximation to the real optical functions
Fit more complicated oscillator model to optical functions. This helps with creating a good initial guess for parameters. All fits use Levenberg-Marquadt to minimize error. A good initial guess
helps avoid local minima.
Modeling Process
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The Gaussian Oscillator
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Experimental vs. ModelGenerated and Experimental
Photon Energy (eV)0.0 1.0 2.0 3.0 4.0 5.0 6.0
< 1
>
-20
0
20
40
60
80
100
Model Fit Exp E 65°Exp E 67°Exp E 69°Exp E 71°Exp E 73°Exp E 75°
Generated and Experimental
Photon Energy (eV)2.4 2.6 2.8 3.0 3.2 3.4 3.6
< 1
>
-10
0
10
20
30
40
50
60
Model Fit Exp E 65°Exp E 67°Exp E 69°Exp E 71°Exp E 73°Exp E 75°
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Results and Analysis
Using Gaussian function oxide thickness = 1860.52 ± 0.977 Å MSE = 35.04 Refractive index = 2.2143
Using Gaussian function with porous interfacial layer between metal and oxide. oxide thickness = 1857.85 ± 1.1 Å MSE = 21.78 Refractive index = 2.2100
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Thickness verification with FESEM
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Comparison of Refractive Index
Compare with n = 2.2100 @ 550 nm for anodic oxidation
Franke, Eva; C. L. Trimble; M. J. DeVries; J. A. Woollam; M. Schubert; F. Frost. Dielectric function of amorphousTantalum oxide from the far infrared to the deep ultraviolet spectral region measured by spectroscopic ellipsometry. Journal of Applied Physics 2000, 88, 9.
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Future work
Understand why Tauc-Lorentz and Cody-Lorentz models are giving poor results.
Further develop the fitting process so that more accurate information about the interfaces can be obtained.
Verify the kinetics of growth for anodic oxidation. Use ellipsometry to calculate etch rates of various receipes. Work with Dr. Jabbour’s student on evaluating tantalum oxide
for organic transistors. Evaluate the use of VASE for studying interface treatments
between dielectric materials and a-Si:H.
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Acknowledgements
The FDC group:
Dr. Gregory RauppShawn O’RourkeCurtis D. MoyerDirk BotteschVirginia WoolfBarry O’BrienEdward BawolekMichael MarrsScott AgenoConsuelo RomeroDiane Carrillo
Engineers at J. A. Woollam Co., Inc.:
Neha Singh
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Correlation Matrix
E1Offset.2
PoleMag.2
Amp1.2 En1.2 Br1.2
Thick.2
Thick.1
EMA2.1
E1Offset.2 1 -0.949 0.799 0.675 0.534 0.389 -0.425 0.353
PoleMag.2 -0.949 1 -0.862 -0.825 -0.667 -0.462 0.392 -0.355
Amp1.2 0.799 -0.862 1 0.744 0.436 0.239 -0.269 0.238
En1.2 0.675 -0.825 0.744 1 0.898 0.187 -0.186 0.167
Br1.2 0.534 -0.667 0.436 0.898 1 0.059 -0.038 0.022
Thick.2 0.389 -0.462 0.239 0.187 0.059 1 -0.793 0.826
Thick.1 -0.425 0.392 -0.269 -0.186 -0.038 -0.793 1 -0.949
EMA2.1 0.353 -0.355 0.238 0.167 0.022 0.826 -0.949 1
Wafer 5 of FESEM experiments
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Step Coverage
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Capacitor Damage
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