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December 2013
Thermal Characteristics
FQU20N06LN-Channel QFET® MOSFET60 V, 17.2 A, 42 mΩ
Description
©2009 Fairchild Semiconductor Corporation FQU20N06L Rev. C3
www.fairchildsemi.com1
FQU20N
06L — N
-Channel Q
FET® M
OSFET
This N-Channel enhancement mode power MOSFET is produced using Fairchild Semiconductor’s proprietary planar stripe and DMOS technology. This advanced MOSFET technology has been especially tailored to reduce on-state resistance, and to provide superior switching performance and high avalanche energy strength. These devices are suitable for switched mode power supplies, audio amplifier, DC motor control, and variable switching power applications.
Features• 17.2 A, 60 V, RDS(on) = 42 mΩ (Max.) @ VGS = 10 V,
ID = 8.6 A
• Low Gate Charge (Typ. 9.5 nC)
• Low Crss (Typ. 35 pF)
• 100% Avalanche Tested
Absolute Maximum Ratings TC = 25°C unless otherwise noted.
Symbol Parameter FQU20N06LTU Unit
RJC Thermal Resistance, Junction to Case, Max. 3.28oC/W
RJAThermal Resistance, Junction to Ambient (Minimum Pad of 2-oz Copper), Max. 110Thermal Resistance, Junction to Ambient (*1 in2 Pad of 2-oz Copper), Max. 50
Symbol Parameter FQU20N06LTU UnitVDSS Drain-Source Voltage 60 VID Drain Current - Continuous (TC = 25°C) 17.2 A
- Continuous (TC = 100°C) 10.9 AIDM Drain Current - Pulsed (Note 1) 68.8 AVGSS Gate-Source Voltage ± 20 VEAS Single Pulsed Avalanche Energy (Note 2) 170 mJIAR Avalanche Current (Note 1) 17.2 AEAR Repetitive Avalanche Energy (Note 1) 3.8 mJdv/dt Peak Diode Recovery dv/dt (Note 3) 7.0 V/nsPD Power Dissipation (TA = 25°C) * 2.5 W
Power Dissipation (TC = 25°C) 38 W- Derate above 25°C 0.30 W/°C
TJ, TSTG Operating and Storage Temperature Range -55 to +150 °C
TLMaximum lead temperature for soldering, 1/8" from case for 5 seconds.
300 °C
• Low Level Gate Drive Requirements Allowing DirectOperation Form Logic Drivers
GDS I-PAK
G
S
D
Package Marking and Ordering Information
©2009 Fairchild Semiconductor Corporation FQU20N06L Rev. C3
www.fairchildsemi.com2
FQU20N
06L — N
-Channel Q
FET® M
OSFET
Part Number Top Mark Package Reel Size Tape Width QuantityFQU20N06LFQU20N06LTU IPAK N/A N/A 70 units
Packing MethodTube
Electrical Characteristics TC = 25°C unless otherwise noted.
Symbol Parameter Test Conditions Min. Typ. Max. Unit
Off CharacteristicsBVDSS Drain-Source Breakdown Voltage VGS = 0 V, ID = 250 µA 60 -- -- V∆BVDSS / ∆TJ
Breakdown Voltage Temperature Coefficient
ID = 250 µA, Referenced to 25°C -- 0.06 -- V/°C
IDSS Zero Gate Voltage Drain CurrentVDS = 60 V, VGS = 0 V -- -- 1 µAVDS = 48 V, TC = 125°C -- -- 10 µA
IGSSF Gate-Body Leakage Current, Forward VGS = 20 V, VDS = 0 V -- -- 100 nAIGSSR Gate-Body Leakage Current, Reverse VGS = -20 V, VDS = 0 V -- -- -100 nA
On Characteristics VGS(th) Gate Threshold Voltage VDS = VGS, ID = 250 µA 1.0 -- 2.5 VRDS(on) Static Drain-Source
On-ResistanceVGS = 10 V, ID = 8.6 AVGS = 5 V, ID = 8.6 A
----
0.0460.057
0.060.075 Ω
gFS Forward Transconductance VDS = 25 V, ID = 8.6 A -- 11 -- S
Dynamic CharacteristicsCiss Input Capacitance VDS = 25 V, VGS = 0 V,
f = 1.0 MHz
-- 480 630 pFCoss Output Capacitance -- 175 230 pFCrss Reverse Transfer Capacitance -- 35 45 pF
Switching Characteristics td(on) Turn-On Delay Time VDD = 30 V, ID = 10.5 A,
RG = 25 Ω
-- 10 30 nstr Turn-On Rise Time -- 165 340 nstd(off) Turn-Off Delay Time -- 35 80 nstf Turn-Off Fall Time -- 70 150 nsQg Total Gate Charge VDS = 48 V, ID = 21 A,
VGS = 5 V
-- 9.5 13 nCQgs Gate-Source Charge -- 2.5 -- nCQgd Gate-Drain Charge -- 5.5 -- nC
Drain-Source Diode Characteristics and Maximum RatingsIS Maximum Continuous Drain-Source Diode Forward Current -- -- 17.2 AISM Maximum Pulsed Drain-Source Diode Forward Current -- -- 68.8 AVSD Drain-Source Diode Forward Voltage VGS = 0 V, IS = 17.2 A -- -- 1.5 Vtrr Reverse Recovery Time VGS = 0 V, IF = 21 A,
dIF / dt = 100 A/µs -- 54 -- ns
Qrr Reverse Recovery Charge -- 75 -- nC
(Note 4)
(Note 4)
Notes:1. Repetitive rating : pulse-width limited by maximum junction temperature.2. L = 670 µH, IAS = 17.2 A, VDD = 25 V, RG = 25 Ω, starting TJ = 25°C.3. ISD ≤ 21 A, di/dt ≤ 300 A/µs, VDD ≤ BVDSS, starting TJ = 25°C.4. Essentially independent of operating tmperature.
©2009 Fairchild Semiconductor Corporation FQU20N06L Rev. C3
www.fairchildsemi.com3
FQU20N
06L — N
-Channel Q
FET® M
OSFET
Typical Characteristics
40 8 12 16 200
2
4
6
8
10
12
VDS = 30V
VDS = 48V
※ Note : ID = 21AVG
S, G
ate-
Sour
ce V
olta
ge [V
]
QG, Total Gate Charge [nC]10-1 100 1010
500
1000
1500Ciss = Cgs + Cgd (Cds = shorted)
Cgd
dsCoss = C + CgdCrss =
※ Notes :1. VGS = 0 V2. f = 1 MHz
Crss
Coss
Ciss
Capa
citan
ce [p
F]
0.2 0.4 0.6 0.8 1.0 1.2 1.410-1
100
101
150※ Notes : 1. VGS = 0V 2. 250μ s Pulse Test
25I DR, R
ever
se D
rain
Curre
nt [A
]
VSD, Source-Drain voltage [V]
0 01 20 30 40 05 6020
40
60
80
100
VGS = 10V
VGS = 5V
※ Note : TJ = 25
RD
S(O
N) [mΩ
],Dr
ain-
Sour
ce O
n-R
esis
tanc
e
ID, Drain Current [A]
000 2 8 1010-1
100
101
150
25
-55
※ Notes : 1. VDS = 25V 2. 250μ s Pulse Test
I D, D
rain
Curre
nt [A
]
10-1 100 101
100
101
VGSTop : 10.0 V
8.0 V 6.0 V 5.0 V 4.5 V 4.0 V 3.5 V
Bottom : 3.0 V
※ Notes :1. 250μs Pulse Test2. TC = 25
I D, D
rain
Curre
nt [A
]
VDS, Drain-Source Voltage [V]
Figure 5. Capacitance Characteristics Figure 6. Gate Charge Characteristics
Figure 3. On-Resistance Variation vs.Drain Current and Gate Voltage
Figure 4. Body Diode Forward Voltage Variation vs. Source Current and
Temperature
VGS, Gate-Source Voltage [V]
Figure 2. Transfer Characteristics
VDS, Drain-Source Voltage [V]
Figure 1. On-Region Characteristics
64
©2009 Fairchild Semiconductor Corporation FQU20N06L Rev. C3
www.fairchildsemi.com4
FQU20N
06L — N
-Channel Q
FET® M
OSFET
Typical Characteristics (Continued)
Z JC
(t), T
herm
al R
espo
nse
[o C/W
]
1 0 -5 1 0 -4 1 0 -3 1 0 -2 1 0 -1 1 0 0 1 0 11 0 -2
1 0 -1
1 0 0
※ N o t e s : 1 . Z
θ J C( t ) = 3 .2 8 /W M a x . 2 . D u t y F a c t o r , D = t 1 /t 2 3 . T J M - T C = P D M Z* Cθ J ( t )
s i n g le p u ls e
D = 0 .5
0 .0 2
0 .2
0 .0 5
0 .1
0 .0 1
25 50 75 100 125 1500
5
10
15
20
I D, D
rain
Cur
rent
[A]
TC, Case Temperature []10-1 100 101 102
10-1
100
101
102
103
DC10 ms
1 ms100 µs
Operation in This Area is Limited by R DS(on)
※ Notes : 1. TC = 25 oC 2. TJ = 150 oC 3. Single Pulse
I D, D
rain
Cur
rent
[A]
-100 -50 0 50 100 150 2000.0
0.5
1.0
1.5
2.0
2.5
※ Notes :1. VGS = 10 V2. ID = 8.6 A
RDS
(ON)
, (No
rmali
zed)
Drain
-Sou
rce
On-R
esist
ance
TJ, Junction Temperature [oC]
-100 -50 0 50 100 150 2000.8
0.9
1.0
1.1
1.2
※ Notes : 1. VGS = 0 V 2. ID = 250 μA
BVDS
S, (N
ormali
zed)
Drain
-Sou
rce B
reakd
own V
oltag
e
TJ, Junction Temperature [oC]
VDS, Drain-Source Voltage [V]
Figure 9. Maximum Safe Operating Area Figure 10. Maximum Drain Currentvs. Case Temperature
Figure 7. Breakdown Voltage Variationvs. Temperature
Figure 8. On-Resistance Variationvs. Temperature
t 1 , S q u a r e W a v e P u ls e D u r a t i o n [ s e c ]
Figure 11. Transient Thermal Response Curve
t1
PDM
t2
Figure 12. Gate Charge Test Circuit & Waveform
Figure 13. Resistive Switching Test Circuit & Waveforms
Figure 14. Unclamped Inductive Switching Test Circuit & Waveforms
VGS
VDS
10%
90%
td(on) tr
t on t off
td(off) tf
VDD
10V
VDSRL
DUT
RG
VGS
VGS
VDS
10%
90%
td(on) tr
t on t off
td(off) tf
VDD
10V
VDSRL
DUT
RG
VGS
VGS
Charge
VGS
10VQg
Qgs Qgd
3mA
VGS
DUT
VDS
300nF
50KΩ
200nF12V
Same Typeas DUT
Charge
VGS
10VQg
Qgs Qgd
3mA
VGS
DUT
VDS
300nF
50KΩ
200nF12V
Same Typeas DUT
EAS = L IAS2----
21 --------------------
BVDSS - VDD
BVDSS
VDD
VDS
BVDSS
t p
VDD
IAS
VDS (t)
ID (t)
Time
10V DUT
RG
L
I D
t p
EAS = L IAS2----
21EAS = L IAS
2----21----21 --------------------
BVDSS - VDD
BVDSS
VDD
VDS
BVDSS
t p
VDD
IAS
VDS (t)
ID (t)
Time
10V DUT
RG
LL
I DI D
t p
VGSVGS
IG = const.
©2009 Fairchild Semiconductor Corporation FQU20N06L Rev. C3
www.fairchildsemi.com5
FQU20N
06L — N
-Channel Q
FET® M
OSFET
Figure 15. Peak Diode Recovery dv/dt Test Circuit & Waveforms
DUT
VDS
+
_
DriverRG
Same Type as DUT
VGS • dv/dt controlled by RG
• ISD controlled by pulse period
VDD
LI SD
10VVGS
( Driver )
I SD
( DUT )
VDS
( DUT )
VDD
Body DiodeForward Voltage Drop
VSD
IFM , Body Diode Forward Current
Body Diode Reverse Current
IRM
Body Diode Recovery dv/dt
di/dt
D =Gate Pulse WidthGate Pulse Period
--------------------------
DUT
VDS
+
_
DriverRG
Same Type as DUT
VGS • dv/dt controlled by RG
• ISD controlled by pulse period
VDD
LLI SD
10VVGS
( Driver )
I SD
( DUT )
VDS
( DUT )
VDD
Body DiodeForward Voltage Drop
VSD
IFM , Body Diode Forward Current
Body Diode Reverse Current
IRM
Body Diode Recovery dv/dt
di/dt
D =Gate Pulse WidthGate Pulse Period
--------------------------D =Gate Pulse WidthGate Pulse Period
--------------------------
©2009 Fairchild Semiconductor Corporation FQU20N06L Rev. C3
www.fairchildsemi.com6
FQU20N
06L — N
-Channel Q
FET® M
OSFET
©2009 Fairchild Semiconductor Corporation FQU20N06L Rev. C3
www.fairchildsemi.com7
FQU20N
06L — N
-Channel Q
FET® M
OSFET
FQU13N06LTU
Mechanical Dimensions
Figure 16. TO251 (I-PAK), Molded, 3-LeadPackage drawings are provided as a service to customers considering Fairchild components. Drawings may change in any manner without notice. Please note the revision and/or date on the drawing and contact a Fairchild Semiconductor representative to verify or obtain the most recent revision. Package specifications do not expand the terms of Fairchild’s worldwide terms and conditions, specif-ically the warranty therein, which covers Fairchild products.
Always visit Fairchild Semiconductor’s online packaging area for the most recent package drawings:
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©2009 Fairchild Semiconductor Corporation FQU20N06L Rev. C3
www.fairchildsemi.com8
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PRODUCT STATUS DEFINITIONSDefinition of Terms
AccuPower™AX-CAP®*BitSiC™Build it Now™CorePLUS™CorePOWER™CROSSVOLT™CTL™Current Transfer Logic™DEUXPEED®
Dual Cool™EcoSPARK®
EfficentMax™ESBC™
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FastvCore™FETBench™FPS™
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Global Power ResourceSM
GreenBridge™Green FPS™Green FPS™ e-Series™Gmax™GTO™IntelliMAX™ISOPLANAR™Marking Small Speakers Sound Louder and Better™MegaBuck™MICROCOUPLER™MicroFET™MicroPak™MicroPak2™MillerDrive™MotionMax™mWSaver®OptoHiT™OPTOLOGIC®
OPTOPLANAR®
PowerTrench®
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QS™Quiet Series™RapidConfigure™
Saving our world, 1mW/W/kW at a time™SignalWise™SmartMax™SMART START™Solutions for Your Success™SPM®
STEALTH™SuperFET®
SuperSOT™-3SuperSOT™-6SuperSOT™-8SupreMOS®
SyncFET™
Sync-Lock™®*
TinyBoost®TinyBuck®
TinyCalc™TinyLogic®
TINYOPTO™TinyPower™TinyPWM™TinyWire™TranSiC™TriFault Detect™TRUECURRENT®*SerDes™
UHC®
Ultra FRFET™UniFET™VCX™VisualMax™VoltagePlus™XS™
®
™
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Rev. I66
tm
®
FQU20N
06L — N
-Channel Q
FET® M
OSFET
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