Uppermidwest VendorExpo New and Emerging Technologies 051811

7/29/2019 Uppermidwest VendorExpo New and Emerging Technologies 051811

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New and Emerging Technologiesin Electronics

Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10

Daniel F. Baldwin, Ph.D.PresidentEngent, Inc.3140 Northwoods ParkwaySuite 300ANorcross Georgia [email protected]

Overview

The Next Paradigm

Snap Shot of Emerging Technologies

Semiconductor Technology

Automotive Electronics MEMS and Microsensor Technology


Biomedical and Molecular Electronics

104

108

102

106

1010

Calculations Per

Second Per $1000

Moores Law The Fifth Paradigm


1900

Electromechanical Relay Transistor IntegratedCircuit

VacuumTube

10-8

10-2

10-4

100

1910 1920 1930 1940 1950 1960 1970 1980 1990 2000

WY93.280bes-paradigm

Whats Next? 3D versus 2D device structures Nanotechnology

Molecular/optical/quantum computing

Smart/Intelligent ElectronicsSource: Wikipedia

Prismark

Adapted fromKurzweil

Innovation in Electronics

Ray Kurzweil: The Law of Accelerating Returns

Most long range forecasts of technical feasibility dramaticallyunderestimate the power of future technology because they arebased on an intuitive linear view rather then a historical exponentialview


We often overestimate what can be done in the short-termandunderestimate the long-term

A specific paradigm (a method or approach to solving a problem,e.g., shrinking transistors on an integrated circuit as an approach tomaking more powerful computers) provides exponential growthuntil the method exhausts its potential. When this happens, a

paradigm shift (i.e., a fundamental change in the approach)occurs, which enables exponential growth to continue.

Snap-ShotEmerging Technology Around the World

Oxford analogue event to look at bio-inspired electronics IMEC develops artificial skin technology Liquid lenses focus under software control Intel looks at shape-shifting materials based on tiny robots Materials bend visible and infra-red light backwards

Surrey University unveils nanotransistortheory Bucky gel enables stretchable conductors MIT turns to hotos nthesis for unlimite solar ower


Intel inside DNA sequencing SMIC claims 0.11-micron CMOS image sensorprocess IMEC moves 3D chips closer to commercial market Researchers efficiently slice germanium wafers for solar power cells Scottish group works on photonic microelectronics project IMEC raises hopes of high efficiencyorganic solar cells MIT team makes step towardhuman cell-sized battery IBM works with AMD and Freescale to build first 22nm SRAM Stanford, Korean nanofab centre, semi startup claim 3D IC breakthrough Sematech engineers advance EUV resist technology to 22nm

Source: Electronics Weekly

Beyond Moores Law

Nanowire Computing Made Practical IBM has developed a process for making speedier and more energy-efficientchips. One of the leading candidates for a technology that

could make computers smaller and more powerful is based on transistors made from semiconducting nanowires. Read More

Nanotube Ink Printable carbon nanotube patterns could find uses in flexible displays and RFID tags.

Small, Cheaper Flash Memory Freescale Semiconductor is using nanoscale materials to halve the size of flas h memory and make it much less expensive.

Trying for a Terahertz Transistor A new transistor design aims to smash speed records.

A New Spin onComputing Researchers have found a material thatcould allow the use ofspintronicsto make more-powerful computers.

A Universal Chip for Cell Phones'


, , .

Holograms Break Storage Record New technology has almost twice the storage density of a magnetic hard drive.

CarbonNanotube Computers IBM resea rchers have made an importantbreakthrough: arranging nanotube transistors for complex circuits.

A Breakthrough in Nanotube Transistors High-currenttransistors made fromperfectly aligned carbon nanotubes show promise for use in flexible and high-speed nanoelectronics.

Bringing Light to Silicon Intel has announced a newsilicon laserthatcan transfer data on a beam of light--and could makecomputers many times faster.

A Laser Technique Could Improve Electronics This novel process mightlead to purer silicon --and faster chips.

How to Burn a Three Terabyte CD A newnano-optical device can focus laser lighttighter than traditional optics, which could lead to higher-density data storage.

An Enhanced Hard Drive for Your Media Hardware manufacturers are staving off storage limits by making bits stand rather than recline.

Nanowire Transistors Faster than Silicon Advances in nanowires show they can be fast enough to use as ultrasmall transistors in cheap, high-performance electronics.

Source: Technology Review


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Silicon Fabrication Technology Nodes

Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: Intel

Vacuum Dielectrics

A main source of the signal lag is not so much the metalinterconnects themselves but rather the insulation between thewires. So the question is, what can you put between those wiresto prevent the signal from

leaking? Vacuumis thebest insulator


known.

IBMs Air-gap technologycarves nanoscale holes intothe insulation between achips copper wires, as seenin this electron micrograph.

Source: I EEE Spectrum

Semiconductor Nanowires

New strategies, including the use ofnovel materials andone-dimensional (1D) device concepts, innovative devicearchitectures, and smart integration schemes are being exploredand are crucial to extending current capabilities the post CMOS era.

Functional nanostructures, particularly one-dimensionalsemiconductor nanowires have been demonstrated.

Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: IBM

Demonstration of firstvertical surround-gateSi-nanowire transistor,see image at right. Asurround-gate allows the

optimal electrostaticcontrol over the channel

Nonvolatile Molecular Memory

Researchers have discovered a new way to switchcurrent on and off in graphene, pointing the way tothe possibility of molecule-size memory.

Graphene is a 1-atom-thick carbon molecule in whichelectrons flow 100 times as fast as they do in silicon.In theory, a graphene transistor would be 100 timesas fast as the same device made of silicon. Onechallenge, though, is that graphene is so conductivethat its hard to stop current from flowing, and such


-transistor.

It is believed that with graphene, a device could, inprinciple, be scaled down to a 1-nanometer-by-1-nanometer size.

The switching is not fast enough to be used in a logiccircuit, and researchers have not yet shown that itwill work for the millions of cycles a memory devicewould require.

Graphene is presently one of the most expensive

materials on Earth. It is the strongestsubstanceknown to man and can be made into a conformalsurface.

Source: IEE E SpectrumWikipedia

Memristor

Fourth basic element in integrated circuits that could make it possible todevelop computers that turn on and off like an electric light.

Short for memory resistor

A class of passive two-terminal circuit elements that maintain a functional

relationship between the time integrals of current and voltage. Results in resistance varying according to

'

wires are 50 nm -about 150 atoms -wide


.

Specifically engineered memristors providecontrollable resistance useful for switchingcurrent.

Could make it possible for memories thatretain information even after the power is off,so there's no wait for the system to boot up

after turning the computer on.

May even be possible to create systems withsome of the pattern-matching abilities of thehuman brain.

Source: HP

Electronics - Communications Tablet


Source: Prismark PartnersCore production rate 1 million units/week, 37 variants


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Communication Surface

Digital communicationplatform

Touch screen interactive

Table top work surface

Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: Microsoft

Power Delivery

93.280/222/151/249/311bes

SOLAR PANELFUEL CELL


Thin Film Solar Cells

The cells are manufactured on 0.6-by-1.2-meter sheets of glass, which are cleaned andcut on an angle to produce the strong, defect-free edges required for processing. The glasshas already been coated with a transparent tinoxide that provides electrical contact to thedevice.

This starting platform is radically different fromthat for silicon cells, which are made from farsmaller monocrystalline and polycrystalline


. An elemental vapor deposition process takes

place in four chambers. Glass is placed onrollers and fed into the first chamber, where itis heated to 600 C. Then it is transferred intothe second chamber, which is full of cadmiumsulfide vapor, formed by heating solid CdS to700 C. The vapor forms a submicrometerdeposit on the glass as it moves through thiscloud, after which a similar process in a thirdchamber adds a layer of micrometers-thickCdTe in about 40 seconds. Then a gust of

nitrogen gas rapidly cools the panels to 300 Cin a fourth chamber, strengthening the materialso that it can withstand hail and high winds.

Source: First Solar

Organic Electronics

Organic semiconductors are strongcandidates for creating flexible, full-color displays and circuits on plastic.

Using organic light-emitting devices(OLEDs), organic full-color displaysmay eventually replace liquid-crystaldisplays (LCDs) for use with laptop andeven desktop computers. Suchdisplays can be deposited on flexibleplastic foils

Currently, efficiencies of the bestdoped polymer and molecular OLEDsexceed that of incandescent light bulbs.Efficiencies of 20 lumens per watt havebeen reported for yellow-green-emittingpolymer devices, and 40 lm/W attainedfor phosphorescent molecular OLEDs,compared to less than 20 lm/W for atypical incandescent light bulb. It isreasonable to predict that soon,efficiencies of 80lm Wa value


comparable to that of fluorescent roomlightingwill be achieved usingphosphorescent OLEDs.

It is reasonable to assume that within10 years, the square footage of organiccircuitry might exceed that of siliconelectronics

Source: I EEESpectrum

An organic passive-matrix display on asubstrateof PE T, a l ightweight plastic, wil lbend around a diameter of less than acentimeter.

Organic Transistor

A transistor that emits light and is made fromorganic materials could lead to cheaper digitaldisplays and fast-switching light sources oncomputer chips, according to the researchers.

The new organic light-emitting transistor (OLET) ismuch more efficient than previous designs. It hasan external quantum efficiency of 5% (0.6% forprevious designs), compared to an OLED based on


e same maera o .

A transistor-based light source would switch muchfaster than a diode, and more easily integratedonto ICs providing faster data transmission acrosschips than copper wire.

The unique three-layer structure leads to higherefficiency. Current flows horizontally through thetop and bottom layersone carrying electrons andthe other holeswhile carriers that wander into thecentral layer recombine and emit photons.

Source: IEEE Spectrum

Printed Organic Electronics

Electronics companies are looking at ways to graduate fromsilicon electronics to printed organic electronics, with the hopeof a 100X cost reduction, driven by roll-to-roll direct printing onflexible plastic substrates.


Source: Xerox


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Printed Displays

-

+


Source: E Ink

Kindle WirelessReadingDevice

This microprocessor is made from organic materials. It is puny compared tomost silicon processors, but is flexible and cheap

Fabricated on 25 mil Flexible Film

4000 Organic Transistors

Collaboration between: IMEC in Leuven, Belgium

Plastic Computer Processor

Source: Technology Review, IM EC


TNO research organization, Netherlands

Polymer Vision display company,Netherlands

Can run only one 16 instruction program.Commands are hardcoded on 2nd foiletched with plastic circuits. P rocessorcalculates running average of an incomingsignal, a simple operation for conventionalmicroprocessors. The chip runs at six hertz-on order of a million times slower than a modern desktop machine-andcan only process information in 8 bits, compared todays128 bits processors

~2cm

Tactile Displays

Images at your fingertips

Tactile displays made from awatery gel that changes shapeto show objects on its surface.

Use a hydrogel, the type ofmaterial used to make soft


contact lenses, which consistsmainly of water bound up withina polymer.

These smart hydrogels cansignificantly change theirvolume and mechanicalstrength.

Source: New Scientist

3D Integration/IC Market and Roadmap


Embedded Chip or Chips First Technology

Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: Fraunhofer IZM

3D Wafer Level Integration Concept

3D integration represents a system-level integration schemewherein multiple layers of planar devices are stacked andinterconnected using through-wafer vias in the Z direction.

Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: RIT & IBM


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3D Wafer Level Packaging Technologies

RTI

Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: Semiconductor International

Semiconductor International

3D Wafer Level Integration Strategies

Primary interconnection strategies

Wafer-to-wafer (W2W)

Die-to-wafer (D2W)

Some believe W2W bonding is being supplanted by D2W

bonding because of D2W's ability to: Assemble onl KGD


Easier alignment tolerances

Ability to interconnect die of dissimilar sizes

Ability to interconnect die from dissimilar size wafers for heterogeneousintegration

Source: Phil Garrou -RTI &

Semiconductor International

3D WLCSP Wafer Level FC/SMT

New package technology that leverages existing infrastructures forwafer level packaging technology including wafer level redistributionand wafer level ball drop and high speed flip chip assemblytechnology.

Package architecture consists of a base silicon wafer having IOredistribution at the wafer level that includes flip chip interconnect


pa s or a ma ng e an so er a s or eve nerconnec. edie is mounted using conventional flip chip techniques and is thinnedto prevent 2nd level assembly interference.

Flip Chips

TSVRDLSolder Balls Solder BallsACT

PA

Source: ENGENT, INC.

3D WLCSP Wafer Level FC/SMT

Leverages D2W process technology

Leverages existing manufacturing infrastructure

Low cost 3D wafer level integration technology

Limited in 3D stack height Source: ENGENT, INC.


Driver ChipASIC

Cap Die

MEMS

Die

ThroughDieVias

3D Wafer Level Package Assembly

Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: ENGENT, INC.

3D WLCSP 2nd GenerationSilicon Through Vias

Confidential/Competition Sensitive Daniel F. Baldwin, Ph.D.ENGENT. NC. 8/15/10Source: Flip Chip International


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Automotive Electronics

Sensor Rich Environment

Electro Mechanical Replacement

Networked Subsystems

Telematics

Wire Harness Elimination Auto Driveand Systems for Platooning Adaptive Cruise Control


a ar arnng

Collision Avoidance

Electric Steering

Higher Voltage Power Systems

Intelligent Transportation advise or warn the driver (collision warning),

partially control the vehicle, either for steady-state driver assistance or as an emergencyintervention to avoid a collision (collisionavoidance), or

fully control the vehicle (vehicle automation).

Automotive Electronics

Smart junction box Single set of wires to route commands to different parts of the car

Network of inter-connected systems Microprocessors Micro-electromechanical systems

Voice-activated technology

Sensors Multiplex to make intelligentvehicles


platforms Voice- interface

Touch-screen-based interfaces Entertainment Navigation Control subsystems

Safety and Fuel conservation Control valves

Electronic clutches/steering Electronic braking systems Radar systems

Air quality improvement Control heated catalysts

Optoelectronic Circuit Board

Optoelectronics - Emerging IntegrationTechnology


Opto Electronic Multichip Module(Low Cost)

Source: Georgia Tech

High Speed Optical T/R Module


MEMS Enabled Products

Micro-electro-mechanical Systems(MEMS) or Microsystems

RF Devices Tuning Tunable Capacitors ActivePassives

Sensors Accelerometers

Pressure/Temperature


Gyroscopes Proximity IR Detectors

Chemical

Actuators Optoelectronics

High Speed Switches Micro Projection Displays Holographic Displays Detectors Multiplexers Active Signal Alignment Active Fiber Alignment

Source: Prismark Partners

Laser/Detector

Lens

Sili conOpitcal BenchSubstrate

Guides

Micromirror

Fiber

Al ignmentV-Groove

AlignmentGroove

Optical Cross Connect Switch

16 Flip Chips

Die Attach

Wirebonding

Multiple Materials Silicon


Flex

Solder

Epoxy

Gold Wire



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SMT on Flex - IMU


3D Wafer Level Fabrication of MEMS Sensors

WLCSP Flip Chip

Wafer Wafer

SphereDrop/

Reflow

PastePrint/

Reflow

Wafer

RepassivationRedistribution

FCI Proces


Thinning

Placement

Underfill/Test

WLCSP Flip Chip

Dicing/

TapeandReel

Fluxing/

Placement

Reflow

WL CSP Test Vehicle Wafer

ENGENT Process

Waffle Packed 1st Level PackagesSource: ENGENT, INC.

3D Wafer Level Fabrication of MEMS Sensors

Conceptual Image


Q1 2ndLevel Assembly Q3 2ndLevel Assembly


Bioelectronics

Bioelectronics is concerned with the study of the interface betweenbiological and electronic systems, particularly at or below the m scale.Three major application areas: Biological sensing

Biological microcircuits

Biological information storage

Low Cost Disposable Lab on a Chip

Im lanted CardiovascularSensors


Implanted Drug Delivery Systems

Biomechanical Actuators

Micro Surgical Devices withSensors/Detectors

Vision implants

Key Issues Protection of Body and Device

Common Interface Materials

Device Communication Mechanical Support

Thermal Management

Cleanliness Management

93.280/293bes

Bioelectronics

Bio-sensing/Drug Delivery


1000 resevoirs on 10 x 10mm device Preprogrammed drug, reagent, other chemical release

Bioelectronics - Muscle Control Stimulator-Telemeter


Source: NeuroControl Corp.


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Bioelectronics- Artificial Vision

Degenerative retinaldiseases Age-related Macular

Degeneration

Retinitis P igmentosa

Devices electrically


s mu a e e ea yganglion cells in theretina corresponding towirelessly transmittedvideo data from outsidethe body, thuseffectively bypassingthe dying photoreceptorcells

Bioelectronics - Implantable Retina Prosthesis


Bioelectronics

Electronic Pills

Designed to treat gastrointestinal disorders, goes a step further,dispensing medication at a location and rate programmed by aphysician. The disposable capsule, which is about the same size asan ordinary pill, contains a tiny computer, a wireless transmitter, and aseries of sensors; it passes naturally through the digestive system


food or water.

A. Microprocessor

B. pH Sensor

C. Temperature Sensor

D. Fluid Pump

E. Wireless Transceiver

F. Battery


Bioelectronics

Electrotransport technology enablespatient-controlled, pulsatile andmacromolecule delivery through intact skin.

Systems use low-level electrical energy totransport drugs through intact skin,addressin harmaceuticalchallen es such


as: Compounds that cannot be delivered by passive

transdermal systems

Potent drugs that must be delivered in small, precisely

controlled doses

Therapy that demands pulsatile or patient-controlleddelivery

Complex delivery patterns, including ascending,descending, variable or circadian delivery

Molecular Electronics

Molecular Electronics has two main strands: Use of organic materials in macroscopic combinations to form

electronic and optoelectronic devices (typicallymicrometer scales)

Use of functionality in individual molecules to providemolecular-scale electronic device (typically


.

Potential Devices

Low Cost Disposable Lab on a Chip

DNA Detectors

DNA Manipulation

Molecular Synthesis Platforms

DNA Sequencing

Walking Molecules

This tiny machine made of just onemolecule can carry other molecules ona surface. The technique can be usedto move atoms or molecules close toeach other, controlling when they react.

The new "molecule carrier" couldeventually lead to more-efficientcatalysts and new methods for


assem ng moecuar eecroncs. Anthraquinone molecules move in a

straight line on a copper surface, whilecarbon dioxide moves randomly. Butwhen the two molecules get closetogether, the anthraquinone picks upthe carbon dioxide and keeps walking.The molecule carrier is able to carrytwo carbon dioxides.



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Molecular Electronics - Microfluidic Lab on aChip

Biochemical microanalysissystems

Biochemical microprocessorsranging from gelelectrophoresis chips to

comprehensive property-characterization devices (e.g.refractive index, viscosity,


turbidity). Genetic assays Fluidic microprocessor

performs two thermal-controlled biochemicalreactions in series, followedby an electrophoreticseparation, enabling it toperform complete geneticanalyses in minutesSource: Engent, Inc. & Univ. Of Michigan

Molecular Electronics - DNA SampleAnalysis

Nanogens technology focuses on analysisof unknown charged biological moleculeswhich are capable of binding specifically toknown capture molecules on a microchipfocusing on DNA-based sample analysis.

The system consists of both a disposable

cartridge containing a proprietarysemiconductor microchip and a fully

Disposable Cartridge

ASIC Microchip

Permeation Layer

Capture Probes


.

Electronic Addressing Placement of charged molecules at specific

test sites

Leverages strong negative charge of DNA

Electronic manipulation

Solution of DNA probesis introduced andchemically bound todesigned site

An array of specificallybound DNA probes canbe assembled oraddressed on themicrochip.

Source: Nanogen & EPOCH Biosciences

Summary

Exciting time for electronics

Advances in electronics technology will continue to drive theindustry.

Notable advances Molecular electronics

Bio-electronics


Automotive electronics

Smart electronics

Display technology

Telecommunication electronics

Military electronics

Uppermidwest VendorExpo New and Emerging Technologies 051811

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