Unit I Testing and Fault Modelling. Syllabus Introduction to testing – Faults in Digital Circuits...
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Transcript of Unit I Testing and Fault Modelling. Syllabus Introduction to testing – Faults in Digital Circuits...
Unit I Testing and Fault Modelling
Syllabus
Introduction to testing – Faults in Digital
Circuits – Modelling of faults – Logical Fault Models
– Fault detection – Fault Location – Fault dominance
– Logic simulation – Types of simulation – Delay
models – Gate Level Event – driven simulation.
Basic Concept of Testing
Related fields Verification: To verify the correctness of a design
Diagnosis: To tell the faulty site Reliability: To tell whether a good system will work
correctly or not after some time. Debug: To find the faulty site and try to eliminate the
fault
VDD
0/10
000
0
Testing: To tell whether a circuit is good or bad
Why Studying Testing?
• Economics!– Reduce test cost (enhance profit)
• Automatic test equipment (ATE) is extremely expensive
– Shorten time-to-market• Market dominating or sharing
– Guarantee IC quality and reliabilityDefects detected in CostWafer 0.01 – 0.1Packaged chip 0.1 – 1Board 1 – 10System 10 – 100Field 100 – 1000
Rule of Ten: Cost to detect faulty IC increases by an order of magnitude
Principle of Testing
• Testing typically consists of– Applying set of test stimuli (input patterns, test vectors)
to inputs of circuit under test (CUT), and– Analyzing output responses
• The quality of the tested circuits will depend upon the thoroughness of the test vectors
Circuit under Test(CUT)
-101111-00-0-1-01--00-101
1-0010011--11011001-01-11
ComparatorStoredCorrectResponse
Test Result
Input Patterns Output Response
Introduction• Integrated Circuits (ICs) have
grown in size and complexity since the late 1950’s– Small Scale Integration (SSI)– Medium Scale Integration (MSI)– Large Scale Integration (LSI) – Very Large Scale Integration (VLSI)
• Moore’s Law: scale of ICs doubles every 18 months– Growing size and complexity poses
many and new testing challenges
VLSI
LSIMSI
SSI
Importance of Testing• Moore’s Law results from decreasing feature size
(dimensions)– from 10s of m to 10s of nm for transistors and
interconnecting wires
• Operating frequencies have increased from 100KHz to several GHz
• Decreasing feature size increases probability of defects during manufacturing process– A single faulty transistor or wire results in faulty IC– Testing required to guarantee fault-free products
N = # transistors in a chipp = prob. (a transistor is faulty)Pf = prob. (the chip is faulty)
Pf = 1- (1- p) N
If p = 10-6
N = 106
Pf = 63.2%
Importance of Testing (contd.)
Difficulties in Testing• Fault may occur anytime - Design - Process - Package - Field
• Fault may occur at any place
• VLSI circuit are large
- Most problems encountered in testing are NP- complete • I/O access is limited
Vss
Vdd
How to do testing
• Circuit modeling• Fault modeling
• Logic simulation• Fault simulation• Test generation
• Design for test• Built-in self test
• Synthesis for testability
Modeling
ATPG
Testable design
From designer’s point of view:
Levels of Structural Description
• Switch level
• Higher/ System level
• Circuit level
• Gate level
B
E
C
1
C2C3
C
4
C
E
CD F
G
AB
VDD VDD VDD
Why We Need Fault Models?
• Fault models are needed for – test generation, – test quality evaluation and – fault diagnosis
• To handle real physical defects is too difficult• The fault model should
– reflect accurately the behaviour of defects, and– be computationably efficient
• Usually combination of different fault models is used• Fault model free approaches (!)
12
Fault Modeling• The effects of physical defects• Most commonly used fault model: Single stuck-at
fault
AB
CD
E
F
G
A s-a-1A s-a-0
E s-a-1E s-a-0
D s-a-1D s-a-0
C s-a-1C s-a-0
B s-a-1B s-a-0
F s-a-1F s-a-0
G s-a-1G s-a-0
14 faults• Other fault models: - Break faults, Bridging faults, Transistor stuck-open faults, Transistor stuck-on faults, Delay faults
Fault Modeling• The effects of physical defects• Most commonly used fault model: Single stuck-at
fault
AB
CD
E
F
G
A s-a-1A s-a-0
E s-a-1E s-a-0
D s-a-1D s-a-0
C s-a-1C s-a-0
B s-a-1B s-a-0
F s-a-1F s-a-0
G s-a-1G s-a-0
14 faults• Other fault models: - Break faults, Bridging faults, Transistor stuck-open faults, Transistor stuck-on faults, Delay faults
Fault Modeling
• Fault modeling levels – Transistor level faults– Logic level faults
» stuck-at fault model » bridging fault model» open fault model » delay fault model
– Register transfer level faults– ISA level faults (MP faults)– SW level faults
• Hierarchical fault handling• Functional fault modeling
Low-Level models
High-Level models
15
Faults and their Detection
• Physical failures are manifested as electrical failures and are interpreted as faults on the logic level
• Several physical defects may be mapped into few fault types
• The main fault type is Stuck-at Fault• A fault is detected by a test pattern• Test pattern is an input combination that confirms
the presence of the fault
ZB
A R1
R 2
RL
BA Z
ZA
A Z
(a) (b)
Possible Defects
• Two technologies, two physical defects map into the same stuck-at zero fault
• Notation used - A SA0, A@0, or A/0
Inputs FF Faulty ResponseAB Response A/0 B/0 Z/0 A/1 B/1 Z/100 0 0 0 0 101 0 0 0 0 110 0 0 0 1 111 1 0 0 1 1
A
BZ
Detecting Stuck-at Faults
Fill in the blanks in faulty response A/0 and A/1
Inputs FF Faulty ResponseAB Response A/0 B/0 Z/0 A/1 B/1 Z/100 0 0 0 0 0 0 101 0 0 0 0 1 0 110 0 0 0 0 0 1 111 1 0 0 0 1 1 1
A
BZ
Detecting Stuck-at Faults
Detecting Stuck-at Faults
A
BZ
Inputs Fault Free Faulty ResponsesAB Response A/0 B/0 Z/0 A/1 B/1 Z/100 0 0 0 0 0 0 101 0 0 0 0 1 0 110 0 0 0 0 0 1 111 1 0 0 0 1 1 1
Structural and Functional Fault Modeling
Fault models are: explicit and implicit· explicit faults may be enumerated· implicit faults are given by some
characterizing properties
Fault models are: structural and functional:· structural faults are related to
structural models, they modify interconnections between components
· functional faults are related to functional models, they modify functions of components
1
&
&x1
x2
x3
x21
x22y
a
b
Structural faults:- line a is broken- short between x2 and x3
Functional fault:
Instead of 3221 xxxxy
32xxy
Classification of fault models
21
Structural Logic Level Fault ModelingWhy logic fault models?• complexity of simulation
reduces (many physical faults may be modeled by the same logic fault)
• one logic fault model is applicable to many technologies
• logic fault tests may be used for physical faults whose effect is not completely understood
• they give a possibility to move from the lower physical level to the higher logic level
1x2
x1
Broken line
1x2
x1
Bridge to ground
0VSingle model: Stuck-at-0
Two defects:
Stuck-at fault model:
Stuck-at Fault PropertiesFault equivalence and fault dominance:
&
&ABC
D
A B C D Fault class
1 1 1 0 A/0, B/0, C/0, D/1 Equivalence class0 1 1 1 A/1, D/01 0 1 1 B/1, D/0 Dominance classes1 1 0 1 C/1, D/0
Fault collapsing:
&1
1
1
0
1&
&1
0
1
1
0
DominanceDominanceEquivalence
Equivalence
Fault Redundancy
1
&
&
&
1
1
01
10
01
1
1
Hazard control circuitry:
Redundant AND-gateFault 0 is not testable
0
Error control circuitry:
Decoder
1
E 1 if decoder is fault-free Fault 0 is not testable
E
24
Fault Redundancy
0
)(
2
434211
x
y
xxxxxxy
Faults at x2 are not testable, the
node is redundant
1
&
&
&
1&
x1
x2
&x4
x3
y
Redundant gates (bad design):
1
&
&
&
x1
&x4
x3
y
142
423411211
x
y
xxxxxy
if 04 x
Fault x42 0 is not testable
x41
x42
x11
x12
25
Fault RedundancyRedundant gates (bad design):
341 xxxy
1
&
&
&
x1
&x4
x3
y
142
423411211
x
y
xxxxxy
if 04 x
Fault x42 0 is not testable
x41
x42
x11
x12
1
&
&
x1
x3
y
112
3411211
x
y
xxxxy
Fault x12 1 is not testable
x4
x11
x12
if 11 x
Final result of optimization:
1
x3
y
x1
x4
26
Fault Coverage (FC)
FC =# faults detected# faults in fault list
ab
c 6 stuck-at faults( a0,a1,b0,b1,c0,c1 )
Test faults detected FC{(0,0)}{(0,1)}{(1,1)}{(0,0),(1,1)}{(1,0),(0,1),(1,1)}
c1
a1,c1
a0,b0,c0
a0,b0,c0,c1
all
16.67%33.33%50.00%66.67%
100.00%
Example:0 00
1 11
1 00
Wafer Yield (Chip Yield, Yield)
Wafer yield = 12/22 = 0.55 Wafer yield = 17/22 = 0.77
Wafer
Defects
Good Chip
Faulty Chip
Testing and Quality
• Quality of shipped parts is a function of yield Y and the test (fault) coverage T
• Defect level (DL, reject rate in textbook): fraction of shipped parts that are defective
ICFabrication Testing
Yield:Fraction of good parts
Rejects
Shipped Parts
Quality:Defective partsper million (DPM)
Fault Equivalence• Number of fault sites in a Boolean gate circuit = #PI +
#gates + # (fanout branches).• Fault equivalence: Two faults f1 and f2 are equivalent
if all tests that detect f1 also detect f2.• If faults f1 and f2 are equivalent then the
corresponding faulty functions are identical.• Fault collapsing: All single faults of a logic circuit can
be divided into disjoint equivalence subsets, where all faults in a subset are mutually equivalent. A collapsed fault set contains one fault from each equivalence subset.
Equivalence Rules
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0
sa1
sa0
sa1
sa0sa0sa1
sa1
sa0
sa0
sa0sa1
sa1
sa1
AND
NAND
OR
NOR
WIRE
NOT
FANOUT
Equivalence Example
sa0 sa1sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
Faults in redremoved byequivalencecollapsing
20Collapse ratio = ----- = 0.625 32
Fault Dominance• If all tests of some fault F1 detect another fault F2, then F2
is said to dominate F1.• Dominance fault collapsing: If fault F2 dominates F1, then
F2 is removed from the fault list.• When dominance fault collapsing is used, it is sufficient to
consider only the input faults of Boolean gates. See the next example.
• In a tree circuit (without fanouts) PI faults form a dominance collapsed fault set.
• If two faults dominate each other then they are equivalent.
Dominance Example
s-a-1F1
s-a-1F2 001
110 010 000101 100
011
All tests of F2
Only test of F1s-a-1
s-a-1
s-a-1s-a-0
A dominance collapsed fault set
Dominance Example
sa0 sa1sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
sa0 sa1
Faults in redremoved byequivalencecollapsing
15Collapse ratio = ----- = 0.47 32
Faults in yellowremoved bydominancecollapsing
Classes of Stuck-at Faults• Following classes of single stuck-at faults are
identified by fault simulators:• Potentially-detectable fault – Test produces an unknown
(X) state at primary output (PO); detection is probabilistic, usually with 50% probability.
• Initialization fault – Fault prevents initialization of the faulty circuit; can be detected as a potentially-detectable fault.
• Hyperactive fault – Fault induces much internal signal activity without reaching PO.
• Redundant fault – No test exists for the fault.• Untestable fault – Test generator is unable to find a test.
Transistor (Switch) Faults
• MOS transistor is considered an ideal switch and two types of faults are modeled:
• Stuck-open -- a single transistor is permanently stuck in the open state.
• Stuck-short -- a single transistor is permanently shorted irrespective of its gate voltage.
• Detection of a stuck-open fault requires two vectors.
• Detection of a stuck-short fault requires the measurement of quiescent current (IDDQ).
Stuck-Open Example
Two-vector s-op testcan be constructed byordering two s-at testsA
B
VDD
C
pMOSFETs
nMOSFETs
Stuck-open
1
0
0
0
0 1(Z)
Good circuit states
Faulty circuit states
Vector 1: test for A s-a-0(Initialization vector)
Vector 2 (test for A s-a-1)
Stuck-Short Example
A
B
VDD
C
pMOSFETs
nMOSFETs
Stuck-short
1
0
0 (X)
Good circuit state
Faulty circuit state
Test vector for A s-a-0
IDDQ path infaulty circuit
Types of Simulation
• Compiler driven simulation• Activity-directed simulation• Event-driven simulation
Delay Model
• Delay modeling for gates– Transport delay– Inertial delay
• Delay modeling for functional elements• Delay modeling in RTLs• Other aspects of Delay modeling
Gate level Event driven simulation
• Transition-Independent Nominal Transport delay
• Other logic values• Other delay models