25 years ZEISS AIMS technology Unique mask qualification for defect-free printing performance for 248 nm, 193 nm and EUV wavelength.

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25 years ZEISS AIMS technology

For 25 years the Aerial Image Measurement System AIMS™ from ZEISS is used for defect review, printability analysis and repair verification. The system precisely qualifies photomasks according to its printing behavior.

25 years ZEISS AIMS

technology

› Milestones

› AIMS™ 1x platform

for 193 nm high end

market

› AIMS™ 32-193i SE

for193 nm mature

market

› AIMS™ fab neo for

248 nm market

› AIMS™ EUV

› ZEISS

Starting point

ZEISS AIMS was introduced in 1993.

Today the systems are an integral part of the mask manufacturing process and

guarantee the delivery of defect free masks to wafer fabs.

Presently the AIMS™ technology covers various nodes with different wavelengths.

Milestones

■ 1993: Arial Image Measurement Algorithm developed

■ 1994: first 365/248 nm ZEISS AIMS introduced to market

■ 1999: first 193 nm ZEISS AIMS delivered to the industry

■ 2006: first 193 nm immersion AIMS™ introduced to the market

■ 2017: first ZEISS AIMS EUV delivered to the customer

1993Optical platform developed in collaboration with IBM

1994MSM 100market introduction(365 / 248 nm)

1999MSM 193market introduction(193 nm)

2000First fab toolAIMSTM fab(248 nm)

2003First fab tool with automatic handlingAIMSTM fab plus

2006AIMSTM 45-193imarket introduction(193 nm)

2009AIMSTM 32-193imarket introduction(193 nm)

2014AIMSTM 1x-193i(193 nm)

2017AIMSTM EUV(13.5 nm)

3

ZEISS AIMS 1x-193i

The AIMS™ 1x-193i high end immersion platform supports further extension of 193nm lithography and qualifies the printing behavior of photomasks with high precision and accuracy for todays and future technology nodes.

Introduction

Extension of 193 nm lithography leads to application of sophisticated techno-

logies such as multi-patterning and computational lithography. For mask

manufacturing this goes along with higher mask complexity and shrinking error

budgets, but requires also to manage productivity and costs.

Solution

ZEISS AIMS 1x-193i addresses the challenges of increased complexity, tighter

mask specifications and more accurate and reliable defect disposition

by offering an excellent CD repeatability and full illumination flexibility with

FlexIllu®, a computer controlled illumination and key enabler for SMO.

The system represents a stable and well proven high-end platform on which

additional application support with respect to automation and application

beyond defect verification is offered:

■ AIMS™ AutoAnalysis (AAA) for accurate and fully automated defect analysis

on aerial images [go to AIMS™ AutoAnalysis]

Additionally the platform goes further and beyond defect verification with

■ WLCD 2G for CD metrology on aerial images [go to WLCD 2G]

Furthermore the ZEISS AIMS 1x-193i platform offers future performance

upgrades to enhance the system capabilities with respect to CD repeatability

and throughput to keep with ongoing technology demands.

AIMS™ 1x-193i accounts for all optical effects including vector effects and

3D mask effects which is of utmost importance to qualify the printing behavior

of a mask.

The LITO™ grade optics provides aberration correction for the latest scanner

technology and together with the enhanced pupil uniformity it contributes

to an excellent scanner and tool to tool matching. The active isolation system

enables the user to measure at high throughput with excellent CD repeatability

and provides an increase in production efficiency.

25 years ZEISS AIMS

technology

› Milestones

› AIMS™ 1x platform

for 193 nm high end

market

› AIMS™ 32-193i SE

for193 nm mature

market

› AIMS™ fab neo for

248 nm market

› AIMS™ EUV

› ZEISS

ZEISS AIMS AutoAnalysis

AIMS™ AutoAnalysis is a software solution providing fast, accurate and fully automated analysis of aerial images to receive shorter turn-around times, higher reliability and an overall boost in productivity.

4

The fully automated workflow in AIMS™ AutoAnalysis provides

accurate and reliable defect evaluation with no manual

interaction required. Direct communication to the AIMS™

tools allows the aerial images to be analyzed in parallel to the

measurement, therefore reducing the overall cycle time.

In addition to the overall time savings, it also helps to contain

the process variability associated with fluctuations in the

manufacturing process. This is key for improved asset utilization

and on time delivery of product to customers.

Because the manual analysis of defects and repairs is no longer

necessary, human error is eliminated leading to standardized results

and higher confidence in the delivery of a defect free mask.

Report templates are customizable and effortlessly support multiple

purposes and various reporting levels.

Defects are analyzed in a fraction of time required by even the most

experienced engineer, thus resulting in a significantly improved overall

productivity.

25 years ZEISS AIMS

technology

› Milestones

› AIMS™ 1x platform

for 193 nm high end

market

› AIMS™ 32-193i SE

for193 nm mature

market

› AIMS™ fab neo for

248 nm market

› AIMS™ EUV

› ZEISS

5

ZEISS AIMS 1x-193i platform with the application WLCD 2G for CD metrology

Introduction

ZEISS WLCD 2G provides the capability to measure the CD in aerial image

capturing OPC, MEEF and mask 3D effects. It addresses the CD metrology

challenges of advanced lithography nodes with high MEEF pattern having an

increased risk to fail in wafer printing.

Solution

ZEISS WLCD 2G is the perfect choice when a printing aware mask CD metrology

is required. CD analysis of potential lithographic hotspots benefits from the

through focus capability of WLCD 2G. It enables CD characterization through

process window, provides access to the process variation band and reveals the

impact of mask process variations on the printing relevant CD.

Additionally, aerial image CD uniformity measurements can be easily performed

on your most critical feature independently of its complexity. This provides an

effective mask process control and enables mask to mask matching and mask

processes qualification.

ZEISS WLCD 2G allows to separate the optical mask contribution from scanner

and lithographic process contribution to the final wafer printing result. For the

first time it is possible to have access to measured aerial image data during the

OPC model calibration and verification flow which leads to an improved overall

OPC model.

Printing aware CD metrology

Hotspot measurement

CDU measurement

Mask WLCD Wafer

Aerial Image Contours Process Variation Band

Mask CD SEM Aerial Image Aerial Image CDU Map

WLCD 2G provides a wafer printing aware mask CD metrology and

quantifies the mask contribution to the printing result.

25 years ZEISS AIMS

technology

› Milestones

› AIMS™ 1x platform

for 193 nm high end

market

› AIMS™ 32-193i SE

for193 nm mature

market

› AIMS™ fab neo for

248 nm market

› AIMS™ EUV

› ZEISS

Introduction

ZEISS AIMS 32-193i SE is dedicated to 193 nm mature products which require

a considerable flexibility for defect verification but facing the challenge of cost

effectiveness.

Solution

AIMS™ 32-193i SE sits on a proven and robust measurement platform.

To provide an improved illumination flexibility the system is equipped with

a two slider solution. The combination of illumination shapes on each slider

offers a large variety of conventional illumination schemes.

On top of that the system provides the FreeForm Illumination (FFI) capability

realizing more complex illumination shapes to support SMO requirements. The

system specification reflects the requirements of 193 nm mature products in

terms of CD repeatability and throughput but ensuring a cost effective solution.

The overall defect verification productivity can be further improved by utilizing

the AIMS™ AutoAnalysis (AAA) option which provides completely automated

defect analysis in parallel to the measurement.

ZEISS AIMS 32-193i SE

AIMS™ 32-193i SE provides an enhanced flexibility for defect and repair verification of 193nm mature products.

Fixed Slider Exchangeable Slider

Standard

FFI

+ =

+ =

6

25 years ZEISS AIMS

technology

› Milestones

› AIMS™ 1x platform

for 193 nm high end

market

› AIMS™ 32-193i SE

for 193 nm mature

market

› AIMS™ fab neo for

248 nm market

› AIMS™ EUV

› ZEISS

7

ZEISS AIMS fab neo

The newly designed AIMS™ fab neo with state-of-the-art technology supports the ongoing need for defect and repair verification for 248nm lithography

Introduction

AIMS™ fab neo focusses on the needs of a mature market where process

simplification and cost effective solutions are the main challenges.

AIMS™ fab neo provides the capability to perform defect and repair verification

for 248 nm masks and ensures hereby the delivery of defect free masks to the

wafer fab.

Solution

ZEISS AIMS fab neo offers a completely new design. The beam path is improved

by separating the UV beam path from the visible beam path ensuring a high

reliability and enhanced serviceability. The illumination unit is equipped with

an exchangeable slider which allows a predefinition of up to 21 user definable

sigma apertures. This ensures an easy switch of illumination schemes during

operation.

The Graphical User Interface was completely re-designed and allows an ease

of use operation of the system, but maintaining the well established operator

workflow. The overall productivity can be further improved by utilizing the

AIMS™ AutoAnalysis (AAA) option which provides completely automated defect

analysis in parallel to the measurement.

AIMS™ fab neo is equipped with state-of-the art components and a Windows

10 operating systems to ensure a reliable operation through the next decade.

Sigma Slider Solution

Aperture matrix (8 by 3)

25 years ZEISS AIMS

technology

› Milestones

› AIMS™ 1x platform

for 193 nm high end

market

› AIMS™ 32-193i SE

for193 nm mature

market

› AIMS™ fab neo for

248 nm market

› AIMS™ EUV

› ZEISS

8

ZEISS AIMS EUV

AIMS™ EUV is the industry platform for actinic EUV measurements, extendible with mask qualification applications beyond pure defect review

The ZEISS AIMS EUV actinic tool for review of EUV photomasks provides full

emulation of the scanner imaging conditions for the NXE:33X0 EUV systems,

with extension capability to NXE:34X0 generation systems. This emulation is

achieved via an integrated chief ray angle rotation performed by a synchronous

mechanical movement of the sigma and NA apertures.

AIMS™ EUV meets the industry production requirements by providing EUV

scanner quality optics, a high precision stage for defect location accuracy

and by employment of an EUV plasma source optimally designed for meeting

metrology applications requirements.

The handling system of the AIMS™ EUV tool is also designed to flexibly serve

the industry with the ability of loading SMIF pods as well as EUV dual pods.

ZEISS supports fully automated analysis of AIMS™ EUV images via the FAVOR®

platform: The AIMS™ AutoAnalysis EUV Application software addresses the

defectivity review application, enabling shorter turn around times, standardized

results and an easier workflow through fully automated analysis.

8

EUV aerial images of line and

space structures.

25 years ZEISS AIMS

technology

› Milestones

› AIMS™ 1x platform

for 193 nm high end

market

› AIMS™ 32-193i SE

for193 nm mature

market

› AIMS™ fab neo for

248 nm market

› AIMS™ EUV

› ZEISS

9

ZEISS Semiconductor Mask Solutions

Competence Centers and Distributors

Competence Center

Sales & Service Center

International Spare Part Hubs

About ZEISSZEISS is an internationally leading technology enterprise operating in the fields of optics and optoelectronics. The ZEISS Group develops, produces and distributes measuring technology, microscopes, medical technology, eyeglass lenses, camera and cinema lenses, binoculars and semiconduc-tor manufacturing equipment. With its solutions, the company constantly advances the world of optics and helps shape technological progress. ZEISS is divided up into the four segments Research & Quality Technology, Medical Tech-nology, Vision Care / Consumer Products and Semiconduc-tor Manufacturing Technology. The ZEISS Group is represented in more than 40 countries and has over 50 sales and service locations, more than 30 manufacturing sites and about 25 research and development centers around the globe.

About Semiconductor Manufacturing Technology With its broad product portfolio and expertise, the Semiconductor Manufacturing Technology segment of ZEISS covers a variety of key processes in the production of microchips. Its products include semiconductor manufacturing optics – notably lithography optics – as well as photomask systems and process control solutions for semiconductor manufacturing. Thanks to ZEISS technology, microchips are becoming increas-ingly more powerful, more energy-efficient and more affordable. The electronic applications of these ongoing enhancements enable global progress in many disciplines such as technology, electronics, com-munication, entertainment, mobility and energy.Semiconductor Manufacturing Technology is headquartered in Oberkochen. Other sites include Jena, Rossdorf and Wetzlar in Germany, as well as Bar Lev (Israel) and Pleasanton, CA (USA). During fiscal year 2016 / 17, the segment generated revenue of € 1.2 billion and employed around 2,900 people.

For more information please visit us at www.zeiss.com/mask-solutions

25 years ZEISS AIMS

technology

› Milestones

› AIMS™ 1x platform

for 193 nm high end

market

› AIMS™ 32-193i SE

for193 nm mature

market

› AIMS™ fab neo for

248 nm market

› AIMS™ EUV

› ZEISS

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Carl Zeiss SMT GmbHStrategic Business Unit SMS ZEISS GroupCarl-Zeiss-Promenade 1007745 Jena GermanyTel. +49 3641 64 2563Fax +49 3641 64 2938info.smt@zeiss.com

Carl Zeiss Co. Ltd. ZEISS Group22 Honshio-cho, Shinjuku-kuTokyo 160-0003JapanTel. +81 3 3355 0256Fax +81 3 3358 7554info@zeiss.co.jp

Carl Zeiss SBE, LLC ZEISS GroupOne Zeiss Drive Thornwood, NY 10594USATel. +1 855 253 8126 Fax +1 914 459 0096info.smt@zeiss.com

Carl Zeiss Co. Ltd.ZEISS Group9F Kyoungdong Building Sunae-dongGyeonggi-do13595 Bundang-gu Seongnam-siSouth KoreaTel. +82 31 711 5961Fax +82 31 711 5915info@zeiss.co.kr

Carl Zeiss Co. Ltd.ZEISS Group5F-1, No. 158, Section 2Gongdao 5th Rd.Hsinchu City 300TaiwanTel. +886 3 575 3747info.smt@zeiss.com

Carl Zeiss SMT GmbHZEISS GroupRudolf-Eber-Strasse 273447 OberkochenGermanyTel. +49 7364 20 0Fax +49 7364 20 6808info.smt@zeiss.com

www.zeiss.com/mask-solutions

25 years ZEISS AIMS

technology

› Milestones

› AIMS™ 1x platform

for 193 nm high end

market

› AIMS™ 32-193i SE

for193 nm mature

market

› AIMS™ fab neo for

248 nm market

› AIMS™ EUV

› ZEISS