Tutorials on Systems Miniaturization Luiz Otávio S. Ferreira - LNLS November 28, 2001.
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Transcript of Tutorials on Systems Miniaturization Luiz Otávio S. Ferreira - LNLS November 28, 2001.
Luiz Otávio S. Ferreira 2
Outline
• Introduction to Systems Miniaturization
• Microfabrication Technologies
• Microsystems Development and Packaging
• Microfabrication in Brazil
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Introduction to Systems Miniaturization
• Microsystems:– Sets of microdevices capable of
integrated sensing, analysis and actuation.
• Microdevices:– Microstructures capable of actuation, or
signal transduction, or chemical reaction, etc.
Ivo M. Raimundo Jr. IQ/UNICAMPMUSA2000Nobuo Oki
UNESP Ilha SolteiraMUSA2000
Luiz O.S. Ferreira LNLS
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Why Miniaturization?• Reduction on mass and size.• Integration with electronics.• Exploitation of new effects due to
small size.• Cost/performance advantages.• Improved reproducibility, accuracy
and reliability.• Redundancy and arrays.• Low power consumption.• Less material used for
manufacturing.• Avoiding of rare or aggressive to
environment material.• Easy disposal.
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Vocabulary
• USA– MEMS– Microelectromechanical Systems
• Europe– Micro Systems
Micro Systems Technology
• Asia– Mechatronics– Micromanufacturing
• Other names– Micromechanics– Nanotechnology– Microtechnology– Meso Systems
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Market Demands on Miniature Systems
• Environment
• Medicin Technology
• Information Technology
• Biotechnology
• Automotive
• Consumer electronics
• Projected sales for 2003:32 B$ (US$)
Source:
Solid State Technology, July 1999, pp. 63-65.
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Technological Possibilites - 1
• Microtechnology for electronics– Technologies developed or improved
on last 20 years:• Silicon crystal production.• Thin film technology.• Lithography and etching.• Modeling.• Characterization.
– Non electronic interations:• Springs, membranes, piezoresistive effect,
heaters, etc.
– Well developed material and technology: low cost if large scale production.
– Systems integration.
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Technological Possibilities - 2
• Full system approach– Technologies for
• Assembly
• Interconnection
• Housing
• System integration
– Bonding and joining• SMD, COB, TAB, DCA, Wire bonding,
Flip Chip
– Analysis of the interactions
– Reliability
– Performance and cost
– Volume
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Technology Adaptation
• Old technologies, from micro-electronics and from mechanics, are adapted for use on micro-systems integration.
• Some new steps must be developed.• Old materials are used on new ways:
different properties.• Only a whole system approach leads
to effective systems.• Numerical analysis of
interdependencies.
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Why Integration?
• Better shielding of weak electric signals from sensors.
• Individual sensor calibration on factory. Lower calibration cost.
• On board intelligence.
• Reduction of connection cables.
• Standard communication protocols.
• Save cost on extra electronics housing.
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How to Integrate?
• Monolithic Integration:– Very difficult and expensive.
– Very large scale of production.
– Large number of interconnects.
– Number of masks.
– Time of development.
– Yield.
– MCM
• Hybrid Integration:– In 1997, 8% of the pressure sensors and
12% of the accelerometers where monolithically integrated.
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Product Oriented Approach
• Problem and product oriented approach: YES!
• Technology oriented approach: NO!• Technology: manufacturability.• Important technologies are not silicon
based:– Mechanical micromachining.– High aspect ratio microstructuring
(LIGA).– Replication methods:
• Electroplating,• Injection molding.• Hot embossing.
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Availability of Production
• Many prototypes of sensors.• Small number on the market.• Prototyping labs are not equipped to
make 100,000 devices batchs.• Moving the prototype to a foundry
implies on starting again from the scratch.
• Orders of less than 250,000 devices are not attractive to silicon foundries.
• Multi-User prototyping approach (The MUSA Project).
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COSTS• CMOS foundry for monolithically
integrated sensors: US$30 Millions.• Micromechanical parts line (if the ion
implantation is made externally): US$4 Million.
• Hybrid integration (assembly and thick film line): US$1 Million.
• CMOS processed silicon: US$ 2.5 to 8. Cent per mm2 = US$750 to 2100 for a processed 20cm waver.
• Sensor process: US$0.35 per mm2 for batch of more than 50,000 chips.
• Surface micromachining; US$1.80 per mm2 for 10,000 Chips batch, and 30 cents per mm2 for 500,000 chips batch.
• Less than 1 Million chips per year is a risk.• Bellow 10,000 chips a year: a big problem.